JP2006173190A - 半導体装置の製造方法及びicチップ配列用支持材 - Google Patents
半導体装置の製造方法及びicチップ配列用支持材 Download PDFInfo
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Abstract
【解決手段】伸張性を有するICチップ配列用支持材3の一方の面に複数のICチップ2を配列し、ICチップ2の間隔が配線基板6の間隔とほぼ等しくなるようにICチップ配列用支持材3を伸張し、少なくとも1個以上のICチップ2もしくは1箇所以上の認識マークを用いて位置決めをすることで、複数個のICチップ2と配線基板6との位置合わせを同時に行い、その後にICチップ2を配線基板6に搭載する。
【選択図】図3
Description
以下、図18を用いて、両面電極素子を使用したRFIDインレットを作製した実施例1を説明する。
次に、RFIDインレット用の両面電極素子(以下、本実施例でICチップという。)を縦方向0.5mm、横方向0.5mmの間隔で形成した厚み0.15mmのウエハを作製した。
次に第1の粘着フィルム31の周囲40箇所をクリップ32で固定し、縦方向のICチップ12の間隔が伸張前の1.16倍である0.58mmに、横方向の間隔が伸張前の1.5倍である0.75mmになるように調整しながらクリップ32を引っ張り、第1の粘着フィルム31を伸張させた。(図18(c))
次に第2の配列用支持材として厚み0.04mm、標準粘着力0.3N/25mm、大きさ80mm×80mmの塩化ビニル基材とアクリル系粘着剤とからなる粘着フィルム(第2の粘着フィルム)33を用意した。
次に、アルミニウム箔とPETフィルムとを貼り合わせたアンテナ基材30を縦方向1.5mm、横方向4.0mmの大きさに切断し、アルミニウム箔面に異方導電接着フィルム(AC−2052P−45、日立化成工業(株)製)を仮固定した。
次に、その上からICチップ12の厚みに等しい突起を形成した圧着ヘッドを所定の位置に合わせ、圧着ヘッドを降下し、温度180℃、荷重4Nの条件で20秒間圧着し、図17に示す構造のRFIDインレットを得た。
以下、両面電極素子(以下、本実施例でICチップという。)を使用したRFIDインレットを作製した実施例2を説明する。
以下、両面電極素子(以下、本実施例でICチップという。)を使用したRFIDインレットを作製した実施例3を説明する。
2:ICチップ
2A:ICチップ外部端子
3:配列用支持材
3A:ベース基材
3B:繊維状基材
3C:粘着剤層
4:ダイシングテープ
5:配線基板支持材
6:配線基板
6A:接続端子
7:金属ワイヤ
8:接続材料
Claims (21)
- ICチップと配線基板とを含む半導体装置の製造方法であって、複数の前記ICチップと、ほぼ一定の間隔で配列された複数の前記配線基板とを電気的に接続するための位置合わせを行う半導体の製造方法において、
伸張性を有するICチップ配列用支持材の一方の面に複数の前記ICチップを配列する工程と、
前記ICチップの間隔が前記配線基板の間隔とほぼ等しくなるように前記ICチップ配列用支持材を伸張する工程と、
少なくとも1個以上の前記ICチップもしくは1箇所以上の認識マークを用いて位置決めをすることで、複数個の前記ICチップと前記配線基板との位置合わせを同時に行う工程と、
前記ICチップを前記配線基板に搭載する工程と、
を有することを特徴とする半導体装置の製造方法。 - 伸張性を有する前記ICチップ配列用支持材の一方の面に複数の前記ICチップを配列する工程が、個片化された半導体ウエハの一部もしくは全体を、前記ICチップ配列用支持材の一方の面に転写することによって行われることを特徴とする請求項1記載の半導体装置の製造方法。
- ICチップと配線基板とを含む半導体装置の製造方法であって、複数の前記ICチップと、ほぼ一定の間隔で配列された複数の前記配線基板とを電気的に接続するための位置合わせを行う半導体装置の製造方法において、
伸張性を有する第1のICチップ配列用支持材の一方の面に複数の前記ICチップを配列する工程と、前記第1のICチップ配列用支持材を伸張する工程と、伸張性を有する第2のICチップ配列用支持材に転写する工程と、前記第2のICチップ配列用支持材を伸張するという工程と、を前記ICチップの間隔が前記配線基板の間隔とほぼ等しくなるまで繰り返す工程と、
少なくとも1個以上の前記ICチップもしくは1箇所以上の認識マークを用いて位置決めをすることで、複数個の前記ICチップと前記配線基板との位置合わせを同時に行う工程と、
前記ICチップを前記配線基板に搭載する工程と、
を有することを特徴とする半導体装置の製造方法。 - 伸張性を有する前記ICチップ配列用支持材の一方の面に複数の前記ICチップを配列する工程が、個片化された半導体ウエハの一部もしくは全体を、前記ICチップ配列用支持材の一方の面に転写することによって行われることを特徴とする請求項3記載の半導体装置の製造方法。
- 伸張性を有する前記ICチップ配列用支持材の一方の面に複数の前記ICチップを配列する工程が、個片化され、かつ表面に粘着層を形成された半導体ウエハの一部もしくは全体を、前記ICチップ配列用支持材の一方の面に転写することによって行われることを特徴とする請求項2乃至4のいずれか1項に記載の半導体装置の製造方法。
- ICチップと配線基板とを含む半導体装置の製造方法において、
前記配線基板を所定の間隔に整列する工程と、
複数個の前記ICチップが形成されたウエハの前記ICチップを個片に分割する工程と、
複数個の前記ICチップの表面に粘着剤層を形成する工程と、
分割された複数個の前記ICチップのうちの任意の複数個を、伸張性を有するICチップ配列用支持材の一方の面に転写し、前記ICチップの表面に形成された前記粘着剤層を介して仮固定する工程と、
前記ICチップ配列用支持材を所定の大きさに伸張し複数個の前記ICチップを整列した前記配線基板の間隔にほぼ等しくする工程と、
複数個の前記ICチップと前記配線基板の相対する電極を少なくとも1個以上の前記ICチップもしくは1箇所以上の認識用マークを用いて位置合せする工程と、
前記ICチップを前記配線基板に搭載する工程と、
を有する半導体装置の製造方法。 - ICチップと配線基板とを含む半導体装置の製造方法において、
前記配線基板を所定の間隔に整列する工程と、複数個の前記ICチップが形成されたウエハの前記ICチップを個片に分割する工程と、複数個の前記ICチップの表面に第1の粘着剤層を形成する工程と、分割された複数個の前記ICチップのうちの任意の複数個を、伸張性を有する第1のICチップ配列用支持材の粘着面に転写し、前記ICチップの表面に形成された前記第1の粘着剤層を介して仮固定する工程と、前記ICチップの表面に第2の粘着剤層を形成する工程と、前記第1のICチップ配列用支持材を所定の大きさに伸張する工程と、第1のICチップ配列用支持材上に仮固定された前記ICチップを伸張性を有する前記第2のICチップ配列用支持材に転写し、前記第2の粘着剤層を介して仮固定する工程と、前記第2のICチップ配列用支持材を所定の大きさに伸張する工程と、を前記ICチップの間隔が前記配線基板の間隔とほぼ等しくなるまで繰り返す工程と、
複数個の前記ICチップと前記配線基板の相対する電極を少なくとも1個以上の前記ICチップもしくは1箇所以上の認識用マークを用いて位置合わせする工程と、
前記ICチップを前記配線基板に搭載する工程と、
を有する半導体装置の製造方法。 - 請求項1から7のいずれか1項に記載の半導体装置の製造方法において用いられる、
厚みが0.01〜0.2mmで、かつ引張破壊伸びが200%以上の有機樹脂フィルムであることを特徴とするICチップ配列用支持材。 - 請求項1から7のいずれか1項に記載の半導体装置の製造方法において用いられる、
厚みが0.01〜0.2mmで、かつ引張破壊伸びが200%以上の天然ゴム又は合成ゴムシートであることを特徴とするICチップ配列用支持材。 - 請求項1から7のいずれか1項に記載の半導体装置の製造方法において用いられる、
弾性繊維又は非弾性繊維又は糸又は糸ゴム又はそれらの組み合わせを編んだもので、厚みが0.01〜0.2mmで、かつ引張破壊伸びが200%以上であることを特徴とするICチップ配列用支持材。 - 請求項1から4のいずれか1項に記載の半導体装置の製造方法において、
前記ICチップ配列用支持材が伸張性と少なくとも一方の表面に粘着性を有するICチップ配列用支持材であることを特徴とする半導体装置の製造方法。 - ICチップと配線基板とを含む半導体装置の製造方法において、
前記配線基板を所定の間隔に整列する工程と、
複数個の前記ICチップが形成されたウエハの前記ICチップを個片に分割する工程と、
分割された複数個の前記ICチップのうちの任意の複数個を、伸張性及び粘着性を有するICチップ配列用支持材の粘着面に転写し仮固定する工程と、
前記ICチップ配列用支持材を所定の大きさに伸張し複数個の前記ICチップを整列した前記配線基板の間隔にほぼ等しくする工程と、
複数個の前記ICチップと前記配線基板の相対する電極を少なくとも1個以上の前記ICチップもしくは1箇所以上の認識用マークを用いて位置合せする工程と、
前記ICチップを前記配線基板に搭載する工程と、
を有する半導体装置の製造方法。 - ICチップと配線基板とを含む半導体装置の製造方法において、
前記配線基板を所定の間隔に整列する工程と、複数個の前記ICチップが形成されたウエハの前記ICチップを個片に分割する工程と、分割された複数個の前記ICチップのうちの任意の複数個を、伸張性及び粘着性を有する第1のICチップ配列用支持材の粘着面に転写し仮固定する工程と、前記第1のICチップ配列用支持材を所定の大きさに伸張する工程と、前記第1のICチップ配列用支持材上に仮固定された前記ICチップを伸張性及び粘着性を有する第2のICチップ配列用支持材に転写し仮固定する工程と、前記第2のICチップ配列用支持材を所定の大きさに伸張する工程と、をICチップの間隔が前記配線基板の間隔とほぼ等しくなるまで繰り返す工程と、
複数個の前記ICチップと前記配線基板の相対する電極を少なくとも1個以上の前記ICチップもしくは1箇所以上の認識用マークを用いて位置合わせする工程と、
前記ICチップを前記配線基板に搭載する工程と、
を有する半導体装置の製造方法。 - 請求項11から13のいずれか1項に記載の半導体装置の製造方法において用いられる、
厚みが0.01〜0.2mmで、かつ引張破壊伸びが200%以上の有機樹脂フィルムからなるベース基材と、前記ベース基材の少なくとも一方の面に粘着剤層が形成された2層フィルムであることを特徴とするICチップ配列用支持材。 - 請求項11から13のいずれか1項に記載の半導体装置の製造方法において用いられる、
厚みが0.01〜0.2mmで、かつ引張破壊伸びが200%以上の天然ゴム又は合成ゴムシートからなるベース基材と、前記ベース基材の少なくとも一方の面に粘着剤層が形成された2層フィルムであることを特徴とするICチップ配列用支持材。 - 請求項11から13のいずれか1項に記載の半導体装置の製造方法において用いられる、
弾性繊維又は非弾性繊維又は糸又は糸ゴム又はそれらの組み合わせを編んだもので、厚みが0.01〜0.2mmで、かつ引張破壊伸びが200%以上であるベース基材と、前記ベース基材の少なくとも一方の表面に粘着剤層が形成されたシート状材料であることを特徴とするICチップ配列用支持材。 - ICチップと配線基板とを含む半導体装置において、
複数の前記ICチップを複数の前記配線基板に、請求項1から16のいずれか1項に記載の方法で搭載する際に、前記ICチップのベース基材面と前記配線基板の前記ICチップを固定する所定の面とを接着剤を介して固定し、前記ICチップの回路面上に形成された外部端子と、前記配線基板上の所定の端子とを、金属ワイヤで電気的に接続することを特徴とする半導体装置の製造方法。 - ICチップと配線基板とを含む半導体装置において、
複数の前記ICチップを複数の前記配線基板に、請求項1から16のいずれか1項に記載の方法で搭載する際に、前記ICチップの回路面上に形成された外部端子と前記配線基板の前記ICチップを接続固定する端子とを対向させ、導電性材料又は異方導電性材料又は非導電性材料を介して電気的接続かつ固定することを特徴とする半導体装置の製造方法。 - 請求項1から7、請求項11から13、請求項17又は18のいずれか1項に記載の半導体装置の製造方法において、
前記ICチップが無線通信用のICチップであり、前記配線基板が送受信アンテナであることを特徴とする半導体装置の製造方法。 - 請求項19に記載の半導体装置の製造方法において、
前記ICチップが、固体識別のための識別情報を記憶し、外部電極が向かい合った1組の各々の面に形成されており、前記配線基板が送受信アンテナであり、前記ICチップの一方の面に形成された外部電極が送受信アンテナの一つの端子に接続され、前記ICチップの他方の面に形成された外部電極が金属ワイヤ又は金属箔または導電性接着剤を介して、前記送受信アンテナの別の端子に接続されることを特徴とする半導体装置の製造方法。 - 請求項19又は20に記載の半導体装置の製造方法において、
前記ICチップの1辺の大きさが、0.5mm以下であることを特徴とする半導体装置の製造方法。
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WO2020235535A1 (ja) | 2019-05-21 | 2020-11-26 | 株式会社ハリーズ | 電子部品取付装置、電子装置の製造方法及びストラップの製造方法 |
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