CN1680486A - 有机树脂组合物及其溶液和成型制品 - Google Patents
有机树脂组合物及其溶液和成型制品 Download PDFInfo
- Publication number
- CN1680486A CN1680486A CNA2005100685353A CN200510068535A CN1680486A CN 1680486 A CN1680486 A CN 1680486A CN A2005100685353 A CNA2005100685353 A CN A2005100685353A CN 200510068535 A CN200510068535 A CN 200510068535A CN 1680486 A CN1680486 A CN 1680486A
- Authority
- CN
- China
- Prior art keywords
- organic resin
- acid
- resin composition
- liquid crystal
- inorganic silicate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000011342 resin composition Substances 0.000 title claims abstract description 14
- 229920005989 resin Polymers 0.000 claims abstract description 46
- 239000011347 resin Substances 0.000 claims abstract description 46
- 229910052909 inorganic silicate Inorganic materials 0.000 claims abstract description 36
- 229910052784 alkaline earth metal Inorganic materials 0.000 claims abstract description 9
- 150000001342 alkaline earth metals Chemical class 0.000 claims abstract description 9
- -1 halogenated phenol compound Chemical class 0.000 claims description 46
- 229920000728 polyester Polymers 0.000 claims description 38
- 239000004973 liquid crystal related substance Substances 0.000 claims description 30
- 238000000034 method Methods 0.000 claims description 15
- 239000002904 solvent Substances 0.000 claims description 13
- 229910052728 basic metal Inorganic materials 0.000 claims description 7
- 150000003818 basic metals Chemical class 0.000 claims description 7
- 125000005843 halogen group Chemical group 0.000 claims description 6
- 238000001704 evaporation Methods 0.000 claims description 4
- 125000001424 substituent group Chemical group 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 125000001188 haloalkyl group Chemical group 0.000 claims description 3
- 239000000155 melt Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 238000005266 casting Methods 0.000 claims 1
- 230000003287 optical effect Effects 0.000 claims 1
- 229920001169 thermoplastic Polymers 0.000 claims 1
- 229910052783 alkali metal Inorganic materials 0.000 abstract description 2
- 150000001340 alkali metals Chemical class 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 20
- 150000001875 compounds Chemical class 0.000 description 19
- 238000006116 polymerization reaction Methods 0.000 description 15
- 125000003118 aryl group Chemical group 0.000 description 13
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 12
- 239000000243 solution Substances 0.000 description 12
- 229910052801 chlorine Inorganic materials 0.000 description 10
- 239000000203 mixture Substances 0.000 description 10
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- 239000000047 product Substances 0.000 description 9
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 8
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 8
- 125000001309 chloro group Chemical group Cl* 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 8
- 239000007788 liquid Substances 0.000 description 8
- 238000003786 synthesis reaction Methods 0.000 description 8
- 238000005809 transesterification reaction Methods 0.000 description 8
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 7
- 229910052731 fluorine Inorganic materials 0.000 description 7
- 239000007787 solid Substances 0.000 description 7
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Natural products OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 6
- 239000002253 acid Substances 0.000 description 6
- 238000005917 acylation reaction Methods 0.000 description 6
- 125000000217 alkyl group Chemical group 0.000 description 6
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical group [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 5
- 239000002734 clay mineral Substances 0.000 description 5
- 150000002148 esters Chemical class 0.000 description 5
- 125000001153 fluoro group Chemical group F* 0.000 description 5
- 229910052740 iodine Inorganic materials 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- WXNZTHHGJRFXKQ-UHFFFAOYSA-N 4-chlorophenol Chemical compound OC1=CC=C(Cl)C=C1 WXNZTHHGJRFXKQ-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 125000001246 bromo group Chemical group Br* 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 4
- IZUPBVBPLAPZRR-UHFFFAOYSA-N pentachlorophenol Chemical compound OC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl IZUPBVBPLAPZRR-UHFFFAOYSA-N 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 150000008065 acid anhydrides Chemical class 0.000 description 3
- 238000010306 acid treatment Methods 0.000 description 3
- 239000011575 calcium Substances 0.000 description 3
- 229910052791 calcium Inorganic materials 0.000 description 3
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 229920001940 conductive polymer Polymers 0.000 description 3
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 125000002887 hydroxy group Chemical class [H]O* 0.000 description 3
- 229910052500 inorganic mineral Inorganic materials 0.000 description 3
- 239000011707 mineral Substances 0.000 description 3
- 235000010755 mineral Nutrition 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229910052901 montmorillonite Inorganic materials 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 238000006068 polycondensation reaction Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- 239000007790 solid phase Substances 0.000 description 3
- QPFMBZIOSGYJDE-UHFFFAOYSA-N 1,1,2,2-tetrachloroethane Chemical compound ClC(Cl)C(Cl)Cl QPFMBZIOSGYJDE-UHFFFAOYSA-N 0.000 description 2
- RFFLAFLAYFXFSW-UHFFFAOYSA-N 1,2-dichlorobenzene Chemical compound ClC1=CC=CC=C1Cl RFFLAFLAYFXFSW-UHFFFAOYSA-N 0.000 description 2
- LINPIYWFGCPVIE-UHFFFAOYSA-N 2,4,6-trichlorophenol Chemical class OC1=C(Cl)C=C(Cl)C=C1Cl LINPIYWFGCPVIE-UHFFFAOYSA-N 0.000 description 2
- HFZWRUODUSTPEG-UHFFFAOYSA-N 2,4-dichlorophenol Chemical compound OC1=CC=C(Cl)C=C1Cl HFZWRUODUSTPEG-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000004695 Polyether sulfone Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Chemical compound BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 2
- YHASWHZGWUONAO-UHFFFAOYSA-N butanoyl butanoate Chemical compound CCCC(=O)OC(=O)CCC YHASWHZGWUONAO-UHFFFAOYSA-N 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 2
- VNSBYDPZHCQWNB-UHFFFAOYSA-N calcium;aluminum;dioxido(oxo)silane;sodium;hydrate Chemical compound O.[Na].[Al].[Ca+2].[O-][Si]([O-])=O VNSBYDPZHCQWNB-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 239000012776 electronic material Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 229910000271 hectorite Inorganic materials 0.000 description 2
- KWLMIXQRALPRBC-UHFFFAOYSA-L hectorite Chemical compound [Li+].[OH-].[OH-].[Na+].[Mg+2].O1[Si]2([O-])O[Si]1([O-])O[Si]([O-])(O1)O[Si]1([O-])O2 KWLMIXQRALPRBC-UHFFFAOYSA-L 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- LSACYLWPPQLVSM-UHFFFAOYSA-N isobutyric acid anhydride Chemical compound CC(C)C(=O)OC(=O)C(C)C LSACYLWPPQLVSM-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 229910000273 nontronite Inorganic materials 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- 229920000620 organic polymer Polymers 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229920001643 poly(ether ketone) Polymers 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 239000011591 potassium Substances 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- SCVFZCLFOSHCOH-UHFFFAOYSA-M potassium acetate Chemical compound [K+].CC([O-])=O SCVFZCLFOSHCOH-UHFFFAOYSA-M 0.000 description 2
- WYVAMUWZEOHJOQ-UHFFFAOYSA-N propionic anhydride Chemical compound CCC(=O)OC(=O)CC WYVAMUWZEOHJOQ-UHFFFAOYSA-N 0.000 description 2
- 239000011541 reaction mixture Substances 0.000 description 2
- 229910000275 saponite Inorganic materials 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 230000003595 spectral effect Effects 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- QAEDZJGFFMLHHQ-UHFFFAOYSA-N trifluoroacetic anhydride Chemical compound FC(F)(F)C(=O)OC(=O)C(F)(F)F QAEDZJGFFMLHHQ-UHFFFAOYSA-N 0.000 description 2
- MEFKFJOEVLUFAY-UHFFFAOYSA-N (2,2,2-trichloroacetyl) 2,2,2-trichloroacetate Chemical compound ClC(Cl)(Cl)C(=O)OC(=O)C(Cl)(Cl)Cl MEFKFJOEVLUFAY-UHFFFAOYSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- MCTWTZJPVLRJOU-UHFFFAOYSA-N 1-methyl-1H-imidazole Chemical compound CN1C=CN=C1 MCTWTZJPVLRJOU-UHFFFAOYSA-N 0.000 description 1
- LHJGJYXLEPZJPM-UHFFFAOYSA-N 2,4,5-trichlorophenol Chemical compound OC1=CC(Cl)=C(Cl)C=C1Cl LHJGJYXLEPZJPM-UHFFFAOYSA-N 0.000 description 1
- ZIYRDJLAJYTELF-UHFFFAOYSA-N 2-bromo-4-chlorophenol Chemical compound OC1=CC=C(Cl)C=C1Br ZIYRDJLAJYTELF-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- ZKMUKBBWORLNLA-UHFFFAOYSA-N 4-chloro-2-fluorophenol Chemical compound OC1=CC=C(Cl)C=C1F ZKMUKBBWORLNLA-UHFFFAOYSA-N 0.000 description 1
- JKPLMQJLGBBFLO-UHFFFAOYSA-N 4-chloro-2-iodophenol Chemical compound OC1=CC=C(Cl)C=C1I JKPLMQJLGBBFLO-UHFFFAOYSA-N 0.000 description 1
- XLHYAEBESNFTCA-UHFFFAOYSA-N 4-chloro-3-fluorophenol Chemical compound OC1=CC=C(Cl)C(F)=C1 XLHYAEBESNFTCA-UHFFFAOYSA-N 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- KAUQJMHLAFIZDU-UHFFFAOYSA-N 6-Hydroxy-2-naphthoic acid Chemical compound C1=C(O)C=CC2=CC(C(=O)O)=CC=C21 KAUQJMHLAFIZDU-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000005639 Lauric acid Substances 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000004113 Sepiolite Substances 0.000 description 1
- 229910000720 Silicomanganese Inorganic materials 0.000 description 1
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 1
- 125000002252 acyl group Chemical group 0.000 description 1
- 230000010933 acylation Effects 0.000 description 1
- 150000007933 aliphatic carboxylic acids Chemical class 0.000 description 1
- OBETXYAYXDNJHR-UHFFFAOYSA-N alpha-ethylcaproic acid Natural products CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 229910052898 antigorite Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229910052626 biotite Inorganic materials 0.000 description 1
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical class [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 150000001733 carboxylic acid esters Chemical class 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- SIEILFNCEFEENQ-UHFFFAOYSA-N dibromo-acetic acid Natural products OC(=O)C(Br)Br SIEILFNCEFEENQ-UHFFFAOYSA-N 0.000 description 1
- JXTHNDFMNIQAHM-UHFFFAOYSA-N dichloro-acetic acid Natural products OC(=O)C(Cl)Cl JXTHNDFMNIQAHM-UHFFFAOYSA-N 0.000 description 1
- 229960005215 dichloroacetic acid Drugs 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003925 fat Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- VANNPISTIUFMLH-UHFFFAOYSA-N glutaric anhydride Chemical compound O=C1CCCC(=O)O1 VANNPISTIUFMLH-UHFFFAOYSA-N 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 229910052622 kaolinite Inorganic materials 0.000 description 1
- 229940046892 lead acetate Drugs 0.000 description 1
- UEGPKNKPLBYCNK-UHFFFAOYSA-L magnesium acetate Chemical compound [Mg+2].CC([O-])=O.CC([O-])=O UEGPKNKPLBYCNK-UHFFFAOYSA-L 0.000 description 1
- 239000011654 magnesium acetate Substances 0.000 description 1
- 229940069446 magnesium acetate Drugs 0.000 description 1
- 235000011285 magnesium acetate Nutrition 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000001404 mediated effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- PSHKMPUSSFXUIA-UHFFFAOYSA-N n,n-dimethylpyridin-2-amine Chemical compound CN(C)C1=CC=CC=N1 PSHKMPUSSFXUIA-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 229910001737 paragonite Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- DUCKXCGALKOSJF-UHFFFAOYSA-N pentanoyl pentanoate Chemical compound CCCCC(=O)OC(=O)CCCC DUCKXCGALKOSJF-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
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Abstract
一种低热膨胀系数的有机树脂组合物,包含(a)一种有机树脂和(b)一种含有碱金属和碱土金属的无机硅酸盐,其中无机硅酸盐中碱金属和碱土金属的总量为1000ppm或更低。
Description
本申请要求韩国专利申请2004-23030的优先权,在本申请中全部引用作为参考。
背景技术
发明领域
本发明涉及一种有机树脂组合物、包含它的溶液和其成型制品,该组合物包含一种有机树脂和一种无机硅酸盐,可用于电子和电子仪器领域。
背景技术描述
本领域常见的树脂组合物包含了一种无机硅酸盐,例如蒙脱土。例如,JP-A-2003-105178公开了一种包含树脂和无机硅酸盐的树脂组合物,可用做气体阻挡膜的原料,这种膜可用于多种包装产品。
但是,当JP-A-2003-105178公开的这样的树脂组合物用作电子装置的材料时,该装置在实用性上并不总是有令人满意的性能,由于由组合物制成的膜或片有较高的热膨胀系数,因此,这种膜或片与金属片的层压制品可能会变形,如扭曲。
发明内容
本发明的目的是提供一种有机树脂组合物,它包含一种有机树脂与一种无机硅酸盐,并有较低的热膨胀性。
本发明的另一个目的是提供一种有机树脂组合物的成型制品,该有机树脂组合物包含有机树脂和无机硅酸盐,并且它具有较低的热膨胀性。
因此,本发明提供一种有机树脂组合物,它包括(a)一种有机树脂与(b)一种包含碱金属与碱土金属的无机硅酸盐,其中碱金属与碱土金属的总量为1,000ppm或更低。
本发明也提供一种溶液,包括本发明的有机树脂组合物和一种溶剂。
而且,本发明提供一种成型制品,比如一种包含本发明的树脂组合物的薄膜。
本发明的树脂组合物与包括该树脂组合物的成型制品有低的热膨胀性,也就是说,低的热膨胀系数。
优选方案的详细说明
用于本发明的有机树脂(a)的种类没有限制,可以是任何常规的有机聚合物。有机树脂的具体例子包括热塑性树脂,如聚烯烃(例如聚乙烯,聚丙烯,等等),苯乙烯基树脂(例如聚苯乙烯,苯乙烯共聚物,等等.),聚氯乙烯,聚酰胺,聚丙烯腈,热塑性聚酰亚胺,聚对苯二甲酸乙二醇酯,聚对苯二甲酸丁二酯,液晶聚酯,聚苯硫醚,聚醚酮,聚碳酸酯,聚醚砜,聚苯醚及其衍生物,以及聚醚酰亚胺;热固性树脂比如苯酚树脂,环氧树脂,热固性聚酰亚胺与氰酸盐树脂等等。
其中,热固性聚酰亚胺,环氧树脂,氰酸盐树脂,液晶聚酯,聚苯硫醚,聚醚砜与聚醚酮优选被用作电子材料。
特别地,从高的耐热性与对最近的电子材料所需的高频的响应的角度来看,液晶聚酯最优选作为树脂(a)。优选这样的液晶聚酯,该种聚酯可溶于含有至少30%重量的卤代苯酚化合物溶液中,苯酚化合物的结构如式(I)所示,因为它有小的各向异性,可以填充大量的无机硅酸盐(b)。
其中A是卤素或卤代烷基,如三氟甲基,i是A的数目并且i是1到5的整数,条件是当i是2到5的整数时,取代基A可能相同或不同。
溶解液晶聚酯的溶剂优选含有至少50%重量,更优选至少60%重量的卤代苯酚化合物(I)。最优选的是该溶剂是纯(100%重量)的卤代苯酚化合物(I)。
优选式(I)中i是1,2或3,更优选是1或2。当i是1时,优选A位于4-位,当i至少是2时,至少一个取代基A优选在4-位,而羟基的取代位置是1-位。
式(I)中A的卤素原子是氟,氯,溴或者碘原子。其中,从树脂在化合物(I)中的溶解度来看,优选氟与氯原子。最优选氯原子,因为当A是氯原子时化合物(I)的成本和树脂的溶解度有良好的平衡。
A是氯原子的式(I)化合物的具体例子包括4-氯苯酚,2,4-二氯苯酚,3,4-二氯苯酚,2,4,5-三氯苯酚,2,4,6三氯苯酚,五氯苯酚,等等。A中之一是氟原子的式(I)化合物的具体例子包括4-氯-2-氟苯酚,4-氯-3-氟苯酚,等等。A中之一是溴原子的式(I)化合物的具体例子包括4-氯-2-溴苯酚,等等。A中之一是碘原子的式(I)化合物的具体例子包括4-氯-2-碘苯酚,等等。
A中之一是卤代烷基的式(I)化合物的具体例子包括4-氯-2-三氟甲基苯酚,4-氯-2-五氟乙基苯酚,等等。
更优选式(I)化合物中的A是氯原子。因此优选的式I化合物的例子包括4-氯苯酚,2,4-二氯苯酚,3,4-二氯苯酚,2,4,5-三氯苯酚,2,4,6-三氯苯酚与五氯苯酚。特别优选4-氯苯酚。
除了式(I)的苯酚化合物之外,溶剂还可含有其它组分,只要该其它组分在溶液储存期间不使液晶聚酯发生沉淀。优选该其它组分是含氯烃,如邻二氯苯,氯仿,二氯甲烷,四氯乙烷等等,因为它们都不会妨碍液晶聚酯的溶解性。
用于本发明的液晶聚酯可以是热致变的液晶聚合物,在450℃或更低温度下,可形成具有光学各向异性的熔体。
液晶聚酯的例子包括如下几类聚酯:
(1)包含衍生自芳族羟基羧酸的重复单元、衍生自芳族二羧酸的重复单元和衍生自芳族二醇的重复单元的聚酯;
(2)包含衍生自两种或多种不同的芳族羟基羧酸的重复单元的聚酯;
(3)包含衍生自芳族二羧酸的重复单元和衍生自芳族二醇的重复单元的聚酯;
(4)通过使芳族羟基羧酸与液晶聚酯如聚对苯二甲酸乙二醇酯反应制备的聚酯。
芳族羟基羧酸,芳族二羧酸或者芳族二醇可以以成酯的衍生物的形式使用。芳族羟基羧酸或芳族二羧酸的成酯衍生物可以是高反应活性的衍生物,如氯化物或者酐,芳族羟基羧酸或芳族二羧酸与醇或乙二醇的酯,该酯可以通过酯交换反应形成聚酯。芳族二醇的成酯衍生物可以是芳族二醇,该芳族二醇的酚羟基与羟酸形成酯,该酯可以通过酯交换反应形成聚酯。
只要成酯的性质不被破坏,芳基羟基羧酸,芳族二羧酸和/或芳族二醇可被至少一个取代基取代。取代基的例子包括卤素原子(如氯原子,氟原子等),烷基(如甲基,乙基等等),芳基(如苯基,等等)。
液晶聚酯的重复单元的非限定性例子包括以下重复单元:
来源于芳族羟基羧酸的重复单元:
上述重复单元可被卤素原子(如氯原子、氟原子、溴原子、碘原子等)或烷基取代。
来源自芳族二羧酸的重复单元:
上述重复单元可以被卤素原子(如氯原子、氟原子、溴原子、碘原子等)或烷基或芳基取代。
来源自芳族二醇的重复单元:
上述重复单元可以被卤素原子(如氯原子、氟原子、溴原子、碘原子等)或烷基或芳基取代。
优选上述烷基含1-10个碳原子,上述芳基含6-20个碳原子。烷基的具体例子包括甲基,乙基,丁基,等等,芳基的具体例子包括苯基等。
从耐热性和机械性能的平衡的观点来看,优选液晶聚酯包含至少30%摩尔的式(Al)代表的重复单元。
优选地,重复单元的组合是如下(a)-(f)的组合:
(a)
(a1)重复单元(A1),(B2)和(C3)的组合;
(a2)重复单元(A2),(B2)和(C3)的组合;
(a3)重复单元(A1),(B1),(B2)和(C3)的组合;
(a4)重复单元(A2),(B1),(B2)和(C3)的组合;
(b)(a1)-(a4)的组合,其中重复单元(C3)的至少一部分被重复单元(C1)代替;
(c)(a1)-(a4)的组合,其中重复单元(C3)的至少一部分被重复单元(C2)代替;
(d)(a1))-(a4)的组合,其中重复单元(C3)的至少一部分被重复单元(C4)代替;
(e)(a1)-(a4)的组合,其中重复单元(C3)的至少一部分被重复单元(C4)和(C5)的混合物代替;
(f)(a1)-(a4)的组合,其中重复单元(A1)的至少一部分被重复单元(A2)代替;
就耐热性而言,液晶聚酯优选包含30-80%摩尔的从选自对-羟基苯甲酸和2-羟基-6-萘甲酸中的至少一种化合物衍生而来的重复单元,10-35%摩尔的从选自氢醌和4,4’-二羟基联苯中的至少一种化合物衍生而来的重复单元,和10-35%摩尔的从选自对苯二酸和间苯二酸中的至少一种化合物衍生而来的重复单元。
液晶聚酯的重量平均分子量不是关键的,优选从10,000到100,000。
用于本发明的液晶聚酯可通过任何方法制备。例如,选自芳族羟基羧酸和芳族二醇的至少一种化合物,被过量的脂肪族羧酸酐酰化,可得到酰化化合物,然后酰化的化合物与至少一种选自芳族羟基羧酸和芳族二羧酸的羧酸通过酯交换反应(缩聚反应)熔融聚合。作为酰化的化合物,一种已经酰基化的脂肪族羧酸酯也可用于本发明。
在酰化反应过程中,羧酸酐的量优选为1.0-1.2当量,更优选为1.05-1.1当量,按每当量酚羟基计算。羧酸酐的量少于上述低限时,酰化化合物和芳族羟基羧酸,芳族二羧酸等,趋向于在酯交换反应(缩聚反应)过程中升华,以致反应体系被阻塞。当羧酸酐的量高于上述上限时,获得的液晶聚酯趋向于有明显的颜色。
酰化反应优选在温度130-180℃进行5分钟-10小时,更优选在140-160℃进行10分钟-3小时。
用于酰化的羧酸酐的种类并不关键。羧酸酐的例子包括乙酸酐,丙酸酐,丁酸酐,异丁酸酐,戊酸酐,新戊酸酐,2-乙基己酸酐,一氯乙酸酐,二氯乙酸酐,三氯乙酸酐,一溴乙酸酐,二溴乙酸酐,三溴乙酸酐,一氟乙酸酐,二氟乙酸酐,三氟乙酸酐,戊二酐,顺式丁烯二酸酐,丁二酸酐,β-溴丙酸酐等。这些酸酐可以单独使用,也可以两种或两种以上混合使用。其中,就成本和加工性能而言,乙酸酐,丙酸酐,丁酸酐和异丁酸酐是优选的,更优选的是乙酸酐。
酯交换反应中,酰化化合物的用量优选是酰基当量是羧基当量的0.8-1.2倍。
酯交换反应优选在温度130-400℃下进行,其中升温速度是0.1-50℃/分钟,更优选的温度范围是150-350℃,升温速度是0.3-5℃/分钟。
未反应的羧酸酐和副产物羧酸优选从反应系统中除去,例如,在用羧酸酰化制备羧酸酯的反应中,使用蒸发方法,可使酯交换的反应平衡向产物方向移动。
酰化反应和/或酯交换反应可在催化剂存在下进行。催化剂可以是常规的用作聚酯的聚合催化剂的催化剂。催化剂的具体例子包括金属盐催化剂(如乙酸镁,亚锡醋酸盐,四丁基钛酸盐,乙酸铅,醋酸钠,乙酸钾,三氧化锑等等),有机化合物催化剂(例如N,N-二甲基氨基吡啶,N-甲基咪唑等等)等。当反应单体装入反应器时,可将催化剂加入到反应器中。用于酰化反应的催化剂不必去除,由酰化反应得到的反应混合物可进行酯交换反应。
通过酯交换的缩聚可由熔融聚合反应进行,熔融聚合后接着可进行固相聚合。当进行固相聚合时,从熔融聚合反应得到的聚合物优选被研磨,得到粉末状或絮片状聚合物,然后进行常规的固相聚合反应。具体而言,从熔融聚合得到的固态聚合物可在惰性气体,如氮气氛中在20-350℃加热1-30个小时。固相聚合反应中可以在搅拌或不搅拌聚合物下进行。当反应器装配有合适的搅拌装置时,熔融聚合反应和固相聚合反应可以在同一反应器中进行。在固相聚合后,所得到的液晶聚酯可以常规方式制成丸状,然后模塑或成型。
液晶聚酯可以分批制备,也可以连续制备。
用于本发明的无机硅酸盐(b)可以是任何常见的硅酸盐。硅酸盐的具体实例包括含有氧化铝/硅酸盐(1∶1)片的1/1类型层状粘土矿物质,(如高岭石,deckite,珍珠陶土,水硅锰钙石,叶蛇纹石,微晶,等等.),云母类型粘土矿物质(例如叶蜡石,滑石,白云母,钠云母,光云母,黑云母,等等),含有硅酸盐/氧化铝/硅酸盐片的2/1类型层状粘土矿物质(如蛭石,蒙脱石如蒙脱土,贝得石,绿脱石,皂石,水辉石等等),以及它们的混合层状矿物质。
无机硅酸盐(b)的更多例子包括纤维状的粘土矿物质,比如海泡石,坡缕石,等等,和层状,立方状,或笼状倍半硅氧烷(silsesquioxane)。
以上所述的无机化合物中,优选2/1类型层状粘土矿物质,特别是蒙脱石。更优选使用蒙脱土,贝得石,绿脱石,皂石或者水辉石。特别的,蒙脱土为最优选。
用于本发明的无机硅酸盐(b)含有少量碱金属和/或碱土金属。用于本发明的无机硅酸盐(b)含有的碱金属与碱土金属的总量为1,000ppm或更少,优选为500ppm或者更少,更优选为150ppm或更少,其总量以硅酸盐的重量为基准。其中,碱金属与碱土金属的含量用ICP光谱测量。
当无机硅酸盐含有相对大量的碱金属和/或碱土金属时,除去碱金属和/或碱土金属,例如:用酸处理硅酸盐。其中,用酸处理包括下述步骤:将硅酸盐分散在呈液态的酸中,搅拌该分散体一段时间,优选1分钟-24小时,通过过滤回收硅酸盐。用于该处理的酸可以是无机酸,比如硫酸,硝酸,盐酸,磷酸等等。其中优选是盐酸与硫酸。
可以通过任何常规方法将无机硅酸盐(b)分散在有机树脂(a)中。优选通过下列方法之一将无机硅酸盐(b)分散在有机树脂(a)中:
(1)将有机树脂(a)溶于已经分散了无机硅酸盐(b)的溶剂中;
(2)将无机硅酸盐(b)分散在已经溶解了有机树脂(a)的有机聚合物清漆中;
(3)将有机树脂(a)与无机硅酸盐(b)用单或多螺杆挤压机、轧辊,混合器(如Banbary混合器等)熔化捏合;
(4)将无机硅酸盐(b)填入聚合反应容器中,其中有机树脂处于聚合反应完成前的预聚物状态,然后预聚物进一步聚合。
在方法(1),(2)与(4)中,无机硅酸盐(b)可以任选地预分散在醇(例如甲醇,乙醇,等等.)与有机酸(例如月桂酸,油酸,柠檬酸,等等.)的混合溶剂中,然后分散物与有机树脂(a)的溶液混合。在这种情形下,混合溶剂中的有机酸的浓度优选是大约1-10N(当量浓度)。
无机硅酸盐(b)的数量可以是0.001-50重量份,优选是0.005-10重量份,按有机树脂的每100重量份计算。当无机硅酸盐(b)的量太大时,有机树脂(a)的机械性能会恶化。当无机硅酸盐(b)的量太小时,树脂组合物的物理性能不能充分改善。
本发明的树脂组合物可以由常规方法成形或模塑,如注塑,吹塑,挤压,片材成型,热成型,旋转成型,层压成型,压机成型等等,得到成型制品。
本发明的树脂组合物可包含纤维加强原料,如玻璃纤维,并可用于生产电子或者电器设备或者部件,如连接器,继电器,线轴等等。
而且,本发明的树脂组合物可以是由成膜方法成型,比如挤压法,片状法(吹塑薄膜挤压),浇铸法,等等。用于生产电子设备的薄膜优选用浇铸法制备。
就浇铸法而言,树脂组合物优选溶于含有上述式(I)的卤代苯酚化合物的溶剂中。在浇铸法中,将溶液涂敷在底物,如玻璃盘上之后,溶剂可以通过常规方法去除,例如加热蒸发溶剂,减压蒸馏,吹气法(通风法),等。特别的,优选用加热蒸发去除溶剂的方法,更优选吹气法和加热蒸发法连用。
除去溶剂过程中的加热温度依有机树脂(a)与无机硅酸盐(b)的种类决定。如日本专利JP A2002-114894(相应于US-B-6,838,546)所公开的,当液晶聚酯被用作有机树脂(a)时,浇铸溶液优选在100-200℃下预干燥10分钟-2小时,然后在200-350℃加热约10分钟-4小时。
上述方法制备的薄膜的厚度可以是约20-200μm。如果需要特别高电绝缘的性能,薄膜的厚度优选为200μm或以上。薄膜表面可以通过研磨物理处理,或用化学品如酸或氧化剂化学处理,或用紫外线或者等离子体辐射照射。
含有本发明树脂组合物的薄膜可用做柔性印刷电路板,标记带用薄膜,等等。这是利用了该薄膜的良好的高频性,低吸湿性与低热膨胀系数。此外,含有本发明的树脂组合物的薄膜通过薄壁成型,可用作电容器薄膜,扬声器膜片,液晶-定位薄膜。
以下例子用以说明本发明,但是本发明的内容不局限于这些实施例。
合成例1
在装备有搅拌器,扭矩计,氮气进口,温度计与回流冷凝器的反应器中,充入对-羟基苯甲酸(141克,1.02摩尔),4,4’-二羟基联苯基(4,4’-dihydroxybephenyl)(63.3克,0.34摩尔),间苯二酸(56.5克,0.34摩尔)与乙酸酐(191克,1.87摩尔)。反应器内部用氮气彻底清洗后,将反应器加热到150℃,保持15分钟,期间反应器内流动氮气,然后混合物在150℃回流3小时。然后将反应混合物加热到320℃,进行反应170分钟,同时蒸去副产物乙酸与未反应的乙酸酐。记录扭矩的增加,当认为反应进行完全时,从反应器中移去内容物。将所获得的固体冷却到室温,粗研磨,将磨碎的固体物在氮气气氛下,于270℃保温10小时,进行固体聚合,得到液晶聚酯粉末。
合成例2
由合成例1制备的液晶聚酯粉末(1克)溶于4-氯苯酚(99克),在120℃搅拌8小时,得到液晶聚酯溶液。
合成例3
无机硅酸盐(蒙脱石,Cloisite-Na+,南方粘土制品,美国)(10g)分散在盐酸水溶液(pH:1.2)(100g)中,25℃下搅拌2小时。过滤所得分散体,回收无机硅酸盐。将回收的硅酸盐再分散在盐酸水溶液(100g)中,25℃下搅拌2小时。用酸处理过的硅酸盐通过过滤从分散液中回收,用水洗(每次100g)三次,然后干燥,筛分,得到30μm或更大粒径的硅酸盐粉末。
将上述步骤得到的无机硅酸盐分散在含有2N的月桂酸的甲醇(200g)中,在80℃回流反应6小时,得到分散在甲醇中的无机硅酸盐。然后,分散液用滤液器过滤,干燥,回收无机硅酸盐。用ICP光谱分析,无机硅酸盐中钠,钾,钙与镁的总量是600ppm。
实施例1
将合成例2制备的液晶聚酯溶液(100g)和合成例3制备得到的无机硅酸盐(1g)混合,在130℃回流4小时,得到含有液晶聚酯与无机硅酸盐的组合物的溶液。
实施例2
将实施例1中制备的组合物溶液浇到玻璃盘上,在热空气干燥炉中在120℃加热以除去溶剂,再在250℃热处理,得到液晶聚酯的薄膜。得到的薄膜的热膨胀系数用TMA(热力学分析仪,TA仪器制造)。热膨胀系数是30×106/℃
比较例1
将合成例2制备的液晶聚酯溶液(100g)与市售的无机硅酸盐(合成例3中作原料的蒙脱土,ICP光谱测量其中含有总计35,000ppm的钠,钾,钙与镁)(1g)混合,在130℃回流4小时,获得含有液晶聚酯与无机硅酸盐的组合物的溶液。
比较例2
将比较例1制备的组合物溶液浇涂到玻璃盘上,在120℃下将浇涂液加热1小时至半干,然后在250℃加热处理,得到液晶聚酯薄膜。用TMA测量所得薄膜的热膨胀系数。热膨胀系数为40×10-6/℃。
Claims (7)
1.含有有机树脂(a)与无机硅酸盐(b)的有机树脂组合物,无机硅酸盐(b)中碱金属与碱土金属的总含量是1,000ppm或更低。
2.如权利要求1的有机树脂组合物,其中有机树脂(a)含有液晶热塑性聚合物,其熔融物显示光学各向异性。
4.一种树脂组合物溶液,包含权利要求1的有机树脂组合物和溶剂。
5.一种包含权利要求1的有机树脂组合物的成型制品。
6.如权利要求5的成型制品,其为薄膜。
7.一种可通过如下方法得到的薄膜:将根据权利要求4的树脂组合物的溶液浇注在基底上并蒸发溶剂。
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