JPS5731150A - Supporting method of wafer - Google Patents

Supporting method of wafer

Info

Publication number
JPS5731150A
JPS5731150A JP10506680A JP10506680A JPS5731150A JP S5731150 A JPS5731150 A JP S5731150A JP 10506680 A JP10506680 A JP 10506680A JP 10506680 A JP10506680 A JP 10506680A JP S5731150 A JPS5731150 A JP S5731150A
Authority
JP
Japan
Prior art keywords
wafer
sheet
supporting base
plate
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10506680A
Other languages
Japanese (ja)
Inventor
Yoshiharu Ozaki
Kazuo Hirata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP10506680A priority Critical patent/JPS5731150A/en
Publication of JPS5731150A publication Critical patent/JPS5731150A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

PURPOSE:To remove a wafer from a rubber sheet, by rolling a synthetic rubber sheet between a supporting base and a wafer from one end. CONSTITUTION:The wafer 2 is held by a plate 4, and the synthetic rubber sheet 3 is fixed to the plate by a member 7 and attached to the back surface of the wafer. The plate 4 is pressed to a temperature controlled supporting base 1 by making a hinge 8 as a fulcrum and fixed by a screw 9. After wafer treatment, the screw 9 is removed to open the supporting base 1, and the member 7 is removed to roll the sheet 3 by making the part, supported by the member, as one end. By said system, the wafer and the sheet will sequentially be peeled off from the end of the wafer or the wafer can be handled without any damage. The member 7 is provided with screw holes 10 and fixed by the bolts 12 of a winding jig 11, and the sheet may be rolled by a handle 13.
JP10506680A 1980-08-01 1980-08-01 Supporting method of wafer Pending JPS5731150A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10506680A JPS5731150A (en) 1980-08-01 1980-08-01 Supporting method of wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10506680A JPS5731150A (en) 1980-08-01 1980-08-01 Supporting method of wafer

Publications (1)

Publication Number Publication Date
JPS5731150A true JPS5731150A (en) 1982-02-19

Family

ID=14397579

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10506680A Pending JPS5731150A (en) 1980-08-01 1980-08-01 Supporting method of wafer

Country Status (1)

Country Link
JP (1) JPS5731150A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006173190A (en) * 2004-12-13 2006-06-29 Hitachi Chem Co Ltd Manufacturing method of semiconductor device and support material for ic chip arrangement

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006173190A (en) * 2004-12-13 2006-06-29 Hitachi Chem Co Ltd Manufacturing method of semiconductor device and support material for ic chip arrangement

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