WO2009150721A1 - 電子部品実装データの作成方法及び作成装置 - Google Patents
電子部品実装データの作成方法及び作成装置 Download PDFInfo
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- WO2009150721A1 WO2009150721A1 PCT/JP2008/060623 JP2008060623W WO2009150721A1 WO 2009150721 A1 WO2009150721 A1 WO 2009150721A1 JP 2008060623 W JP2008060623 W JP 2008060623W WO 2009150721 A1 WO2009150721 A1 WO 2009150721A1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/0882—Control systems for mounting machines or assembly lines, e.g. centralized control, remote links, programming of apparatus and processes as such
Definitions
- the present invention relates to a technical field of a mounting apparatus for mounting an electronic component on a substrate and a method for creating coordinate data for mounting the electronic component by the mounting apparatus.
- Teaching to acquire actual coordinate data is performed by simulating the mounting of electronic components on a printed circuit board on a computer.
- Patent Document 1 a shape corresponding to the shape of an electronic component is displayed on a printed board image, and a component shape cursor generated from the dimension data of the electronic component is displayed.
- a method of displaying and using the same scale is known.
- Patent Document 2 discloses a method for displaying an image of an electronic component on an image of a printed circuit board by transmitting one of the images so that both are visible.
- Patent Document 1 a plurality of data such as shape data and dimension data of electronic parts are required, and accurate teaching cannot be performed if any one of them cannot be referred to. There is a technical problem. Also, a coordinate error or the like due to a dimensional error or the like may occur.
- the present invention has been made in view of such problems, using less data than conventional techniques, a method for creating coordinate data for mounting electronic components with excellent accuracy and visibility, And it aims at providing a mounting apparatus.
- an electronic component mounting data creating method of the present invention is a method for creating electronic component mounting data for mounting an electronic component on a board, wherein the electronic component is mounted on the board.
- a data creation step for creating the electronic component mounting data for mounting the electronic component on the substrate based on the calculated coordinates, and the electronic unit based on the electronic component mounting data.
- an electronic component mounting apparatus for mounting an electronic component on a substrate
- a substrate image acquisition means for acquiring a substrate image that is an image image on the side on which the electronic component is mounted, and a component image obtained by inverting the image image on the side of the electronic component that is mounted facing the substrate
- Component image acquisition means display means for displaying the component image on the board image in the same scale as the board image and in a movable manner, and the electronic component displayed on the board image.
- Coordinate calculation means for calculating coordinates, and data creation means for creating the electronic component mounting data for mounting the electronic component on the substrate based on the calculated coordinates.
- An embodiment of the electronic component mounting data creation method of the present invention is an electronic component mounting data creation method for mounting an electronic component on a board, and is an image of a side on which the electronic component is mounted on the board.
- the electronic component is mounted on an actual board by displaying the component image on the board image at the same scale as the board image.
- the component image can be arranged on the board image under the same visual effect.
- the component image displayed at the same scale as the substrate image is displayed on the substrate image, and the component image is arranged at the mounting position on the substrate image, so that the electronic image is formed on the actual substrate.
- Electronic component mounting data such as coordinates for mounting components can be created.
- the component image is an image obtained by inverting the image image of the electronic component that is mounted on the board so as to be opposed (represented as the back side for the sake of convenience). In other words, it is displayed as an image when viewed through the back side from the side opposite to the side mounted on the substrate (for the sake of convenience, indicated as the front side).
- the component image on the back side of the electronic component that has been subjected to the reversal processing as described above typically has the same outer shape as the component image on the front side of the electronic component (that is, to indicate the contour and direction),
- the component image on the board image it is possible to perform the same alignment as in the case where the component image on the front side of the electronic component is used even if the display inside the contour of the component image is different.
- the image on the back side of such an electronic component it is possible to suitably detect the electrode position of the electronic component, and when mounting the electronic component, a pattern (typically It is possible to relatively easily match the land position) and the electrode position of the electronic component. Therefore, it leads to creation of accurate mounting data.
- the electronic component mounting data is intended to indicate a series of data typically required for mounting an electronic component on a board, including the type, mounting position, angle, mounting order, etc. of the electronic component. If the data can be mounted on the board based on at least the electronic component mounting data, the mode is not limited.
- displaying in a movable manner is intended to indicate that the component image displayed on the board image can be moved by an operation with a pointing device such as a mouse or coordinate input.
- the component image displayed on the substrate image is actually displayed in the display process using the substrate image and the component image acquired as described above, for example, by an operation by the user. It is arranged at a predetermined position corresponding to the mounting position on the substrate. Thereafter, coordinates for a predetermined origin on the board image are calculated in the coordinate calculation process, and electronic component mounting data for mounting the electronic parts on the actual board is created in the subsequent data creation process. Therefore, even when dimensional data relating to a board or electronic component is not used, an electronic part having excellent accuracy and visibility can be obtained by using a board image and an electronic part image acquired from the actual board and electronic component. Implementation data can be created.
- the component image acquisition step acquires a component image in which the outside of the contour of the electronic component is made transparent.
- an image image obtained by making the outside of the contour of the electronic component transparent is displayed as the electronic component image, which is obtained when the electronic component is actually mounted on the substrate. It is possible to place the component image on the board image (in other words, to determine the coordinates) under the same display as the visual effect.
- the board image on which the component image is arranged has a visual effect equivalent to that of the board on which the electronic component is actually mounted, it has remarkable utility as a board image inspection or work sample.
- the component image acquisition step determines a contour of the electronic component by using a predetermined background, and acquires the component image.
- Images can be acquired.
- the predetermined background may be in any form as long as the outline of the electronic component can be easily identified, and typically, as described above, by the light from the backlight or the fluorescent reflector.
- the component image acquisition step includes the component image, and component information for mounting the electronic component indicated in the component image. Obtained in a referable manner.
- the component image includes, for example, a component size, a package shape, an angle based on the supply direction, electrode coordinates, and tolerances required for mounting on the electronic component indicated in the component image. Since data related to dimensions and data related to construction methods including moving speed and pressure during mounting and nozzles used can be linked in a referable manner, it is required for operations such as creating electronic component mounting data or mounting electronic components. It is possible to relatively easily refer to data relating to the dimensions and construction method.
- the component image data in which the component image is stored includes the data related to the dimensions and the construction method of the electronic component indicated in the component image, or the reference destination of the data. Any aspect is applicable as long as the data can be referred to at least by referring to information included in or added to the component image. good.
- the component image is based on a detection step of detecting the component information in the electronic component indicated in the component image, and the component information. And a generation step of generating the component information related to the electronic component shown in FIG.
- image recognition is performed on a component image that cannot be referred to data relating to the size and method in the electronic component indicated in the component image, so that the size and method in the electronic component can be reduced.
- data can be detected.
- the data can be further generated based on the detected data.
- the generation of data may be obtained by performing an operation based on detection data, for example, and data may be obtained by referring to an existing data source such as a data library related to electronic components. May be obtained. That is, as long as at least other data related to the electronic component can be acquired based on the detection data, the specific technique may be any form.
- the display step is different from the layer on which the board image is displayed, and the component image is independent for each component image. Display on different layers.
- a substrate image is displayed on a layer arranged at the back of the plurality of layers (that is, a background layer), and the plurality of layers arranged on the background layer are superimposed on each other.
- the part image is displayed on the screen.
- one component image is displayed for each layer, and by moving the layers individually, the alignment of a plurality of component images can be performed independently for each component image.
- the shape of each layer is preferably a rectangle set in accordance with the minimum size at which the shape of the component image displayed in each layer can be displayed.
- the plurality of component images are moved simultaneously.
- the amount of processing increases significantly as the amount of data or the number of points of the image to be moved increases. Accordingly, when creating electronic component mounting data that requires individual alignment of a relatively large number of component images, the amount of processing is enormous, which may cause a technical problem of operation responsiveness.
- the layer where the desired component image is displayed is moved from among the plurality of component layers.
- the processing amount (in other words, memory consumption) for displaying a plurality of layers on which individual component images are displayed is taken into consideration, that is, the processing for moving a plurality of images on a single layer (that is, Compared with erasing and drawing), it is possible to move the component image with a small processing amount.
- the processing amount for displaying the plurality of layers can be reduced. is there.
- the component image acquisition step is an image image on a side opposite to a side of the electronic component mounted facing the substrate.
- the component surface image obtained by making the outside of the outline of the electronic component transparent is acquired, and the display step displays the component surface image and the component image at the same scale.
- the front side image that is, the component surface image
- the back side image that is, the component image
- the front side image that is, the component surface image
- the back surface image of the component is made translucent so that the electrode position and the land position on the board image can be easily aligned and the component surface image can be referred to.
- the display step may be configured to display the component surface image and the component image while alternately switching.
- the image after switching is displayed at the same position (or coordinates) without changing the display position of the component image by switching. Therefore, the above-described effect obtained by displaying the component image and the component surface image can be more easily enjoyed. In particular, in the case of a component in which the electrode is not visible in the component surface image and the electrode is visible only in the component image, the above-described effect obtained by switching and displaying the component image and the component surface image can be more easily enjoyed. It becomes possible.
- the display step may be configured so that the component surface image and the component image are displayed in an overlapping manner, and at the same time, one of them is displayed through the other so that both are visible.
- an image recognition process for performing image recognition of the component image and the board image, and the component image based on a result of the image recognition. And an arrangement step of arranging at a predetermined position on the substrate image.
- the part image can be arranged on the board image relatively easily.
- the image recognition detects the electrode position, the outer shape of the electronic component, the polarity mark, etc. shown in the component image, and on the other hand, the fiducial mark or electronic component on the substrate shown in the substrate image. Is to detect the land position, the polarity mark, and the like to be arranged and obtain them as information relating to both images.
- the arrangement at the mounting position means that the component electrode position and outer shape recognized by the image coincide with the land position on the board image (more preferably, the direction in which the polarity mark of the part and the polarity mark of the board match).
- the image recognition step includes at least one of the electrode position, the outer shape, and the polarity mark of the electronic component indicated in the component image, and the land position and the polarity mark of the substrate indicated in the substrate image.
- Image recognition for detecting at least one is performed, and the coordinate calculation step calculates the coordinates by arranging the component image at a mounting position on the board image based on the image recognition result.
- the electrode position of the electronic component indicated in the component image is detected by image recognition, and typically, the electrode position and the land position on the board image are determined to coincide with each other.
- the mounting position of the electronic component can be determined with higher accuracy. Such an effect is particularly remarkable in the automatic placement of component images at the mounting position by a computer.
- An embodiment of the electronic component mounting apparatus is an electronic component mounting apparatus for mounting an electronic component on a substrate, and is a substrate that is an image image of the substrate on which the electronic component is mounted.
- Board image acquisition means for acquiring an image
- component image acquisition means for acquiring a component image obtained by inverting an image image of the electronic component mounted on the side facing the board; and the component image on the board image.
- display means for displaying in a movable manner in the same scale as the board image, coordinates calculating means for calculating the coordinates of the electronic component displayed on the board image, and
- data creation means for creating the electronic component mounting data for mounting the electronic component on the substrate.
- the electronic component mounting data creating apparatus of the present invention when the electronic component mounting data creating method according to the present invention described above is performed, the dimension data or the like related to the board or electronic component is not used. Even so, it is possible to create electronic component mounting data for mounting electronic components on an actual board.
- the electronic component mounting data creation device may be configured to acquire an image of the substrate and the supplied electronic component by including a camera and a scanner as the substrate image acquisition unit and the component image acquisition unit. .
- each image may be acquired by referring to a substrate image and an electronic component image that are acquired in advance and stored in a memory provided in the electronic component mounting data generation apparatus.
- Another aspect of the embodiment of the electronic component mounting apparatus of the present invention further includes mounting means for mounting the electronic component on the substrate based on the electronic component mounting data.
- An electronic component mounting device typically holds a substrate on the device and places the electronic component at each land position by movement of an arm that is movable by providing a servo motor or the like on the substrate. By doing so, electronic components are mounted. Such arrangement of the electronic components is performed by driving the arm under the control of the CPU based on the above-described electronic component mounting data stored in the memory, for example.
- the image acquisition unit 100 is a specific example of the board image acquisition unit and the component image acquisition unit according to the present invention, and typically includes a camera that can acquire an image of a subject as image data.
- Image data acquired by the image acquisition unit 100 is stored in the memory 170.
- the image acquisition unit 100 also has a function of processing image data, and the acquired component image is made transparent (more preferably, completely transparent) outside the outline of the electronic component indicated by the component image. It may be configured to store in the memory 170 after performing the above.
- FIG. 2 is a schematic diagram illustrating a series of flows in acquiring a component image according to the present embodiment. Further, the component image may be acquired as a rectangle having a shape with some margins on the outer shape of the electronic component shown in the electronic component.
- the image acquisition unit 100 acquires an image of the side mounted on the substrate (that is, the back side) when mounting the electronic component, and further reverses the acquired image horizontally (or upside down, etc.) Are obtained as part images.
- the image of the back side of the electronic component is reversed left and right (or various reversal processes including upside down, etc.), so that the front side of the electronic component (in other words, facing the substrate when mounting the electronic component)
- FIG. 3 is a schematic view showing an aspect of acquiring a component image on the back side of the electronic component according to this embodiment.
- the image acquisition unit 100 may be configured to acquire an image on the front side of the electronic component.
- the component image showing the back side of the electronic component it is easy to visually recognize the electrode position that contacts a predetermined position of the substrate at the time of mounting, and as a feature of the component image showing the front side of the electronic component, The aspect of the electronic component at the time of mounting is visible.
- the image display unit 110 is a specific example of the display unit according to the present invention, and typically includes a display capable of displaying a board image and a component image in a manner that is visible to the user.
- the image display unit 110 displays a substrate image acquired by the image acquisition unit 100, and is superimposed on the substrate image by a user operation or alignment processing by an image recognition unit 150 described later, and is the same as the substrate image.
- a scaled part image is displayed.
- the component image is a plurality of layers different from the layer on which the board image is displayed, and is displayed on a different layer for each component image, and the layer is the same as the displayed component image.
- the shape is displayed.
- the displayed board image and component image are displayed in a manner that can be moved on a predetermined coordinate axis by the user's operation or alignment processing. Specifically, with respect to a board image displayed at a predetermined angle, a component image is displayed at a predetermined angle on a plane coordinate having a predetermined position in the board image as an origin (in other words, arranged). Is done.
- FIG. 4 is a schematic diagram showing a part image alignment mode according to the present embodiment.
- the user's operation or the automatic alignment process is performed so that the corresponding electronic component 220 is arranged on the silk 211 indicating the mounting position of the electronic component 220 in the board image.
- the user's operation or automatic alignment processing is performed in consideration of this point. It is preferable.
- the display of the board image on which the component image is arranged is actually It has a visual effect equivalent to a substrate image on which electronic components are mounted.
- the image display unit 110 may be configured to display a component image indicating the front side of the electronic component in addition to the component image indicating the back side of the electronic component. At this time, the image display unit 110 may switch and display the back side image and the front side image of the component at the same position on the screen or on the same coordinate in accordance with a user operation. It is also possible to perform a transmission process in such a manner that both of them can be visually recognized at the same time, and to superimpose them for display. That is, it is possible to visually recognize the electrode position in at least the component image, and on the other hand, the so-called back electrode component that cannot be visually recognized from the component surface image can be aligned with the land 212 and the electrode 221 in the board image.
- the aspect of the electronic component 220 actually arranged on the substrate 210 is not limited as long as it can obtain a considerable visual effect corresponding to the real thing.
- the mounting apparatus 1 is preferably configured to include, for example, a mouse or a keyboard as operation means for suitably reflecting the user's operation on the image display.
- the image display unit 110 may be configured to display a board image or a component image by referring to image data acquired in advance by the image acquisition unit 100 and stored in the memory 170. As long as a predetermined image defined by the user operation or the automatic alignment process can be displayed, the mode may be arbitrary.
- the coordinate calculation unit 120 is a specific example of the coordinate calculation unit according to the present invention, and typically indicates a predetermined function of the CPU that acquires data related to the component image displayed on the image display unit 110.
- the coordinate calculation unit 120 acquires coordinates in a planar space with a predetermined position on the substrate as the origin in each of the component images arranged on the substrate image by a user operation or alignment processing. At this time, it is preferable that various component arrangement information related to the arrangement such as an angle of the component image is also acquired.
- the coordinate acquisition unit 120 acquires various data that can be read to reproduce the arrangement mode of each component image arranged on the board image in the image display unit 110.
- the coordinate calculation unit 120 outputs the acquired component arrangement information to the mounting data creation unit 130 or stores it in the memory 170.
- the mounting data creation unit 130 is a specific example of the data creation unit according to the present invention. Typically, the mounting data creation unit 130 receives the input of the component image arrangement information acquired by the coordinate calculation unit 120 and is based on the arrangement information. A predetermined function of the CPU for creating mounting data for mounting electronic components is shown. The mounting data creation unit 130 creates mounting data including position information, angle information, and the like related to the placement of each electronic component for mounting the electronic component on an actual board based on the placement information of the component image. Further, the mounting data creation unit 130 can create mounting data including construction method data for mounting each electronic component by acquiring data related to the electronic component stored in the component data library 300 described later. preferable.
- the mounting data created in this way can create a board on which the electronic component is mounted according to the concept at the time of component image placement by mounting the electronic component on the board according to at least information included in the mounting data.
- the purpose of this is to indicate a set of information required for this purpose.
- the alignment process may be performed using a plurality of substrate images divided into a plurality of image areas each including at least one land position, and more preferably divided once only at the start of production. It is preferable that an image of the entire board is synthesized from the plurality of board images thus obtained, and the alignment process between the synthesized board image and the component image is performed first.
- the image recognition unit 150 can also acquire information such as the form and size of the electronic component indicated in the component image as necessary by recognizing the component image.
- the acquired information is output to the component data generation unit 160, and the component data generation unit 160 generates component data based on the information.
- the component data generation unit 160 may be configured to acquire other data related to the electronic component by referring to a component data library in which various component data is stored based on the acquired information. good.
- the generated component data is stored in, for example, the memory 170 by being included in or associated with the corresponding component image data.
- FIG. 5 is an example of a flowchart showing the flow of the electronic component mounting data creation method.
- images of the board and the electronic component 200 are acquired, and the images are displayed on a display unit such as a display.
- the displayed component image is arranged at a predetermined position on the board image by a user operation or an automatic alignment process based on an image recognition result by the CPU, and the component angle such as an arrangement angle and coordinates is related to the component mounting.
- Data acquisition is performed.
- mounting data for mounting the electronic component on the actual board is created based on the acquired component arrangement data.
- the image of the electronic component 200 and the board used for mounting the electronic component are acquired by the operation of the image acquisition unit 100 (steps S101 and S102). ).
- the image acquisition unit 100 steps S101 and S102.
- the image acquisition unit 100 by performing processing to make the outside of the outline (in other words, the outer shape) of the electronic component transparent, it is acquired as an image having the same outer shape as the outer shape of the electronic component 220 shown in the component image.
- a predetermined image is designated by a user operation or the like and displayed on the image display unit 110 (step S103).
- the displayed image is in a mode in which it can move on the plane coordinates under the user's operation or the control by the CPU. That is, for example, it is possible to move the component image so as to be arranged at an arbitrary position in the plane coordinate system with a predetermined position of the board image displayed on the display as an origin.
- the user's operation is, for example, an operation with a pointing device such as a mouse or an input of coordinates and angles. Based on such an operation, a predetermined component image is moved and displayed on the board image. Is done.
- a component image is displayed at the set coordinates and angle.
- the electronic component mounting data creation method according to the present invention and the mounting of the electronic component according to the mounting data are performed. At this time, for example, even when the dimension information relating to the electronic component cannot be referred to, it is possible to create mounting data of the electronic component by using the component image of the electronic component.
- the component image indicating the back side of the electronic component since the component image indicating the back side of the electronic component is used, it is relatively easy to visually recognize the electrode position of the electronic component. Therefore, in an operation accompanied by visual recognition by the user or alignment by image recognition, it is relatively easy to align the position of the board-side electrode 212 shown in the board image and the electrode position 221 of the electronic component shown in the component image. And can be implemented with high accuracy. Further, by using the image on the front side of the electronic component together, it is possible to obtain a visual effect equivalent to the external shape of the electronic component mounted on the substrate from the component image displayed on the display means. Therefore, it is also possible to create a drawing sample or work sample having visibility equivalent to the actual product.
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Abstract
Description
上記課題を解決するために、本発明の電子部品の実装装置は、電子部品を基板上に実装するための電子部品の実装装置であって、前記基板の前記電子部品が実装される側のイメージ画像である基板画像を取得する基板画像取得手段と、前記電子部品の前記基板に対向して実装される側のイメージ画像を反転した部品画像を取得する部品画像取得手段と、前記部品画像を前記基板画像上に、前記基板画像と同縮尺であり、且つ移動可能な態様で表示する表示手段と、前記基板画像上に表示される前記電子部品の座標を算出する座標算出手段と、算出された前記座標に基づき、前記電子部品を前記基板上に実装するための前記電子部品実装データを作成するデータ作成手段とを備える。
100…画像取得部
110…画像表示部
120…座標算出部
130…実装データ作成部
140…実装部
150…画像認識部
160…部品データ生成部
200…基板、電子部品
300…部品データライブラリ
従って、基板設計CADなどから得られる基板へのおおよその実装座標がわかれば、電子部品に係る寸法データなどを用いない場合であっても、実際の基板及び電子部品から取得される、基板画像及び電子部品画像を用いることで、電子部品の実装を行うことが可能となる。
まず、本発明に係る電子部品の実装データの作成方法を実施するための、電子部品の実装装置の構成例について、図1を参照しながら説明する。ここに、図1は本実施例に係る電子部品の実装装置の各部の構成を示す概略図である。
次に、図5を参照して、上述の電子部品の実装データの作成装置によって実施される、本発明の実施例に係る電子部品の実装データ作成方法の流れについて説明する。図5は、電子部品の実装データ作成方法の流れを示すフローチャートの一例である。この電子部品の実装データ作成方法によれば、基板及び電子部品200の画像が取得され、該画像は、例えばディスプレイなどの表示手段に表示される。表示される部品画像は、ユーザの操作、或いはCPUによる画像認識結果に基づく自動位置合わせ処理によって基板画像上の所定位置に配置され、夫々の部品画像について配置角度、座標など、部品の実装に係るデータの取得が行われる。そして、取得された部品の配置データに基づき、実際の基板上に電子部品を実装するための実装データが作成される。
Claims (14)
- 電子部品を基板上に実装するための電子部品実装データの作成方法であって、
前記基板の前記電子部品が実装される側のイメージ画像である基板画像を取得する基板画像取得工程と、
前記電子部品の前記基板に対向して実装される側のイメージ画像を反転した部品画像取得する部品画像取得工程と、
前記部品画像を前記基板画像上に、前記基板画像と同縮尺であり、且つ移動可能な態様で表示する表示工程と、
前記基板画像上に表示される前記電子部品の座標を算出する座標算出工程と、
算出された前記座標に基づき、前記電子部品を前記基板上に実装するための前記電子部品実装データを作成するデータ作成工程と
を備えることを特徴とする電子部品実装データの作成方法。 - 前記部品画像取得工程は、前記電子部品の輪郭外側を透明化した前記部品画像を取得することを特徴とする請求の範囲第1項に記載の電子部品実装データの作成方法。
- 前記部品画像取得工程は、所定の背景を用いることで前記電子部品の輪郭を判別し、前記部品画像を取得することを特徴とする請求の範囲第2項に記載の電子部品実装データの作成方法。
- 前記部品画像取得工程は、前記部品画像を、前記部品画像に示される前記電子部品に係る実装のための部品情報を参照可能な態様で取得することを特徴とする請求の範囲第1項に記載の電子部品実装データの作成方法。
- 前記部品画像に示される前記電子部品における、前記部品情報を検出する検出工程と、
前記部品情報に基づき、前記部品画像に示される前記電子部品に係る前記部品情報を生成する生成工程と
を更に備えることを特徴とする請求の範囲第1項に記載の電子部品実装データの作成方法。 - 前記表示工程は、前記部品画像を、前記基板画像が表示されるレイヤとは異なり、且つ前記部品画像毎に独立する相異なる複数のレイヤに表示することを特徴とする請求の範囲第1項に記載の電子部品実装データの作成方法。
- 前記部品画像取得工程は、前記電子部品の前記基板に対向して実装される側とは反対側のイメージ画像であり、前記電子部品の輪郭外側を透明化した部品表面画像を取得し、
前記表示工程は、前記部品表面画像及び前記部品画像を同縮尺で表示することを特徴とする請求の範囲第1項に記載の電子部品実装データの作成方法。 - 前記表示工程は、前記部品表面画像及び前記部品画像を交互に切り替えながら表示可能であることを特徴とする請求の範囲第7項に記載の電子部品実装データの作成方法。
- 前記表示工程は、前記部品表面画像及び前記部品画像を重ねて表示するとともに、同時に両者が視認可能となるよう一方が他方を透過して表示することを特徴とする請求の範囲第7項に記載の電子部品実装データの作成方法。
- 前記部品画像及び前記基板画像の画像認識を行う画像認識工程と、
該画像認識の結果に基づき、前記部品画像を前記基板画像上の所定の位置に配置する配置工程と
を更に備えることを特徴とする請求の範囲第1項から第9項に記載の電子部品実装データの作成方法。 - 前記画像認識工程は、前記部品画像に示される前記電子部品の電極位置、外形及び極性マークのうち少なくとも一つ、並びに前記基板画像に示される前記基板のランド位置及び極性マークのうち少なくとも一つを検出する画像認識を行い、
前記座標算出工程は、該画像認識の結果に基づき、前記部品画像を前記基板画像上の実装位置に配置することで、前記座標を算出することを特徴とする請求の範囲第10項に記載の電子部品実装データの作成方法。 - 電子部品を基板上に実装するための電子部品実装データの作成装置であって、
前記基板の前記電子部品が実装される側のイメージ画像である基板画像を取得する基板画像取得手段と、
前記電子部品の前記基板に対向して実装される側のイメージ画像を反転した部品画像を取得する部品画像取得手段と、
前記部品画像を前記基板画像上に、前記基板画像と同縮尺であり、且つ移動可能な態様で表示する表示手段と、
前記基板画像上に表示される前記電子部品の座標を算出する座標算出手段と、
算出された前記座標に基づき、前記電子部品を前記基板上に実装するための前記電子部品実装データを作成するデータ作成手段と
を備えることを特徴とする電子部品実装データの作成装置。 - 前記部品画像に示される前記電子部品の電極位置、外形及び極性マークのうち少なくとも一つ、並びに前記基板画像に示される前記基板のランド位置及び極性マークのうち少なくとも一つを検出する画像認識を行う画像認識手段と、
該画像認識の結果に基づき、前記部品画像を前記基板画像上の所定の位置に配置する配置手段と、
を更に備えることを特徴とする請求の範囲第12項に記載の電子部品実装データの作成装置。 - 前記電子部品実装データに基づき、前記電子部品を前記基板上に実装する実装手段を更に備えることを特徴とする請求の範囲第12項に記載の電子部品実装データの作成装置。
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