CN1501520A - 发光装置 - Google Patents

发光装置 Download PDF

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CN1501520A
CN1501520A CNA200310116114A CN200310116114A CN1501520A CN 1501520 A CN1501520 A CN 1501520A CN A200310116114 A CNA200310116114 A CN A200310116114A CN 200310116114 A CN200310116114 A CN 200310116114A CN 1501520 A CN1501520 A CN 1501520A
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light
conductive component
emitting device
emitting diode
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CN100514681C (zh
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矶田宽人
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Citizen Electronics Co Ltd
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21V29/75—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21Y2115/00—Light-generating elements of semiconductor light sources
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/4805—Shape
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    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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Abstract

一种发光装置具有多个设置在基体部件中的导热性能优良的导电部件，这些导电部件通过设置在它们之间的绝缘部件而隔离。一发光元件装置被安置在基体部件上。在发光装置中设有发光二极管并安装在导电部件上。一突起部从导热部件上突出以便冷却LED。

Description

发光装置
发明背景
本发明涉及使用发光二极管的发光装置。
图16为日本特许3,302,203中所揭示的常规发光装置的透视图。发光装置1包括用树脂如环氧树脂制造的基板2、一对固定在基板2上侧和下侧的电极2a和2b、安装在电极2a上并经导线4连接到电极2b上的LED3以及用透明树脂制成的密封部件5用于封装LED3。
发光装置1安装在印刷衬底6上，用一对导电图型6a、6b将电极2a、ab相连接。
当电流从图型6a、6b通过电极2a、2b加到LED3时，LED3发射光7。
因为发光装置是通过薄电极2a、2b安装到印刷衬底6之上的，所以发光装置1的厚度可以降低。然而，由环氧树脂之类的树脂制成的衬底2热传导率很低，只是铜的百分之一左右。因此，LED3所散发的热量几乎不会传递到印刷衬底6上。其结果是，当为了产生高亮度而向LED施加大电流时，所散发的热量变成了高温，这使得LED的结发生退化，使密封部件5变色从而降低该部件的透明度。因而，LED装置的质量大大降低。
图17是日本特许公开11-307820中揭示的另一种常规发光装置的透视图，其散热性得到了改善。
发光装置10包括一对导电部件11a、11b，是热导率高的金属制成的，一绝缘部件12，是树脂制成的，用于隔绝电部件并把部件结合起来。绝缘部件具有扁圆形状的开口13。各导电部件11a、11b的一部分被置于该开口内。LED14被固定于导电部件11a、11b的暴露部分上，以致于LED14与导电部件11a、11b实现电及热连接。LED14用透明密封部件15进行密封。
发光装置10被安装在印刷衬底16上，导电部件11a、11b通过焊接连接到一对导电图型16a、16b上。
当电流从16a、16b经过导电部件11a、11b加到LED14时，该LED发光17。在LED14中产生的热量通过导电部件11a、11b传到印刷衬底16，以致热量可有效地从印刷衬底16上散发出去，如果该衬底是用高热导性金属材料制成。
然而，印刷衬底16一般是由环氧树脂之类的廉价材料制造的。如前所述，环氧树脂的热导性差。因此，热量不能充分地传到印刷衬底上，因而使LED的温度升高，质量降低。
在此，如果印刷衬底是用高热导性材料制造，热辐射的问题可以解决。但是，印刷衬底不只为安装发光装置，还要安装CPU、存储器等其它电子器件。
对于其它电子器件而言，热传导性高是不必要的。相反，金属制造的印刷衬底会使电子装置的成本增加。
发明概述
本发明的目的在于提供一种具有有效散热装置的发光装置。
根据本发明，提供一种发光装置，包括：基体部件、设置在基体部件上的多个导电部件和用于固定并隔离这些导电部件的绝缘部件、安装在基体部件上的发光二极管组件、设置于发光装置之中并安装在高热导性的导电部件之上的发光二极管、用于将发光元件与导电部件电连接的连接装置、从其上安装着发光二极管的导电部件的另一侧向外伸出用于散热的突起部。
在发光装置中还设有电路衬底，而连接装置包括设在电路衬底上的电路图以及连接发光二极管和电路图的导线。
印刷衬底带有开口，突起部插在该开口内，基体部件固定于印刷衬底。
电路衬底带有开口，发光二极管安装在暴露于该开口内的导电部件上。
导电部件具有导电性，以便将电流加到发光二极管上。
印刷衬底有一发光二极管驱动电路图型连接到导电部件上以向发光二极管施加电流，并在开口的内壁上以及印刷衬底的底面上形成有热辐射图型。
在印刷衬底的底面上固定有冷却部件用于冷却发光二极管。
本发明还提供一种制造发光装置的方法，包括的步骤有：将导电部件与绝缘部件如绝缘树脂相结合形成基体部件组件、形成带有多个开口和电流图的电路衬底组件、将电路衬底组件固定到基体部件组件上、将各发光二极管安装到暴露在电路衬底组件各开口中的导电部件上、将各发光二极管与各电路图至少用一根导线相连接、用透明树脂等密封部件将发光二极管和导线封装在电路衬底组件上、通过切割成块(dicing)的形式将各独立发光装置相互分离。
结合附图阅读下面详细说明，本发明的以上和其它目的及特征将会变得更加清楚。
附图简要说明
图1为用于本发明发光装置的基体部件的透视图；
图2为本发明发光装置的透视图；
图3为用于本发明发光装置的印刷衬底平面图；
图4为安装在带有冷却部件的印刷衬底之上的发光装置的剖面图；
图5为作为本发明第一实施例的另一例中排列安装在印刷衬底上的多个发光装置的侧面图；
图6为本发明另一实施例的发光装置的剖面图；
图7为本发明第二实施例发光装置的透视图；
图8为根据本发明第二实施例安装在带有多个冷却翅片的印刷衬底上的发光装置的侧面图；
图9为本发明第三实施例的发光装置的透视图；
图10为导电部件组件和电路衬底组件的透视图，说明根据本发明的第一实施例制造多个发光装置的步骤；
图11为导电部件组件和电路组件的组件透视图，说明根据本发明的第一实施例制造多个发光装置的步骤；
图12为说明根据本发明第一实施例制造多个发光装置的LED安装步骤的透视图；
图13为说明根据本发明第一实施例制造多个发光装置的导线连接步骤的透视图；
图14为说明根据本发明第一实施例制造多个发光装置的封装步骤的透视图；
图15为说明根据本发明第一实施例制造多个发光装置的分离发光装置组件的步骤的透视图；
图16为常规发光装置的透视图；
图17为另一常规发光装置的透视图。
较佳实施例的详细说明
图1为用于本发明发光装置的基体部件的透视图；图2为本发明第一实施例发光装置的透视图。
基体部件20包括一对导电部件21a、21b和21c，四个树脂制的绝缘部件23a～23d。绝缘部件23b、23c将导电部件21a、21b、21c进行电隔离并将这些部件结合在一起。导电部件21c是由热导性优良的金属制成的。各部件有一方形棱镜(quadratic prism)。导电部件21c有一较低的突起21d。
参照图2，所示我本发明的发光装置30a，该发光装置30a包括发光元件组件30和基体部件20。
发光元件组件30具有通过热压接合固定到基体部件上表面的电路衬底31上。电路衬底31具有一对形成于其表面上的铜箔电路图型31a、31b，以及形成于中心部的开口31c，暴露出热导性部件21c上表面的一部分。图型31a、31b上设有通孔32a、32b用于将该图型与导电部件21a、21b电连接。通过银膏把LED33安装到热导部件21c的暴露部分上。如此，LED33热连接到热导部件21c、LED33的阳极和阴极(未示出)通过导线34a、34b连接到电路图型31a、31b上。这样，LED33的电极就通过图型31a、31b和通孔32a、32b电连接到导电部件21a、21b上。LED33和导线34a、34b用密封部件35封装。
图3为用于本发明第一实施例发光装置的印刷衬底平面图；图4为安装在印刷衬底上的发光装置的剖面图。
印刷衬底40有一对分别为T形的LED驱动图型40a和40b、和一热辐射开口40d，其形状有利于容纳热导部件21c的较低的突起21d。在印刷衬底40的表面上围绕热辐射开口40d、在开口40d的内侧壁、在印刷衬底40的底面上形成有热辐射图型40c。
如图4所示，开口40d的深度等于突起21d的高度。发光装置30a安装在印刷衬底40上，将突起21d插入开口40d。
导电部件21a和21b通过焊接(未示出)固定到LED驱动图型40a和40b上。在图3中，方形线40e示出了发光装置30a的安装区域。如此，LED33通过导线34a、34b、图型31a、31b、通孔32a、32b以及导电部件21a、21b电连接到LED驱动图型40a、40b上。
突起21d的底面与印刷衬底40的底面基本上处于相同水平。如图4所示，由导热性金属制成并带有多个冷却翅片41a的冷却部件41被附着到印刷衬底底面的热辐射图型40c上，并通过焊接料41d固定在图型41c上。
这样，LED33通过热导部件21c的暴露部分、突起21d和热辐射图型40c而与冷却部件41热连接。
当驱动电压被加到LED驱动图型40a、40b上时，电压通过导电部件21a和21b、通孔32a和32b、图型31a和31b以及导线34a和34b而施加到LED33。如此，LED33被驱动发射出光，并变热。LED的热量通过作为散热器的导电部件21c以及热辐射图型40c传递至冷却部件41。这样，传递的热量通过冷却翅片41a而冷却。
尽管以上描述的实施例中导电部件21c上只安装了一个LED33，但是，在导电部件21c可以安装多个LED33，电流通过独立的电路施加到各LED上。
图5为本发明第一实施例的另一例子中的侧面图。如图5所示，在长形印刷衬底40e中形成有三个热辐射开口40d。三个发光装置安装在印刷衬底40上，把各个突起部21d插入于热辐射开口40d。与冷却部件41构造相类似的带有多个冷却翅片42a的长形冷却部件42被固定到印刷衬底40e的底面。
在发光装置例子中，因为对于三个发光装置30a只提供了一个印刷衬底40e，安装操作以及构造都简化了，相对于三个独立装置所占面积而言，装置的面积也减小。
图6为本发明再一例子的发光装置的剖面图。
发光装置30a在其印刷衬底的底面具有热辐射图型40c，其面积比第一实施例的大。突起21d通过大厚度的宽焊点43与热辐射图型40c相连接。因此，热辐射图型40c和焊点43有效地从突起21d辐射热量。由于没有冷却部件41，安装操作和构造都简化了，生产成本降低。
图7为本发明第二实施例发光装置的透视图。与第一实施例相同的部件用与第一实施例相同的标号表示，其说明在此省略。发光装置50有一不同于第一实施例的导热部件。
热导部件21c有一突起部21e从其一侧端横向伸出。
图8为安装在印刷衬底上的发光装置50的侧面图。发光装置50安装在印刷衬底40上，将横向突起21e插入开口41d。如此，发光装置50是以竖直位置安装的。因此，LED33在水平方向上发射光36。
LED33所辐射的热量通过热导性优良的导电部件21c、热辐射图型40c传递到冷却部件41上，并从冷却部件41上辐射出去。这样，LED33得以冷却。
图9为本发明第三实施例的发光装置的透视图。
发光装置51包括基体部件20a和发光元件组件30b。基体部件20a包括导电部件21a、具有导热性和导电性的导电部件21f、以及绝缘部件23e、23f、23g。LED52安装在导电部件21f上，以致LED底面上的电极被连接到导电部件21f上。电路衬底31只有通过导线34a连接到LED52的电极上的电极图型31a。如此，LED52与导电部件21a电连接，与作为热沉(heatsink)的导电部件21f电连接并热连接。
根据第三实施例，由于只提供了单个图型31a和一对导电部件21a和21f，构造简化。
接下来，将说明制造多个第一实施例的发光装置30a的方法。
图10为导电部件组件60和电路衬底组件61的透视图。导电部件组件60包括六条长导电部件60a、60b和60c，对应于导电部件21a、21b和21c。
电路衬底组件61是树脂制成的，且在其上表面上有一铜箔薄膜61a。电路衬底组件有四个分区，在四个分区中有四个开口61b。
图11为导电部件组件和电路组件的组件透视图。导电部件60a、60b和60c通过热压接合方式固定到电路衬底组件61的底面。其后，在导电部件60a、60b和60c之间的空间中充填树脂以形成绝缘部件62。
接下来，形成多个通孔并用铜涂覆，然后在预定位置上通过蚀刻形成4套铜箔图型31a和31b。
图12为说明LED安装步骤的透视图。通过银膏将LED33安装到导电部件60c在各开口61b中暴露的部分上。
图13为说明连接导线步骤的透视图。各LED33通过导线34a和34b电连接到铜箔图型31a和31b上。
图14为说明封装步骤的透视图。如图14所示，电路衬底组件61的上表面用一封装部件62所覆盖，从而封装各LED33和导线34a和34b。这样，完成了发光装置组件63。
图15为说明发光装置组件的分离步骤的透视图。发光装置组件63在相邻分区之间分割成小区。如此，生产出四个发光装置30a。
依照本发明，由于LED是直接安装在具有优良热导性的导电部件上，LED得以有效冷却。LED的特性得以保留，其可靠性提高。
虽然已经结合本发明较佳具体实施例描述了本发明，但是要理解的是，本说明书意在示意而非限制由所附权利要求书所限定的本发明的范围。

Claims (7)

1.一种发光装置，其特征在于，包括：
基体部件，它具有多个热传导性能优良的导电部件和将各导电部件固定并分隔的绝缘部件；
发光二极管，安置在所述导电部件之一上；
电连接装置，将发光二极管和导电部件相连接以向发光元件施加电流；
密封部件，将发光二极管和电连接装置覆盖加以保护；
突起部，从其上安置发光二极管的导电部件的另一侧向外伸出以利散热。
2.如权利要求1所述的装置，其特征在于，所述导电部件与外部冷却部件接触以利散热。
3.如权利要求1所述的装置，其特征在于，所述电连接装置包括一电路衬底，该衬底有电路图型固定到所述基体部件上，以及至少一导线，以便将电流施加到发光二极管上，以及
所述电路衬底具有开口，以便将发光二极管直接设置在导电部件上。
4.如权利要求1所述的装置，其特征在于，所述多个导电部件由金属型芯材料制造。
5.如权利要求2所述的装置，其特征在于，还包括外部印刷衬底，其上有通孔，以便插入导电部件的突起部并使突起部与固定至印刷衬底另一侧的冷却部件相接触。
6.如权利要求1所述的装置，其特征在于，所述冷却部件具有多个冷却翅片。
7.一种制造发光装置的方法，其特征在于，包括以下步骤：
将导电部件与绝缘部件相接合形成用于多个发光装置的基体部件组件；
形成有多个开口以及用于多个发光装置的电路图型的电路衬底组件；
将电路衬底组件固定到基体部件组件上；
至少用一条导线将各发光二极管与各电路图型相连接；
用密封部件将发光二极管和导线密封在电路衬底组件上；以及
通过切割的形式分离各独立发光装置。
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