CN1705427B - 电子部件安装装置及电子部件安装方法 - Google Patents

电子部件安装装置及电子部件安装方法 Download PDF

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Publication number
CN1705427B
CN1705427B CN2005100746747A CN200510074674A CN1705427B CN 1705427 B CN1705427 B CN 1705427B CN 2005100746747 A CN2005100746747 A CN 2005100746747A CN 200510074674 A CN200510074674 A CN 200510074674A CN 1705427 B CN1705427 B CN 1705427B
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CN
China
Prior art keywords
exist
unit
electronic
lead
identification
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN2005100746747A
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English (en)
Chinese (zh)
Other versions
CN1705427A (zh
Inventor
吉井贵志
浦川明裕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Motor Co Ltd
Original Assignee
Hitachi High Tech Instruments Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi High Tech Instruments Co Ltd filed Critical Hitachi High Tech Instruments Co Ltd
Publication of CN1705427A publication Critical patent/CN1705427A/zh
Application granted granted Critical
Publication of CN1705427B publication Critical patent/CN1705427B/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Image Analysis (AREA)
CN2005100746747A 2004-05-31 2005-05-30 电子部件安装装置及电子部件安装方法 Expired - Lifetime CN1705427B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP160716/04 2004-05-31
JP2004160716A JP4417779B2 (ja) 2004-05-31 2004-05-31 電子部品装着装置及び電子部品装着方法

Publications (2)

Publication Number Publication Date
CN1705427A CN1705427A (zh) 2005-12-07
CN1705427B true CN1705427B (zh) 2012-07-25

Family

ID=34993334

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2005100746747A Expired - Lifetime CN1705427B (zh) 2004-05-31 2005-05-30 电子部件安装装置及电子部件安装方法

Country Status (6)

Country Link
US (1) US7367117B2 (enExample)
EP (1) EP1603382B1 (enExample)
JP (1) JP4417779B2 (enExample)
KR (1) KR101122806B1 (enExample)
CN (1) CN1705427B (enExample)
DE (1) DE602005023938D1 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4237766B2 (ja) * 2006-02-10 2009-03-11 パナソニック株式会社 部品実装機制御方法、部品実装機およびプログラム
US8156642B2 (en) * 2007-04-03 2012-04-17 Panasonic Corporation Component mounting method
JP4846649B2 (ja) * 2007-04-26 2011-12-28 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
JP4997124B2 (ja) * 2008-01-21 2012-08-08 株式会社日立ハイテクインスツルメンツ 電子部品装着ヘッド及び電子部品装着装置
JP5103238B2 (ja) * 2008-03-25 2012-12-19 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
JP5342159B2 (ja) * 2008-03-25 2013-11-13 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
CN101897248B (zh) * 2008-06-10 2012-12-12 日本先锋公司 电子部件安装数据的生成方法及生成装置
KR101398205B1 (ko) * 2008-09-18 2014-05-21 삼성테크윈 주식회사 전자 부품 정보 인식 및 처리 장치
JP5427054B2 (ja) * 2010-01-29 2014-02-26 株式会社日立ハイテクインスツルメンツ 異常検出装置を備えた部品実装装置
JP5730114B2 (ja) * 2011-04-25 2015-06-03 富士機械製造株式会社 部品回転角度検出装置及び画像処理用部品データ作成装置並びに部品回転角度検出方法及び画像処理用部品データ作成方法
CN106879245A (zh) * 2012-02-08 2017-06-20 Juki株式会社 电子部件安装装置、电子部件安装系统以及电子部件安装方法
CN107079617B (zh) * 2014-11-11 2019-08-06 株式会社富士 电子元件安装机的控制装置及向该控制装置输入数据的数据输入装置
CN105057838B (zh) * 2015-08-17 2017-03-22 潍坊路加精工有限公司 引脚纠偏焊锡装置及其纠偏焊锡方法
EP3376843B1 (en) * 2015-11-09 2024-11-13 Fuji Corporation Lead end-position image recognition method and lead end-position image recognition system
CN111343846B (zh) * 2020-02-23 2021-05-25 苏州浪潮智能科技有限公司 一种基于pcb制板过程的电子元件识别装置及方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1216674A (zh) * 1996-04-23 1999-05-12 松下电器产业株式会社 电子元件安装装置
US6429387B1 (en) * 1996-12-13 2002-08-06 Matsushita Electric Industrial Co., Ltd. Electronic component and mounting method and device therefor

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2941617B2 (ja) * 1993-10-21 1999-08-25 株式会社テンリュウテクニックス 電子部品の部品データ記録装置およびそれを用いた電子部品の搬送組み付け装置
US6938335B2 (en) * 1996-12-13 2005-09-06 Matsushita Electric Industrial Co., Ltd. Electronic component mounting method
JPH10283480A (ja) * 1997-03-31 1998-10-23 Omron Corp 認識処理装置およびこの装置に適用される認識処理用の記憶媒体
JP4147505B2 (ja) * 1999-01-28 2008-09-10 富士機械製造株式会社 保持ヘッド
JP2001304828A (ja) 2000-04-27 2001-10-31 Sanyo Electric Co Ltd 電子部品装着装置におけるパーツライブラリデータの作成方法及び作成装置
US6718626B2 (en) * 2000-09-13 2004-04-13 Fuji Machine Mfg. Co., Ltd. Apparatus for detecting positioning error of a component with respect to a suction nozzle
US6496248B2 (en) * 2000-12-15 2002-12-17 Nikon Corporation Stage device and exposure apparatus and method
JP4516220B2 (ja) * 2001-01-15 2010-08-04 富士機械製造株式会社 部品装着精度関連部分の相対位置関係取得方法および電気部品装着システム
JP2002298132A (ja) * 2001-04-02 2002-10-11 Fuji Mach Mfg Co Ltd 撮像システム，撮像システム制御プログラムおよび電気部品装着システム
US6788385B2 (en) * 2001-06-21 2004-09-07 Nikon Corporation Stage device, exposure apparatus and method
JP4664550B2 (ja) * 2001-09-21 2011-04-06 富士機械製造株式会社 電気回路製造装置および電気回路製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1216674A (zh) * 1996-04-23 1999-05-12 松下电器产业株式会社 电子元件安装装置
US6429387B1 (en) * 1996-12-13 2002-08-06 Matsushita Electric Industrial Co., Ltd. Electronic component and mounting method and device therefor

Also Published As

Publication number Publication date
EP1603382B1 (en) 2010-10-06
JP2005340711A (ja) 2005-12-08
US7367117B2 (en) 2008-05-06
KR20060046250A (ko) 2006-05-17
EP1603382A2 (en) 2005-12-07
CN1705427A (zh) 2005-12-07
JP4417779B2 (ja) 2010-02-17
US20050274004A1 (en) 2005-12-15
KR101122806B1 (ko) 2012-03-21
EP1603382A3 (en) 2009-07-22
DE602005023938D1 (de) 2010-11-18

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: YAMAHA MOTOR CO. LTD.

Free format text: FORMER OWNER: HITACHI HIGH TECH INSTR CO., LTD.

Effective date: 20150421

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20150421

Address after: Shizuoka

Patentee after: Yamaha Motor Co.,Ltd.

Address before: Gunma

Patentee before: Hitachi High-Tech Instruments Co.,Ltd.

CX01 Expiry of patent term

Granted publication date: 20120725

CX01 Expiry of patent term