KR20030077922A - 기판의 반송방법 및 그 장치 - Google Patents

기판의 반송방법 및 그 장치 Download PDF

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Publication number
KR20030077922A
KR20030077922A KR1020020051203A KR20020051203A KR20030077922A KR 20030077922 A KR20030077922 A KR 20030077922A KR 1020020051203 A KR1020020051203 A KR 1020020051203A KR 20020051203 A KR20020051203 A KR 20020051203A KR 20030077922 A KR20030077922 A KR 20030077922A
Authority
KR
South Korea
Prior art keywords
conveying
sheet
line
conveying line
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020020051203A
Other languages
English (en)
Korean (ko)
Inventor
우치마키요이치
에가와유코
가지데츠노리
Original Assignee
가부시키가이샤 히다치 하이테크놀로지즈
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 히다치 하이테크놀로지즈 filed Critical 가부시키가이샤 히다치 하이테크놀로지즈
Publication of KR20030077922A publication Critical patent/KR20030077922A/ko
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3216—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3222—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
KR1020020051203A 2002-03-26 2002-08-28 기판의 반송방법 및 그 장치 Ceased KR20030077922A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002086199A JP4220173B2 (ja) 2002-03-26 2002-03-26 基板の搬送方法
JPJP-P-2002-00086199 2002-03-26

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020050001992A Division KR100599987B1 (ko) 2002-03-26 2005-01-10 기판의 반송방법

Publications (1)

Publication Number Publication Date
KR20030077922A true KR20030077922A (ko) 2003-10-04

Family

ID=28449293

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020020051203A Ceased KR20030077922A (ko) 2002-03-26 2002-08-28 기판의 반송방법 및 그 장치
KR1020050001992A Expired - Fee Related KR100599987B1 (ko) 2002-03-26 2005-01-10 기판의 반송방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020050001992A Expired - Fee Related KR100599987B1 (ko) 2002-03-26 2005-01-10 기판의 반송방법

Country Status (5)

Country Link
US (1) US6979168B2 (enExample)
JP (1) JP4220173B2 (enExample)
KR (2) KR20030077922A (enExample)
CN (2) CN1583532A (enExample)
TW (1) TW583129B (enExample)

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US10086511B2 (en) 2003-11-10 2018-10-02 Brooks Automation, Inc. Semiconductor manufacturing systems
US20070269297A1 (en) * 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
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US20060218680A1 (en) * 2005-03-28 2006-09-28 Bailey Andrew D Iii Apparatus for servicing a plasma processing system with a robot
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WO2006115157A1 (ja) * 2005-04-22 2006-11-02 Rorze Corporation カセット搬送システム
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KR20140091768A (ko) * 2005-11-07 2014-07-22 브룩스 오토메이션 인코퍼레이티드 반도체 작업대상물 공정처리 시스템
US20090053017A1 (en) * 2006-03-17 2009-02-26 Shlomo Shmuelov Storage and purge system for semiconductor wafers
JP4200387B2 (ja) 2006-04-14 2008-12-24 村田機械株式会社 搬送システム
KR20140069354A (ko) 2006-08-18 2014-06-09 브룩스 오토메이션 인코퍼레이티드 용량이 축소된 캐리어, 이송, 로드 포트, 버퍼 시스템
US7694688B2 (en) 2007-01-05 2010-04-13 Applied Materials, Inc. Wet clean system design
US7925502B2 (en) * 2007-03-01 2011-04-12 Microsoft Corporation Pitch model for noise estimation
CA2701402A1 (en) * 2007-10-24 2009-04-30 Oc Oerlikon Balzers Ag Method for manufacturing workpieces and apparatus
TWI368271B (en) * 2008-07-02 2012-07-11 Powertech Technology Inc Equipment and method for cutting big size wafer
US8602706B2 (en) 2009-08-17 2013-12-10 Brooks Automation, Inc. Substrate processing apparatus
JP5835722B2 (ja) * 2009-12-10 2015-12-24 オルボテック エルティ ソラー，エルエルシー 自動順位付け多方向直列型処理装置
JP5361002B2 (ja) * 2010-09-01 2013-12-04 独立行政法人産業技術総合研究所 デバイス製造装置および方法
US8459276B2 (en) 2011-05-24 2013-06-11 Orbotech LT Solar, LLC. Broken wafer recovery system
JP5877016B2 (ja) * 2011-08-26 2016-03-02 株式会社Ｓｃｒｅｅｎホールディングス 基板反転装置および基板処理装置
ES2616058T3 (es) * 2012-04-16 2017-06-09 Armen VARDANYAN Transportador por gravedad
US20140119858A1 (en) * 2012-10-31 2014-05-01 Sandisk 3D Llc Semiconductor Device Manufacturing Line
CN103101704B (zh) * 2013-02-28 2015-10-21 上海和辉光电有限公司 自动派工方法
US9685357B2 (en) * 2013-10-31 2017-06-20 Semes Co., Ltd. Apparatus for treating substrate
US9411332B2 (en) * 2014-02-14 2016-08-09 GlobalFoundries, Inc. Automated mechanical handling systems for integrated circuit fabrication, system computers programmed for use therein, and methods of handling a wafer carrier having an inlet port and an outlet port
JP6330596B2 (ja) * 2014-09-16 2018-05-30 株式会社デンソー 搬送システム
DE102015211941A1 (de) * 2015-06-26 2016-12-29 Zf Friedrichshafen Ag Verfahren und Vorrichtung zur Reduzierung eines Energiebedarfs einer Werkzeugmaschine und Werkzeugmaschinensystem
JP6539558B2 (ja) * 2015-10-05 2019-07-03 リンテック株式会社 処理装置
JP6493339B2 (ja) * 2016-08-26 2019-04-03 村田機械株式会社 搬送容器、及び収容物の移載方法
JP6987693B2 (ja) * 2018-04-27 2022-01-05 株式会社荏原製作所 検査方法、検査装置、及びこれを備えためっき装置
US12327746B2 (en) * 2020-01-14 2025-06-10 Rorze Corporation FOUP transfer device
WO2021156985A1 (ja) * 2020-02-05 2021-08-12 株式会社安川電機 搬送システム、搬送方法および搬送装置
WO2021234928A1 (ja) * 2020-05-21 2021-11-25 株式会社安川電機 搬送装置、搬送方法および搬送システム
DE102020207676A1 (de) * 2020-06-22 2021-12-23 Krones Aktiengesellschaft Verfahren und Vorrichtung zum Puffern von Behältern in einer Behälterbehandlungsanlage
CN114220754B (zh) * 2021-12-14 2025-04-22 拓荆科技股份有限公司 一种基片处理装置

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Also Published As

Publication number Publication date
CN1583532A (zh) 2005-02-23
JP2003282669A (ja) 2003-10-03
TW583129B (en) 2004-04-11
US6979168B2 (en) 2005-12-27
US20030185655A1 (en) 2003-10-02
KR20050010998A (ko) 2005-01-28
KR100599987B1 (ko) 2006-07-13
CN1446742A (zh) 2003-10-08
JP4220173B2 (ja) 2009-02-04

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