CN1583532A - 基板的输送方法及其装置 - Google Patents

基板的输送方法及其装置 Download PDF

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Publication number
CN1583532A
CN1583532A CNA2004100644876A CN200410064487A CN1583532A CN 1583532 A CN1583532 A CN 1583532A CN A2004100644876 A CNA2004100644876 A CN A2004100644876A CN 200410064487 A CN200410064487 A CN 200410064487A CN 1583532 A CN1583532 A CN 1583532A
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CN
China
Prior art keywords
mentioned
conveying
line
processing
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2004100644876A
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English (en)
Chinese (zh)
Inventor
内牧阳一
江川优子
加治哲德
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Hitachi Ltd
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Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of CN1583532A publication Critical patent/CN1583532A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3216—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3222—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
CNA2004100644876A 2002-03-26 2002-08-23 基板的输送方法及其装置 Pending CN1583532A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002086199A JP4220173B2 (ja) 2002-03-26 2002-03-26 基板の搬送方法
JP086199/2002 2002-03-26

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN02142211A Division CN1446742A (zh) 2002-03-26 2002-08-23 基板的输送方法及其装置

Publications (1)

Publication Number Publication Date
CN1583532A true CN1583532A (zh) 2005-02-23

Family

ID=28449293

Family Applications (2)

Application Number Title Priority Date Filing Date
CNA2004100644876A Pending CN1583532A (zh) 2002-03-26 2002-08-23 基板的输送方法及其装置
CN02142211A Pending CN1446742A (zh) 2002-03-26 2002-08-23 基板的输送方法及其装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN02142211A Pending CN1446742A (zh) 2002-03-26 2002-08-23 基板的输送方法及其装置

Country Status (5)

Country Link
US (1) US6979168B2 (enExample)
JP (1) JP4220173B2 (enExample)
KR (2) KR20030077922A (enExample)
CN (2) CN1583532A (enExample)
TW (1) TW583129B (enExample)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100265287B1 (ko) 1998-04-21 2000-10-02 윤종용 반도체소자 제조용 식각설비의 멀티챔버 시스템
US8960099B2 (en) 2002-07-22 2015-02-24 Brooks Automation, Inc Substrate processing apparatus
US7959395B2 (en) * 2002-07-22 2011-06-14 Brooks Automation, Inc. Substrate processing apparatus
KR20040110391A (ko) * 2003-06-19 2004-12-31 삼성전자주식회사 기판 처리 장치
US10086511B2 (en) 2003-11-10 2018-10-02 Brooks Automation, Inc. Semiconductor manufacturing systems
US20070269297A1 (en) * 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
TWI274710B (en) * 2004-02-13 2007-03-01 Advanced Display Proc Eng Co Apparatus for manufacturing flat-panel display
US7905960B2 (en) 2004-03-24 2011-03-15 Jusung Engineering Co., Ltd. Apparatus for manufacturing substrate
EP1806303A4 (en) 2004-10-25 2009-07-15 Tokyo Electron Ltd TRANSPORT SYSTEM, SUBSTRATE TREATMENT DEVICE AND TRANSPORT PROCESS
US7959984B2 (en) * 2004-12-22 2011-06-14 Lam Research Corporation Methods and arrangement for the reduction of byproduct deposition in a plasma processing system
US20060218680A1 (en) * 2005-03-28 2006-09-28 Bailey Andrew D Iii Apparatus for servicing a plasma processing system with a robot
JP4221603B2 (ja) * 2005-03-31 2009-02-12 村田機械株式会社 天井走行車システム
WO2006115157A1 (ja) * 2005-04-22 2006-11-02 Rorze Corporation カセット搬送システム
WO2006124683A2 (en) * 2005-05-16 2006-11-23 Asyst Technologies, Inc. Modular terminal for high-throughput amhs
KR20070029032A (ko) * 2005-09-08 2007-03-13 주성엔지니어링(주) 이동식 이송챔버와 이를 포함하는 기판처리장치
KR20140091768A (ko) * 2005-11-07 2014-07-22 브룩스 오토메이션 인코퍼레이티드 반도체 작업대상물 공정처리 시스템
US20090053017A1 (en) * 2006-03-17 2009-02-26 Shlomo Shmuelov Storage and purge system for semiconductor wafers
JP4200387B2 (ja) 2006-04-14 2008-12-24 村田機械株式会社 搬送システム
KR20140069354A (ko) 2006-08-18 2014-06-09 브룩스 오토메이션 인코퍼레이티드 용량이 축소된 캐리어, 이송, 로드 포트, 버퍼 시스템
US7694688B2 (en) 2007-01-05 2010-04-13 Applied Materials, Inc. Wet clean system design
US7925502B2 (en) * 2007-03-01 2011-04-12 Microsoft Corporation Pitch model for noise estimation
CA2701402A1 (en) * 2007-10-24 2009-04-30 Oc Oerlikon Balzers Ag Method for manufacturing workpieces and apparatus
TWI368271B (en) * 2008-07-02 2012-07-11 Powertech Technology Inc Equipment and method for cutting big size wafer
US8602706B2 (en) 2009-08-17 2013-12-10 Brooks Automation, Inc. Substrate processing apparatus
JP5835722B2 (ja) * 2009-12-10 2015-12-24 オルボテック エルティ ソラー，エルエルシー 自動順位付け多方向直列型処理装置
JP5361002B2 (ja) * 2010-09-01 2013-12-04 独立行政法人産業技術総合研究所 デバイス製造装置および方法
US8459276B2 (en) 2011-05-24 2013-06-11 Orbotech LT Solar, LLC. Broken wafer recovery system
JP5877016B2 (ja) * 2011-08-26 2016-03-02 株式会社Ｓｃｒｅｅｎホールディングス 基板反転装置および基板処理装置
ES2616058T3 (es) * 2012-04-16 2017-06-09 Armen VARDANYAN Transportador por gravedad
US20140119858A1 (en) * 2012-10-31 2014-05-01 Sandisk 3D Llc Semiconductor Device Manufacturing Line
CN103101704B (zh) * 2013-02-28 2015-10-21 上海和辉光电有限公司 自动派工方法
US9685357B2 (en) * 2013-10-31 2017-06-20 Semes Co., Ltd. Apparatus for treating substrate
US9411332B2 (en) * 2014-02-14 2016-08-09 GlobalFoundries, Inc. Automated mechanical handling systems for integrated circuit fabrication, system computers programmed for use therein, and methods of handling a wafer carrier having an inlet port and an outlet port
JP6330596B2 (ja) * 2014-09-16 2018-05-30 株式会社デンソー 搬送システム
DE102015211941A1 (de) * 2015-06-26 2016-12-29 Zf Friedrichshafen Ag Verfahren und Vorrichtung zur Reduzierung eines Energiebedarfs einer Werkzeugmaschine und Werkzeugmaschinensystem
JP6539558B2 (ja) * 2015-10-05 2019-07-03 リンテック株式会社 処理装置
JP6493339B2 (ja) * 2016-08-26 2019-04-03 村田機械株式会社 搬送容器、及び収容物の移載方法
JP6987693B2 (ja) * 2018-04-27 2022-01-05 株式会社荏原製作所 検査方法、検査装置、及びこれを備えためっき装置
US12327746B2 (en) * 2020-01-14 2025-06-10 Rorze Corporation FOUP transfer device
WO2021156985A1 (ja) * 2020-02-05 2021-08-12 株式会社安川電機 搬送システム、搬送方法および搬送装置
WO2021234928A1 (ja) * 2020-05-21 2021-11-25 株式会社安川電機 搬送装置、搬送方法および搬送システム
DE102020207676A1 (de) * 2020-06-22 2021-12-23 Krones Aktiengesellschaft Verfahren und Vorrichtung zum Puffern von Behältern in einer Behälterbehandlungsanlage
CN114220754B (zh) * 2021-12-14 2025-04-22 拓荆科技股份有限公司 一种基片处理装置

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3812947A (en) * 1969-07-29 1974-05-28 Texas Instruments Inc Automatic slice processing
US4178113A (en) * 1977-12-05 1979-12-11 Macronetics, Inc. Buffer storage apparatus for semiconductor wafer processing
US5536128A (en) * 1988-10-21 1996-07-16 Hitachi, Ltd. Method and apparatus for carrying a variety of products
US5668056A (en) * 1990-12-17 1997-09-16 United Microelectronics Corporation Single semiconductor wafer transfer method and manufacturing system
US5658115A (en) * 1991-09-05 1997-08-19 Hitachi, Ltd. Transfer apparatus
JPH0616206A (ja) * 1992-07-03 1994-01-25 Shinko Electric Co Ltd クリーンルーム内搬送システム
ES2079829T3 (es) * 1992-08-04 1996-01-16 Ibm Aparato de enlace a presion para transferir una rebanada semiconductora entre un recipiente transportable estanco a presion y un equipo de tratamiento.
US5417537A (en) * 1993-05-07 1995-05-23 Miller; Kenneth C. Wafer transport device
US5830272A (en) * 1995-11-07 1998-11-03 Sputtered Films, Inc. System for and method of providing a controlled deposition on wafers
US5855465A (en) * 1996-04-16 1999-01-05 Gasonics International Semiconductor wafer processing carousel
US6517303B1 (en) * 1998-05-20 2003-02-11 Applied Komatsu Technology, Inc. Substrate transfer shuttle
US6282459B1 (en) * 1998-09-01 2001-08-28 International Business Machines Corporation Structure and method for detection of physical interference during transport of an article
US6449522B1 (en) * 1998-11-17 2002-09-10 Micro Devices, Inc. Managing a semiconductor fabrication facility using wafer lot and cassette attributes
JP3193026B2 (ja) * 1999-11-25 2001-07-30 株式会社半導体先端テクノロジーズ 基板処理装置のロードポートシステム及び基板の処理方法
US6413356B1 (en) * 2000-05-02 2002-07-02 Applied Materials, Inc. Substrate loader for a semiconductor processing system
US6599763B1 (en) * 2000-06-20 2003-07-29 Advanced Micro Devices, Inc. Wafer randomization and alignment system integrated into a multiple chamber wafer processing system
WO2002008831A2 (en) * 2000-07-06 2002-01-31 Pri Automation, Inc. Reticle storage and retrieval system
US6568896B2 (en) * 2001-03-21 2003-05-27 Applied Materials, Inc. Transfer chamber with side wall port
US6519502B2 (en) * 2001-03-28 2003-02-11 Taiwan Semiconductor Manufacturing Co., Ltd Apparatus and method for positioning a cassette pod onto a loadport by an overhead hoist transport system
JP4190161B2 (ja) * 2001-05-08 2008-12-03 株式会社新川 ウェーハリングの供給返送装置
JP2003188229A (ja) * 2001-12-18 2003-07-04 Hitachi Kasado Eng Co Ltd ウエハ製造システムおよびウエハ製造方法
US6663340B1 (en) * 2002-08-30 2003-12-16 Motorola, Inc. Wafer carrier transport system for tool bays
US6848882B2 (en) * 2003-03-31 2005-02-01 Taiwan Semiconductor Manufacturing Co., Ltd Apparatus and method for positioning a cassette pod onto a loadport by an overhead hoist transport system

Also Published As

Publication number Publication date
JP2003282669A (ja) 2003-10-03
TW583129B (en) 2004-04-11
US6979168B2 (en) 2005-12-27
US20030185655A1 (en) 2003-10-02
KR20050010998A (ko) 2005-01-28
KR100599987B1 (ko) 2006-07-13
CN1446742A (zh) 2003-10-08
JP4220173B2 (ja) 2009-02-04
KR20030077922A (ko) 2003-10-04

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