JP6330596B2 - 搬送システム - Google Patents
搬送システム Download PDFInfo
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- JP6330596B2 JP6330596B2 JP2014187798A JP2014187798A JP6330596B2 JP 6330596 B2 JP6330596 B2 JP 6330596B2 JP 2014187798 A JP2014187798 A JP 2014187798A JP 2014187798 A JP2014187798 A JP 2014187798A JP 6330596 B2 JP6330596 B2 JP 6330596B2
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- Japan
- Prior art keywords
- station
- processing device
- connection processing
- transfer
- processing apparatus
- Prior art date
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0612—Production flow monitoring, e.g. for increasing throughput
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Program-control systems
- G05B19/02—Program-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/4189—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the transport system
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3218—Conveying cassettes, containers or carriers
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/31—From computer integrated manufacturing till monitoring
- G05B2219/31002—Computer controlled agv conveys workpieces between buffer and cell
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/31—From computer integrated manufacturing till monitoring
- G05B2219/31014—Synchronization between AGV movement and workpiece treatment chambers
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45031—Manufacturing semiconductor wafers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
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- Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Quality & Reliability (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Control Of Conveyors (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
Description
本発明の第1実施形態にかかる搬送システムについて説明する。なお、本実施形態の搬送システムは、半導体装置の生産工場等で容器に収容された被処理物を搬送するのに適用されると好適であり、以下では半導体装置の生産工場に適用した例について説明する。
本発明は上記した実施形態に限定されるものではなく、特許請求の範囲に記載した範囲内において適宜変更が可能である。
12 移載ロボット
20a 連結処理装置
20b 通常処理装置
70 ステーション制御部
80a 連結処理装置制御手段
80b 通常処理装置制御手段
Claims (3)
- 被処理物に対して所定の処理を施す複数の処理装置(20a、20b)と、
前記処理装置を制御する処理装置制御手段(80a、80b)と、
前記処理装置で処理される前記被処理物を保管するステーション(10)と、
前記ステーション内に配置され、前記被処理物を移載する移載手段(12)と、
前記移載手段を制御するステーション制御手段(70)と、を備え、
前記複数の処理装置は、一部の処理装置が前記ステーションに連結された連結処理装置(20a)とされ、残りの処理装置が前記ステーションに連結されていない通常処理装置(20b)とされており、
前記ステーションと前記通常処理装置との間で前記被処理物の搬入および搬出を行う搬送台車(30a)を有し、
前記ステーション制御手段は、前記処理装置制御手段(80a)との間で通信を行い、前記移載手段を制御することによって前記ステーションから前記連結処理装置に前記被処理物を搬入すると共に前記連結処理装置から前記ステーションに前記被処理物を搬出し、前記連結処理装置から前記ステーションに前記被処理物を搬出する際には、前記処理装置制御手段から搬出する被処理物があることを示す信号(REQ1、REQ2)が入力された後に開始することを特徴とする搬送システム。 - 前記連結処理装置は、前記複数の処理装置のうちの最も処理期間が長いものを除いた処理装置であることを特徴とする請求項1に記載の搬送システム。
- 前記連結処理装置は、前記複数の処理装置のうちの最も処理期間が短いものであることを特徴とする請求項1または2に記載の搬送システム。
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014187798A JP6330596B2 (ja) | 2014-09-16 | 2014-09-16 | 搬送システム |
| TW104129774A TWI626703B (zh) | 2014-09-16 | 2015-09-09 | 轉移系統 |
| US14/852,802 US9805961B2 (en) | 2014-09-16 | 2015-09-14 | Transfer system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014187798A JP6330596B2 (ja) | 2014-09-16 | 2014-09-16 | 搬送システム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2016060561A JP2016060561A (ja) | 2016-04-25 |
| JP6330596B2 true JP6330596B2 (ja) | 2018-05-30 |
Family
ID=55455450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014187798A Active JP6330596B2 (ja) | 2014-09-16 | 2014-09-16 | 搬送システム |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US9805961B2 (ja) |
| JP (1) | JP6330596B2 (ja) |
| TW (1) | TWI626703B (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2732469B2 (ja) | 1989-09-22 | 1998-03-30 | 原子燃料工業株式会社 | 被覆燃料粒子 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG11202006535YA (en) * | 2018-01-10 | 2020-08-28 | Murata Machinery Ltd | Method for controlling conveyance system, conveyance system, and management device |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11334810A (ja) | 1998-03-25 | 1999-12-07 | Hitachi Ltd | 搬送装置及び製造方法 |
| JP2000203702A (ja) | 1999-01-13 | 2000-07-25 | Hitachi Ltd | 自動搬送システム |
| US7457680B2 (en) * | 2000-12-27 | 2008-11-25 | Tokyo Electron Limited | Conveyance method for transporting objects |
| JP4220173B2 (ja) * | 2002-03-26 | 2009-02-04 | 株式会社日立ハイテクノロジーズ | 基板の搬送方法 |
| JP2004221227A (ja) | 2003-01-14 | 2004-08-05 | Hitachi Kokusai Electric Inc | 基板処理装置 |
| US20090292388A1 (en) * | 2006-12-19 | 2009-11-26 | Tatsushi Iimori | Semiconductor manufacturing system |
| JP4908304B2 (ja) * | 2007-04-27 | 2012-04-04 | 東京エレクトロン株式会社 | 基板の処理方法、基板の処理システム及びコンピュータ読み取り可能な記憶媒体 |
| JP2011211218A (ja) * | 2011-06-02 | 2011-10-20 | Tokyo Electron Ltd | 塗布、現像装置及び塗布、現像装置の制御方法並びに記憶媒体 |
| JP6017134B2 (ja) * | 2011-12-13 | 2016-10-26 | 東京エレクトロン株式会社 | 生産効率化システム、生産効率化装置および生産効率化方法 |
| JP5772800B2 (ja) * | 2012-11-27 | 2015-09-02 | 株式会社デンソー | 搬送システム |
-
2014
- 2014-09-16 JP JP2014187798A patent/JP6330596B2/ja active Active
-
2015
- 2015-09-09 TW TW104129774A patent/TWI626703B/zh active
- 2015-09-14 US US14/852,802 patent/US9805961B2/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2732469B2 (ja) | 1989-09-22 | 1998-03-30 | 原子燃料工業株式会社 | 被覆燃料粒子 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI626703B (zh) | 2018-06-11 |
| US20160079103A1 (en) | 2016-03-17 |
| US9805961B2 (en) | 2017-10-31 |
| TW201630104A (zh) | 2016-08-16 |
| JP2016060561A (ja) | 2016-04-25 |
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