JP2005340711A - 電子部品装着装置及び電子部品装着方法 - Google Patents
電子部品装着装置及び電子部品装着方法 Download PDFInfo
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- JP2005340711A JP2005340711A JP2004160716A JP2004160716A JP2005340711A JP 2005340711 A JP2005340711 A JP 2005340711A JP 2004160716 A JP2004160716 A JP 2004160716A JP 2004160716 A JP2004160716 A JP 2004160716A JP 2005340711 A JP2005340711 A JP 2005340711A
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- electronic component
- recognition processing
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- 238000000034 method Methods 0.000 title claims description 15
- 229910000679 solder Inorganic materials 0.000 claims description 25
- 238000007689 inspection Methods 0.000 abstract description 8
- 238000001514 detection method Methods 0.000 abstract description 6
- 230000002159 abnormal effect Effects 0.000 abstract description 2
- 238000012790 confirmation Methods 0.000 description 5
- 230000005856 abnormality Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 229910000004 White lead Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53191—Means to apply vacuum directly to position or hold work part
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Image Analysis (AREA)
Abstract
【解決手段】 電子部品の認識処理は、RAM22に格納された部品ライブラリデータに従って行なわれる。部品ライブラリデータの検査条件の「通常」データに従い、グループ番号「1」及び「2」のリードの有無検出がCPU21の指令に基づき認識処理装置13により行われ、全てのリードが有るものと判断すると、CPU21は部品認識カメラ16Aに撮像された画像に基づき位置ずれ量の算出を認識処理装置13に指示し、電子部品の位置と角度が算出される。次は存在してはならないリードの無し確認の検査が認識処理装置13により行なわれる。1本でも存在してはならないリードの存在が検出されると、CPU21は存在してはならないリードの「無し確認リード検出異常」と判断し、吸着ノズル17Aから落下させ、廃棄回収箱内に回収する。
【選択図】 図5
Description
13 認識処理装置
16A、B 部品認識カメラ
17A、B 吸着ノズル
21 CPU
22 RAM
Claims (6)
- 任意の部品供給ユニットから取出されて吸着ノズルに吸着保持された電子部品を部品認識カメラで撮像した画像を認識処理装置により認識処理してプリント基板上に装着する電子部品装着装置において、各電子部品の特性として存在してはならないリードやハンダボールについてのデータを格納する記憶手段と、この記憶手段に格納された前記データに従って前記部品認識カメラで撮像した画像を前記認識処理装置が認識処理するように制御する制御手段とを設けたことを特徴とする電子部品装着装置。
- 任意の部品供給ユニットから取出されて吸着ノズルに吸着保持された電子部品を部品認識カメラで撮像した画像を認識処理装置により認識処理してプリント基板上に装着する電子部品装着装置において、各電子部品の特性として存在しなければならないリードやハンダボールについてのデータと存在してはならないリードやハンダボールについてのデータを格納する記憶手段と、この記憶手段に格納された前記両データに従って前記部品認識カメラで撮像した画像を前記認識処理装置が認識処理するように制御する制御手段とを設けたことを特徴とする電子部品装着装置。
- 前記認識処理装置が認識処理した結果、存在してはならないリードやハンダボールが存在したものと判断された場合に電子部品の装着運転を停止するように制御する制御装置を設けたことを特徴とする請求項1又は2に記載の電子部品装着装置。
- 任意の部品供給ユニットから取出されて吸着ノズルに吸着保持された電子部品を部品認識カメラで撮像した画像を認識処理装置により認識処理してプリント基板上に装着する電子部品装着方法において、各電子部品の特性として存在してはならないリードやハンダボールについてのデータを記憶手段に格納し、この記憶手段に格納された前記データに従って前記部品認識カメラで撮像した画像を前記認識処理装置が認識処理するように制御手段が制御することを特徴とする電子部品装着方法。
- 任意の部品供給ユニットから取出されて吸着ノズルに吸着保持された電子部品を部品認識カメラで撮像した画像を認識処理装置により認識処理してプリント基板上に装着する電子部品装着方法において、各電子部品の特性として存在しなければならないリードやハンダボールについてのデータと存在してはならないリードやハンダボールについてのデータを記憶手段に格納し、この記憶手段に格納された前記両データに従って前記部品認識カメラで撮像した画像を前記認識処理装置が認識処理するように制御手段が制御することを特徴とする電子部品装着方法。
- 前記認識処理装置が認識処理した結果、存在してはならないリードやハンダボールが存在したものと判断された場合に電子部品の装着運転を停止するように制御することを特徴とする請求項4又は5に記載の電子部品装着方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004160716A JP4417779B2 (ja) | 2004-05-31 | 2004-05-31 | 電子部品装着装置及び電子部品装着方法 |
US11/134,498 US7367117B2 (en) | 2004-05-31 | 2005-05-23 | Electronic component mounting apparatus and electronic component mounting method |
KR1020050045340A KR101122806B1 (ko) | 2004-05-31 | 2005-05-30 | 전자 부품 장착 장치 및 전자 부품 장착 방법 |
CN2005100746747A CN1705427B (zh) | 2004-05-31 | 2005-05-30 | 电子部件安装装置及电子部件安装方法 |
DE602005023938T DE602005023938D1 (de) | 2004-05-31 | 2005-05-31 | Elektronische Bauteile-Bestückungsvorrichtung und Methode |
EP05011737A EP1603382B1 (en) | 2004-05-31 | 2005-05-31 | Electronic component mounting apparatus and electronic component mounting method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004160716A JP4417779B2 (ja) | 2004-05-31 | 2004-05-31 | 電子部品装着装置及び電子部品装着方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005340711A true JP2005340711A (ja) | 2005-12-08 |
JP2005340711A5 JP2005340711A5 (ja) | 2009-01-22 |
JP4417779B2 JP4417779B2 (ja) | 2010-02-17 |
Family
ID=34993334
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004160716A Expired - Lifetime JP4417779B2 (ja) | 2004-05-31 | 2004-05-31 | 電子部品装着装置及び電子部品装着方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7367117B2 (ja) |
EP (1) | EP1603382B1 (ja) |
JP (1) | JP4417779B2 (ja) |
KR (1) | KR101122806B1 (ja) |
CN (1) | CN1705427B (ja) |
DE (1) | DE602005023938D1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105057838A (zh) * | 2015-08-17 | 2015-11-18 | 潍坊路加精工有限公司 | 引脚纠偏焊锡装置及其纠偏焊锡方法 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4237766B2 (ja) * | 2006-02-10 | 2009-03-11 | パナソニック株式会社 | 部品実装機制御方法、部品実装機およびプログラム |
KR20090125151A (ko) * | 2007-04-03 | 2009-12-03 | 파나소닉 주식회사 | 부품 실장 방법 |
JP4846649B2 (ja) * | 2007-04-26 | 2011-12-28 | 株式会社日立ハイテクインスツルメンツ | 電子部品装着装置 |
JP4997124B2 (ja) * | 2008-01-21 | 2012-08-08 | 株式会社日立ハイテクインスツルメンツ | 電子部品装着ヘッド及び電子部品装着装置 |
JP5103238B2 (ja) * | 2008-03-25 | 2012-12-19 | 株式会社日立ハイテクインスツルメンツ | 電子部品装着装置 |
JP5342159B2 (ja) * | 2008-03-25 | 2013-11-13 | 株式会社日立ハイテクインスツルメンツ | 電子部品装着装置 |
CN101897248B (zh) * | 2008-06-10 | 2012-12-12 | 日本先锋公司 | 电子部件安装数据的生成方法及生成装置 |
KR101398205B1 (ko) * | 2008-09-18 | 2014-05-21 | 삼성테크윈 주식회사 | 전자 부품 정보 인식 및 처리 장치 |
JP5427054B2 (ja) * | 2010-01-29 | 2014-02-26 | 株式会社日立ハイテクインスツルメンツ | 異常検出装置を備えた部品実装装置 |
JP5730114B2 (ja) * | 2011-04-25 | 2015-06-03 | 富士機械製造株式会社 | 部品回転角度検出装置及び画像処理用部品データ作成装置並びに部品回転角度検出方法及び画像処理用部品データ作成方法 |
CN103249293B (zh) * | 2012-02-08 | 2018-05-29 | Juki株式会社 | 电子部件安装装置、电子部件安装系统以及电子部件安装方法 |
US11140801B2 (en) * | 2014-11-11 | 2021-10-05 | Fuji Corporation | Data input and control devices of an electronic component mounting machine |
US10380457B2 (en) * | 2015-11-09 | 2019-08-13 | Fuji Corporation | Lead tip position image recognition method and lead tip position image recognition system |
CN111343846B (zh) * | 2020-02-23 | 2021-05-25 | 苏州浪潮智能科技有限公司 | 一种基于pcb制板过程的电子元件识别装置及方法 |
Family Cites Families (13)
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JP2941617B2 (ja) * | 1993-10-21 | 1999-08-25 | 株式会社テンリュウテクニックス | 電子部品の部品データ記録装置およびそれを用いた電子部品の搬送組み付け装置 |
CN1095624C (zh) * | 1996-04-23 | 2002-12-04 | 松下电器产业株式会社 | 电子元件安装装置 |
CN1138463C (zh) * | 1996-12-13 | 2004-02-11 | 松下电器产业株式会社 | 电子部件及其安装方法和装置 |
US6938335B2 (en) * | 1996-12-13 | 2005-09-06 | Matsushita Electric Industrial Co., Ltd. | Electronic component mounting method |
JPH10283480A (ja) * | 1997-03-31 | 1998-10-23 | Omron Corp | 認識処理装置およびこの装置に適用される認識処理用の記憶媒体 |
JP4147505B2 (ja) * | 1999-01-28 | 2008-09-10 | 富士機械製造株式会社 | 保持ヘッド |
JP2001304828A (ja) | 2000-04-27 | 2001-10-31 | Sanyo Electric Co Ltd | 電子部品装着装置におけるパーツライブラリデータの作成方法及び作成装置 |
US6718626B2 (en) * | 2000-09-13 | 2004-04-13 | Fuji Machine Mfg. Co., Ltd. | Apparatus for detecting positioning error of a component with respect to a suction nozzle |
US6496248B2 (en) * | 2000-12-15 | 2002-12-17 | Nikon Corporation | Stage device and exposure apparatus and method |
JP4516220B2 (ja) * | 2001-01-15 | 2010-08-04 | 富士機械製造株式会社 | 部品装着精度関連部分の相対位置関係取得方法および電気部品装着システム |
JP2002298132A (ja) * | 2001-04-02 | 2002-10-11 | Fuji Mach Mfg Co Ltd | 撮像システム,撮像システム制御プログラムおよび電気部品装着システム |
US6788385B2 (en) * | 2001-06-21 | 2004-09-07 | Nikon Corporation | Stage device, exposure apparatus and method |
JP4664550B2 (ja) * | 2001-09-21 | 2011-04-06 | 富士機械製造株式会社 | 電気回路製造装置および電気回路製造方法 |
-
2004
- 2004-05-31 JP JP2004160716A patent/JP4417779B2/ja not_active Expired - Lifetime
-
2005
- 2005-05-23 US US11/134,498 patent/US7367117B2/en active Active
- 2005-05-30 CN CN2005100746747A patent/CN1705427B/zh active Active
- 2005-05-30 KR KR1020050045340A patent/KR101122806B1/ko active IP Right Grant
- 2005-05-31 EP EP05011737A patent/EP1603382B1/en active Active
- 2005-05-31 DE DE602005023938T patent/DE602005023938D1/de active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105057838A (zh) * | 2015-08-17 | 2015-11-18 | 潍坊路加精工有限公司 | 引脚纠偏焊锡装置及其纠偏焊锡方法 |
CN105057838B (zh) * | 2015-08-17 | 2017-03-22 | 潍坊路加精工有限公司 | 引脚纠偏焊锡装置及其纠偏焊锡方法 |
Also Published As
Publication number | Publication date |
---|---|
DE602005023938D1 (de) | 2010-11-18 |
EP1603382A3 (en) | 2009-07-22 |
EP1603382A2 (en) | 2005-12-07 |
JP4417779B2 (ja) | 2010-02-17 |
US20050274004A1 (en) | 2005-12-15 |
CN1705427B (zh) | 2012-07-25 |
KR101122806B1 (ko) | 2012-03-21 |
US7367117B2 (en) | 2008-05-06 |
CN1705427A (zh) | 2005-12-07 |
EP1603382B1 (en) | 2010-10-06 |
KR20060046250A (ko) | 2006-05-17 |
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