CN1726607A - 有机电致发光器件及其制造方法 - Google Patents

有机电致发光器件及其制造方法 Download PDF

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Publication number
CN1726607A
CN1726607A CNA2003801064250A CN200380106425A CN1726607A CN 1726607 A CN1726607 A CN 1726607A CN A2003801064250 A CNA2003801064250 A CN A2003801064250A CN 200380106425 A CN200380106425 A CN 200380106425A CN 1726607 A CN1726607 A CN 1726607A
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China
Prior art keywords
electrode
organic electroluminescent
conductive layer
electroluminescent device
conductive
Prior art date
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Pending
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CNA2003801064250A
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English (en)
Chinese (zh)
Inventor
F·B·麦克尔米克
J·E·奥特曼
R·帕迪雅思
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication of CN1726607A publication Critical patent/CN1726607A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H10K59/351—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels comprising more than three subpixels, e.g. red-green-blue-white [RGBW]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14—Carrier transporting layers
    • H10K50/16—Electron transporting layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/221—Static displays, e.g. displaying permanent logos
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/17—Passive-matrix OLED displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
CNA2003801064250A 2002-12-19 2003-10-10 有机电致发光器件及其制造方法 Pending CN1726607A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/324,585 US6975067B2 (en) 2002-12-19 2002-12-19 Organic electroluminescent device and encapsulation method
US10/324,585 2002-12-19

Publications (1)

Publication Number Publication Date
CN1726607A true CN1726607A (zh) 2006-01-25

Family

ID=32593491

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2003801064250A Pending CN1726607A (zh) 2002-12-19 2003-10-10 有机电致发光器件及其制造方法

Country Status (10)

Country Link
US (2) US6975067B2 (enExample)
EP (1) EP1579517A1 (enExample)
JP (1) JP4855682B2 (enExample)
KR (1) KR100983446B1 (enExample)
CN (1) CN1726607A (enExample)
AU (1) AU2003277364A1 (enExample)
MX (1) MXPA05006240A (enExample)
MY (1) MY141533A (enExample)
TW (1) TWI351236B (enExample)
WO (1) WO2004061992A1 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102439751A (zh) * 2009-04-23 2012-05-02 荷兰应用科学研究会(Tno) 光电装置以及制造所述光电装置的方法
CN102812577A (zh) * 2010-03-22 2012-12-05 皇家飞利浦电子股份有限公司 制造具有空间隔离的发光区的oled器件的方法
CN107591622A (zh) * 2016-07-08 2018-01-16 三星电机株式会社 无线通信天线及其制造方法
CN108496409A (zh) * 2016-01-26 2018-09-04 住友化学株式会社 有机el元件

Families Citing this family (167)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6623861B2 (en) 2001-04-16 2003-09-23 Battelle Memorial Institute Multilayer plastic substrates
US6413645B1 (en) 2000-04-20 2002-07-02 Battelle Memorial Institute Ultrabarrier substrates
US6866901B2 (en) * 1999-10-25 2005-03-15 Vitex Systems, Inc. Method for edge sealing barrier films
US7198832B2 (en) 1999-10-25 2007-04-03 Vitex Systems, Inc. Method for edge sealing barrier films
US20100330748A1 (en) 1999-10-25 2010-12-30 Xi Chu Method of encapsulating an environmentally sensitive device
US20070196682A1 (en) * 1999-10-25 2007-08-23 Visser Robert J Three dimensional multilayer barrier and method of making
US8900366B2 (en) 2002-04-15 2014-12-02 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
US8808457B2 (en) 2002-04-15 2014-08-19 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
KR100475849B1 (ko) * 2002-04-17 2005-03-10 한국전자통신연구원 습식 공정에 의하여 형성된 엔캡슐레이션 박막을 갖춘유기 전기발광 소자 및 그 제조 방법
US8405107B2 (en) * 2002-07-15 2013-03-26 Epistar Corporation Light-emitting element
JP3729262B2 (ja) * 2002-08-29 2005-12-21 セイコーエプソン株式会社 エレクトロルミネセンス装置及び電子機器
JP3997888B2 (ja) 2002-10-25 2007-10-24 セイコーエプソン株式会社 電気光学装置、電気光学装置の製造方法及び電子機器
US7235920B2 (en) * 2003-02-24 2007-06-26 Osram Opto Semiconductors Gmbh Display device and method of its manufacture
JP4197447B2 (ja) * 2003-03-31 2008-12-17 富士フイルム株式会社 有機電界発光素子の製造方法及びその有機電界発光素子
US7018713B2 (en) * 2003-04-02 2006-03-28 3M Innovative Properties Company Flexible high-temperature ultrabarrier
US7202602B2 (en) * 2003-04-08 2007-04-10 Organic Lighting Technologies Llc Metal seal packaging for organic light emitting diode device
US7510913B2 (en) 2003-04-11 2009-03-31 Vitex Systems, Inc. Method of making an encapsulated plasma sensitive device
US7648925B2 (en) 2003-04-11 2010-01-19 Vitex Systems, Inc. Multilayer barrier stacks and methods of making multilayer barrier stacks
KR100826424B1 (ko) * 2003-04-21 2008-04-29 삼성전기주식회사 반도체 발광 다이오드 및 그 제조방법
US7432124B2 (en) * 2003-11-04 2008-10-07 3M Innovative Properties Company Method of making an organic light emitting device
US7271534B2 (en) 2003-11-04 2007-09-18 3M Innovative Properties Company Segmented organic light emitting device
KR100565636B1 (ko) * 2003-12-02 2006-03-30 엘지전자 주식회사 유기 ｅｌ 소자 및 그의 제조방법
KR100553758B1 (ko) * 2004-02-02 2006-02-20 삼성에스디아이 주식회사 유기 전계 발광 소자
JP2005276514A (ja) * 2004-03-23 2005-10-06 Dainippon Printing Co Ltd 有機ｅｌ素子
US20050248270A1 (en) * 2004-05-05 2005-11-10 Eastman Kodak Company Encapsulating OLED devices
GB2416621A (en) * 2004-07-27 2006-02-01 Cambridge Display Tech Ltd Laminated interconnects for opto-electronic device modules
JP2006107996A (ja) * 2004-10-07 2006-04-20 Dainippon Printing Co Ltd 発光表示パネル
US7258469B2 (en) * 2004-10-27 2007-08-21 Eastman Kodak Company Touch light panel
JP2006185840A (ja) * 2004-12-28 2006-07-13 Tohoku Pioneer Corp シート状乾燥部材、有機ｅｌパネル、有機ｅｌパネルの製造方法
US9530968B2 (en) * 2005-02-15 2016-12-27 Semiconductor Energy Laboratory Co., Ltd. Light emitting element and light emitting device
WO2006087653A2 (en) * 2005-02-16 2006-08-24 Koninklijke Philips Electronics N.V. An oled device
US20060226429A1 (en) * 2005-04-08 2006-10-12 Sigalas Mihail M Method and apparatus for directional organic light emitting diodes
US7586247B2 (en) * 2005-04-18 2009-09-08 Jiahn-Chang Wu Ballast for light emitting device
US20070020451A1 (en) * 2005-07-20 2007-01-25 3M Innovative Properties Company Moisture barrier coatings
KR20120128155A (ko) 2005-08-12 2012-11-26 캄브리오스 테크놀로지즈 코포레이션 나노와이어 기반의 투명 도전체
US7722929B2 (en) * 2005-08-18 2010-05-25 Corning Incorporated Sealing technique for decreasing the time it takes to hermetically seal a device and the resulting hermetically sealed device
US20080206589A1 (en) * 2007-02-28 2008-08-28 Bruce Gardiner Aitken Low tempertature sintering using Sn2+ containing inorganic materials to hermetically seal a device
US7829147B2 (en) 2005-08-18 2010-11-09 Corning Incorporated Hermetically sealing a device without a heat treating step and the resulting hermetically sealed device
US20070040501A1 (en) * 2005-08-18 2007-02-22 Aitken Bruce G Method for inhibiting oxygen and moisture degradation of a device and the resulting device
US7767498B2 (en) 2005-08-25 2010-08-03 Vitex Systems, Inc. Encapsulated devices and method of making
US8058093B2 (en) * 2005-08-26 2011-11-15 Global Photonic Energy Corp. Method of forming an encapsulating electrode
US7378781B2 (en) * 2005-09-07 2008-05-27 Nokia Corporation Acoustic wave resonator with integrated temperature control for oscillator purposes
KR20080063794A (ko) * 2005-09-28 2008-07-07 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 유기 다이오드 디바이스 및 그 형성 방법
JP4857688B2 (ja) * 2005-09-29 2012-01-18 カシオ計算機株式会社 表示装置及びその製造方法
US20070131949A1 (en) * 2005-12-12 2007-06-14 General Electric Company Color tunable light-emitting devices and method of making the same
US20070132371A1 (en) * 2005-12-12 2007-06-14 General Electric Company Color tunable light-emitting devices and method of making the same
TW200726311A (en) * 2005-12-30 2007-07-01 Au Optronics Corp Display panel structure with shielding structure
US20070176539A1 (en) * 2006-02-01 2007-08-02 Osram Opto Semiconductors Gmbh OLED with area defined multicolor emission within a single lighting element
KR100868427B1 (ko) * 2006-05-10 2008-11-11 가시오게산키 가부시키가이샤 표시장치 및 그 제조방법
US20080048178A1 (en) * 2006-08-24 2008-02-28 Bruce Gardiner Aitken Tin phosphate barrier film, method, and apparatus
US7714340B2 (en) * 2006-09-06 2010-05-11 Palo Alto Research Center Incorporated Nitride light-emitting device
US8017220B2 (en) * 2006-10-04 2011-09-13 Corning Incorporated Electronic device and method of making
TWI358537B (en) * 2006-10-04 2012-02-21 Corning Inc Method and apparatus for proof testing a sheet of
WO2008147431A2 (en) * 2006-10-12 2008-12-04 Cambrios Technologies Corporation Functional films formed by highly oriented deposition of nanowires
EP3595016A1 (en) 2006-10-12 2020-01-15 Cambrios Film Solutions Corporation Nanowire-based transparent conductors and method of making them
US8018568B2 (en) 2006-10-12 2011-09-13 Cambrios Technologies Corporation Nanowire-based transparent conductors and applications thereof
US8203073B2 (en) 2006-11-02 2012-06-19 Guardian Industries Corp. Front electrode for use in photovoltaic device and method of making same
US20080105298A1 (en) * 2006-11-02 2008-05-08 Guardian Industries Corp. Front electrode for use in photovoltaic device and method of making same
US20080105293A1 (en) * 2006-11-02 2008-05-08 Guardian Industries Corp. Front electrode for use in photovoltaic device and method of making same
US7964788B2 (en) 2006-11-02 2011-06-21 Guardian Industries Corp. Front electrode for use in photovoltaic device and method of making same
US8076571B2 (en) 2006-11-02 2011-12-13 Guardian Industries Corp. Front electrode for use in photovoltaic device and method of making same
US8012317B2 (en) 2006-11-02 2011-09-06 Guardian Industries Corp. Front electrode including transparent conductive coating on patterned glass substrate for use in photovoltaic device and method of making same
RU2452140C2 (ru) * 2006-12-12 2012-05-27 Конинклейке Филипс Электроникс Н.В. Управляемая напряжением слоистая компоновка
JP5249240B2 (ja) * 2006-12-29 2013-07-31 スリーエム イノベイティブ プロパティズ カンパニー 金属アルコキシド含有フィルムの硬化方法
US8334452B2 (en) 2007-01-08 2012-12-18 Guardian Industries Corp. Zinc oxide based front electrode doped with yttrium for use in photovoltaic device or the like
EP2137338A2 (en) * 2007-03-28 2009-12-30 Dow Corning Corporation Roll-to-roll plasma enhanced chemical vapor deposition method of barrier layers comprising silicon and carbon
CN101689568B (zh) 2007-04-20 2014-02-26 凯博瑞奥斯技术公司 复合透明导体及其形成方法
US8179034B2 (en) 2007-07-13 2012-05-15 3M Innovative Properties Company Light extraction film for organic light emitting diode display and lighting devices
US20090015142A1 (en) * 2007-07-13 2009-01-15 3M Innovative Properties Company Light extraction film for organic light emitting diode display devices
US20100299978A1 (en) * 2007-08-27 2010-12-02 Bayer Materialscience Ag Marking having electroluminescent lighting effect, method for the production thereof
ITTO20070116U1 (it) * 2007-09-11 2009-03-12 Enea Ente Nuove Tec Dispositivo elettronico organico incapsulato, con migliorata resistenza al degrado
JP4497185B2 (ja) * 2007-09-18 2010-07-07 カシオ計算機株式会社 表示装置の製造方法
US7888594B2 (en) * 2007-11-20 2011-02-15 Guardian Industries Corp. Photovoltaic device including front electrode having titanium oxide inclusive layer with high refractive index
CN101945965A (zh) 2007-12-28 2011-01-12 3M创新有限公司 柔性封装膜系统
EP2252662A1 (en) * 2008-02-26 2010-11-24 Cambrios Technologies Corporation Methods and compositions for ink jet deposition of conductive features
KR20110020862A (ko) * 2008-06-02 2011-03-03 쓰리엠 이노베이티브 프로퍼티즈 컴파니 접착성 캡슐화 조성물 및 그것을 사용하여 제조한 전자 소자
CN102083930B (zh) * 2008-06-02 2013-12-11 3M创新有限公司 粘合剂封装组合物以及用其制备的电子器件
US12064979B2 (en) 2008-06-13 2024-08-20 Kateeva, Inc. Low-particle gas enclosure systems and methods
US12018857B2 (en) 2008-06-13 2024-06-25 Kateeva, Inc. Gas enclosure assembly and system
US10434804B2 (en) 2008-06-13 2019-10-08 Kateeva, Inc. Low particle gas enclosure systems and methods
US11975546B2 (en) 2008-06-13 2024-05-07 Kateeva, Inc. Gas enclosure assembly and system
US9481927B2 (en) 2008-06-30 2016-11-01 3M Innovative Properties Company Method of making inorganic or inorganic/organic hybrid barrier films
EP2144290A1 (en) * 2008-07-08 2010-01-13 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Electronic device and method of manufacturing the same
KR101415252B1 (ko) * 2008-07-22 2014-07-04 삼성디스플레이 주식회사 유기 발광 표시 장치
TWI367442B (en) * 2008-08-27 2012-07-01 Au Optronics Corp Touch panel
US8022291B2 (en) 2008-10-15 2011-09-20 Guardian Industries Corp. Method of making front electrode of photovoltaic device having etched surface and corresponding photovoltaic device
US20100110551A1 (en) * 2008-10-31 2010-05-06 3M Innovative Properties Company Light extraction film with high index backfill layer and passivation layer
US7957621B2 (en) 2008-12-17 2011-06-07 3M Innovative Properties Company Light extraction film with nanoparticle coatings
US9184410B2 (en) 2008-12-22 2015-11-10 Samsung Display Co., Ltd. Encapsulated white OLEDs having enhanced optical output
US9337446B2 (en) 2008-12-22 2016-05-10 Samsung Display Co., Ltd. Encapsulated RGB OLEDs having enhanced optical output
KR100967273B1 (ko) * 2008-12-29 2010-07-01 인하대학교 산학협력단 셀룰로오스로 만든 전자 디스플레이 종이의 제조방법
CN102308408B (zh) * 2009-02-05 2016-03-16 皇家飞利浦电子股份有限公司 封装的电致发光设备
WO2010093237A1 (en) * 2009-02-11 2010-08-19 Nederlandse Organisatie Voor Toegepast- Natuurwetenschappelijk Onderzoek Tno Optoelectronic device and method for fabricating such device
WO2010128439A1 (en) 2009-05-08 2010-11-11 Koninklijke Philips Electronics N. V. Electroluminescent device
US20100294526A1 (en) * 2009-05-21 2010-11-25 General Electric Company Hermetic electrical package
US8525407B2 (en) * 2009-06-24 2013-09-03 Semiconductor Energy Laboratory Co., Ltd. Light source and device having the same
WO2011025782A1 (en) 2009-08-24 2011-03-03 Cambrios Technologies Corporation Contact resistance measurement for resistance linearity in nanostructure thin films
SG10201709677PA (en) 2009-09-29 2017-12-28 Solvay Usa Inc Organic electronic devices, compositions, and methods
US8833971B2 (en) * 2009-10-12 2014-09-16 Bml Productions, Inc. Subsurface organic light emitting diode display
JP2011090878A (ja) * 2009-10-22 2011-05-06 Fujifilm Corp 透明導電体の製造方法
US20110186120A1 (en) * 2009-11-05 2011-08-04 Guardian Industries Corp. Textured coating with various feature sizes made by using multiple-agent etchant for thin-film solar cells and/or methods of making the same
US20110168252A1 (en) * 2009-11-05 2011-07-14 Guardian Industries Corp. Textured coating with etching-blocking layer for thin-film solar cells and/or methods of making the same
US8502066B2 (en) * 2009-11-05 2013-08-06 Guardian Industries Corp. High haze transparent contact including insertion layer for solar cells, and/or method of making the same
US8590338B2 (en) 2009-12-31 2013-11-26 Samsung Mobile Display Co., Ltd. Evaporator with internal restriction
JP2013522814A (ja) 2010-02-24 2013-06-13 カンブリオス テクノロジーズ コーポレイション ナノワイヤベースの透明導体およびそれをパターン形成するための方法
WO2011119707A2 (en) 2010-03-23 2011-09-29 Cambrios Technologies Corporation Etch patterning of nanostructure transparent conductors
US9778470B2 (en) 2010-09-22 2017-10-03 Koninklijke Philips Electronics N.V. Multi-view display device
KR101837656B1 (ko) * 2010-11-22 2018-03-13 삼성디스플레이 주식회사 액정표시장치
US8692457B2 (en) 2010-12-20 2014-04-08 General Electric Company Large area light emitting electrical package with current spreading bus
KR101771581B1 (ko) 2011-05-23 2017-08-28 삼성디스플레이 주식회사 유기 전계 발광 소자
TWI565119B (zh) * 2011-05-27 2017-01-01 半導體能源研究所股份有限公司 發光裝置的製造方法及發光裝置
KR101328867B1 (ko) * 2011-06-02 2013-11-13 삼성전자주식회사 투명 접착 유닛 및 이를 구비한 터치스크린
US8747959B2 (en) 2011-06-30 2014-06-10 Guardian Industries Corp. Planar patterned transparent contact, devices with planar patterned transparent contacts, and/or methods of making the same
US20130005139A1 (en) * 2011-06-30 2013-01-03 Guardian Industries Corp. Techniques for manufacturing planar patterned transparent contact and/or electronic devices including same
CN103959125A (zh) * 2011-10-05 2014-07-30 新加坡恒立私人有限公司 微光学系统及其制造方法
FR2985378B1 (fr) * 2011-12-30 2014-01-24 Saint Gobain Dispositif oled a emission par l'arriere, et procede d'homogeneisation de la luminance d'un dispositif oled a emission par l'arriere
FR2985379B1 (fr) * 2011-12-30 2014-01-24 Saint Gobain Dispositif oled a emission par l'arriere
KR101985053B1 (ko) 2012-03-27 2019-05-31 쓰리엠 이노베이티브 프로퍼티즈 컴파니 광 지향 매체를 포함하는 광기전 모듈 및 이를 제조하는 방법
US11230338B2 (en) 2012-03-28 2022-01-25 Salvaggio Jr David Integrated electronic component in vehicle body
DE102012106815A1 (de) * 2012-07-26 2014-01-30 Heliatek Gmbh Verfahren zur Kontaktierung optoelektronischer Bauelemente
SG11201504125UA (en) 2012-12-07 2015-06-29 3M Innovative Properties Co Method of making transparent conductors on a substrate
US8957322B2 (en) 2012-12-07 2015-02-17 Cambrios Technologies Corporation Conductive films having low-visibility patterns and methods of producing the same
JP2016511913A (ja) 2013-01-22 2016-04-21 カンブリオス テクノロジーズ コーポレイション Ｅｓｄ保護のための高熱安定性を有するナノ構造透明導体
US10971277B2 (en) 2013-02-15 2021-04-06 Cambrios Film Solutions Corporation Methods to incorporate silver nanowire-based transparent conductors in electronic devices
US10720257B2 (en) 2013-02-15 2020-07-21 Cambrios Film Solutions Corporation Methods to incorporate silver nanowire-based transparent conductors in electronic devices
JP6588829B2 (ja) 2013-02-15 2019-10-09 カンブリオス フィルム ソリューションズ コーポレーション 光学スタック
US20140262443A1 (en) * 2013-03-14 2014-09-18 Cambrios Technologies Corporation Hybrid patterned nanostructure transparent conductors
CN105247697A (zh) 2013-07-31 2016-01-13 沙特基础工业全球技术公司 用于制造具有微米或纳米结构导电层的材料的方法
SG11201600591VA (en) 2013-07-31 2016-02-26 3M Innovative Properties Co Bonding electronic components to patterned nanowire transparent conductors
KR102113175B1 (ko) * 2013-08-19 2020-05-21 삼성디스플레이 주식회사 유기 발광 표시 장치
US9807871B2 (en) 2013-08-28 2017-10-31 3M Innovative Properties Company Electronic assembly with fiducial marks for precision registration during subsequent processing steps
US9759846B2 (en) 2013-09-27 2017-09-12 Cam Holding Corporation Silver nanostructure-based optical stacks and touch sensors with UV protection
CN104516577B (zh) 2013-09-29 2016-06-01 宸鸿科技(厦门)有限公司 触控面板
US10362685B2 (en) 2013-09-30 2019-07-23 3M Innovative Properties Company Protective coating for printed conductive pattern on patterned nanowire transparent conductors
JP6392874B2 (ja) 2013-12-26 2018-09-19 カティーバ， インコーポレイテッド 電子デバイスの熱処理のための装置および技法
KR102669753B1 (ko) 2014-01-21 2024-05-28 카티바, 인크. 전자 장치 인캡슐레이션을 위한 기기 및 기술
US9343678B2 (en) 2014-01-21 2016-05-17 Kateeva, Inc. Apparatus and techniques for electronic device encapsulation
DE102014104229B4 (de) * 2014-03-26 2023-05-04 Pictiva Displays International Limited Organisches optoelektronisches Bauelement und Verfahren zur Herstellung eines organischen optoelektronischen Bauelements
DE102014205747A1 (de) * 2014-03-27 2015-10-01 Tridonic Gmbh & Co Kg Leuchtmodul und Herstellungsverfahren für ein Leuchtmodul
KR102483666B1 (ko) * 2014-04-30 2023-01-02 카티바, 인크. 가스 쿠션 장비 및 기판 코팅 기술
WO2016073717A1 (en) 2014-11-05 2016-05-12 Champ Great Int'l Corporation Short-chain fluorosurfactants with iodide additives for forming silver nanowire-based transparent conductive films
US11284521B2 (en) 2015-06-30 2022-03-22 3M Innovative Properties, Company Electronic devices comprising a via and methods of forming such electronic devices
EP3317753B1 (en) 2015-06-30 2022-11-02 3M Innovative Properties Company Patterned overcoat layer
US10829605B2 (en) 2015-07-02 2020-11-10 Sabic Global Technologies B.V. Process and material for growth of adsorbed compound via nanoscale-controlled resistive heating and uses thereof
DE102015111564A1 (de) * 2015-07-16 2017-01-19 Osram Oled Gmbh Organisches optoelektronisches Bauteil und Herstellungsverfahren hierfür
JP2018156722A (ja) * 2015-08-19 2018-10-04 株式会社カネカ 有機ｅｌパネル
WO2017048633A1 (en) 2015-09-16 2017-03-23 3M Innovative Properties Company Overcoated patterned conductive layer and methods
EP3362744A4 (en) 2015-10-12 2019-06-12 3M Innovative Properties Company USEABLE LUMINOUS FILM WITH SOLAR MODULES
DE102015223053B4 (de) * 2015-11-23 2020-03-12 Thyssenkrupp Ag Verfahren zur Herstellung eines Funktionsmoduls
CN205582942U (zh) * 2016-03-11 2016-09-14 鄂尔多斯市源盛光电有限责任公司 基板及显示装置
WO2017176498A1 (en) 2016-04-05 2017-10-12 3M Innovative Properties Company Nanowire contact pads with enhanced adhesion to metal interconnects
CN110167833B (zh) * 2016-10-31 2021-11-09 D·萨尔瓦焦 车辆本体中的集成电子部件
CN110121921A (zh) 2016-12-29 2019-08-13 3M创新有限公司 用于制备导电图案的方法以及包含导电图案的制品
KR102482456B1 (ko) * 2017-03-13 2022-12-29 삼성디스플레이 주식회사 유기 발광 표시 장치 및 유기 발광 표시 장치의 제조 방법
US10987902B2 (en) 2017-07-10 2021-04-27 Guardian Glass, LLC Techniques for laser ablation/scribing of coatings in pre- and post-laminated assemblies, and/or associated methods
US11148228B2 (en) 2017-07-10 2021-10-19 Guardian Glass, LLC Method of making insulated glass window units
AU2019213710B2 (en) 2018-01-30 2021-08-12 3M Innovative Properties Company Light redirecting device and solar cell module comprising said device
CN112567280A (zh) 2018-08-31 2021-03-26 3M创新有限公司 用于太阳能组件的具有杂散光减轻特性的光重定向膜
US20230109576A1 (en) * 2020-03-31 2023-04-06 Sony Group Corporation Display device and electronic apparatus
KR20210145026A (ko) * 2020-05-22 2021-12-01 삼성디스플레이 주식회사 전자 장치
KR20230124564A (ko) * 2020-12-25 2023-08-25 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 디바이스, 발광 장치, 전자 기기, 및 조명 장치
US20240065054A1 (en) * 2021-01-14 2024-02-22 Semiconductor Energy Laboratory Co., Ltd. Display device and method for fabricating display device
JP7775233B2 (ja) * 2021-02-09 2025-11-25 株式会社Magnolia White 表示装置
CN113161499B (zh) * 2021-04-13 2022-06-17 浙江大学 光电器件及其制造方法
KR20220161643A (ko) * 2021-05-28 2022-12-07 삼성디스플레이 주식회사 표시 장치
CN118266267A (zh) * 2021-11-26 2024-06-28 索尼半导体解决方案公司 显示装置及电子设备
WO2023144656A1 (ja) * 2022-01-31 2023-08-03 株式会社半導体エネルギー研究所 表示装置

Family Cites Families (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2580416B1 (fr) * 1985-04-12 1987-06-05 Radiotechnique Compelec Procede et dispositif pour fabriquer une carte d'identification electronique
GB8909011D0 (en) 1989-04-20 1989-06-07 Friend Richard H Electroluminescent devices
US5104731A (en) * 1990-08-24 1992-04-14 Arkwright Incorporated Dry toner imaging films possessing an anti-static matrix layer
US5408109A (en) 1991-02-27 1995-04-18 The Regents Of The University Of California Visible light emitting diodes fabricated from soluble semiconducting polymers
WO1995010117A1 (en) 1993-10-04 1995-04-13 Catalina Coatings, Inc. Cross-linked acrylate coating material useful for forming capacitor dielectrics and oxygen barriers
DE59510315D1 (de) 1994-04-07 2002-09-19 Covion Organic Semiconductors Spiroverbindungen und ihre Verwendung als Elektrolumineszenzmaterialien
DE4436773A1 (de) 1994-10-14 1996-04-18 Hoechst Ag Konjugierte Polymere mit Spirozentren und ihre Verwendung als Elektrolumineszenzmaterialien
US5707745A (en) 1994-12-13 1998-01-13 The Trustees Of Princeton University Multicolor organic light emitting devices
US5607789A (en) 1995-01-23 1997-03-04 Duracell Inc. Light transparent multilayer moisture barrier for electrochemical cell tester and cell employing same
US5587589A (en) 1995-03-22 1996-12-24 Motorola Two dimensional organic light emitting diode array for high density information image manifestation apparatus
US5530581A (en) 1995-05-31 1996-06-25 Eic Laboratories, Inc. Protective overlayer material and electro-optical coating using same
JP3865406B2 (ja) 1995-07-28 2007-01-10 住友化学株式会社 ２，７−アリール−９−置換フルオレン及び９−置換フルオレンオリゴマー及びポリマー
US5708130A (en) 1995-07-28 1998-01-13 The Dow Chemical Company 2,7-aryl-9-substituted fluorenes and 9-substituted fluorene oligomers and polymers
WO1997020877A2 (de) 1995-12-01 1997-06-12 Ciba Specialty Chemicals Holding Inc. Poly(9,9'-spirobisfluorene), deren herstellung und deren verwendung
US5929194A (en) 1996-02-23 1999-07-27 The Dow Chemical Company Crosslinkable or chain extendable polyarylpolyamines and films thereof
WO1997033323A1 (en) 1996-03-04 1997-09-12 Uniax Corporation Polyfluorenes as materials for photoluminescence and electroluminescence
US5695907A (en) 1996-03-14 1997-12-09 Minnesota Mining And Manufacturing Company Laser addressable thermal transfer imaging element and method
US5725989A (en) 1996-04-15 1998-03-10 Chang; Jeffrey C. Laser addressable thermal transfer imaging element with an interlayer
US5693446A (en) 1996-04-17 1997-12-02 Minnesota Mining And Manufacturing Company Polarizing mass transfer donor element and method of transferring a polarizing mass transfer layer
US5710097A (en) 1996-06-27 1998-01-20 Minnesota Mining And Manufacturing Company Process and materials for imagewise placement of uniform spacers in flat panel displays
US5731661A (en) * 1996-07-15 1998-03-24 Motorola, Inc. Passivation of electroluminescent organic devices
US5998085A (en) 1996-07-23 1999-12-07 3M Innovative Properties Process for preparing high resolution emissive arrays and corresponding articles
US5728801A (en) 1996-08-13 1998-03-17 The Dow Chemical Company Poly (arylamines) and films thereof
JPH10208883A (ja) 1996-11-20 1998-08-07 Hokuriku Electric Ind Co Ltd 発光装置とその製造方法
US5952778A (en) * 1997-03-18 1999-09-14 International Business Machines Corporation Encapsulated organic light emitting device
GB9711237D0 (en) 1997-06-02 1997-07-23 Isis Innovation Organomettallic Complexes
JP3774897B2 (ja) * 1997-06-03 2006-05-17 ソニー株式会社 有機電界発光素子
US6242115B1 (en) 1997-09-08 2001-06-05 The University Of Southern California OLEDs containing thermally stable asymmetric charge carrier materials
US6150043A (en) 1998-04-10 2000-11-21 The Trustees Of Princeton University OLEDs containing thermally stable glassy organic hole transporting materials
US6030715A (en) 1997-10-09 2000-02-29 The University Of Southern California Azlactone-related dopants in the emissive layer of an OLED
DE69901425T2 (de) 1998-02-04 2002-11-14 Covion Organic Semiconductors Gmbh Verwendung von spiroverbindungen als laserfarbstoffe
US6004660A (en) 1998-03-12 1999-12-21 E.I. Du Pont De Nemours And Company Oxygen barrier composite film structure
JP2000003783A (ja) * 1998-06-12 2000-01-07 Tdk Corp 有機ｅｌ表示装置
JP2000048964A (ja) * 1998-07-30 2000-02-18 Toray Ind Inc 有機ｅｌディスプレイ
GB9820805D0 (en) 1998-09-25 1998-11-18 Isis Innovation Divalent lanthanide metal complexes
WO2000026973A1 (en) 1998-11-02 2000-05-11 Presstek, Inc. Transparent conductive oxides for plastic flat panel displays
EP1145338B1 (en) 1998-12-16 2012-12-05 Samsung Display Co., Ltd. Environmental barrier material for organic light emitting device and method of making
US6268695B1 (en) 1998-12-16 2001-07-31 Battelle Memorial Institute Environmental barrier material for organic light emitting device and method of making
JP2000195673A (ja) 1998-12-25 2000-07-14 Sanyo Electric Co Ltd 有機エレクトロルミネッセント素子及び発光素子
US6114088A (en) * 1999-01-15 2000-09-05 3M Innovative Properties Company Thermal transfer element for forming multilayer devices
WO2000041893A1 (en) 1999-01-15 2000-07-20 3M Innovative Properties Company Thermal transfer element and process for forming organic electroluminescent devices
EP3321954A1 (en) 1999-05-13 2018-05-16 The Trustees of Princeton University Very high efficiency organic light emitting devices based on electrophosphorescence
US6221543B1 (en) 1999-05-14 2001-04-24 3M Innovatives Properties Process for making active substrates for color displays
US6228543B1 (en) 1999-09-09 2001-05-08 3M Innovative Properties Company Thermal transfer with a plasticizer-containing transfer layer
US6413645B1 (en) 2000-04-20 2002-07-02 Battelle Memorial Institute Ultrabarrier substrates
US6521324B1 (en) 1999-11-30 2003-02-18 3M Innovative Properties Company Thermal transfer of microstructured layers
US6228555B1 (en) 1999-12-28 2001-05-08 3M Innovative Properties Company Thermal mass transfer donor element
US6284425B1 (en) 1999-12-28 2001-09-04 3M Innovative Properties Thermal transfer donor element having a heat management underlayer
US6933098B2 (en) * 2000-01-11 2005-08-23 Sipix Imaging Inc. Process for roll-to-roll manufacture of a display by synchronized photolithographic exposure on a substrate web
US6672921B1 (en) * 2000-03-03 2004-01-06 Sipix Imaging, Inc. Manufacturing process for electrophoretic display
US6242152B1 (en) 2000-05-03 2001-06-05 3M Innovative Properties Thermal transfer of crosslinked materials from a donor to a receptor
US6867539B1 (en) 2000-07-12 2005-03-15 3M Innovative Properties Company Encapsulated organic electronic devices and method for making same
JP2002062422A (ja) * 2000-08-14 2002-02-28 Canon Inc 光学素子とその製造方法、液晶素子
JP2002063985A (ja) * 2000-08-22 2002-02-28 Nec Corp 有機エレクトロルミネッセンス素子
JP4423767B2 (ja) * 2000-08-22 2010-03-03 ソニー株式会社 有機電界発光素子及びその製造方法
US6358664B1 (en) 2000-09-15 2002-03-19 3M Innovative Properties Company Electronically active primer layers for thermal patterning of materials for electronic devices
TW533446B (en) 2000-12-22 2003-05-21 Koninkl Philips Electronics Nv Electroluminescent device and a method of manufacturing thereof
US6485884B2 (en) 2001-04-27 2002-11-26 3M Innovative Properties Company Method for patterning oriented materials for organic electronic displays and devices
US20020158574A1 (en) 2001-04-27 2002-10-31 3M Innovative Properties Company Organic displays and devices containing oriented electronically active layers
US6856086B2 (en) * 2001-06-25 2005-02-15 Avery Dennison Corporation Hybrid display device
JP3823916B2 (ja) * 2001-12-18 2006-09-20 セイコーエプソン株式会社 表示装置及び電子機器並びに表示装置の製造方法
JP4531324B2 (ja) * 2002-10-21 2010-08-25 大日本印刷株式会社 有機ｅｌ素子の製造方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102439751A (zh) * 2009-04-23 2012-05-02 荷兰应用科学研究会(Tno) 光电装置以及制造所述光电装置的方法
CN102812577A (zh) * 2010-03-22 2012-12-05 皇家飞利浦电子股份有限公司 制造具有空间隔离的发光区的oled器件的方法
CN102812577B (zh) * 2010-03-22 2016-09-07 皇家飞利浦电子股份有限公司 制造具有空间隔离的发光区的oled器件的方法
CN108496409A (zh) * 2016-01-26 2018-09-04 住友化学株式会社 有机el元件
US10991905B2 (en) 2016-01-26 2021-04-27 Sumitomo Chemical Company, Limited Organic electroluminescent element
CN107591622A (zh) * 2016-07-08 2018-01-16 三星电机株式会社 无线通信天线及其制造方法
CN107591622B (zh) * 2016-07-08 2020-10-20 株式会社Wits 无线通信天线及其制造方法

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