JP4353181B2 - 電子装置の製造方法 - Google Patents
電子装置の製造方法 Download PDFInfo
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- JP4353181B2 JP4353181B2 JP2005515960A JP2005515960A JP4353181B2 JP 4353181 B2 JP4353181 B2 JP 4353181B2 JP 2005515960 A JP2005515960 A JP 2005515960A JP 2005515960 A JP2005515960 A JP 2005515960A JP 4353181 B2 JP4353181 B2 JP 4353181B2
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- antenna
- chips
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- electronic device
- manufacturing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
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- G—PHYSICS
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- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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Description
(1)外部電極が向かい合った1組の各々の面に形成されたICチップと、スリットが形成された送受信アンテナと、前記ICチップと前記アンテナとを電気的に接続する短絡板とを備えた電子装置の製造方法において、整列した複数の前記ICチップのうち少なくとも1個のICチップと対応する搭載すべきアンテナ回路上の所定の位置との位置合せをすれば、それに従って残りのICチップについても高精度な位置合わせをすることなくアンテナ回路上の所定の位置に一括して配置することができることを特徴とする電子装置の製造方法。
以下、図4を用いて、第1の実施の形態を説明する。
以下、図5を用いて、第2の実施の形態を説明する。
<第3の実施の形態>
以下、第3の実施形態を説明する。
図5における図5(d)までは第2の実施の形態と同様の工程を用いて、前記アンテナ基板の加工を行い、前記異方導電性接着フィルムをアンテナ回路上にラミネートして異方導電性接着剤層を形成し、前記外部電極が向かい合った1組の各々の面に形成されたICチップを整列して、アンテナ回路上の所定の位置に前記ICチップを、アンテナ基板の幅方向に並んだ1列分に対して一括して仮固定した。
Claims (14)
- 外部電極が向かい合った1組の各々の面に形成されたICチップと、このICチップの一方の外部電極と電気的に接続される、スリットが形成された送受信アンテナと、前記ICチップの他方の外部電極と前記アンテナとを前記スリットを跨いで電気的に接続する短絡板とを備えた電子装置の製造方法において、第1の金属箔を用いて複数のアンテナ回路を形成する工程及びベース基材上に前記アンテナ回路を設けることでアンテナ基板を形成する工程もしくはベース基材上に設けた第1の金属箔から複数のアンテナ回路を設けることでアンテナ基板を形成する工程、複数の前記ICチップを対応する搭載すべき前記複数のアンテナ回路上の所定の位置に配置するときと同じ間隔により、複数の前記ICチップを整列する縦列又は横列のうちの少なくとも一方の列を整列する工程、整列した複数の前記ICチップのうち少なくとも1個のICチップと対応する搭載すべきアンテナ回路上の所定の位置との位置合せを行い、それに従って残りのICチップについてもアンテナ回路上の所定の位置に一括して配置する工程、を少なくとも有することを特徴とする電子装置の製造方法。
- 外部電極が向かい合った1組の各々の面に形成されたICチップと、スリットが形成された送受信アンテナと、前記ICチップと前記アンテナとを電気的に接続する短絡板とを備えた電子装置の製造方法において、第1の金属箔を用いて複数のアンテナ回路を形成する工程及びベース基材上に前記アンテナ回路を設けることでアンテナ基板を形成する工程もしくはベース基材上に設けた第1の金属箔から複数のアンテナ回路を設けることでアンテナ基板を形成する工程、複数の前記ICチップを対応する搭載すべき前記複数のアンテナ回路上の所定の位置に配置するときと同じ間隔により、複数の前記ICチップを整列する縦列又は横列のうちの少なくとも一方の列を整列する工程、整列した複数の前記ICチップを電気的に接続するように第2の金属箔を形成した短絡板に第1の異方導電性接着剤層を介して一括して仮固定し、ICチップ付き短絡板を作製する工程、前記複数のアンテナ回路上の所定の位置に、複数の前記ICチップが電気的に接続するように、前記ICチップ付き短絡板を位置合せする工程、アンテナ基板上の所定の位置に、前記ICチップ付き短絡板を第2の異方導電性接着剤層を介して一括して加熱圧着する工程、を少なくとも有することを特徴とする電子装置の製造方法。
- 外部電極が向かい合った1組の各々の面に形成されたICチップと、スリットが形成された送受信アンテナと、前記ICチップと前記アンテナとを電気的に接続する短絡板とを備えた電子装置の製造方法において、第1の金属箔を用いて複数のアンテナ回路を形成する工程及びベース基材上に前記アンテナ回路を設けることでアンテナ基板を形成する工程もしくはベース基材上に設けた第1の金属箔から複数のアンテナ回路を設けることでアンテナ基板を形成する工程、複数の前記ICチップを対応する搭載すべき前記複数のアンテナ回路上の所定の位置に配置するときと同じ間隔により、複数の前記ICチップを整列する縦列及び横列のうちの少なくとも一方の列を整列する工程、対応する搭載すべき前記複数のアンテナ回路上の所定の位置に複数の前記ICチップが電気的に接続するように、整列した複数の前記ICチップを一括して位置合せした後、第1の異方導電性接着剤層を介して仮固定する工程、仮固定した複数の前記ICチップ及びアンテナ回路上の所定の位置に電気的に接続するように第2の金属箔を形成した短絡板を位置合せする工程、前記短絡板を、複数の前記ICチップ及びアンテナ基板上に第2の異方導電性接着剤層を介して一括して加熱圧着する工程、を少なくとも有することを特徴とする電子装置の製造方法。
- 外部電極が向かい合った1組の各々の面に形成されたICチップと、スリットが形成された送受信アンテナと、前記ICチップと前記アンテナとを電気的に接続する短絡板とを備えた電子装置の製造方法において、第1の金属箔を用いて複数のアンテナ回路を形成する工程及びベース基材上に前記アンテナ回路を設けることでアンテナ基板を形成する工程もしくはベース基材上に設けた第1の金属箔から複数のアンテナ回路を設けることでアンテナ基板を形成する工程、前記アンテナ回路上の所定の位置に第1の異方導電性接着剤層を形成する工程、複数の前記ICチップを対応する搭載すべき前記複数のアンテナ回路上の所定の位置に配置するときと同じ間隔により、複数の前記ICチップを整列する縦列及び横列のうちの少なくとも一方の列を整列する工程、対応する搭載すべき前記複数のアンテナ回路上の所定の位置に複数の前記ICチップが電気的に接続するように、第1の異方導電性接着剤層上に整列した複数の前記ICチップを一括して位置合せした後、仮固定する工程、仮固定した複数の前記ICチップ及びアンテナ回路上の所定の位置に第2の異方導電性接着剤層を形成する工程、仮固定した複数の前記ICチップ及びアンテナ回路上の所定の位置に電気的に接続するように第2の金属箔を形成した短絡板を位置合せする工程、前記短絡板を、複数の前記ICチップ及びアンテナ基板上に一括して加熱圧着する工程、を少なくとも有することを特徴とする電子装置の製造方法。
- 外部電極が向かい合った1組の各々の面に形成されたICチップと、このICチップの一方の外部電極と電気的に接続される、スリットが形成された、第1の金属箔により形成される送受信アンテナと、前記ICチップの他方の外部電極と前記アンテナとを前記スリットを跨いで電気的に接続する、第2の金属箔により形成される短絡板とを備えた電子装置の製造方法において、アンテナ基板の幅方向に前記ICチップを並べたときの列を1列ずつ、一括して加熱圧着することができる個数分を1個片として短絡板を分割する工程、前記短絡板をアンテナ基板の幅方向に並べられたアンテナ回路の1列と位置合せする工程、前記短絡板と前記ICチップとを第1の異方導電性接着剤層を介して、前記ICチップと前記アンテナ基板とを第2の異方導電性接着剤を介して一括して加熱圧着する工程、を少なくとも有することを特徴とする電子装置の製造方法。
- 請求の範囲第1項〜第5項に記載の電子装置の製造方法において、第1及び第2の金属箔の少なくとも一方がアルミニウムであることを特徴とする電子装置の製造方法。
- 請求の範囲第1項〜第6項に記載の電子装置の製造方法において、第1及び第2の金属箔の少なくとも一方が有機樹脂からなるベース基材に支持されており、前記有機樹脂は、塩化ビニル樹脂(PVC)、アクリロニトリルブタジエンスチレン(ABS)、ポリエチレンテレフタレート(PET)、グリコール変性ポリエチレンテレフタレート(PETG)、ポリエチレンナフタレート(PEN)、ポリカーボネート樹脂(PC)、2軸延伸ポリエステル(O−PET)、ポリイミド樹脂から選択されることを特徴とする電子装置の製造方法。
- 請求の範囲第1項〜第6項に記載の電子装置の製造方法において、第1及び第2の金属箔の少なくとも一方が紙からなるベース基材に支持されていることを特徴とする電子装置の製造方法。
- 請求の範囲第2項〜第8項に記載の電子装置の製造方法において、第1及び第2の異方導電性接着剤層の加熱圧着によって、アンテナ基板と短絡板との空隙を封止することを特徴とする電子装置の製造方法。
- 請求の範囲第1項〜第9項に記載の電子装置の製造方法において、複数の前記ICチップをアンテナ基板及び短絡板と一括して加熱圧着する工程の後に、連続しているアンテナ回路を1個ずつの個片に切断する工程を有することを特徴とする電子装置の製造方法。
- 外部電極が向かい合った1組の各々の面に形成されたICチップと、このICチップの一方の外部電極と電気的に接続される、スリットが形成された送受信アンテナとを備え、前記ICチップの他方の外部電極が前記アンテナと前記スリットを跨いで電気的に接続される電子装置における部材において、前記アンテナが複数のアンテナ回路を有し、複数の前記ICチップを対応する搭載すべき前記複数のアンテナ回路上の所定の位置に配置するときと同じ間隔により、複数の前記ICチップを整列する縦列又は横列のうちの少なくとも一方の列が整列され、前記ICチップの外部電極が付いている各々の面に異方導電性接着剤層を形成して、前記ICチップを前記異方導電性接着剤層で挟み込んだ状態の半導体素子であることを特徴とする電子装置の部材。
- 外部電極が向かい合った1組の各々の面に形成されたICチップと、スリットが形成された送受信アンテナと、前記ICチップと前記アンテナとを電気的に接続する短絡板とを備えた電子装置における部材において、前記アンテナが複数のアンテナ回路を有し、複数の前記ICチップを対応する搭載すべき前記複数のアンテナ回路上の所定の位置に配置するときと同じ間隔により、複数の前記ICチップを整列する縦列又は横列のうちの少なくとも一方の列が整列され、前記ICチップの外部電極が付いている各々の面に異方導電性接着剤層を形成して、前記ICチップを前記異方導電性接着剤層で挟み込んだ状態の半導体素子の前記異方導電性接着剤層のうちの一方の面上に、前記ICチップの一方の外部電極と前記アンテナとをスリットを跨いで電気的に接続する短絡板をさらに設けていることを特徴とする電子装置の部材。
- 請求の範囲第1項〜第10項に記載の電子装置の製造方法において、複数の前記ICチップを対応する搭載すべき前記複数のアンテナ回路上の所定の位置に配置するときと同じ間隔により、複数の前記ICチップを整列する縦列及び横列のうちの少なくとも一方の列を整列して、複数の前記ICチップを一括して整列する方法が、前記ICチップが収まる寸法の凹部を数個から数万個程度形成した治具を用いて、治具を振動させることで治具上の前記ICチップを各凹部に収める方法であることを特徴とする電子装置の製造方法。
- 請求の範囲第1項〜第10項及び第13項に記載の電子装置の製造方法において、短絡板と前記ICチップ及びアンテナ基板を一括して加熱圧着することを特徴とする電子装置の製造方法。
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JP2003407182 | 2003-12-05 | ||
JP2003407182 | 2003-12-05 | ||
PCT/JP2004/017939 WO2005055130A1 (ja) | 2003-12-05 | 2004-12-02 | 電子装置の製造方法 |
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JPWO2005055130A1 JPWO2005055130A1 (ja) | 2007-12-06 |
JP4353181B2 true JP4353181B2 (ja) | 2009-10-28 |
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JP2005515960A Expired - Fee Related JP4353181B2 (ja) | 2003-12-05 | 2004-12-02 | 電子装置の製造方法 |
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US (1) | US8273605B2 (ja) |
EP (1) | EP1830309A4 (ja) |
JP (1) | JP4353181B2 (ja) |
KR (1) | KR100895567B1 (ja) |
CN (1) | CN100562889C (ja) |
TW (1) | TW200527311A (ja) |
WO (1) | WO2005055130A1 (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7230580B1 (en) * | 2003-08-29 | 2007-06-12 | National Semiconductor Corporation | Design of a two interconnect IC chip for a radio frequency identification tag and method for manufacturing same |
WO2005069205A1 (ja) * | 2004-01-15 | 2005-07-28 | Hitachi Chemical Co., Ltd. | 電子装置の製造方法 |
JP4992465B2 (ja) * | 2007-02-22 | 2012-08-08 | 富士通株式会社 | Rfidタグおよびrfidタグの製造方法 |
JP5299749B2 (ja) * | 2008-03-19 | 2013-09-25 | Nec東芝スペースシステム株式会社 | 広帯域給電回路及びそれを備えたスロットアンテナ |
KR101288165B1 (ko) * | 2011-08-29 | 2013-07-18 | 삼성전기주식회사 | 바이오칩 스탬핑 장치 및 스탬핑 방법 |
JP6179843B2 (ja) * | 2012-12-04 | 2017-08-16 | 三星電子株式会社Samsung Electronics Co.,Ltd. | 実装装置及び実装方法 |
JP2015053418A (ja) * | 2013-09-09 | 2015-03-19 | 株式会社東芝 | 半導体製造装置 |
JP6212011B2 (ja) * | 2014-09-17 | 2017-10-11 | 東芝メモリ株式会社 | 半導体製造装置 |
JP6442707B2 (ja) * | 2015-04-09 | 2018-12-26 | パナソニックIpマネジメント株式会社 | 部品実装装置及び部品実装方法 |
WO2016179023A1 (en) * | 2015-05-01 | 2016-11-10 | Adarza Biosystems, Inc. | Methods and devices for the high-volume production of silicon chips with uniform anti-reflective coatings |
JP2019032733A (ja) * | 2017-08-09 | 2019-02-28 | 日本メクトロン株式会社 | 貼付タグ、タグシステム |
JP7082874B2 (ja) * | 2017-12-26 | 2022-06-09 | ヤマシンフィルタ株式会社 | フィルタ装置 |
TWI684135B (zh) * | 2018-07-17 | 2020-02-01 | 昱盛國際企業股份有限公司 | 智能膠帶及使用其的物流系統 |
Family Cites Families (9)
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JPH0217487A (ja) * | 1988-07-06 | 1990-01-22 | Hitachi Ltd | 周波数センサ |
JP2001217380A (ja) * | 2000-02-04 | 2001-08-10 | Hitachi Ltd | 半導体装置およびその製造方法 |
JP2002190003A (ja) * | 2000-12-21 | 2002-07-05 | Hitachi Ltd | Icモジュールの製造方法 |
JP4433629B2 (ja) | 2001-03-13 | 2010-03-17 | 株式会社日立製作所 | 半導体装置及びその製造方法 |
JP2002366917A (ja) | 2001-06-07 | 2002-12-20 | Hitachi Ltd | アンテナを内蔵するicカード |
US7204425B2 (en) * | 2002-03-18 | 2007-04-17 | Precision Dynamics Corporation | Enhanced identification appliance |
JP3803085B2 (ja) * | 2002-08-08 | 2006-08-02 | 株式会社日立製作所 | 無線icタグ |
JP4525002B2 (ja) * | 2003-06-06 | 2010-08-18 | 株式会社日立製作所 | 無線認識半導体装置および無線認識半導体装置製造方法 |
JP4177241B2 (ja) * | 2003-12-04 | 2008-11-05 | 株式会社日立情報制御ソリューションズ | 無線icタグ用アンテナ、無線icタグ及び無線icタグ付き容器 |
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2004
- 2004-12-02 CN CNB2004800358459A patent/CN100562889C/zh not_active Expired - Fee Related
- 2004-12-02 US US10/581,721 patent/US8273605B2/en not_active Expired - Fee Related
- 2004-12-02 KR KR1020067013553A patent/KR100895567B1/ko not_active IP Right Cessation
- 2004-12-02 WO PCT/JP2004/017939 patent/WO2005055130A1/ja active Application Filing
- 2004-12-02 JP JP2005515960A patent/JP4353181B2/ja not_active Expired - Fee Related
- 2004-12-02 EP EP04819892A patent/EP1830309A4/en not_active Withdrawn
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Also Published As
Publication number | Publication date |
---|---|
US8273605B2 (en) | 2012-09-25 |
KR100895567B1 (ko) | 2009-04-29 |
JPWO2005055130A1 (ja) | 2007-12-06 |
KR20060105880A (ko) | 2006-10-11 |
TWI296392B (ja) | 2008-05-01 |
TW200527311A (en) | 2005-08-16 |
CN100562889C (zh) | 2009-11-25 |
EP1830309A1 (en) | 2007-09-05 |
WO2005055130A1 (ja) | 2005-06-16 |
EP1830309A4 (en) | 2009-05-13 |
US20110133345A1 (en) | 2011-06-09 |
CN1890678A (zh) | 2007-01-03 |
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