CN1695229A - 用于减少衬底处理室中的杂散光的设备和方法 - Google Patents
用于减少衬底处理室中的杂散光的设备和方法 Download PDFInfo
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- CN1695229A CN1695229A CNA038248980A CN03824898A CN1695229A CN 1695229 A CN1695229 A CN 1695229A CN A038248980 A CNA038248980 A CN A038248980A CN 03824898 A CN03824898 A CN 03824898A CN 1695229 A CN1695229 A CN 1695229A
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B17/00—Furnaces of a kind not covered by any preceding group
- F27B17/0016—Chamber type furnaces
- F27B17/0025—Especially adapted for treating semiconductor wafers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B5/00—Muffle furnaces; Retort furnaces; Other furnaces in which the charge is held completely isolated
- F27B5/04—Muffle furnaces; Retort furnaces; Other furnaces in which the charge is held completely isolated adapted for treating the charge in vacuum or special atmosphere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Radiation Pyrometers (AREA)
Abstract
Description
Claims (47)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/288,271 US6835914B2 (en) | 2002-11-05 | 2002-11-05 | Apparatus and method for reducing stray light in substrate processing chambers |
US10/288,271 | 2002-11-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1695229A true CN1695229A (zh) | 2005-11-09 |
CN100364038C CN100364038C (zh) | 2008-01-23 |
Family
ID=32175878
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB038248980A Expired - Lifetime CN100364038C (zh) | 2002-11-05 | 2003-07-22 | 用于减少衬底处理室中的杂散光的设备和方法 |
Country Status (8)
Country | Link |
---|---|
US (3) | US6835914B2 (zh) |
JP (1) | JP4937513B2 (zh) |
KR (1) | KR101057841B1 (zh) |
CN (1) | CN100364038C (zh) |
AU (1) | AU2003265297A1 (zh) |
DE (1) | DE10393617B4 (zh) |
TW (1) | TWI226941B (zh) |
WO (1) | WO2004044961A1 (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102077335A (zh) * | 2008-07-01 | 2011-05-25 | 应用材料股份有限公司 | 在热处理期间用于测量辐射能的设备和方法 |
CN102576676A (zh) * | 2009-10-09 | 2012-07-11 | 应用材料公司 | 用于改善控制加热和冷却基板的设备与方法 |
CN102820208A (zh) * | 2011-06-08 | 2012-12-12 | 无锡华润上华半导体有限公司 | 快速热处理中控制晶片温度的方法及其快速热处理方法 |
CN106158622A (zh) * | 2014-11-12 | 2016-11-23 | 台湾积体电路制造股份有限公司 | 用于热映射和热工艺控制的方法和装置 |
CN110230098A (zh) * | 2018-03-06 | 2019-09-13 | 哈尔滨理工大学 | 镱铕双掺杂铌酸锂晶体及其制备方法 |
Families Citing this family (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7015422B2 (en) | 2000-12-21 | 2006-03-21 | Mattson Technology, Inc. | System and process for heating semiconductor wafers by optimizing absorption of electromagnetic energy |
US6970644B2 (en) * | 2000-12-21 | 2005-11-29 | Mattson Technology, Inc. | Heating configuration for use in thermal processing chambers |
US7101812B2 (en) | 2002-09-20 | 2006-09-05 | Mattson Technology, Inc. | Method of forming and/or modifying a dielectric film on a semiconductor surface |
US7654596B2 (en) | 2003-06-27 | 2010-02-02 | Mattson Technology, Inc. | Endeffectors for handling semiconductor wafers |
US7109443B2 (en) * | 2004-03-26 | 2006-09-19 | Intel Corporation | Multi-zone reflecting device for use in flash lamp processes |
US20060160365A1 (en) * | 2005-01-14 | 2006-07-20 | Cheng-Ming Wang | Water-cooling apparatus for semiconductor thermal processing |
US20060240680A1 (en) * | 2005-04-25 | 2006-10-26 | Applied Materials, Inc. | Substrate processing platform allowing processing in different ambients |
US8152365B2 (en) * | 2005-07-05 | 2012-04-10 | Mattson Technology, Inc. | Method and system for determining optical properties of semiconductor wafers |
US7543981B2 (en) * | 2006-06-29 | 2009-06-09 | Mattson Technology, Inc. | Methods for determining wafer temperature |
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CN102077335B (zh) * | 2008-07-01 | 2014-04-16 | 应用材料公司 | 在热处理期间用于测量辐射能的设备和方法 |
CN102576676A (zh) * | 2009-10-09 | 2012-07-11 | 应用材料公司 | 用于改善控制加热和冷却基板的设备与方法 |
CN108615674A (zh) * | 2009-10-09 | 2018-10-02 | 应用材料公司 | 用于改善控制加热和冷却基板的设备与方法 |
CN102820208A (zh) * | 2011-06-08 | 2012-12-12 | 无锡华润上华半导体有限公司 | 快速热处理中控制晶片温度的方法及其快速热处理方法 |
CN102820208B (zh) * | 2011-06-08 | 2015-04-22 | 无锡华润上华科技有限公司 | 快速热处理中控制晶片温度的方法及其快速热处理方法 |
CN106158622A (zh) * | 2014-11-12 | 2016-11-23 | 台湾积体电路制造股份有限公司 | 用于热映射和热工艺控制的方法和装置 |
CN110230098A (zh) * | 2018-03-06 | 2019-09-13 | 哈尔滨理工大学 | 镱铕双掺杂铌酸锂晶体及其制备方法 |
Also Published As
Publication number | Publication date |
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TWI226941B (en) | 2005-01-21 |
KR101057841B1 (ko) | 2011-08-19 |
CN100364038C (zh) | 2008-01-23 |
DE10393617B4 (de) | 2015-10-22 |
US6835914B2 (en) | 2004-12-28 |
US20040084437A1 (en) | 2004-05-06 |
US20060289434A1 (en) | 2006-12-28 |
DE10393617T5 (de) | 2005-08-25 |
JP4937513B2 (ja) | 2012-05-23 |
AU2003265297A1 (en) | 2004-06-03 |
US7135656B2 (en) | 2006-11-14 |
WO2004044961A1 (en) | 2004-05-27 |
US7358462B2 (en) | 2008-04-15 |
JP2006505946A (ja) | 2006-02-16 |
KR20050073605A (ko) | 2005-07-14 |
US20050098552A1 (en) | 2005-05-12 |
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