KR101122806B1 - Electronic component mounting apparatus and electronic component mounting method - Google Patents

Electronic component mounting apparatus and electronic component mounting method Download PDF

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Publication number
KR101122806B1
KR101122806B1 KR1020050045340A KR20050045340A KR101122806B1 KR 101122806 B1 KR101122806 B1 KR 101122806B1 KR 1020050045340 A KR1020050045340 A KR 1020050045340A KR 20050045340 A KR20050045340 A KR 20050045340A KR 101122806 B1 KR101122806 B1 KR 101122806B1
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KR
South Korea
Prior art keywords
electronic component
recognition processing
lead
exist
component
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KR1020050045340A
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Korean (ko)
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KR20060046250A (en
Inventor
다까시 요시이
아끼히로 우라까와
Original Assignee
가부시끼가이샤 히다찌 하이테크 인스트루먼츠
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Priority to JP2004160716A priority Critical patent/JP4417779B2/en
Priority to JPJP-P-2004-00160716 priority
Application filed by 가부시끼가이샤 히다찌 하이테크 인스트루먼츠 filed Critical 가부시끼가이샤 히다찌 하이테크 인스트루먼츠
Publication of KR20060046250A publication Critical patent/KR20060046250A/en
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=34993334&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR101122806(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/081Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base
    • Y10T29/49165Manufacturing circuit on or in base by forming conductive walled aperture in base
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/5313Means to assemble electrical device
    • Y10T29/53174Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178Chip component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/5313Means to assemble electrical device
    • Y10T29/53191Means to apply vacuum directly to position or hold work part

Abstract

An object of the present invention is to prevent incorrect mounting of an electronic component due to erroneous locking of the component supply unit to the apparatus main body.
The recognition process of the electronic component is performed in accordance with the component library data stored in the RAM 22. In accordance with the "normal" data of the inspection conditions of the parts library data, the detection of the presence or absence of the reads of the group numbers "1" and "2" is performed by the recognition processing apparatus 13 on the basis of the instruction of the CPU 21, and all reads are performed. If it is judged that there is, the CPU 21 instructs the recognition processing device 13 to calculate the position shift amount based on the image picked up by the component recognition camera 16A, and the position and angle of the electronic component are calculated. . Next, the recognition processing apparatus 13 checks the absence confirmation of the lead which should not exist. If the presence of one lead that should not exist even one is detected, the CPU 21 judges that the "no confirmation lead detection abnormality" of the lead that should not exist, and drops it from the suction nozzle 17A and collects it in the waste collection box. .
Suction nozzle, parts recognition camera, recognition processing unit, CPU, RAM

Description

ELECTRONIC COMPONENT MOUNTING APPARATUS AND ELECTRONIC COMPONENT MOUNTING METHOD}

1 is a plan view of an electronic component mounting apparatus.

2 is a control block diagram;

3 is a diagram showing component library data.

4 is a diagram showing a plan view of an electronic component for convenience of explanation of inspection conditions;

5 is a diagram showing a flowchart for recognition processing.

<Explanation of symbols for the main parts of the drawings>

3: parts supply unit

13: recognition processing device

16A, 16B: Part Identification Camera

17A, 17B: Suction Nozzle

21: CPU

22: RAM

[Document 1] Japanese Unexamined Patent Publication No. 2001-304828

The present invention provides an electronic component mounting apparatus and an electronic component which recognizes and processes an image obtained by a component recognition camera on an electronic component taken out from an arbitrary component supply unit and sucked and held by an adsorption nozzle, and mounted on a printed board by a recognition processing apparatus. It relates to a component mounting method.

An electronic component mounting apparatus of this kind is known, for example, from Japanese Patent Laid-Open No. 2001-304828 (Patent Document 1) and the like. In general, the lead attachment part, the ball grid array (BGA), or the chip size package (CSP) detects only the lead or solder ball registered and stored as the part library data, and even if an unregistered lead or solder ball is present, Ignoring this, it was being processed.

[Patent Document 1] Japanese Unexamined Patent Application Publication No. 2001-304828

Therefore, a predetermined component supply unit must be set at a predetermined position on the apparatus main body. When the component supply unit for supplying other electronic components is set so that the component supply unit is erroneously caught, the lead or solder ball that should be present should be In the case where there were more electronic parts that were actually processed than the number, it could not be determined as abnormal. That is, when the electronic component of TR 6 pin (transistor with 6 pins) is recognized using the component library data of the electronic component of TR 3 pin (transistor with 3 pins), it is determined as above. It could not be done, and it was wrong to mount it on the printed circuit board.

Therefore, an object of the present invention is to prevent the erroneous mounting of an electronic component due to an error of the component supply unit to the apparatus main body.

For this reason, the 1st invention mounts the electronic component which recognizes the image image | photographed by the component recognition camera of the electronic component taken out from the arbitrary component supply unit and adsorbed-held by the adsorption nozzle by a recognition processing apparatus, and mounts it on a printed board. An apparatus, comprising: memory means for storing data on a lead or solder ball, which should not exist as characteristics of each electronic component, and an image captured by the component recognition camera in accordance with the data stored in the memory means; And control means for controlling the recognition process.

2nd invention is the electronic component mounting apparatus which recognizes the image which image | photographed the electronic component picked up from arbitrary component supply units and adsorbed-held by the adsorption nozzle with the component recognition camera by a recognition processing apparatus, and mounts it on a printed board. And a storage means for storing data about a lead or solder ball, which must exist as characteristics of each electronic component, and data on a lead or solder ball, which should not exist, and the component recognition in accordance with both of the data stored in the storage means. It is characterized by providing control means for controlling the recognition processing device to perform recognition processing on the image captured by the camera.

The third invention is, in the first or second invention of the electronic component mounting apparatus, in the case where it is determined that there is a lead or solder ball that should not exist as a result of the recognition processing by the recognition processing apparatus, the electronic component is mounted. A control device for controlling to stop operation is provided.

Moreover, 4th invention is the electronic component mounting method which mounts on the printed circuit board by the recognition processing apparatus the image processed by the component recognition camera of the image picked up from the arbitrary component supply unit, and the adsorption holding held by the suction nozzle by the component recognition camera. In the storage means, and the recognition processing apparatus captures an image captured by the component recognition camera according to the data stored in the storage means. The control means is controlled to process the recognition.

5th invention is the electronic component mounting method which recognizes the image which image | photographed the electronic component picked up from the arbitrary component supply unit and adsorbed-held by the adsorption nozzle with the component recognition camera by a recognition processing apparatus, and mounts it on a printed board. Therefore, the data on the lead or solder ball which should be present as characteristics of each electronic component and the data on the lead or solder ball which should not exist are stored in the storage means, and the component recognition is performed in accordance with the both data stored in the storage means. The control means is controlled so that the recognition processing device recognizes the image captured by the camera.

In the sixth or fifth invention of the electronic component mounting method, the sixth invention mounts the electronic component when it is determined that there is a lead or solder ball that should not exist as a result of the recognition processing by the recognition processing apparatus. It characterized in that the control to stop the operation.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described based on drawing. FIG. 1 is a plan view of an electronic component mounting apparatus 1, in which a variety of electronic components are mounted on a component supply table (not shown) provided in the mounting apparatus main body 2 of the mounting apparatus 1, respectively. The component supply unit 3 which supplies one by one to the component suction position is provided in parallel. The supply conveyor 4, the positioning part 5, and the discharge conveyor 6 are provided between the opposing unit 3 groups. The supply conveyor 4 conveys the printed board P received from the upstream to the said positioning part 5, and on the said board | substrate P positioned by the positioning mechanism not shown by the positioning part 5. After the electronic component is mounted, it is conveyed to the discharge conveyor 6.

Reference numerals 8A and 8B denote a pair of beams long in the X direction, respectively, to rotate the screw shaft 10 by driving of the Y-axis motor 9, and the printed circuit board P along the left and right pairs of guides 11. In addition, the part ejection part (part adsorption position) upper direction of the component supply unit 3 is moved to a Y direction individually.

Each of the beams 8A, 8B is provided with mounting heads 7A, 7B that move along the guide (not shown) by the X-axis motor 12 in its longitudinal direction, that is, in the X direction. Each mounting head 7A, 7B is equipped with a vertical axis motor 14 for moving the suction nozzles 17A, 17B up and down and a θ axis motor 15 for rotating around the vertical axis. Therefore, the suction nozzles of the two mounting heads 7A and 7B are movable in the X direction and the Y direction, are rotatable around the vertical line, and can be moved vertically.

Reference numerals 16A and 16B are component recognition cameras for component position recognition, each of which is provided with two adsorption nozzles 17A and 17B corresponding to each other, and how much the electronic component is displaced with respect to the adsorption nozzle and adsorbed and held. With respect to the direction and the rotation angle, the electronic component is imaged for position recognition, but two electronic components can be imaged at the same time. Reference numerals 18 and 18 denote nozzle stockers for storing various adsorption nozzles, and a maximum of 10 can be stored, but 9 are stored.

2 is a control block diagram of the electronic component mounting apparatus 1, and for convenience, the X-axis motor 12, the Y-axis motor 9, the θ-axis motor 15, the up-and-down shaft motor 4, and the like are each 1. Only dogs are shown and described below.

CPU 21 as a control unit that collectively controls the operation of mounting the electronic components of the mounting apparatus 1, RAM (random access memory) 22 and ROM (lead only memory) 23 as storage devices. And the like.

The RAM 22 includes printed boards such as X direction, Y direction and angle information in the printed board P and placement number information of each component supply unit 3 in each mounting order (every step number). The mounting data is stored for each type of P), and information on the type (part ID) of each electronic part corresponding to the arrangement number (lane number) of the respective component supply units 3, that is, the component arrangement information is stored. have. The part library data is also stored for each part ID, which is composed of items representing characteristics such as group numbers, group directions, lengths of the X and Y directions of the leads, the number of leads, the pitch, the positions and the inspection conditions, and the like. .

For example, the component library data of the electronic component of the TR 3 pin as shown in FIG. 4 is shown in FIG. 3, and the data shown at the top indicated by the group number &quot; 1 &quot; The data shown in the second stage represented by the group number "2" represents data relating to the lead and the like on the side with two leads, and the data shown in the third stage represented by the group number "3" is the side with one lead. The data related to the lead or the like that should not exist is shown, and the data shown in the fourth stage indicated by the group number "4" represents the data relating to the lead or the like which should not exist on the side having two leads.

The white lead of the electronic component shown in FIG. 4 has an inspection condition of "normal", the presence or absence of a lead, or a bend, which should be present as usual, is inspected, and the hatched lead has an inspection condition of "no confirmation". This means doing a no-check check of the leads that should not be.

Then, the CPU 21 collectively controls the operation relating to the component mounting operation of the electronic component mounting apparatus 1 in accordance with the program stored in the ROM 23 based on the data stored in the RAM 22. . That is, the CPU 21 drives the X-axis motor 12 through the drive circuit 25, drives the Y-axis motor 9 through the drive circuit 28, and drives the drive circuit 32. The drive of the θ-axis motor 15 is controlled through this, and the drive of the up / down shaft motor 14 is controlled via the drive circuit 30.

Reference numeral 13 denotes a recognition processing device connected to the CPU 21 through an interface 24, and the recognition processing of the image captured by the component recognition cameras 16A and 16B is carried out in the recognition processing device 13. The processing result is sent to the CPU 21. That is, the CPU 21 outputs an instruction to the recognition processing device 13 to perform recognition processing (calculation of positional displacement amount, etc.) of the image picked up by the component recognition cameras 16A, 16B, and at the same time recognizes the recognition processing result. It is received from the apparatus 13.

That is, when the amount of positional shift | offset | difference is grasped | ascertained by the recognition processing of the said recognition processing apparatus 13, the result is conveyed to CPU21, and the CPU21 makes the beams 8A and 8B drive the Y-axis motor 9. By the mounting heads 7A and 7B in the X direction by the drive of the X-axis motor 12, and the adsorption nozzles 17A and 17B are rotated by the θ-axis motor 15. The rotation angle position around the X, Y direction and the vertical axis is corrected.

The CRT 36 as a display device is provided with various touch panel switches 35 as input means for data setting, and various settings can be made by the operator by operating the touch panel switch 35. A keyboard may be used as an input means for the purpose.

Although the operation | movement is demonstrated below based on FIG. 3 especially by the above structure, although two mounting heads are provided with 7A and 7B, for convenience of description, it demonstrates below with the mounting head 7A as an example. First, the printed board P is conveyed to the positioning part 5 via the supply conveyor 4 rather than an upstream apparatus by the conveyor which is not shown in figure, and is positioned and fixed by the positioning mechanism. Then, the XY coordinate position to which the printed circuit board P stored in the RAM 22 should be mounted, the rotation angle position around the vertical axis, the FDR number (arrangement number of each component supply unit 3), and the like are assigned to the specified mounting data. Therefore, the electronic component to which the suction nozzle 17A corresponding to the component type of the electronic component is to be mounted is sucked from the predetermined component supply unit 3 and taken out.

That is, the suction nozzle 17A of the mounting head 7A moves so as to be located above the component supply unit 3 that houses the electronic component to be mounted in mounting step number 0001, but the Y direction is driven by the drive circuit 28. The Y-axis motor 9 is driven to move the beam 8A along the pair of guides 11, and the X-axis motor 12 is driven by the drive circuit 25 in the X-direction to mount the head 7A. Is moved, and the predetermined component supply unit 3 is already driven so that the component can be taken out at the component adsorption position, so that the vertical shaft motor 14 is driven by the drive circuit 30 so that the nozzle 17A is moved. It descends and absorbs and extracts an electronic component.

Next, the CPU 21 moves the suction nozzle 17A above the part recognition camera 16A by the Y-axis motor 9 and the X-axis motor 25. The component recognition camera 16A picks up the electronic component adsorbed and held by this suction nozzle 17A, and the recognition processing device 13 recognizes the captured image.

This recognition processing will be described in detail with reference to Fig. 5 showing a flowchart for the recognition processing. First, a recognition process is performed in accordance with the part library data based on the part arrangement information on the type of electronic component corresponding to the arrangement number information of the component supply unit 3 for each mounting order stored in the RAM 22. Hereinafter, the said electronic component is demonstrated as an electronic component of TR3 pin.

First, in accordance with the "normal" data of the inspection conditions of the part library data, detection of the presence or absence of reads that should exist for the group numbers "1" and "2" is performed based on the instruction of the CPU 21. Is done by. In this case, in the case where there is one lead on one side of the electronic component and there are two leads on the other side, the data shown in the uppermost and second stages is the data according to the recognition processing of the recognition processing device 13. Based on the result, it is determined that there are all the leads that the CPU 21 must exist in the electronic component. Then, the CPU 21 instructs the recognition processing device 13 to perform recognition processing (calculation of positional displacement amount, etc.) of the image picked up to the component recognition camera 16A, and picked up by the recognition processing device 13. The position and angle of the electronic component are calculated based on the obtained image. In addition, when the presence or absence of the read which should exist as mentioned above is detected, when the presence (all three presence) of all leads is not detected, it is judged by the CPU 21 as "lead detection abnormality", and the CPU 21 Vacuum suction is released, and the electronic component falls from the suction nozzle 17A at a predetermined position and is recovered in the waste collection box.

Then, as described above, when the position and angle of the electronic component are calculated, the CPU 21 performs the detection (confirmation) of the presence or absence of "no confirmation" data in the inspection condition, and if not, the recognition processing result is normal and ends. According to the data shown in the third and fourth stages, since the CPU 21 detects (confirms) that there is "no confirmation" data, the inspection (detection) of the absence confirmation of the read that should not exist is performed by the CPU 21. It is performed by the recognition processing device 13 on the basis of the command.

Then, the CPU 21 performs detection (confirmation) of lead which should not be hatched in Fig. 4, that is, two lead-ins on one side of the electronic component and one lead on the other side, If it is determined by the CPU 21 that the presence of all the reads (reads that should not exist) has not been detected, the recognition processing result is concluded to be normal. On the other hand, when the presence of the lead which should not exist even if one is detected, CPU21 judges that it is "the abnormal confirmation lead detection abnormality" of the lead which should not exist, and vacuum suction is performed by CPU21. The electronic component is released so as to fall from the suction nozzle 17A at a predetermined position and be recovered in the waste collection box, after which the CPU 21 controls to stop the electronic component mounting apparatus. In this case, the CPU 21 may cause the monitor 36 to display the component supply unit 3 supplied with the electronic component.

Therefore, when it is judged that this is "absence confirmation lead detection abnormality", there is an erroneous locking (set at the wrong position) of the component supply unit 3 on the component supply table, which is the main body of the apparatus, and the worker has a correct component supply unit. By fixing (3) at the position where it is to be set, it is possible to prevent incorrect mounting of electronic components.

Further, after the recognition processing result is finished as normal, the result of determining the position shift amount by the recognition processing of the recognition processing device 13 as described above is transferred to the CPU 21, and the CPU 21 The beams 8A, 8B are moved in the Y direction by the drive of the Y-axis motor 9, and the mounting heads 7A, 7B are moved in the X direction by the drive of the X-axis motor 12, and the θ-axis motor ( 15), and after the correction of the rotation angle position around the X, Y direction and the vertical axis is performed, the electronic component is mounted on the printed board P. FIG.

In addition, although the electronic component with a lead was demonstrated as an example in this embodiment, it is not limited to this, It is applicable also to the ball grid array (BGA) with a solder ball. In this case, the parts library data, such as solder balls such as the size, number, pitch, position and inspection conditions of the solder balls (data for solder balls that should be present and data for solder balls that should not exist), etc. The part library data consisting of items is stored in the RAM 22. Based on this component library data, when a recognition process is performed and a solder ball is detected at a position where the original solder ball of the electronic component should not exist, the detection result difference (polarity difference) is determined by this detection result. You can check it.

Moreover, although the multifunction type chip mounter which an adsorption nozzle can move to an X direction and a Y direction in a horizontal plane was taken as an example as an electronic component mounting apparatus of this embodiment, it is not limited to this, You may apply to what is called a rotary table type high speed chip mounter. .

While the embodiments of the present invention have been described above, various alternatives, modifications, or modifications are possible to those skilled in the art based on the above description, and the present invention has been described in various ways without departing from the spirit thereof. It includes alternatives, modifications or variations.

The present invention can prevent the erroneous mounting of an electronic component due to an error of the component supply unit to the apparatus main body.

Claims (6)

  1. An electronic component mounting apparatus for recognizing, by a recognition processing apparatus, an image of an electronic component taken out of an arbitrary component supply unit and adsorbed and held by an adsorption nozzle by a component recognition camera, and mounted on a printed board. A storage means for storing data about a lead or solder ball that should not exist as a characteristic of and a part recognition camera according to the data stored in this storage means to detect the presence or absence of a lead or solder ball that should not exist. And a control means for controlling the recognition processing device to recognize the image.
  2. An electronic component mounting apparatus for recognizing, by a recognition processing apparatus, an image of an electronic component taken out of an arbitrary component supply unit and adsorbed and held by an adsorption nozzle by a component recognition camera, and mounted on a printed board. Storage means for storing data about leads or solder balls that should be present and data about leads or solder balls that should not exist, and stored in these storage means to detect the presence or absence of leads or solder balls that should not exist. And a control means for controlling the recognition processing device to perform recognition processing on the image captured by the part recognition camera in accordance with the both data.
  3. The control apparatus according to claim 1 or 2, further comprising a control device for controlling to stop the mounting operation of the electronic component when the recognition processing device determines that a lead or solder ball, which should not exist, is present. The electronic component mounting apparatus characterized by the above-mentioned.
  4. An electronic component mounting method in which an electronic component taken out from an arbitrary component supply unit and adsorbed and held by an adsorption nozzle is imaged by a component recognition camera to be processed by a recognition processing device and mounted on a printed board. The data for the lead or solder ball, which should not exist as a characteristic of, is stored in the storage means, and the part recognition camera is photographed according to the data stored in the storage means to detect the presence or absence of the lead or solder ball. And a control means is controlled so that the recognition processing device recognizes an image.
  5. An electronic component mounting method in which an electronic component taken out from an arbitrary component supply unit and adsorbed and held by an adsorption nozzle is imaged by a component recognition camera to be processed by a recognition processing device and mounted on a printed board. The data of the lead or solder ball which should exist as a characteristic of and the data of the lead or solder ball which should not exist are stored in the storage means, and stored in this storage means to detect the presence or absence of the lead or solder ball which should not exist. And control means are controlled such that the recognition processing device recognizes the image captured by the component recognition camera in accordance with the both data.
  6. 6. The method according to claim 4 or 5, wherein the recognition processing device stops the mounting operation of the electronic component when it is judged that there is a lead or solder ball that should not exist as a result of the recognition processing. How to Mount Electronic Components.
KR1020050045340A 2004-05-31 2005-05-30 Electronic component mounting apparatus and electronic component mounting method KR101122806B1 (en)

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Application Number Priority Date Filing Date Title
JP2004160716A JP4417779B2 (en) 2004-05-31 2004-05-31 Electronic component mounting apparatus and electronic component mounting method
JPJP-P-2004-00160716 2004-05-31

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KR20060046250A KR20060046250A (en) 2006-05-17
KR101122806B1 true KR101122806B1 (en) 2012-03-21

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US (1) US7367117B2 (en)
EP (1) EP1603382B1 (en)
JP (1) JP4417779B2 (en)
KR (1) KR101122806B1 (en)
CN (1) CN1705427B (en)
DE (1) DE602005023938D1 (en)

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JP4237766B2 (en) * 2006-02-10 2009-03-11 パナソニック株式会社 Component mounter control method, component mounter and program
WO2008120461A1 (en) * 2007-04-03 2008-10-09 Panasonic Corporation Method for mounting component
JP4846649B2 (en) * 2007-04-26 2011-12-28 株式会社日立ハイテクインスツルメンツ Electronic component mounting device
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