CN101160596B - 电子装置的制造方法 - Google Patents
电子装置的制造方法 Download PDFInfo
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- CN101160596B CN101160596B CN2006800127538A CN200680012753A CN101160596B CN 101160596 B CN101160596 B CN 101160596B CN 2006800127538 A CN2006800127538 A CN 2006800127538A CN 200680012753 A CN200680012753 A CN 200680012753A CN 101160596 B CN101160596 B CN 101160596B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
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- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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Abstract
本发明提供一种价格低廉、生产性优越且可得到良好通讯特性的电子装置的制造方法。该电子装置具备外部电极形成于相对向的一组的各个面上的IC芯片(100),形成有缝隙的天线电路(201),以及电连接IC芯片(100)和天线电路(201)的短路板(300);通过将IC芯片(100)分别保持在在外周具有多个可保持一个IC芯片的机械手(704)的圆盘状搬送器(703)的机械手(704)上,并利用圆盘状搬送器(703)的旋转来进行IC芯片(100)的搬送,同时可搬送以机械手(704)的数量为上限的多个IC芯片。
Description
技术领域
本发明涉及搭载了IC芯片的非接触式个体识别装置,尤其涉及适合价格低廉而生产性优良且可得到良好通讯特性的电子装置的制造方法。
背景技术
近年来使用RFID(Radio Frequency Identification)标签(Tag)的非接触式个体识别系统,作为管理物品的整个寿命周期的系统而在制造、物流、贩卖的所有营业状况深受注目。特别是使用2.45GHz微波的电波方式的RFID标签,是一种在IC芯片上安装外部天线的构造,并因能具有数米的通讯距离的特征而深受注目,现在以大量商品的物流以及物品管理、制造物履历管理等为目的促进系统的构筑。
使用上述微波的电波方式的RFID标签,已知有采用例如通过日立制作所和株式会社ルネサステクノロジ社所开发的TCP(Tape Carrier Package)型嵌入物(inlet)的标签,TCP型嵌入物的制造,是采用在连接聚酰亚胺基材与铜天线电路所形成的输送胶带(tape earrier)上,一个个封装所有的外部电极形成于同一面上的IC芯片的TAB(Tape Automated Bonding)方法(参照香山晋、成濑邦彦[VLSI封装技术(上)、(下)]、日经BP公司、1993年)。下面是用图1对应用一般TAB方法的RFID标签(Tag)的制造工序进行说明。
在图1中,首先如(a)所示,将所有的外部电极形成于在电路面形成有金凸块104的同一面上的IC芯片110,通过切割加工而单片化之后,通过真空吸附器20从切割薄膜10吸附。其次,如(b)所示,以所有的外部电极形成在同一面上的IC芯片110的金凸块104为表面的方式移动到真空吸附站30。其次,如(c)所示,以金凸块104为下面地使真空吸附站30上下反转。将所有的外部电极形成于上述同一面上的IC芯片110,定位于将附铜箔聚酰亚胺基材的铜箔施以天线电路加工所制作的天线基板500的规定位置之后,利用加热器40加热压固、固定。在与天线电路501上的金凸块连接的部分,通过施行镀锡或是镀软钎料,就可得到利用金-锡合金的连接。其次,如(d)所示,将所有的外部电极形成于同一面上的IC芯片110与天线基板500的空隙利用热硬化性树脂600进行密封。上述热硬化性树脂硬化结束的状态是指称为嵌入物的RFID标签的中间形态。通过将该嵌入物储存在标签或薄型盒内可当作RFID标签使用。
其他的嵌入物构造为,例如根据日立制作所的宇佐美提出的技术,对于一个个形成于IC芯片的外部电极相对的一组的各个面上的IC芯片,开发出在形成于各个面上的各外部电极上连接偶极天线的玻璃二极管封装构造(参照日本特开2002-269520号公报)。进而,根据宇佐美等提出的技术,开发出了将上述两个外部电极一个个形成于IC芯片相对的一组的各个面上的IC芯片,安装在激励缝隙型偶极天线上时,由天线夹着一个个形成于上述IC芯片相对的一组的各个面上的各外部电极的多层天线构造(参照ISSCC Digest of TechnicalPapers,pp·398-399,2003年)。具有激励缝隙的偶极天线构造可改变该缝隙的宽幅以及长度来整合天线的阻抗与上述IC芯片的输入阻抗,从而能提高通讯距离。
为了利用运用RFID标签的非接触式个体识别系统来实现大量商品的物流及物品管理,必须对一个个商品装设RFID标签(Tag),因此RFID标签(Tag)的大量且廉价的生产变得不可欠缺。
但是,为了在得到良好通讯特性的激励型偶极天线构造中,让IC芯片的两个外部电极跨越激励缝隙连接于天线上而形成共振电路,所有的外部电极形成于同一面上的IC芯片中,必须将信号输入用的两个外部电极与缝隙精度良好地对位。因此,在图1所示的现有的TAB方法中,由切割薄膜开始利用真空吸附器的所有的外部电极形成于同一面上的IC芯片的吸附以及搬送或所有的外部电极形成于同一面上的IC芯片与天线基板的对位以及配置,进而对所有的外部电极形成于同一面上的IC芯片一个个进行将加热压固、树脂密封等的各工序,因此将各工序的生产周期时间(tact time)缩短到1秒左右或是1秒以下是非常的困难,成为大量生产中的一大课题。
另外,生产周期时间很长的话,除了花费该部分人事费等有碍低成本化外,由于所有的外部电极形成于同一面上的IC芯片与天线基板的连接是利用金-锡或是金-焊锡接合来施行,所以作为基板材料,因需要使用耐热性优良且在高价的聚酰亚胺薄膜粘贴上铜箔的胶带基材而难以生产廉价的嵌入物(inlet)。
若使用由上述天线夹着在相对的一组的各面上分别形成有两个外部电极的IC芯片的各面上分别形成的各外部电极的多层天线构造,虽然不需要激励缝隙与一个个形成在上述IC芯片的各个面的各外部电极的高精度对位,但在如使用TAB方法的现有的生产方法中,为了缩短生产周期时间,采取将多个上述晶片利用多个真空吸附器同时进行吸附及搬送的方式,因此生产设备变得复杂且设备投资金额也增加,嵌入物的大量生产及低成本化变得困难。
于是提出了如下方式:将上述IC芯片一个个收纳在圆盘状搬送器的上述缺口,该圆盘状搬送器在外周具有多个可插入一个上述IC芯片的缺口,通过上述圆盘状搬送器的旋转来进行上述IC芯片的搬送,由此同时搬送以上述缺口的数量为上限的多个上述IC芯片(参照特愿2004-008313)。
但在利用圆盘状搬送器的方式中,存在以下课题:在将上述IC芯片插入到上述缺口时,上述IC芯片卡置在上述缺口,或是上述IC芯片夹在上述圆盘状搬送器和保持上述圆盘状搬送器的空间之间等设备的稳定作业。
发明内容
本发明是鉴于上述问题而提出的技术方案,目的在于提供一种价格低廉、生产性优越且可得到良好通讯特性的电子装置的制造方法。
即,本发明如以下所述。
(1)一种电子装置的制造方法,该电子装置具备外部电极形成于相对向的一组的各个面上的IC芯片,形成有缝隙的发送/接收天线,以及电连接上述IC芯片与上述天线的短路板,该电子装置的制造方法的特征在于,通过将上述IC芯片分别保持在在外周具有多个可保持一个上述IC芯片的机械手的圆盘状搬送器的上述机械手上,并利用上述圆盘状搬送器的旋转来进行上述IC芯片的搬送,同时搬送以上述机械手的数量为上限的多个上述IC芯片。
(2)一种电子装置的制造方法,该电子装置具备外部电极形成于相对向的一组的各个面上的IC芯片,形成有缝隙的发送/接收天线,以及电连接上述IC芯片与上述天线的短路板,该电子装置的制造方法的特征在于,至少具有以下工序:通过使用第一金属箔形成多个天线电路,并在底部基材上设置上述天线电路以形成天线基板的工序,或者,通过由设置在底部基材上的第一金属箔来设置多个天线电路以形成天线基板的工序;排列上述IC芯片的工序;将排列的IC芯片分别保持于多个机械手上,并通过圆盘状搬送器的旋转来进行搬送的工序,其中上述机械手配置在上述圆盘状搬送器的外周且分别保持一个上述IC芯片;以电连接的方式将所搬送的IC芯片通过第一各向异性导电粘着剂层分别配置在形成有第二金属箔的短路板上,并制作附IC芯片短路板的工序;在上述天线电路上的规定位置上,以电连接上述IC芯片的方式,使上述附IC芯片短路板对位的工序;以及,在天线基板上的规定位置上,将上述附IC芯片短路板通过第二各向异性导电粘着剂层而一并加热压固的工序。
(3)一种电子装置的制造方法,该电子装置具备外部电极形成于相对向的一组的各个面上的IC芯片,形成有缝隙的发送/接收天线,以及电连接上述IC芯片与上述天线的短路板,该电子装置的制造方法的特征在于,至少具有以下工序:通过使用第一金属箔形成多个天线电路,并在底部基材上设置上述天线电路以形成天线基板的工序,或者通过由设置在底部基材上的第一金属箔来设置多个天线电路以形成天线基板的工序;排列上述IC芯片的工序;将排列的IC芯片分别保持于多个机械手上,并通过圆盘状搬送器的旋转来进行搬送的工序,其中上述机械手配置在上述圆盘状搬送器的外周且分别保持一个上述IC芯片;将所搬送的上述IC芯片以电连接上述IC芯片的方式分别对位于上述天线电路的规定位置上后,通过第一各向异性导电粘着剂层来进行配置的工序;在所配置的上述IC芯片以及天线电路上的规定位置上,以电连接的方式使形成有第二金属箔的短路板对位的工序;以及,通过第二各向异性导电粘着剂层将上述短路板一并加热压固在上述IC芯片以及天线基板上的工序。
(4)一种电子装置的制造方法,该电子装置具备外部电极形成于相对向的一组的各个面上的IC芯片,形成有缝隙的发送/接收天线,以及电连接上述IC芯片与上述天线的短路板,该电子装置的制造方法的特征在于,至少具有以下工序:通过使用第一金属箔形成多个天线电路,并在底部基材上设置上述天线电路以形成天线基板的工序,或者通过由设置在底部基材上的第一金属箔来设置多个天线电路以形成天线基板的工序;在上述天线电路上的规定位置上形成第一各向异性导电粘着剂层的工序;排列上述IC芯片的工序;将排列的IC芯片分别保持于多个机械手上,并通过圆盘状搬送器的旋转来进行搬送的工序,其中上述机械手配置在上述圆盘状搬送器的外周且分别保持一个上述IC芯片;将所搬送的上述IC芯片以电连接上述IC芯片的方式分别对位于上述天线电路的规定位置上后,通过第一各向异性导电粘着剂层来进行配置的工序;在所配置的多个上述IC芯片以及天线电路上的规定位置上形成第二各向异性导电粘着剂层的工序;在所配置的多个上述IC芯片以及天线电路上的规定位置上,以电连接的方式使形成有第二金属箔的短路板对位的工序;以及,将上述短路板一并加热压固在多个上述IC芯片以及天线基板上的工序。
(5)在上述电子装置的制造方法的任一项中,其特征在于,第一及第二金属箔的至少一方为铝。
(6)在上述电子装置的制造方法的任一项中,其特征在于,第一及第二金属箔的至少一方支撑于由有机树脂所构成的底部基材上,上述有机树脂从聚氯乙烯树脂(PVC)、丙烯腈-丁二烯-苯乙烯(ABS)、聚对苯二甲酸乙二醇酯(PET)、乙二醇改性聚对苯二甲酸乙二醇酯(PETG)、聚奈二甲酸二乙醇酯(PEN)、聚碳酸酯树脂(PC)、双向拉伸聚酯(O-PET)、聚酰亚胺树脂中选择。
(7)在上述电子装置的制造方法的任一项中,其特征在于,第一及第二金属箔的至少一方支撑于由纸所构成的底部基材上。
(8)在上述电子装置的制造方法的任一项中,其特征在于,通过第一及第二各向异性导电粘着剂层的加热压固,来密封天线基板与短路板的空隙。
(9)在上述电子装置的制造方法的任一项中,其特征在于,在将多个上述IC芯片与天线基板以及短路板一并加热压固的工序之后,具有将连续的天线电路切断成一个个单片的工序。
(10)在上述电子装置的制造方法的任一项中,其特征在于,将短路板与上述IC芯片以及天线基板一并加热压固。
利用本发明的电子装置的制造方法,可得到如下的效果。
将外部电极形成于相对向的一组的各个面上的IC芯片分别保持在多个机械手上,该机械手可保持一个配置在圆盘状搬送器的外周的上述IC芯片,通过上述圆盘状搬送器的旋转,同时搬送以上述机械手的数量为上限的多个上述IC芯片,即使分别配置在天线基板以及短路板上,也能实现优良的生产性,而且可得到良好的通讯特性。可将每一个嵌入物(inlet)的生产生产周期时间(tact time)缩短到1秒左右或是1秒以下,以及由于通过各向异性导电粘着剂层来连接上述IC芯片与天线基板及短路板,可在底部基材以及天线电路的材料上使用便宜的材料,因此能实现低价格的嵌入物。
附图说明
图1是用于说明现有的制造方法的图。
图2是表示由本发明的制造方法所取得的嵌入物的构造的图。
图3是用于说明本发明的第一实施方式的制造工序图。
图4是用于说明本发明的第二实施方式的制造工序图。
图5是用于说明本发明的第四实施方式的制造工序图。
具体实施方式
以下使用附图对本发明的实施方式进行详细说明。
本发明的电子装置具备在相对向的一组的各个面上形成有外部电极的IC芯片,形成有缝隙的发送/接收天线,以及电连接上述IC芯片与上述天线的短路板。
上述电子装置是采用本发明的制造方法的RFID标签(Tag)用嵌入物。图2(a)是由上面观看RFID标签(Tag)用嵌入物的示意图。另外,图2(b)是图1(a)的A-A′部的剖面示意图。使用图2简单说明上述嵌入物的构造。
在图2中,如(b)所示,在上述IC芯片100的相对向的一组的各个面上,分别形成有第一外部电极102以及第二外部电极103。上述IC芯片100是通过第一外部电极102,在由底部基材202以及天线电路201所构成的天线基板200上,通过各向异性导电粘着剂层400所含有的导电粒子401而连接于第一连接部2。同样地,由底部基材302以及金属箔301所构成的短路板300与上述IC芯片100的第二外部电极103,是于第二连接部3,而短路板300与天线基板200是于第三连接部4,通过各向异性导电粘着剂层400所含有的导电粒子401而分别连接。上述IC芯片的第二外部电极103的第二连接部3与天线基板上的第三连接部4成为跨越形成在天线基板上的缝隙1而连接的构造。即,上述IC芯片的第一外部电极102与第二外部电极103通过第一连接部2、天线电路201、第三连接部4、短路板的金属箔301以及第二连接部3而电连接。另外,天线基板200与短路板300的空隙由各向异性导电粘着剂层的基质树脂402密封。
其次,使用附图举例说明上述电子装置的制造方法。
本发明的上述电子装置的制造方法的第一例是,在具备外部电极形成于相对向的一组的各个面上的IC芯片,形成有缝隙的发送/接收天线,以及电连接上述IC芯片与上述天线的短路板的电子装置的制造方法中,至少具有:使用第一金属箔形成多个天线电路的工序,以及在底部基材上设置上述天线电路以形成天线基板的工序,或是由设置在底部基材上的第一金属箔来设置多个天线电路以形成天线基板的工序;排列上述IC芯片的工序;将排列的IC芯片分别保持于配置在圆盘状搬送器的外周的分别可保持一个上述IC芯片的多个机械手上,并通过上述圆盘状搬送器的旋转来搬送的工序;以电连接的方式将所搬送的IC芯片通过第一各向异性导电粘着剂层分别配置在形成有第二金属箔的短路板上,制作附IC芯片短路板的工序;在上述天线电路上的规定位置上,以电连接上述IC芯片的方式,使上述附IC芯片短路板对位的工序;以及将上述附IC芯片短路板通过第二各向异性导电粘着剂层而一并加热压固在天线基板上的规定位置上的工序。
另外,本发明的上述电子装置的制造方法的第二例是,在具备外部电极形成在相对向的一组的各个面的IC芯片,形成有缝隙的发送/接收天线,以及电连接上述IC芯片与上述天线的短路板的电子装置的制造方法中,至少具有:使用第一金属箔形成多个天线电路的工序,以及在底部基材上设置上述天线电路以形成天线基板的工序,或是由设置在底部基材上的第一金属箔来设置多个天线电路以形成天线基板的工序;排列上述IC芯片的工序;将排列的IC芯片分别保持于配置在圆盘状搬送器外周的分别可保持一个上述IC芯片的多个机械手上,并通过上述圆盘状搬送器的旋转来进行搬送的工序;将所搬送的上述IC芯片以可电连接上述IC芯片的方式分别对位于上述天线电路的规定位置上后,通过第一各向异性导电粘着剂层来进行配置的工序;以电连接的方式在所配置的上述IC芯片以及天线电路上的规定位置上使形成第二金属箔的短路板对位的工序;以及将上述短路板通过第二各向异性导电粘着剂层而一并加热压固在上述IC芯片以及天线基板上的工序。
另外,本发明的上述电子装置的制造方法的第三例是,在具备外部电极形成在相对向的一组的各个面的IC芯片,形成有缝隙的发送/接收天线,以及电连接上述IC芯片与上述天线的短路板的电子装置的制造方法中,至少具有:使用第一金属箔形成多个天线电路的工序,以及在底部基材上设置上述天线电路以形成天线基板的工序,或是由设置在底部基材上的第一金属箔来设置多个天线电路以形成天线基板的工序;在上述天线电路上的规定位置形成第一各向异性导电粘着剂层的工序;排列上述IC芯片的工序;将排列的IC芯片分别保持于配置在圆盘状搬送器的外周的分别可保持一个上述IC芯片的多个机械手上,并通过上述圆盘状搬送器的旋转来搬送的工序;将所搬送的上述IC芯片以可电连接上述IC芯片的方式分别对位于上述天线电路的规定位置上后,通过第一各向异性导电粘着剂层来进行配置的工序;在所配置的上述IC芯片以及天线电路上的规定位置上形成第二各向异性导电粘着剂层的工序;以电连接的方式在所配置的多个上述IC芯片以及天线电路上的规定位置上使形成第二金属箔的短路板对位的工序;以及将上述短路板一并加热压固在多个上述IC芯片以及天线基板上的工序。
在上述第一~第三例中,第一及第二金属箔的至少一方为铝。
在上述第一~第三例中,第一及第二金属箔的至少一方支撑于由有机树脂或纸构成的底部基材上。上述有机树脂可从聚氯乙烯树脂(PVC)、丙烯腈-丁二烯-苯乙烯(ABS)、聚对苯二甲酸乙二醇酯(PET)、乙二醇改性聚对苯二甲酸乙二醇酯(PETG)、聚奈二甲酸二乙醇酯(PEN)、聚碳酸酯树脂(PC)、双向拉伸聚酯(O-PET)以及聚酰亚胺树脂中选择。
在上述第一~第三例中,作为形成天线基板的方法具有,例如使用第一金属箔形成多个天线电路后,设置在底部基材上而形成天线基板的方法;在底部基材上设置第一金属箔后通过蚀刻等形成多个天线电路而形成天线基板的方法。
作为上述IC芯片的排列方法具有,例如将芯片电容器或芯片电阻等芯片零件排列成一列的高速散装式供料器(bulk feeder)、高频零件供给器(partsfeeder)和线性供料器(linear feeder)。
在上述第一~第三例中具有,在具有将上述IC芯片排列于天线基板的宽度方向时的列逐列可一并加热压固的个数做为一片来分隔短路板的工序;使上述短路板与天线基板电路上的规定位置对位的工序,以及在上述IC芯片与天线基板上通过各向异性导电性粘接剂层将短路板一并加热压固的工序时,在可以缩短生产周期(tact)时间的这点为佳。
在上述第一~第三例中,采用在附有上述IC芯片的外部电极的各个面形成各向异性导电粘着剂层,并将上述IC芯片利用上述各向异性导电粘着剂层预先夹入的状态的半导体元件亦可,此时能更有效率的制造嵌入物。
在上述第一~第三例中,通过上述第一及第二各向异性导电粘着剂层的加热压固,将多个上述IC芯片与天线基板以及短路板一并加热压固,并且能够密封天线基板与短路板的空隙。
此时,虽然上述第一及第二各向异性导电粘着剂层的厚度总合至少为上述IC芯片厚度的二分之一以上,但可得到天线基板与短路板的密封性,在实现高可靠性的这点为佳。
若在上述加热压固前将短路板分割为多个,则在能防止热畸变引起的偏位的这点为佳。
在上述第一~第三例中,采用在上述IC芯片的附有外部电极的各个面上形成各向异性导电粘着剂层,进而在预先用上述各向异性导电粘着剂层夹入上述IC芯片的状态的半导体元件的上述各向异性导电粘着剂层中的一个面上预先设置短路板的部件亦可,此时能更有效率的制造嵌入物。
在上述第一~第三例中,为了形成短路板而将第二金属箔设置在底部基材上的方法具有,例如,只将第二金属箔贴附在上述底部基材上的方法,且因不必对上述第二金属箔进行蚀刻等的处理,故而工序减少,在可缩短生产周期时间、低成本化的这点为佳。
在上述第一~第三例中,具有如下工序:将短路板通过各向异性导电粘着剂层一并加热压固在上述IC芯片以及天线基板上的工序之后,将连接的天线电路切割为一个个单片。
在上述第一~第三例中,在上述切断的工序中,以图2的A-A′方向为宽幅方向时,短路板必须具有跨越缝隙直到上述IC芯片的程度的长度,具有大致等同于天线电路宽幅的长度,但嵌入物整体的外观上较为理想。
在上述第一~第三例中,经由上述各工序,可得到作为本发明的电子装置的嵌入物构造。
对于上述嵌入物,在以RFlD标签的形态使用时,虽是在嵌入物的上下设置覆盖薄片,但在保护电路防止短路等的这点较佳。
在上述第一~第三例中,将排列的IC芯片分别保持于配置在圆盘状搬送器外周上的分别可保持一个上述IC芯片的多个机械手上,并通过上述圆盘状搬送器的旋转,同时搬送以上述机械手的数量为上限的多个上述IC芯片,从而将搬送的芯片一个个配置在短路板以及天线电路上的规定位置上,比起将上述IC芯片利用真空吸附器等一个个进行吸附、搬送及配置的情况,还要能实现优良的生产性。通过提高生产性,可缩短每一个嵌入物的生产周期(时间)。
在上述第一~第三例中,通过使用上述IC芯片与短路板而成为跨越缝隙的连接构造,由于不需要连接在上述IC芯片的天线电路这侧的面的外部电极与天线电路上的激励缝隙的高精度对位,因此能实现生产设备的低价格化与搬送的高速化。
在上述第一~第三例中,上述IC芯片与天线基板以及短路板、短路板以及天线基板的各电连接通过各向异性导电粘着剂层进行。利用各向异性导电粘着剂层的连接,通过将形成于作为被连接体的上述IC芯片的各个面上的各外部电极与上述各向异性导电粘着剂层所含有的导电粒子的接触而得到,不需要天线电路上的表面电镀,且由于形成金属接合,不需要耐得住在200℃以上高温的接合的高耐热性底部基材,所以可使用便宜的底部基材及天线电路,就能实现低成本化。
由于通过各向异性导电粘着剂层进行上述电连接,因此例如在利用现有金-锡接合等进行连接的场合,对必需使用耐热性高的聚酰亚胺作为天线基板的底部基材而言,例如可使用便宜的聚对苯二甲酸乙二醇酯等。另外,因不必在上述连接部的天线电路上的表面施行镀锡等,所以可在天线电路的材料上使用锡和软钎料的电镀性差的便宜的铝。因而,例如在聚对苯二甲酸乙二醇酯的底部基材上形成铝的天线电路所得到的天线基板,很适合用于制造便宜的RFID标签用嵌入物的构造。
在上述第一例中,第一各向异性导电粘着剂层可预先形成于短路板上,也可形成于上述IC芯片的第二外部电极侧。另外,第二各向异性导电粘着剂层可预先形成于天线基板上,也可形成于上述IC芯片的第一外部电极102侧。
在上述第二例中,第一各向异性导电粘着剂层可预先形成于天线基板上,也可形成于上述IC芯片的第一外部电极102侧。另外,第二各向异性导电粘着剂层可预先形成于短路板上,也可形成于IC芯片及天线电路上。
即,本发明的电子装置的制造方法,在具备外部电极形成于相对向的一组的各个面的IC芯片,形成有缝隙的发送/接收天线,以及电连接上述IC芯片与上述天线的短路板的电子装置的制造方法中,其特征在于:上述IC芯片的搬送如下进行:将上述IC芯片分别保持于圆盘状搬送器的上述机械手上,该圆盘状搬送器在外周具有多个可保持一个上述IC芯片的机械手,并利用上述圆盘状搬送器的旋转来进行上述IC芯片的搬送,从而可同时搬送以上述机械手的数量为上限的多个上述IC芯片。
如上述第一~第三例所说明的那样,通过将上述IC芯片分别保持于圆盘状搬送器的上述机械手上,该圆盘状搬送器在外周具有多个可保持一个上述IC芯片的机械手,并利用上述圆盘状搬送器的旋转同时搬送以上述机械手的数量为上限的多个上述IC芯片,即使以电连接的方式在短路板以及天线基板上分别配置,也能飞跃性的提高嵌入物的生产性。
实施例
以下,使用附图对本发明的最佳实施例进一步详细说明,但本发明并不限于这些实施例。
图2是本发明的实施方式,是由上面观看使用本发明的制造方法的RFID标签(Tag)用嵌入物的示意图。另外,图2(b)是图2(a)的A-A′部的剖面示意图。使用图2简单说明嵌入物的构造。
在图2中,如(b)所示,在IC芯片100的相对的一组的各个面,形成有第一外部电极102以及第二外部电极103。IC芯片100是通过第一外部电极102,在由底部基材202以及天线电路201所构成的天线基板200上,通过各向异性导电粘着剂层400所含有的导电粒子401而连接于第一连接部2。同样地,由底部基材302以及金属箔301所构成的短路板300与IC芯片100的第二外部电极103,是于第二连接部3,而短路板300与天线基板200是于第三连接部4,通过上述导电粒子401而分别连接。即,上述IC芯片的第二外部电极103的第二连接部3与天线基板上的第三连接部4,成为跨越形成于天线基板的缝隙1所连接的构造。即,上述IC芯片的第一外部电极102与第二外部电极103,是通过第一连接部2、天线电路201、第三连接部4、短路板的金属箔301以及第二连接部3而电连接。另外,天线基板200与短路板300的空隙由各向异性导电粘着剂层的基质树脂402而密封。
<第一实施方式>
以下,使用图3说明第一实施方式。
首先,如(a)所示,在厚50μm的聚对苯二甲酸乙二醇酯基材202上,在用接著剂贴合厚9μm的铝箔的带状基材的铝箔面上,以网版印刷形成蚀刻光阻剂之后,在蚀刻液中使用氯化铁水溶液,连续形成天线电路201。在此,使每一个天线电路的天线的宽幅为2.5mm、缝隙宽幅为0.5mm、天线电路的形成间距为3mm。
其次,如(b)所示,将准备的大约10000个、在相对向一组的各面上形成有外部电极的、纵横各0.4mm、厚度0.15mm的IC芯片100供给到高频零件供给器700之后,通过使上述高频供零件给器以及连接在上述零件供料器上的线性供料器701以频率280Hz连续振动,将上述IC芯片在上述线性供料器上排列成一列。
其次,如(c)所示,在宽幅2mm、长度50m、厚度50μm的聚对苯二甲酸乙二醇酯基材上,准备在用接着剂贴合厚度9μm的铝箔的短路板300的铝箔面上,将宽幅2mm、长度50m的各向异性导电性粘着薄膜400(AC-2052P-45(日立化成工业(株)制))以80℃进行积层,剥离分隔薄膜所形成的各向异性导电粘着剂层,并向上配置上述线性供料器701、在外周具有可保持一个上述IC芯片的多个机械手(hand)704的圆盘状搬送器703以及上述各向异性导电粘着剂层。再者,在上述线性供料器的前端附有销702,该销702用于防止上述IC芯片因振动脱落以及只分离一个保持于上述圆盘状搬送器的机械手上的上述IC芯片。
其次,如(d)所示,降下上述线性供料器701前端的销702,只分离一个排列在上述线性供料器的前头的IC芯片B之后,降下停止在连接于上述线性供料器的位置上的上述圆盘状搬送器703的机械手704,将只分离的一个IC芯片B保持在机械手704前端,上升机械手704并旋转上述圆盘状搬送器。此时,上述线性供料器前端的销,为了防止之后所保持的上述IC芯片脱落因此上升,上述圆盘状搬送器会在此后保持上述IC芯片的机械手连接于上述线性供料器的位置停止旋转。另外,向上述圆盘状搬送器703的机械手704前端的IC芯片保持是利用真空吸附进行的,因此在机械手704上开有孔。
其次,如(e)所示,保持在上述圆盘状搬送器703的机械手704上的上述IC芯片B位于上述各向异性导电粘着剂层400的上方的话,降下上述圆盘状搬送器703的机械手704会破坏吸附上述IC芯片B的真空,从而将上述IC芯片B固定在上述各向异性导电粘着剂层上,且将具有上述各向异性导电粘着剂层400的短路板移动3mm。重复上述动作,在形成于上述短路板上的各向异性导电粘着剂层上以3mm间隔配置40个上述IC芯片。此时,上述圆盘状搬送器的外周所具有的机械手为20个,上述圆盘状搬送器的旋转速度为0.3转/秒,具有上述各向异性导电粘着剂层的短路板的移动速度为18mm/秒。
其次,如(f)所示,在与所配置的上述IC芯片的短路板侧的外部电极相反侧的外部电极面上,将上述宽幅的上述各向异性导电粘接薄膜400以80℃予以积层之后,剥离分隔薄膜形成各向异性导电粘着剂层,做成40个IC芯片以3mm间距排成一列的上述附IC芯片短路板。此时,上述IC芯片的附有外部电极的各个面,成为以上述各向异性导电粘着剂层夹入的状态。
其次,如(g)所示,使用CCD摄相机与图像处理装置,使从上述附IC芯片短路板的各向异性导电粘着剂层上透视所见的上述IC芯片与天线电路上的规定位置对位,上述附IC芯片短路板的IC芯片暂固定在与天线基板连接的方向。另外,取代CCD摄相机与图像处理装置,从各向异性导电粘着剂层上目视透视所见的上述IC芯片的位置精度也不成问题。接着,从短路板侧降下压固头,在压力3MPa、温度180℃、加热时间15秒的条件下,对于将上述附IC芯片短路板排列在天线基板的宽幅方向的天线电路的一列份,一并加热压固在规定位置,并且密封天线基板与短路板的空隙。在压固头上,以可同时进行上述IC芯片与天线基板以及短路板的连接和短路板以及天线基板的连接的方式,在规定的位置形成相当于上述IC芯片厚度的突起。
其次,如(h)所示,使用冲压切断机切成一个个单片,得到图2所示的形状的嵌入物构造。
若采用本工序,上述IC芯片的搬送及配置所要的时间为每一个嵌入物0.167秒,上述附IC芯片短路板连接在天线基板上所要的时间为每一个嵌入物0.375秒。若用多个压固头,就能进一步缩短每一个嵌入物的生产周期时间。
另外,上述IC芯片的实际安装位置精度为从规定的位置相差±0.3mm以内,就没有因偏位引起的组装不良以及通讯不良。
<第二实施方式>
以下,使用第4图说明第二实施方式。
首先,如(a)所示,在厚50μm的聚对苯二甲酸乙二醇酯基材202上,在用粘接剂贴合厚9μm的铝箔的带状基材的铝箔面上,以网版印刷形成蚀刻光阻剂之后,在蚀刻液中使用氯化铁水溶液,连续形成天线电路201。在此,相当一个天线电路的天线的宽幅为2.5mm、缝隙宽幅为0.5mm、天线电路的形成间距为3mm。
其次,如(b)所示,在天线电路上的规定的位置上,将宽幅2mm的各向异性导电粘接薄膜400(AC-2052P-45(日立化成工业(公司)制))以80℃进行积层,剥离分隔薄膜形成各向异性导电粘着剂层。
其次,如(c)所示,将准备的大约10000个、在相对的一组的各个面上形成有外部电极的、纵横各0.4mm、厚度0.15mm的IC芯片100供给到高频零件供给器700之后,将上述高频零件供给器以及连接在上述供给器上的线性供料器701以频率280Hz连续振动,由此将上述IC芯片在上述线性供料器上排列成一列。
其次,如(d)所示,向上配置上述线性供料器701、在外周具有可保持一个上述IC芯片的多个机械手704的圆盘状搬送器703、形成在上述天线电路上的规定位置上的各向异性导电粘着剂层400。再者,在上述线性供料器的前端附有销702,该销702用于防止上述IC芯片因振动脱落以及只分离一个保持在上述圆盘状搬送器的机械手上的上述IC芯片。
其次,如(e)所示,降下上述线性供料器701前端的销702,只分离一个排列在上述线性供料器的前头的IC芯片C之后,降下停止在连接于上述线性供料器的位置的上述圆盘状搬送器703的机械手704,将只分离的一个IC芯片C保持在机械手704前端,上升机械手704并旋转上述圆盘状搬送器。此时,上述线性供料器前端的销,为了防止之后所保持的上述IC芯片脱落因此上升,上述圆盘状搬送器会在此后保持上述IC芯片的机械手连接于上述线性供料器的位置停止旋转。另外,向上述圆盘状搬送器703的机械手704前端的IC芯片保持,是利用真空吸附进行,因此在机械手704上开有孔。
其次,如(f)所示,保持在上述圆盘状搬送器703的机械手704上的上述IC芯片C位于上述各向异性导电粘着剂层400的上方的话,降下上述圆盘状搬送器703的机械手704,来破坏吸附上述IC芯片C的真空,从而将上述IC芯片C固定在上述各向异性导电粘着剂层上,且将具有上述各向异性导电粘着剂层的天线电路201移动3mm。重复上述动作,且在形成于上述天线电路的各向异性导电粘着剂层上以3mm间隔配置40个上述IC芯片。此时,上述圆盘状搬送器的外周所具有的短口为20个,上述圆盘状搬送器的旋转速度为0.3转/秒,具有上述各向异性导电粘着剂层的短路板的移动速度为18mm/秒。
其次,如(g)所示,在厚度50μm的聚对苯二甲酸乙二醇酯基材上,在用粘接剂贴合厚度9μm的铝箔的宽幅2mm的带状基材的铝箔面上,将与上述带状基材同宽的上述各向异性导电粘接薄膜400以80℃进行积层,剥离分隔薄膜形成附各向异性导电粘着剂层的短路板。
其次,如(h)所示,附各向异性导电粘着剂层的短路板与天线基板以外形尺寸为基准并与规定的位置吻合而暂时固定。接着,从附各向异性导电粘着剂层的短路板侧降下压固头,在压力3MPa、温度180℃、加热时间15秒的条件下,对于将上述附各向异性导电粘着剂层的短路板排列在天线基板的宽幅方向的上述IC芯片以及天线电路的一列份,一并加热压固在规定位置,并且密封天线基板与短路板的空隙。在压固头上,以可同时进行上述IC芯片与天线基板以及短路板的连接和短路板以及天线基板的连接的方式,在规定的位置形成相当于上述IC芯片厚度的突起。
其次,如(i)所示,使用冲压切断机切成一个个单片,得到图2所示的形状的嵌入物。
若采用本工序,与第一实施方式同样地,上述IC芯片的搬送及配置所要的时间为每一个嵌入物0.167秒,将上述短路板连接在天线基板上所要的时间为每一个嵌入物0.375秒。若用多个压固头,就能进一步缩短每一个嵌入物的生产周期时间。
另外,与第一实施方式同样地,上述IC芯片的实际安装位置精度为从规定的位置相差±0.3mm以内,就没有因偏位引起的组装不良以及通讯不良。
<第三实施方式>
以下说明第三实施方式。
至图4的(f)为止,使用与第二实施方式同样的工序进行上述天线基板的加工,将上述各向异性导电粘接薄膜积层到天线电路上形成各向异性导电粘着剂层,且整剂排列以及搬送在相对的一组的各个面形成有上述外部电极的IC芯片,从而将上述IC芯片分别配置在天线电路上的规定的位置上。
其次,在所配置的上述IC芯片上,将与上述积层的各向异性导电粘接薄膜同宽幅的各向异性导电粘接薄膜,以80℃予以积层,剥离分隔薄膜而形成各向异性导电粘着剂层。
其次,在厚50μm的聚对苯二甲酸乙二醇酯基材上,准备用粘接剂贴合厚9μm的铝箔的宽幅2m的带状基材,以此作为短路板。
以将上述短路板的铝箔面侧朝向上述IC芯片,并以外形尺寸为基准而与上述各向异性导电粘接薄膜重叠的方式进行对位并暂时固定。接着,从短路板侧降下压固头,在压力3Mpa、温度180℃、加热时间15秒的条件下,将短路板相对上述IC芯片以及天线电路一并加热压固在规定的位置上,并且密封天线基板与短路板的空隙。在压固头上,以可同时进行IC芯片与天线基板以及短路板的连接和短路板以及天线基板的连接的方式,在规定的位置形成相当于上述IC芯片厚度的突起。
其次,使用冲压切断机切成一个个单片,得到图2所示的形状的嵌入物构造。
若采用本工序,与第一及第二实施方式同样地,上述IC芯片的搬送及配置所要的时间为每一个嵌入物0.167秒,上述短路板连接在天线基板所要的时间为每一个嵌入物0.375秒。若用多个压固头,就能进一步缩短每一个嵌入物的生产周期时间。
另外,与第一及第二实施方式同样地,上述IC芯片的实际安装位置精度为从规定的位置相差±0.3mm以内,就没有因偏位引起的组装不良以及通讯不良。
<第4实施方式>
以下使用图5说明第4实施方式。
至图5的(b)为止,使用与第一实施方式同样的工序,进行上述天线基板的加工,将上述IC芯片在上述线性供料器上排列成一列。
其次,如(c)所示,在宽幅2mm、长度50m、厚度50μm的聚对苯二甲酸乙二醇酯基材,准备在用粘接剂贴合厚度9μm的铝箔的短路板300的铝箔面上,将宽幅2mm、长度50m的各向异性导电粘接薄膜400(AC-2052P-45(日立化成工业(株)制))以80℃进行积层,剥离分隔薄膜所形成的各向异性导电粘着剂层,并向上配置上述线性供料器701、在外周具有可插入一个上述IC芯片的多个缺口804的圆盘状搬送器803、上述各向异性导电粘着剂层。再者,在上述线性供料器的前端附有销702,该销702用于防止上述IC芯片因振动脱落以及只分离一个插入到上述圆盘状搬送器的缺口中的上述IC芯片。
其次,如(d)所示,降下上述线性供料器701前端的销702,只将一个排列在上述线性供料器的前头的IC芯片D插入到上述圆盘状搬送器803的缺口804且旋转上述圆盘状搬送器。此时,上述线性供料器前端的销,为了防止之后所插入的上述IC芯片脱落因此上升,上述圆盘状搬送器会在此后插入上述IC芯片的缺口连接于上述线性供料器的位置停止旋转。
其次,如(e)所示,插入到上述圆盘状搬送器803的缺口804中的上述IC芯片D,位于上述各向异性导电粘着剂层400的上方的话,利用临时附加(仮付)用销805将上述IC芯片D从上述缺口取出固定在上述各向异性导电粘着剂层上,且具有上述各向异性导电粘着剂层400的短路板移动3mm。重复上述动作,且在形成于上述短路板的各向异性导电粘着剂层上以3mm间隔配置40个上述IC芯片。此时,上述圆盘状搬送器的外周所具有的短口为24个,上述圆盘状搬送器的旋转速度为0.3转/秒,具有上述各向异性导电粘着剂层的短路板的移动速度为18mm/秒。
图5的(f)以后使用与第一实施方式同样的工序,得到图2所示的形状的嵌入物构造。
若采用本工序,上述IC芯片的搬送及配置所要的时间为每一个嵌入物0.167秒。但上述0.167秒是因如下原故而扣除设备停止的时间,即,将上述IC芯片插入到上述缺口的际,相当于上述IC芯片2000个发生一次左右的上述IC芯片卡置在上述缺口。虽然上述附IC芯片的短路板连接在天线基板上所要的时间是每一个嵌入物0.375秒,但若使用多个压固头,可更进一步缩短每一个嵌入物的生产周期时间。
另外,上述IC芯片的实际安装位置精度为从规定的位置相差±0.3mm以内,就没有因偏位引起的组装不良以及通讯不良。
<第5实施方式>
首先,在厚50μm的聚对苯二甲酸乙二醇酯基材上,在用粘接剂贴合厚9μm的铝箔的带状基材的铝箔面上,以网版印刷形成蚀刻光阻剂之后,在蚀刻液中使用氯化铁水溶液,连续形成天线电路。在此,每一个天线电路的天线的宽幅为2.5mm、缝隙宽幅为0.5mm、天线电路的形成间距为3mm。
其次,在天线电路上的规定的位置上,将宽幅2m的各向异性导电粘接薄膜400(AC-2052P-45(日立化成工业(公司)制))以80℃进行积层,剥离分隔薄膜形成各向异性导电粘着剂层。
其次,准备约3000个、在相对的一组的各个面上形成有外部电极的、纵横各0.4mm、厚度0.15mm的IC芯片,投入到安装在高速芯片安装器的高速散装式供料器中。使用高速晶片安装器将通过高速散装式供料器整齐排成一列所排出的上述IC芯片依次搬送到天线基板上的规定的位置予以配置。
其次,在厚度50μm的聚对苯二甲酸乙二醇酯基材,在利用接著剂贴合厚度9μm的铝箔的宽幅2mm的带状基材的铝箔面上,将与上述铝箔同宽的上述各向异性导电粘接薄膜以80℃进行积层,剥离分隔薄膜形成附各向异性导电粘着剂层的短路板。
其次,附各向异性导电粘着剂层的短路板与天线基板,以外形尺寸为基准而与规定的位置吻合并暂时固定。接着,从附各向异性导电粘着剂层的短路板侧降下压固头,在压力3MPa、温度180℃、加热时间15秒的条件下,将附各向异性导电粘着剂层的短路板相对上述IC芯片以及天线电路一并加热压固在规定的位置,并且密封天线基板与短路板的空隙。在压固头上,以可同时进行IC芯片与天线基板以及短路板的连接和短路板以及天线基板的连接的方式,在规定的位置形成相当于上述IC芯片厚度的突起。
其次,使用冲压切断机切成一个个单片,得到图2所示的形状的嵌入物。
若采用本工序,上述IC芯片的搬送及配置所要的时间为每一个嵌入物0.2秒,上述短路板连接在天线基板所要的时间为每一个嵌入物0.375秒。
另外,与第一及第二实施方式同样地,上述IC芯片的实际安装位置精度为从规定的位置相差±0.3mm以内,就没有因偏位引起的组装不良以及通讯不良。
综合以上的实施例的结果表示为表1。
[表1]
实施方式 | 搬送及配置所要的时间(秒/个) | 连接所要的时间(秒/个) | 组装不良(不良数/个) | 通讯不良(不良数/总数) | 备考 |
第一实施方式 | 0.167 | 0.375 | 0/2000 | 0/2000 | |
第二实施方式 | 0.167 | 0.375 | 0/2000 | 0/2000 | |
第三实施方式 | 0.167 | 0.375 | 0/2000 | 0/2000 | |
第4实施方式 | 0.167,但除去了上述IC芯片卡置在上述缺口上而致使设备停止的时间 | 0.375 | 0/2000 | 0/2000 | 每2000个一次左右,上述IC芯片卡置在上述缺口,设备停止 |
第5实施方式 | 0.2 | 0.375 | 0/2000 | 0/2000 |
Claims (9)
1.一种电子装置的制造方法,该电子装置具备在相对向的一组面的每个上形成外部电极的IC芯片,形成有缝隙的发送/接收天线,以及电连接上述IC芯片与上述天线的短路板,该电子装置的制造方法的特征在于,
至少具有以下工序:
通过使用第一金属箔形成多个天线电路,并在底部基材上设置上述天线电路以形成天线基板的工序,或者,通过由设置在底部基材上的第一金属箔来设置多个天线电路以形成天线基板的工序;
排列上述IC芯片的工序;
将排列的IC芯片分别保持于多个机械手上,并通过圆盘状搬送器的旋转来进行搬送的工序,其中上述多个机械手设置在上述圆盘状搬送器外周且分别保持一个上述IC芯片;
将所搬送的IC芯片通过第一各向异性导电粘着剂层分别配置在形成有第二金属箔的短路板上以使其电连接,并制作附IC芯片短路板的工序;
在上述天线电路上的规定位置上,以电连接上述IC芯片的方式,使上述附IC芯片短路板对位的工序;以及,
在天线基板上的规定位置上,将上述附IC芯片短路板通过第二各向异性导电粘着剂层而一并加热压固的工序。
2.一种电子装置的制造方法,该电子装置具备在相对向的一组面的每个上形成外部电极的IC芯片,形成有缝隙的发送/接收天线,以及电连接上述IC芯片与上述天线的短路板,该电子装置的制造方法的特征在于,
至少具有以下工序:
通过使用第一金属箔形成多个天线电路,并在底部基材上设置上述天线电路以形成天线基板的工序,或者通过由设置在底部基材上的第一金属箔来设置多个天线电路以形成天线基板的工序;
排列上述IC芯片的工序;
将排列的IC芯片分别保持于多个机械手上,并通过圆盘状搬送器的旋转来搬送的工序,其中上述多个机械手设置在上述圆盘状搬送器外周且分别保持一个上述IC芯片;
将所搬送的上述IC芯片以电连接上述IC芯片的方式分别对位于上述天线电路的规定位置上后,通过第一各向异性导电粘着剂层来进行配置的工序;
在所配置的上述IC芯片以及天线电路上的规定位置上,以电连接的方式使形成有第二金属箔的短路板对位的工序;以及
通过第二各向异性导电粘着剂层将上述短路板一并加热压固在上述IC芯片以及天线基板上的工序。
3.一种电子装置的制造方法,该电子装置具备在相对向的一组面的每个上形成外部电极的IC芯片,形成有缝隙的发送/接收天线,以及电连接上述IC芯片与上述天线的短路板,该电子装置的制造方法的特征在于,
至少具有以下工序:
通过使用第一金属箔形成多个天线电路,并在底部基材上设置上述天线电路以形成天线基板的工序,或者通过由设置在底部基材上的第一金属箔来设置多个天线电路以形成天线基板的工序;
在上述天线电路上的规定位置上形成第一各向异性导电粘着剂层的工序;
排列上述IC芯片的工序;
将排列的IC芯片分别保持于多个机械手上,并通过圆盘状搬送器的旋转来搬送的工序,其中上述多个机械手设置在上述圆盘状搬送器外周且分别保持一个上述IC芯片;
将所搬送的上述IC芯片以电连接上述IC芯片的方式分别对位于上述天线电路的规定位置上后,通过第一各向异性导电粘着剂层来进行配置的工序;
在所配置的多个上述IC芯片以及天线电路上的规定位置上形成第二各向异性导电粘着剂层的工序;
在所配置的上述IC芯片以及天线电路上的规定位置上,以电连接的方式使形成有第二金属箔的短路板对位的工序;以及,
将上述短路板一并加热压固在多个上述IC芯片以及天线基板上的工序。
4.根据权利要求1~3任一项所述的电子装置的制造方法,其特征在于,
第一及第二金属箔的至少一方为铝。
5.根据权利要求1~3任一项所述的电子装置的制造方法,其特征在于,
第一及第二金属箔的至少一方支撑于由有机树脂所构成的底部基材上,上述有机树脂从聚氯乙烯树脂、丙烯腈-丁二烯-苯乙烯、聚对苯二甲酸乙二醇酯、乙二醇改性聚对苯二甲酸乙二醇酯、聚奈二甲酸二乙醇酯、聚碳酸酯树脂、双向拉伸聚酯及聚酰亚胺树脂中选择。
6.根据权利要求1~3任一项所述的电子装置的制造方法,其特征在于,
第一及第二金属箔的至少一方支撑于由纸所构成的底部基材上。
7.根据权利要求1~3任一项所述的电子装置的制造方法,其特征在于,
通过第一及第二各向异性导电粘着剂层的加热压固,来密封天线基板与短路板的空隙。
8.根据权利要求1~3任一项所述的电子装置的制造方法,其特征在于,
在将多个上述IC芯片与天线基板以及短路板一并加热压固的工序之后,具有将连续的天线电路切断成一个个单片的工序。
9.根据权利要求1~3任一项所述的电子装置的制造方法,其特征在于,
将短路板与上述IC芯片以及天线基板一并加热压固。
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