TW583129B - Method and device for transporting substrate - Google Patents
Method and device for transporting substrate Download PDFInfo
- Publication number
- TW583129B TW583129B TW091118306A TW91118306A TW583129B TW 583129 B TW583129 B TW 583129B TW 091118306 A TW091118306 A TW 091118306A TW 91118306 A TW91118306 A TW 91118306A TW 583129 B TW583129 B TW 583129B
- Authority
- TW
- Taiwan
- Prior art keywords
- conveying
- transfer
- line
- processing
- lines
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 99
- 239000000758 substrate Substances 0.000 title claims description 313
- 235000012431 wafers Nutrition 0.000 claims abstract description 992
- 238000012545 processing Methods 0.000 claims abstract description 955
- 238000012546 transfer Methods 0.000 claims abstract description 701
- 238000011282 treatment Methods 0.000 claims abstract description 7
- 239000004065 semiconductor Substances 0.000 claims description 130
- 230000032258 transport Effects 0.000 claims description 84
- 238000004519 manufacturing process Methods 0.000 claims description 77
- 230000008569 process Effects 0.000 claims description 55
- 230000002079 cooperative effect Effects 0.000 claims description 46
- 239000004973 liquid crystal related substance Substances 0.000 claims description 38
- 230000001276 controlling effect Effects 0.000 claims description 11
- 239000013078 crystal Substances 0.000 claims description 11
- 238000003860 storage Methods 0.000 claims description 7
- 239000000969 carrier Substances 0.000 claims description 2
- 238000002360 preparation method Methods 0.000 claims 1
- 230000006866 deterioration Effects 0.000 abstract 1
- 230000000875 corresponding effect Effects 0.000 description 53
- 238000001020 plasma etching Methods 0.000 description 31
- 239000007789 gas Substances 0.000 description 19
- 230000000694 effects Effects 0.000 description 16
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 16
- 238000001514 detection method Methods 0.000 description 12
- 230000009467 reduction Effects 0.000 description 12
- 238000005516 engineering process Methods 0.000 description 11
- 230000002829 reductive effect Effects 0.000 description 11
- 238000010276 construction Methods 0.000 description 9
- 230000036961 partial effect Effects 0.000 description 9
- 238000010926 purge Methods 0.000 description 9
- 238000007796 conventional method Methods 0.000 description 8
- 238000007639 printing Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 5
- 230000003247 decreasing effect Effects 0.000 description 5
- 229910001873 dinitrogen Inorganic materials 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 5
- 238000007689 inspection Methods 0.000 description 4
- 230000002441 reversible effect Effects 0.000 description 4
- 238000011144 upstream manufacturing Methods 0.000 description 4
- 229910052770 Uranium Inorganic materials 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 208000037998 chronic venous disease Diseases 0.000 description 3
- 230000003749 cleanliness Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000003306 harvesting Methods 0.000 description 3
- JFALSRSLKYAFGM-UHFFFAOYSA-N uranium(0) Chemical compound [U] JFALSRSLKYAFGM-UHFFFAOYSA-N 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000006837 decompression Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 229910052704 radon Inorganic materials 0.000 description 2
- SYUHGPGVQRZVTB-UHFFFAOYSA-N radon atom Chemical compound [Rn] SYUHGPGVQRZVTB-UHFFFAOYSA-N 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910052778 Plutonium Inorganic materials 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- FFBHFFJDDLITSX-UHFFFAOYSA-N benzyl N-[2-hydroxy-4-(3-oxomorpholin-4-yl)phenyl]carbamate Chemical compound OC1=C(NC(=O)OCC2=CC=CC=C2)C=CC(=C1)N1CCOCC1=O FFBHFFJDDLITSX-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000000866 electrolytic etching Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- OYEHPCDNVJXUIW-UHFFFAOYSA-N plutonium atom Chemical compound [Pu] OYEHPCDNVJXUIW-UHFFFAOYSA-N 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000012958 reprocessing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 238000009489 vacuum treatment Methods 0.000 description 1
- 230000003245 working effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67727—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Warehouses Or Storage Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002086199A JP4220173B2 (ja) | 2002-03-26 | 2002-03-26 | 基板の搬送方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW583129B true TW583129B (en) | 2004-04-11 |
Family
ID=28449293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW091118306A TW583129B (en) | 2002-03-26 | 2002-08-14 | Method and device for transporting substrate |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6979168B2 (enExample) |
| JP (1) | JP4220173B2 (enExample) |
| KR (2) | KR20030077922A (enExample) |
| CN (2) | CN1446742A (enExample) |
| TW (1) | TW583129B (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI871412B (zh) * | 2020-01-14 | 2025-02-01 | 日商樂華股份有限公司 | 前開式晶圓傳送盒移載裝置 |
Families Citing this family (42)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100265287B1 (ko) | 1998-04-21 | 2000-10-02 | 윤종용 | 반도체소자 제조용 식각설비의 멀티챔버 시스템 |
| US7959395B2 (en) | 2002-07-22 | 2011-06-14 | Brooks Automation, Inc. | Substrate processing apparatus |
| US8960099B2 (en) | 2002-07-22 | 2015-02-24 | Brooks Automation, Inc | Substrate processing apparatus |
| KR20040110391A (ko) * | 2003-06-19 | 2004-12-31 | 삼성전자주식회사 | 기판 처리 장치 |
| US20070269297A1 (en) | 2003-11-10 | 2007-11-22 | Meulen Peter V D | Semiconductor wafer handling and transport |
| US10086511B2 (en) | 2003-11-10 | 2018-10-02 | Brooks Automation, Inc. | Semiconductor manufacturing systems |
| TWI274710B (en) * | 2004-02-13 | 2007-03-01 | Advanced Display Proc Eng Co | Apparatus for manufacturing flat-panel display |
| US7905960B2 (en) | 2004-03-24 | 2011-03-15 | Jusung Engineering Co., Ltd. | Apparatus for manufacturing substrate |
| EP1806303A4 (en) | 2004-10-25 | 2009-07-15 | Tokyo Electron Ltd | TRANSPORT SYSTEM, SUBSTRATE TREATMENT DEVICE AND TRANSPORT PROCESS |
| US7959984B2 (en) * | 2004-12-22 | 2011-06-14 | Lam Research Corporation | Methods and arrangement for the reduction of byproduct deposition in a plasma processing system |
| US20060218680A1 (en) * | 2005-03-28 | 2006-09-28 | Bailey Andrew D Iii | Apparatus for servicing a plasma processing system with a robot |
| JP4221603B2 (ja) * | 2005-03-31 | 2009-02-12 | 村田機械株式会社 | 天井走行車システム |
| WO2006115157A1 (ja) * | 2005-04-22 | 2006-11-02 | Rorze Corporation | カセット搬送システム |
| US7798759B2 (en) * | 2005-05-16 | 2010-09-21 | Muratec Automation Co., Ltd. | Modular terminal for high-throughput AMHS |
| KR20070029032A (ko) * | 2005-09-08 | 2007-03-13 | 주성엔지니어링(주) | 이동식 이송챔버와 이를 포함하는 기판처리장치 |
| EP1945541B1 (en) * | 2005-11-07 | 2013-04-10 | Brooks Automation, Inc. | Transport system |
| US20090053017A1 (en) * | 2006-03-17 | 2009-02-26 | Shlomo Shmuelov | Storage and purge system for semiconductor wafers |
| JP4200387B2 (ja) * | 2006-04-14 | 2008-12-24 | 村田機械株式会社 | 搬送システム |
| KR20140069354A (ko) * | 2006-08-18 | 2014-06-09 | 브룩스 오토메이션 인코퍼레이티드 | 용량이 축소된 캐리어, 이송, 로드 포트, 버퍼 시스템 |
| US7694688B2 (en) | 2007-01-05 | 2010-04-13 | Applied Materials, Inc. | Wet clean system design |
| US7925502B2 (en) * | 2007-03-01 | 2011-04-12 | Microsoft Corporation | Pitch model for noise estimation |
| WO2009053435A1 (en) * | 2007-10-24 | 2009-04-30 | Oc Oerlikon Balzers Ag | Method for manufacturing workpieces and apparatus |
| TWI368271B (en) * | 2008-07-02 | 2012-07-11 | Powertech Technology Inc | Equipment and method for cutting big size wafer |
| US8602706B2 (en) | 2009-08-17 | 2013-12-10 | Brooks Automation, Inc. | Substrate processing apparatus |
| TWI436831B (zh) * | 2009-12-10 | 2014-05-11 | Orbotech Lt Solar Llc | 真空處理裝置之噴灑頭總成 |
| JP5361002B2 (ja) * | 2010-09-01 | 2013-12-04 | 独立行政法人産業技術総合研究所 | デバイス製造装置および方法 |
| US8459276B2 (en) | 2011-05-24 | 2013-06-11 | Orbotech LT Solar, LLC. | Broken wafer recovery system |
| JP5877016B2 (ja) * | 2011-08-26 | 2016-03-02 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板反転装置および基板処理装置 |
| ES2616058T3 (es) * | 2012-04-16 | 2017-06-09 | Armen VARDANYAN | Transportador por gravedad |
| US20140119858A1 (en) * | 2012-10-31 | 2014-05-01 | Sandisk 3D Llc | Semiconductor Device Manufacturing Line |
| CN103101704B (zh) * | 2013-02-28 | 2015-10-21 | 上海和辉光电有限公司 | 自动派工方法 |
| US9685357B2 (en) * | 2013-10-31 | 2017-06-20 | Semes Co., Ltd. | Apparatus for treating substrate |
| US9411332B2 (en) * | 2014-02-14 | 2016-08-09 | GlobalFoundries, Inc. | Automated mechanical handling systems for integrated circuit fabrication, system computers programmed for use therein, and methods of handling a wafer carrier having an inlet port and an outlet port |
| JP6330596B2 (ja) * | 2014-09-16 | 2018-05-30 | 株式会社デンソー | 搬送システム |
| DE102015211941A1 (de) * | 2015-06-26 | 2016-12-29 | Zf Friedrichshafen Ag | Verfahren und Vorrichtung zur Reduzierung eines Energiebedarfs einer Werkzeugmaschine und Werkzeugmaschinensystem |
| JP6539558B2 (ja) * | 2015-10-05 | 2019-07-03 | リンテック株式会社 | 処理装置 |
| JP6493339B2 (ja) * | 2016-08-26 | 2019-04-03 | 村田機械株式会社 | 搬送容器、及び収容物の移載方法 |
| JP6987693B2 (ja) * | 2018-04-27 | 2022-01-05 | 株式会社荏原製作所 | 検査方法、検査装置、及びこれを備えためっき装置 |
| JP6985531B1 (ja) * | 2020-02-05 | 2021-12-22 | 株式会社安川電機 | 搬送システム、搬送方法および搬送装置 |
| JP7279858B2 (ja) * | 2020-05-21 | 2023-05-23 | 株式会社安川電機 | 搬送装置、搬送方法および搬送システム |
| DE102020207676A1 (de) * | 2020-06-22 | 2021-12-23 | Krones Aktiengesellschaft | Verfahren und Vorrichtung zum Puffern von Behältern in einer Behälterbehandlungsanlage |
| CN114220754B (zh) * | 2021-12-14 | 2025-04-22 | 拓荆科技股份有限公司 | 一种基片处理装置 |
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| US4178113A (en) * | 1977-12-05 | 1979-12-11 | Macronetics, Inc. | Buffer storage apparatus for semiconductor wafer processing |
| US5536128A (en) * | 1988-10-21 | 1996-07-16 | Hitachi, Ltd. | Method and apparatus for carrying a variety of products |
| US5668056A (en) * | 1990-12-17 | 1997-09-16 | United Microelectronics Corporation | Single semiconductor wafer transfer method and manufacturing system |
| US5658115A (en) * | 1991-09-05 | 1997-08-19 | Hitachi, Ltd. | Transfer apparatus |
| JPH0616206A (ja) * | 1992-07-03 | 1994-01-25 | Shinko Electric Co Ltd | クリーンルーム内搬送システム |
| DE69205571T2 (de) * | 1992-08-04 | 1996-06-13 | Ibm | Unter Druck stehende Koppelsysteme zum Transferieren von einem Halbleiterwafer zwischen einem tragbaren abdichtbaren unter druckstehenden Behälter und einer Bearbeitungsanlage. |
| US5417537A (en) * | 1993-05-07 | 1995-05-23 | Miller; Kenneth C. | Wafer transport device |
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| US6519502B2 (en) * | 2001-03-28 | 2003-02-11 | Taiwan Semiconductor Manufacturing Co., Ltd | Apparatus and method for positioning a cassette pod onto a loadport by an overhead hoist transport system |
| JP4190161B2 (ja) * | 2001-05-08 | 2008-12-03 | 株式会社新川 | ウェーハリングの供給返送装置 |
| JP2003188229A (ja) * | 2001-12-18 | 2003-07-04 | Hitachi Kasado Eng Co Ltd | ウエハ製造システムおよびウエハ製造方法 |
| US6663340B1 (en) * | 2002-08-30 | 2003-12-16 | Motorola, Inc. | Wafer carrier transport system for tool bays |
| US6848882B2 (en) * | 2003-03-31 | 2005-02-01 | Taiwan Semiconductor Manufacturing Co., Ltd | Apparatus and method for positioning a cassette pod onto a loadport by an overhead hoist transport system |
-
2002
- 2002-03-26 JP JP2002086199A patent/JP4220173B2/ja not_active Expired - Fee Related
- 2002-08-14 TW TW091118306A patent/TW583129B/zh not_active IP Right Cessation
- 2002-08-14 US US10/217,405 patent/US6979168B2/en not_active Expired - Fee Related
- 2002-08-23 CN CN02142211A patent/CN1446742A/zh active Pending
- 2002-08-23 CN CNA2004100644876A patent/CN1583532A/zh active Pending
- 2002-08-28 KR KR1020020051203A patent/KR20030077922A/ko not_active Ceased
-
2005
- 2005-01-10 KR KR1020050001992A patent/KR100599987B1/ko not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI871412B (zh) * | 2020-01-14 | 2025-02-01 | 日商樂華股份有限公司 | 前開式晶圓傳送盒移載裝置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4220173B2 (ja) | 2009-02-04 |
| CN1446742A (zh) | 2003-10-08 |
| US6979168B2 (en) | 2005-12-27 |
| KR20050010998A (ko) | 2005-01-28 |
| KR100599987B1 (ko) | 2006-07-13 |
| US20030185655A1 (en) | 2003-10-02 |
| KR20030077922A (ko) | 2003-10-04 |
| CN1583532A (zh) | 2005-02-23 |
| JP2003282669A (ja) | 2003-10-03 |
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