FR2899763B1 - Support, notamment pour composant electronique de puissance, module de puissance comprenant ce support, ensemble comprenant le module et organe electrique pilote par ce module - Google Patents

Support, notamment pour composant electronique de puissance, module de puissance comprenant ce support, ensemble comprenant le module et organe electrique pilote par ce module

Info

Publication number
FR2899763B1
FR2899763B1 FR0603049A FR0603049A FR2899763B1 FR 2899763 B1 FR2899763 B1 FR 2899763B1 FR 0603049 A FR0603049 A FR 0603049A FR 0603049 A FR0603049 A FR 0603049A FR 2899763 B1 FR2899763 B1 FR 2899763B1
Authority
FR
France
Prior art keywords
module
support
power
assembly
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR0603049A
Other languages
English (en)
Other versions
FR2899763A1 (fr
Inventor
Jean Michel Morelle
Laurent Vivet
Blaise Rouleau
Mathieu Medina
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Leoni Wiring Systems France SAS
Original Assignee
Valeo Electronique et Systemes de Liaison SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Electronique et Systemes de Liaison SA filed Critical Valeo Electronique et Systemes de Liaison SA
Priority to FR0603049A priority Critical patent/FR2899763B1/fr
Priority to PCT/FR2007/051053 priority patent/WO2007116172A1/fr
Priority to US12/225,875 priority patent/US20090175005A1/en
Priority to JP2009503627A priority patent/JP2009532892A/ja
Priority to EP07731857A priority patent/EP2005471A1/fr
Publication of FR2899763A1 publication Critical patent/FR2899763A1/fr
Application granted granted Critical
Publication of FR2899763B1 publication Critical patent/FR2899763B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
FR0603049A 2006-04-06 2006-04-06 Support, notamment pour composant electronique de puissance, module de puissance comprenant ce support, ensemble comprenant le module et organe electrique pilote par ce module Active FR2899763B1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR0603049A FR2899763B1 (fr) 2006-04-06 2006-04-06 Support, notamment pour composant electronique de puissance, module de puissance comprenant ce support, ensemble comprenant le module et organe electrique pilote par ce module
PCT/FR2007/051053 WO2007116172A1 (fr) 2006-04-06 2007-04-02 Support, notamment pour composant electronique de puissance, module de puissance comprenant ce support, ensemble comprenant le module et organe electrique pilote par ce module
US12/225,875 US20090175005A1 (en) 2006-04-06 2007-04-02 Support, in Particular for an Electronic Power Component, a Power Module Including the Support, an Assembly Including the Module, and an Electrical Member Controlled by the Module
JP2009503627A JP2009532892A (ja) 2006-04-06 2007-04-02 特にパワーエレクトロニクス部品用のスタンド、そのようなスタンドを備える電力モジュール、モジュールを備えるアセンブリ、及び、上記モジュールによって制御される電気部材
EP07731857A EP2005471A1 (fr) 2006-04-06 2007-04-02 Support, notamment pour composant electronique de puissance, module de puissance comprenant ce support, ensemble comprenant le module et organe electrique pilote par ce module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0603049A FR2899763B1 (fr) 2006-04-06 2006-04-06 Support, notamment pour composant electronique de puissance, module de puissance comprenant ce support, ensemble comprenant le module et organe electrique pilote par ce module

Publications (2)

Publication Number Publication Date
FR2899763A1 FR2899763A1 (fr) 2007-10-12
FR2899763B1 true FR2899763B1 (fr) 2008-07-04

Family

ID=37101346

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0603049A Active FR2899763B1 (fr) 2006-04-06 2006-04-06 Support, notamment pour composant electronique de puissance, module de puissance comprenant ce support, ensemble comprenant le module et organe electrique pilote par ce module

Country Status (5)

Country Link
US (1) US20090175005A1 (fr)
EP (1) EP2005471A1 (fr)
JP (1) JP2009532892A (fr)
FR (1) FR2899763B1 (fr)
WO (1) WO2007116172A1 (fr)

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69013310T2 (de) * 1989-12-22 1995-04-27 Westinghouse Electric Corp Gehäuse für Leistungshalbleiterbauelemente.
US5736786A (en) * 1996-04-01 1998-04-07 Ford Global Technologies, Inc. Power module with silicon dice oriented for improved reliability
US6028354A (en) * 1997-10-14 2000-02-22 Amkor Technology, Inc. Microelectronic device package having a heat sink structure for increasing the thermal conductivity of the package
JP2001244390A (ja) * 2000-02-29 2001-09-07 Kyocera Corp 半導体素子用パッケージおよびその実装構造
US6517218B2 (en) * 2000-03-31 2003-02-11 Relume Corporation LED integrated heat sink
JP2002203932A (ja) * 2000-10-31 2002-07-19 Hitachi Ltd 半導体パワー素子用放熱基板とその導体板及びヒートシンク材並びにロー材
DE10142615A1 (de) * 2001-08-31 2003-04-10 Siemens Ag Leistungselektronikeinheit
DE10227658B4 (de) * 2002-06-20 2012-03-08 Curamik Electronics Gmbh Metall-Keramik-Substrat für elektrische Schaltkreise -oder Module, Verfahren zum Herstellen eines solchen Substrates sowie Modul mit einem solchen Substrat
FR2842042A1 (fr) * 2002-07-04 2004-01-09 Valeo Equip Electr Moteur Module de controle et de puissance d'un alterno-demarreur integrale
JP4305896B2 (ja) * 2002-11-15 2009-07-29 シチズン電子株式会社 高輝度発光装置及びその製造方法
US7170151B2 (en) * 2003-01-16 2007-01-30 Philips Lumileds Lighting Company, Llc Accurate alignment of an LED assembly
US6903380B2 (en) * 2003-04-11 2005-06-07 Weldon Technologies, Inc. High power light emitting diode
JP4225119B2 (ja) * 2003-05-28 2009-02-18 三菱マテリアル株式会社 放熱体の製造方法及びパワーモジュール用基板の製造方法
JP4179055B2 (ja) * 2003-05-28 2008-11-12 三菱マテリアル株式会社 パワーモジュール用基板並びに放熱体及び放熱体の製造方法
KR100541387B1 (ko) * 2003-08-01 2006-01-11 주식회사 실리온 실리콘고무를 이용한 방열시스템
FR2862424B1 (fr) * 2003-11-18 2006-10-20 Valeo Electronique Sys Liaison Dispositif de refroidissement d'un composant electrique et procede de fabrication de ce dispositif
US7280288B2 (en) * 2004-06-04 2007-10-09 Cree, Inc. Composite optical lens with an integrated reflector
JP4160026B2 (ja) * 2004-07-30 2008-10-01 稔之 新井 電気部品用の放熱体
JP4457921B2 (ja) * 2005-03-01 2010-04-28 三菱マテリアル株式会社 パワーモジュール用の絶縁回路基板およびパワーモジュール

Also Published As

Publication number Publication date
EP2005471A1 (fr) 2008-12-24
US20090175005A1 (en) 2009-07-09
FR2899763A1 (fr) 2007-10-12
WO2007116172A1 (fr) 2007-10-18
JP2009532892A (ja) 2009-09-10

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