CN1729430A - 阻质层涂覆方法、粘性材料的使用、粘性材料及阻质层 - Google Patents
阻质层涂覆方法、粘性材料的使用、粘性材料及阻质层 Download PDFInfo
- Publication number
- CN1729430A CN1729430A CNA2003801068270A CN200380106827A CN1729430A CN 1729430 A CN1729430 A CN 1729430A CN A2003801068270 A CNA2003801068270 A CN A2003801068270A CN 200380106827 A CN200380106827 A CN 200380106827A CN 1729430 A CN1729430 A CN 1729430A
- Authority
- CN
- China
- Prior art keywords
- layer
- matter layer
- resistance matter
- viscous
- resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/34—Imagewise removal by selective transfer, e.g. peeling away
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Adhesive Tapes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10260235.2 | 2002-12-20 | ||
DE10260235A DE10260235B4 (de) | 2002-12-20 | 2002-12-20 | Verfahren zum Strukturieren einer Resistschicht und Negativ-Resistschicht |
Publications (1)
Publication Number | Publication Date |
---|---|
CN1729430A true CN1729430A (zh) | 2006-02-01 |
Family
ID=32519239
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNA2003801068270A Pending CN1729430A (zh) | 2002-12-20 | 2003-12-18 | 阻质层涂覆方法、粘性材料的使用、粘性材料及阻质层 |
Country Status (8)
Country | Link |
---|---|
US (4) | US7351514B2 (de) |
EP (1) | EP1573400A2 (de) |
JP (1) | JP2006510064A (de) |
CN (1) | CN1729430A (de) |
AU (1) | AU2003292253A1 (de) |
DE (1) | DE10260235B4 (de) |
TW (1) | TWI233540B (de) |
WO (1) | WO2004059393A2 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107645854A (zh) * | 2017-09-21 | 2018-01-30 | 台州学院 | 一种多层柔性电路板形成过孔连接的方法 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4175662B2 (ja) | 1996-01-08 | 2008-11-05 | インパルス ダイナミクス エヌ.ヴイ. | 電気的筋肉制御装置 |
US9289618B1 (en) | 1996-01-08 | 2016-03-22 | Impulse Dynamics Nv | Electrical muscle controller |
US9713723B2 (en) | 1996-01-11 | 2017-07-25 | Impulse Dynamics Nv | Signal delivery through the right ventricular septum |
WO2006073671A1 (en) | 2004-12-09 | 2006-07-13 | Impulse Dynamics Nv | Protein activity modification |
DE10260235B4 (de) * | 2002-12-20 | 2010-10-28 | Infineon Technologies Ag | Verfahren zum Strukturieren einer Resistschicht und Negativ-Resistschicht |
US11439815B2 (en) | 2003-03-10 | 2022-09-13 | Impulse Dynamics Nv | Protein activity modification |
US11779768B2 (en) | 2004-03-10 | 2023-10-10 | Impulse Dynamics Nv | Protein activity modification |
WO2006119467A2 (en) | 2005-05-04 | 2006-11-09 | Impulse Dynamics Nv | Protein activity modification |
KR101318517B1 (ko) * | 2008-05-30 | 2013-10-16 | 코오롱인더스트리 주식회사 | 필름형 광분해성 전사재료 |
US8934975B2 (en) | 2010-02-01 | 2015-01-13 | Metacure Limited | Gastrointestinal electrical therapy |
KR101084811B1 (ko) | 2010-08-20 | 2011-11-21 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
Family Cites Families (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3469982A (en) * | 1968-09-11 | 1969-09-30 | Jack Richard Celeste | Process for making photoresists |
JPS4829541B1 (de) * | 1969-06-13 | 1973-09-11 | ||
CA1099435A (en) * | 1971-04-01 | 1981-04-14 | Gwendyline Y. Y. T. Chen | Photosensitive block copolymer composition and elements |
US3961961A (en) | 1972-11-20 | 1976-06-08 | Minnesota Mining And Manufacturing Company | Positive or negative developable photosensitive composition |
JPS6032173B2 (ja) * | 1974-12-28 | 1985-07-26 | 富士写真フイルム株式会社 | 画像形成法 |
GB2049972B (en) * | 1977-07-12 | 1982-06-23 | Asahi Chemical Ind | Photosensitive element for producing a printed circuit board |
US4289841A (en) * | 1978-02-26 | 1981-09-15 | E. I. Du Pont De Nemours And Company | Dry-developing photosensitive dry film resist |
WO1980001321A1 (en) * | 1978-12-25 | 1980-06-26 | N Smirnova | Dry film photoresist |
US4349620A (en) * | 1979-06-15 | 1982-09-14 | E. I. Du Pont De Nemours And Company | Solvent developable photoresist film |
US4289481A (en) * | 1979-07-06 | 1981-09-15 | Comet, Inc. | Fuel and apparatus for drying grain |
US4357413A (en) * | 1980-04-28 | 1982-11-02 | E. I. Du Pont De Nemours And Company | Dry-developing photosensitive dry film resist |
US4528261A (en) * | 1983-03-28 | 1985-07-09 | E. I. Du Pont De Nemours And Company | Prelamination, imagewise exposure of photohardenable layer in process for sensitizing, registering and exposing circuit boards |
DE3473065D1 (en) * | 1983-11-26 | 1988-09-01 | Basf Ag | Process for the production of resist images and dry resist film for this process |
US4571374A (en) * | 1984-12-27 | 1986-02-18 | Minnesota Mining And Manufacturing Company | Multilayer dry-film positive-acting laminable photoresist with two photoresist layers wherein one layer includes thermal adhesive |
US4652513A (en) | 1985-09-18 | 1987-03-24 | Vacuum Applied Coatings Corp. | Method for creating a design in relief in a hard smooth substrate and apparatus for use in the method |
US4826705A (en) * | 1986-07-02 | 1989-05-02 | Loctite Corporation | Radiation curable temporary solder mask |
US4698294A (en) | 1986-09-12 | 1987-10-06 | E. I. Du Pont De Nemours And Company | Lamination of photopolymerizable film onto a substrate employing an intermediate nonphotosensitive liquid layer |
US5015059A (en) * | 1988-01-15 | 1991-05-14 | E. I. Du Pont De Nemours And Company | Optical fiber connector assemblies and methods of making the assemblies |
JPH0796664B2 (ja) * | 1988-11-08 | 1995-10-18 | 出光石油化学株式会社 | 硬化性樹脂組成物 |
US5049623A (en) * | 1989-08-03 | 1991-09-17 | Monsanto Company | Ethylenically unsaturated carbamates and coating compositions |
CA2031776A1 (en) * | 1989-12-08 | 1991-06-09 | Masanori Nishiguchi | Pickup method and the pickup apparatus for chip-type part |
DE4000038A1 (de) * | 1990-01-03 | 1991-07-04 | Hoechst Ag | Polyesterfolie mit verbesserten hafteigenschaften |
US5077174A (en) | 1990-04-10 | 1991-12-31 | E. I. Du Pont De Nemours And Company | Positive working dry film element having a layer of resist composition |
US5106450A (en) * | 1990-12-20 | 1992-04-21 | International Business Machines Corporation | Dry film resist transport and lamination system for semiconductor wafers |
US5250387A (en) * | 1992-01-29 | 1993-10-05 | E. I. Du Pont De Nemours And Company | Transfer process using ultraviolet curable, non-prolonged tack toning materials |
EP0559248B1 (de) * | 1992-02-29 | 1999-06-16 | Agfa-Gevaert N.V. | Bildaufzeichnungselement, als photoempfindliches Element eine photopolymerisierbare Zusammensetzung enthaltend |
US5378583A (en) | 1992-12-22 | 1995-01-03 | Wisconsin Alumni Research Foundation | Formation of microstructures using a preformed photoresist sheet |
US5378298A (en) * | 1993-06-01 | 1995-01-03 | Motorola, Inc. | Radiation sensitive adhesive composition and method of photoimagingsame |
US5466325A (en) * | 1993-06-02 | 1995-11-14 | Nitto Denko Corporation | Resist removing method, and curable pressure-sensitive adhesive, adhesive sheets and apparatus used for the method |
JP3396357B2 (ja) | 1995-11-16 | 2003-04-14 | 日東電工株式会社 | レジスト除去装置 |
JP3800650B2 (ja) * | 1995-11-17 | 2006-07-26 | 凸版印刷株式会社 | プラズマディスプレイパネルの製造方法 |
US6224976B1 (en) * | 1996-08-14 | 2001-05-01 | Asahi Kogaku Kogyo Kabushiki Kaisha | Adhesive transparent resin and a composite including the same |
JPH1167626A (ja) | 1997-08-12 | 1999-03-09 | Hitachi Ltd | レジスト除去方法および装置 |
MY120763A (en) * | 1997-09-19 | 2005-11-30 | Hitachi Chemical Co Ltd | Photosensitive film, process for laminating photosensitive resin layer, photosensitive resin layer-laminated substrate and process for curing photosensitive resin layer |
US6100006A (en) * | 1999-08-19 | 2000-08-08 | E. I. Du Pont De Nemours And Company | Peel-apart photosensitive elements and their process of use |
US20030091926A1 (en) * | 1999-11-03 | 2003-05-15 | Shipley Company, L.L.C. | Dry film photoresist |
AU7078301A (en) | 2000-07-11 | 2002-01-21 | Pharma Mar Sa | Variolin derivatives as anti-cancer agents |
JP2002231600A (ja) * | 2001-01-30 | 2002-08-16 | Nitto Denko Corp | レジスト除去用接着テープとレジスト除去方法 |
CN1512934A (zh) * | 2001-12-10 | 2004-07-14 | ���˶Ű�����ձ���ʽ���� | 光学用粘结性聚酯膜 |
DE10260235B4 (de) * | 2002-12-20 | 2010-10-28 | Infineon Technologies Ag | Verfahren zum Strukturieren einer Resistschicht und Negativ-Resistschicht |
US6842288B1 (en) * | 2003-10-30 | 2005-01-11 | 3M Innovative Properties Company | Multilayer optical adhesives and articles |
KR101318517B1 (ko) * | 2008-05-30 | 2013-10-16 | 코오롱인더스트리 주식회사 | 필름형 광분해성 전사재료 |
-
2002
- 2002-12-20 DE DE10260235A patent/DE10260235B4/de not_active Expired - Fee Related
-
2003
- 2003-12-12 TW TW092135306A patent/TWI233540B/zh not_active IP Right Cessation
- 2003-12-18 EP EP03767816A patent/EP1573400A2/de not_active Withdrawn
- 2003-12-18 JP JP2004562781A patent/JP2006510064A/ja active Pending
- 2003-12-18 WO PCT/EP2003/014460 patent/WO2004059393A2/de not_active Application Discontinuation
- 2003-12-18 AU AU2003292253A patent/AU2003292253A1/en not_active Abandoned
- 2003-12-18 CN CNA2003801068270A patent/CN1729430A/zh active Pending
-
2005
- 2005-06-20 US US11/156,405 patent/US7351514B2/en not_active Ceased
-
2007
- 2007-11-20 US US11/943,145 patent/US8003292B2/en not_active Expired - Fee Related
-
2010
- 2010-03-29 US US12/798,150 patent/USRE42980E1/en not_active Expired - Fee Related
-
2011
- 2011-07-08 US US13/178,710 patent/US8415080B2/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107645854A (zh) * | 2017-09-21 | 2018-01-30 | 台州学院 | 一种多层柔性电路板形成过孔连接的方法 |
Also Published As
Publication number | Publication date |
---|---|
US8003292B2 (en) | 2011-08-23 |
US8415080B2 (en) | 2013-04-09 |
AU2003292253A1 (en) | 2004-07-22 |
TWI233540B (en) | 2005-06-01 |
TW200413857A (en) | 2004-08-01 |
USRE42980E1 (en) | 2011-11-29 |
WO2004059393A3 (de) | 2005-04-07 |
US20080305428A1 (en) | 2008-12-11 |
US20110269073A1 (en) | 2011-11-03 |
US7351514B2 (en) | 2008-04-01 |
AU2003292253A8 (en) | 2004-07-22 |
EP1573400A2 (de) | 2005-09-14 |
WO2004059393A2 (de) | 2004-07-15 |
DE10260235A1 (de) | 2004-07-22 |
US20050266353A1 (en) | 2005-12-01 |
JP2006510064A (ja) | 2006-03-23 |
DE10260235B4 (de) | 2010-10-28 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |