KR101122806B1 - 전자 부품 장착 장치 및 전자 부품 장착 방법 - Google Patents

전자 부품 장착 장치 및 전자 부품 장착 방법 Download PDF

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Publication number
KR101122806B1
KR101122806B1 KR1020050045340A KR20050045340A KR101122806B1 KR 101122806 B1 KR101122806 B1 KR 101122806B1 KR 1020050045340 A KR1020050045340 A KR 1020050045340A KR 20050045340 A KR20050045340 A KR 20050045340A KR 101122806 B1 KR101122806 B1 KR 101122806B1
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KR
South Korea
Prior art keywords
electronic component
recognition processing
lead
exist
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020050045340A
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English (en)
Korean (ko)
Other versions
KR20060046250A (ko
Inventor
다까시 요시이
아끼히로 우라까와
Original Assignee
가부시끼가이샤 히다찌 하이테크 인스트루먼츠
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Publication of KR20060046250A publication Critical patent/KR20060046250A/ko
Application granted granted Critical
Publication of KR101122806B1 publication Critical patent/KR101122806B1/ko
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Image Analysis (AREA)
KR1020050045340A 2004-05-31 2005-05-30 전자 부품 장착 장치 및 전자 부품 장착 방법 Expired - Fee Related KR101122806B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2004-00160716 2004-05-31
JP2004160716A JP4417779B2 (ja) 2004-05-31 2004-05-31 電子部品装着装置及び電子部品装着方法

Publications (2)

Publication Number Publication Date
KR20060046250A KR20060046250A (ko) 2006-05-17
KR101122806B1 true KR101122806B1 (ko) 2012-03-21

Family

ID=34993334

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050045340A Expired - Fee Related KR101122806B1 (ko) 2004-05-31 2005-05-30 전자 부품 장착 장치 및 전자 부품 장착 방법

Country Status (6)

Country Link
US (1) US7367117B2 (enExample)
EP (1) EP1603382B1 (enExample)
JP (1) JP4417779B2 (enExample)
KR (1) KR101122806B1 (enExample)
CN (1) CN1705427B (enExample)
DE (1) DE602005023938D1 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4237766B2 (ja) * 2006-02-10 2009-03-11 パナソニック株式会社 部品実装機制御方法、部品実装機およびプログラム
DE112008000767T5 (de) * 2007-04-03 2010-04-29 Panasonic Corporation, Kadoma-shi Verfahren zum Bestücken von Bauelementen
JP4846649B2 (ja) * 2007-04-26 2011-12-28 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
JP4997124B2 (ja) * 2008-01-21 2012-08-08 株式会社日立ハイテクインスツルメンツ 電子部品装着ヘッド及び電子部品装着装置
JP5342159B2 (ja) * 2008-03-25 2013-11-13 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
JP5103238B2 (ja) * 2008-03-25 2012-12-19 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
WO2009150721A1 (ja) * 2008-06-10 2009-12-17 パイオニア株式会社 電子部品実装データの作成方法及び作成装置
KR101398205B1 (ko) * 2008-09-18 2014-05-21 삼성테크윈 주식회사 전자 부품 정보 인식 및 처리 장치
JP5427054B2 (ja) * 2010-01-29 2014-02-26 株式会社日立ハイテクインスツルメンツ 異常検出装置を備えた部品実装装置
JP5730114B2 (ja) * 2011-04-25 2015-06-03 富士機械製造株式会社 部品回転角度検出装置及び画像処理用部品データ作成装置並びに部品回転角度検出方法及び画像処理用部品データ作成方法
CN106879245A (zh) * 2012-02-08 2017-06-20 Juki株式会社 电子部件安装装置、电子部件安装系统以及电子部件安装方法
US11140801B2 (en) * 2014-11-11 2021-10-05 Fuji Corporation Data input and control devices of an electronic component mounting machine
CN105057838B (zh) * 2015-08-17 2017-03-22 潍坊路加精工有限公司 引脚纠偏焊锡装置及其纠偏焊锡方法
WO2017081736A1 (ja) * 2015-11-09 2017-05-18 富士機械製造株式会社 リード先端位置画像認識方法及びリード先端位置画像認識システム
CN111343846B (zh) * 2020-02-23 2021-05-25 苏州浪潮智能科技有限公司 一种基于pcb制板过程的电子元件识别装置及方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10283480A (ja) * 1997-03-31 1998-10-23 Omron Corp 認識処理装置およびこの装置に適用される認識処理用の記憶媒体

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JP2941617B2 (ja) * 1993-10-21 1999-08-25 株式会社テンリュウテクニックス 電子部品の部品データ記録装置およびそれを用いた電子部品の搬送組み付け装置
WO1997040657A1 (en) * 1996-04-23 1997-10-30 Matsushita Electric Industrial Co., Ltd. Electronic component mounting apparatus
WO1998026641A1 (en) * 1996-12-13 1998-06-18 Matsushita Electric Industrial Co., Ltd. Electronic component and mounting method and device therefor
US6938335B2 (en) * 1996-12-13 2005-09-06 Matsushita Electric Industrial Co., Ltd. Electronic component mounting method
JP4147505B2 (ja) * 1999-01-28 2008-09-10 富士機械製造株式会社 保持ヘッド
JP2001304828A (ja) 2000-04-27 2001-10-31 Sanyo Electric Co Ltd 電子部品装着装置におけるパーツライブラリデータの作成方法及び作成装置
US6718626B2 (en) * 2000-09-13 2004-04-13 Fuji Machine Mfg. Co., Ltd. Apparatus for detecting positioning error of a component with respect to a suction nozzle
US6496248B2 (en) * 2000-12-15 2002-12-17 Nikon Corporation Stage device and exposure apparatus and method
JP4516220B2 (ja) * 2001-01-15 2010-08-04 富士機械製造株式会社 部品装着精度関連部分の相対位置関係取得方法および電気部品装着システム
JP2002298132A (ja) * 2001-04-02 2002-10-11 Fuji Mach Mfg Co Ltd 撮像システム，撮像システム制御プログラムおよび電気部品装着システム
US6788385B2 (en) * 2001-06-21 2004-09-07 Nikon Corporation Stage device, exposure apparatus and method
JP4664550B2 (ja) * 2001-09-21 2011-04-06 富士機械製造株式会社 電気回路製造装置および電気回路製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10283480A (ja) * 1997-03-31 1998-10-23 Omron Corp 認識処理装置およびこの装置に適用される認識処理用の記憶媒体

Also Published As

Publication number Publication date
DE602005023938D1 (de) 2010-11-18
EP1603382A2 (en) 2005-12-07
US20050274004A1 (en) 2005-12-15
CN1705427B (zh) 2012-07-25
KR20060046250A (ko) 2006-05-17
JP2005340711A (ja) 2005-12-08
US7367117B2 (en) 2008-05-06
EP1603382A3 (en) 2009-07-22
EP1603382B1 (en) 2010-10-06
JP4417779B2 (ja) 2010-02-17
CN1705427A (zh) 2005-12-07

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