JP4699042B2 - 発光素子用配線基板ならびに発光装置 - Google Patents
発光素子用配線基板ならびに発光装置 Download PDFInfo
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- JP4699042B2 JP4699042B2 JP2005044402A JP2005044402A JP4699042B2 JP 4699042 B2 JP4699042 B2 JP 4699042B2 JP 2005044402 A JP2005044402 A JP 2005044402A JP 2005044402 A JP2005044402 A JP 2005044402A JP 4699042 B2 JP4699042 B2 JP 4699042B2
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- Prior art keywords
- light emitting
- emitting element
- insulating substrate
- light
- wiring board
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- 239000000758 substrate Substances 0.000 claims description 61
- 239000004020 conductor Substances 0.000 claims description 21
- 239000000919 ceramic Substances 0.000 claims description 15
- 230000017525 heat dissipation Effects 0.000 description 33
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 11
- 238000010304 firing Methods 0.000 description 10
- 239000000843 powder Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 239000013078 crystal Substances 0.000 description 8
- 238000005245 sintering Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000020169 heat generation Effects 0.000 description 5
- 239000011812 mixed powder Substances 0.000 description 5
- 239000012778 molding material Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910020068 MgAl Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Led Device Packages (AREA)
Description
前記絶縁基板の発光素子が搭載される一方の面から該面の反対側の他方の面に向かって貫通して延びており且つ前記セラミックスよりも高い熱伝導率を有する放熱ブロックが設けられており、
該放熱ブロックは、前記絶縁基板から成るセラミックスと焼成されて一体化された複数の放熱ブロックからなり、該複数の放熱ブロックが、前記発光素子が搭載される搭載領域に間隔をあけて配列されているとともに、前記絶縁基板の一方の面から該面の反対側の他方の面に向かって貫通し、そのまま前記絶縁基板の他方の面から突出してそれぞれ凸部を形成し、前記絶縁基板の他方の面側には前記凸部による放熱面が形成されていることを特徴とする発光素子用配線基板が提供される。
図1は、発光素子用配線基板の概略側断面図であり、
図2は、図1(b)の配線基板に形成されている放熱ブロックの凸部を拡大して示す図であり、
図3は、本発明の発光素子用配線基板の概略側断面図であり、
図4は、発光素子用配線基板の他の例の概略側断面図であり、
図5は、発光素子用配線基板に発光素子を搭載した発光装置の概略側断面図である。
3a,3b:接続端子
5:外部電極端子
7:ビア導体
8:放熱ブロック
10:凸部
11:発光素子用配線基板
13:枠体
21:発光素子
25:発光装置
Claims (3)
- セラミックスから成る絶縁基板と、該絶縁基板の表面または内部に形成された配線導体層とを備え、該絶縁基板の一方の面上に発光素子が搭載される発光素子用配線基板において、
前記絶縁基板の発光素子が搭載される一方の面から該面の反対側の他方の面に向かって貫通して延びており且つ前記セラミックスよりも高い熱伝導率を有する放熱ブロックが設けられており、
該放熱ブロックは、前記絶縁基板から成るセラミックスと焼成されて一体化された複数の放熱ブロックからなり、該複数の放熱ブロックが、前記発光素子が搭載される搭載領域に間隔をあけて配列されているとともに、前記絶縁基板の一方の面から該面の反対側の他方の面に向かって貫通し、そのまま前記絶縁基板の他方の面から突出してそれぞれ凸部を形成し、前記絶縁基板の他方の面側には前記凸部による放熱面が形成されていることを特徴とする発光素子用配線基板。 - 前記凸部が、半球形状を有している請求項1に記載の発光素子用配線基板。
- 請求項1又は2に記載の発光素子用配線基板に発光素子を搭載してなることを特徴とする発光装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005044402A JP4699042B2 (ja) | 2005-02-21 | 2005-02-21 | 発光素子用配線基板ならびに発光装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005044402A JP4699042B2 (ja) | 2005-02-21 | 2005-02-21 | 発光素子用配線基板ならびに発光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006229151A JP2006229151A (ja) | 2006-08-31 |
JP4699042B2 true JP4699042B2 (ja) | 2011-06-08 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005044402A Expired - Fee Related JP4699042B2 (ja) | 2005-02-21 | 2005-02-21 | 発光素子用配線基板ならびに発光装置 |
Country Status (1)
Country | Link |
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JP (1) | JP4699042B2 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4915274B2 (ja) * | 2007-04-25 | 2012-04-11 | 豊田合成株式会社 | 発光装置及びその製造方法 |
JP5549104B2 (ja) * | 2008-05-29 | 2014-07-16 | 株式会社リコー | 発光装置、光走査装置及び画像形成装置 |
KR101125296B1 (ko) * | 2009-10-21 | 2012-03-27 | 엘지이노텍 주식회사 | 라이트 유닛 |
EP2597691B1 (en) * | 2010-07-23 | 2015-09-09 | Kyocera Corporation | Light irradiation device, light irradiation module, and printing device |
JP5968674B2 (ja) * | 2011-05-13 | 2016-08-10 | エルジー イノテック カンパニー リミテッド | 発光素子パッケージ及びこれを備える紫外線ランプ |
WO2022014411A1 (ja) * | 2020-07-15 | 2022-01-20 | Agc株式会社 | 発光素子用基板 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50155973A (ja) * | 1974-06-07 | 1975-12-16 | ||
JPH11298048A (ja) * | 1998-04-15 | 1999-10-29 | Matsushita Electric Works Ltd | Led実装基板 |
JP2004172170A (ja) * | 2002-11-15 | 2004-06-17 | Citizen Electronics Co Ltd | 高輝度発光装置及びその製造方法 |
JP2004228240A (ja) * | 2003-01-21 | 2004-08-12 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
JP2005033028A (ja) * | 2003-07-07 | 2005-02-03 | Sanken Electric Co Ltd | 半導体発光装置 |
-
2005
- 2005-02-21 JP JP2005044402A patent/JP4699042B2/ja not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50155973A (ja) * | 1974-06-07 | 1975-12-16 | ||
JPH11298048A (ja) * | 1998-04-15 | 1999-10-29 | Matsushita Electric Works Ltd | Led実装基板 |
JP2004172170A (ja) * | 2002-11-15 | 2004-06-17 | Citizen Electronics Co Ltd | 高輝度発光装置及びその製造方法 |
JP2004228240A (ja) * | 2003-01-21 | 2004-08-12 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
JP2005033028A (ja) * | 2003-07-07 | 2005-02-03 | Sanken Electric Co Ltd | 半導体発光装置 |
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JP2006229151A (ja) | 2006-08-31 |
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