CN101714597B - 用于制造发光二极管封装的方法 - Google Patents
用于制造发光二极管封装的方法 Download PDFInfo
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- CN101714597B CN101714597B CN2009101794426A CN200910179442A CN101714597B CN 101714597 B CN101714597 B CN 101714597B CN 2009101794426 A CN2009101794426 A CN 2009101794426A CN 200910179442 A CN200910179442 A CN 200910179442A CN 101714597 B CN101714597 B CN 101714597B
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (2)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060031093A KR100764432B1 (ko) | 2006-04-05 | 2006-04-05 | 아노다이징 절연 층을 갖는 엘이디 패키지 및 그 제조방법 |
KR10-2006-0031093 | 2006-04-05 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007100922606A Division CN101051665B (zh) | 2006-04-05 | 2007-04-03 | 具有阳极化绝缘层的发光二极管封装及其制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101714597A CN101714597A (zh) | 2010-05-26 |
CN101714597B true CN101714597B (zh) | 2011-11-16 |
Family
ID=38574270
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007100922606A Active CN101051665B (zh) | 2006-04-05 | 2007-04-03 | 具有阳极化绝缘层的发光二极管封装及其制造方法 |
CN2009101794426A Active CN101714597B (zh) | 2006-04-05 | 2007-04-03 | 用于制造发光二极管封装的方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007100922606A Active CN101051665B (zh) | 2006-04-05 | 2007-04-03 | 具有阳极化绝缘层的发光二极管封装及其制造方法 |
Country Status (5)
Country | Link |
---|---|
US (2) | US8030762B2 (zh) |
JP (1) | JP4787783B2 (zh) |
KR (1) | KR100764432B1 (zh) |
CN (2) | CN101051665B (zh) |
TW (1) | TWI383517B (zh) |
Families Citing this family (46)
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JP5401025B2 (ja) * | 2007-09-25 | 2014-01-29 | 三洋電機株式会社 | 発光モジュールおよびその製造方法 |
US8360593B2 (en) * | 2007-09-28 | 2013-01-29 | Seoul Semiconductor Co., Ltd. | LED package and back light unit using the same |
KR100939273B1 (ko) | 2008-03-31 | 2010-01-29 | 성균관대학교산학협력단 | 양극산화를 이용한 멀티레이어 제조방법 |
JP3142406U (ja) * | 2008-03-31 | 2008-06-12 | サンケン電気株式会社 | 半導体発光装置及び半導体発光ユニット |
KR100998010B1 (ko) * | 2008-04-28 | 2010-12-03 | 삼성엘이디 주식회사 | 발광소자 패키지 및 그 제조방법 |
TWI488329B (zh) * | 2008-05-15 | 2015-06-11 | Everlight Electronics Co Ltd | 線路基板與發光二極體封裝 |
CN102142423B (zh) * | 2008-05-16 | 2014-11-26 | 亿光电子工业股份有限公司 | 线路基板与发光二极管封装 |
AT506709B1 (de) * | 2008-05-30 | 2009-11-15 | Kuster Martin | Leuchtmittel |
DE102008039147A1 (de) * | 2008-05-30 | 2009-12-03 | Osram Opto Semiconductors Gmbh | Optoelektronisches Modul und optoelektronische Anordnung |
KR101021245B1 (ko) * | 2008-08-07 | 2011-03-11 | 이동규 | 발광다이오드 장치 |
JP5204618B2 (ja) * | 2008-10-21 | 2013-06-05 | 電気化学工業株式会社 | 発光素子搭載用基板、発光素子パッケージおよび発光素子搭載用基板の製造方法 |
KR101114592B1 (ko) * | 2009-02-17 | 2012-03-09 | 엘지이노텍 주식회사 | 발광 디바이스 패키지 및 그 제조방법 |
KR101077264B1 (ko) * | 2009-02-17 | 2011-10-27 | (주)포인트엔지니어링 | 광소자용 기판, 이를 갖는 광소자 패키지 및 이의 제조 방법 |
KR101092063B1 (ko) * | 2009-04-28 | 2011-12-12 | 엘지이노텍 주식회사 | 발광소자 패키지 및 그 제조방법 |
WO2011034259A1 (ko) | 2009-09-17 | 2011-03-24 | 포인트엔지니어링 | 광소자 기판, 광소자 디바이스 및 그 제조 방법 |
WO2011034304A2 (ko) * | 2009-09-17 | 2011-03-24 | 주식회사 포인트 엔지니어링 | 광소자 기판, 광소자 디바이스 및 그 제조 방법 |
TWI416771B (zh) * | 2009-10-01 | 2013-11-21 | Everlight Electronics Co Ltd | 發光二極體 |
KR101022485B1 (ko) * | 2009-10-20 | 2011-03-15 | (주)브이엘시스템 | 히트파이프 모듈을 이용한 엘이디 조명장치의 방열구조 |
KR101053835B1 (ko) | 2010-04-29 | 2011-08-03 | 에스티플렉스 주식회사 | 엘이디 방열처리구조 |
WO2011136417A1 (ko) * | 2010-04-30 | 2011-11-03 | 주식회사 웨이브닉스이에스피 | 단자 일체형 금속베이스 패키지 모듈 및 금속베이스 패키지 모듈을 위한 단자 일체형 패키지방법 |
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US8304279B2 (en) | 2012-11-06 |
TW200802975A (en) | 2008-01-01 |
JP2007281468A (ja) | 2007-10-25 |
TWI383517B (zh) | 2013-01-21 |
US8030762B2 (en) | 2011-10-04 |
CN101051665A (zh) | 2007-10-10 |
US20070235743A1 (en) | 2007-10-11 |
JP4787783B2 (ja) | 2011-10-05 |
CN101051665B (zh) | 2010-12-15 |
KR100764432B1 (ko) | 2007-10-05 |
US20110312109A1 (en) | 2011-12-22 |
CN101714597A (zh) | 2010-05-26 |
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