CN1458698A - 薄膜半导体器件 - Google Patents
薄膜半导体器件 Download PDFInfo
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- CN1458698A CN1458698A CN03136734A CN03136734A CN1458698A CN 1458698 A CN1458698 A CN 1458698A CN 03136734 A CN03136734 A CN 03136734A CN 03136734 A CN03136734 A CN 03136734A CN 1458698 A CN1458698 A CN 1458698A
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- silicon thin
- raceway groove
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 39
- 239000010409 thin film Substances 0.000 claims abstract description 129
- 239000013078 crystal Substances 0.000 claims abstract description 79
- 229910052710 silicon Inorganic materials 0.000 claims description 103
- 239000010703 silicon Substances 0.000 claims description 103
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 96
- 239000000758 substrate Substances 0.000 claims description 66
- 239000010408 film Substances 0.000 claims description 46
- 238000002425 crystallisation Methods 0.000 claims description 32
- 239000012212 insulator Substances 0.000 claims description 32
- 230000008025 crystallization Effects 0.000 claims description 30
- 230000002093 peripheral effect Effects 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 abstract description 24
- 239000007787 solid Substances 0.000 abstract description 6
- 230000037230 mobility Effects 0.000 description 32
- 230000008901 benefit Effects 0.000 description 23
- 229920005591 polysilicon Polymers 0.000 description 16
- 238000000034 method Methods 0.000 description 14
- 239000002245 particle Substances 0.000 description 8
- 150000003376 silicon Chemical class 0.000 description 7
- 239000012528 membrane Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 239000010410 layer Substances 0.000 description 4
- 238000007711 solidification Methods 0.000 description 4
- 230000008023 solidification Effects 0.000 description 4
- 230000000994 depressogenic effect Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 230000004927 fusion Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 239000002800 charge carrier Substances 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000005224 laser annealing Methods 0.000 description 2
- 238000005499 laser crystallization Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000007715 excimer laser crystallization Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/127—Multistep manufacturing methods with a particular formation, treatment or patterning of the active layer specially adapted to the circuit arrangement
- H01L27/1274—Multistep manufacturing methods with a particular formation, treatment or patterning of the active layer specially adapted to the circuit arrangement using crystallisation of amorphous semiconductor or recrystallisation of crystalline semiconductor
- H01L27/1285—Multistep manufacturing methods with a particular formation, treatment or patterning of the active layer specially adapted to the circuit arrangement using crystallisation of amorphous semiconductor or recrystallisation of crystalline semiconductor using control of the annealing or irradiation parameters, e.g. using different scanning direction or intensity for different transistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02422—Non-crystalline insulating materials, e.g. glass, polymers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
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- H01L21/02532—Silicon, silicon germanium, germanium
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02587—Structure
- H01L21/0259—Microstructure
- H01L21/02595—Microstructure polycrystalline
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02609—Crystal orientation
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02675—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02691—Scanning of a beam
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1296—Multistep manufacturing methods adapted to increase the uniformity of device parameters
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/04—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
- H01L29/6675—Amorphous silicon or polysilicon transistors
- H01L29/66757—Lateral single gate single channel transistors with non-inverted structure, i.e. the channel layer is formed before the gate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78651—Silicon transistors
- H01L29/7866—Non-monocrystalline silicon transistors
- H01L29/78672—Polycrystalline or microcrystalline silicon transistor
- H01L29/78675—Polycrystalline or microcrystalline silicon transistor with normal-type structure, e.g. with top gate
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Ceramic Engineering (AREA)
- Optics & Photonics (AREA)
- Materials Engineering (AREA)
- Thin Film Transistor (AREA)
- Recrystallisation Techniques (AREA)
- Liquid Crystal (AREA)
Abstract
Description
Claims (19)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002142368A JP2003332350A (ja) | 2002-05-17 | 2002-05-17 | 薄膜半導体装置 |
JP142368/2002 | 2002-05-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1458698A true CN1458698A (zh) | 2003-11-26 |
CN100377365C CN100377365C (zh) | 2008-03-26 |
Family
ID=29416999
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB031367348A Expired - Fee Related CN100377365C (zh) | 2002-05-17 | 2003-05-15 | 薄膜半导体器件 |
Country Status (5)
Country | Link |
---|---|
US (4) | US6969871B2 (zh) |
JP (1) | JP2003332350A (zh) |
KR (1) | KR101060418B1 (zh) |
CN (1) | CN100377365C (zh) |
TW (1) | TWI301329B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101038867B (zh) * | 2006-03-13 | 2011-11-23 | 索尼株式会社 | 结晶半导体薄膜的方法 |
CN102543997A (zh) * | 2008-09-19 | 2012-07-04 | 友达光电股份有限公司 | 薄膜晶体管阵列基板 |
CN101355090B (zh) * | 2008-09-19 | 2012-08-29 | 友达光电股份有限公司 | 薄膜晶体管阵列基板及其制作方法 |
US8884304B2 (en) | 2008-09-04 | 2014-11-11 | Au Optronics Corporation | Thin film transistor array substrate having polysilicon |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100521274B1 (ko) * | 2003-06-10 | 2005-10-12 | 삼성에스디아이 주식회사 | 씨모스 박막 트랜지스터 및 이를 사용한 디스플레이디바이스 |
WO2005029551A2 (en) | 2003-09-16 | 2005-03-31 | The Trustees Of Columbia University In The City Of New York | Processes and systems for laser crystallization processing of film regions on a substrate utilizing a line-type beam, and structures of such film regions |
JP2005276944A (ja) * | 2004-03-23 | 2005-10-06 | Sharp Corp | 半導体デバイス、その製造方法および製造装置 |
KR101132404B1 (ko) * | 2005-08-19 | 2012-04-03 | 삼성전자주식회사 | 다결정 실리콘 박막의 제조 방법 및 이를 포함하는 박막트랜지스터의 제조 방법 |
TWI389316B (zh) * | 2005-09-08 | 2013-03-11 | Sharp Kk | 薄膜電晶體、半導體裝置、顯示器、結晶化方法及製造薄膜電晶體方法 |
KR20070082191A (ko) * | 2006-02-15 | 2007-08-21 | 삼성전자주식회사 | 유기 전자발광디스플레이 및 그 제조방법 |
JP4169072B2 (ja) | 2006-03-13 | 2008-10-22 | ソニー株式会社 | 薄膜半導体装置および薄膜半導体装置の製造方法 |
JP4169071B2 (ja) | 2006-05-25 | 2008-10-22 | ソニー株式会社 | 表示装置 |
JP4853519B2 (ja) * | 2006-10-16 | 2012-01-11 | コニカミノルタオプト株式会社 | ディスクトラックリートメディア用またはパターンドメディア用磁気記録媒体用基板、ディスクトラックリートメディア用またはパターンドメディア用磁気記録媒体用基板の製造方法、ディスクトラックリートメディア用またはパターンドメディア用磁気記録媒体、及びディスクトラックリートメディア用またはパターンドメディア用磁気記録媒体の製造方法 |
KR100841372B1 (ko) * | 2006-12-19 | 2008-06-26 | 삼성에스디아이 주식회사 | 박막트랜지스터 및 이의 제조방법 |
JP4411331B2 (ja) * | 2007-03-19 | 2010-02-10 | 信越化学工業株式会社 | 磁気記録媒体用シリコン基板およびその製造方法 |
TWI452632B (zh) * | 2008-02-29 | 2014-09-11 | Univ Columbia | 製造均勻一致結晶矽膜的微影方法 |
CN102097368A (zh) * | 2010-11-08 | 2011-06-15 | 昆山工研院新型平板显示技术中心有限公司 | 一种低温多晶硅薄膜晶体管阵列基板的制造方法 |
EP2915161B1 (en) | 2012-11-05 | 2020-08-19 | University of Florida Research Foundation, Inc. | Brightness compensation in a display |
EP2926376B1 (en) | 2012-11-30 | 2017-11-08 | University of Florida Research Foundation, Inc. | Ambipolar vertical field effect transistor |
TWI570899B (zh) * | 2014-09-10 | 2017-02-11 | 群創光電股份有限公司 | 薄膜電晶體基板 |
JP2017037178A (ja) * | 2015-08-10 | 2017-02-16 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
US11024736B2 (en) | 2019-08-09 | 2021-06-01 | Micron Technology, Inc. | Transistor and methods of forming integrated circuitry |
US10964811B2 (en) | 2019-08-09 | 2021-03-30 | Micron Technology, Inc. | Transistor and methods of forming transistors |
US11637175B2 (en) * | 2020-12-09 | 2023-04-25 | Micron Technology, Inc. | Vertical transistors |
KR102538146B1 (ko) * | 2021-09-07 | 2023-05-30 | (주)알엔알랩 | 에피택셜 반도체층의 형성 방법 및 이를 적용한 반도체 소자의 제조 방법 |
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JP2000183358A (ja) | 1998-07-17 | 2000-06-30 | Sony Corp | 薄膜半導体装置の製造方法 |
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JP2002124467A (ja) | 2000-10-18 | 2002-04-26 | Matsushita Electric Ind Co Ltd | 多結晶半導体膜の形成方法および薄膜トランジスタの製造方法 |
JP4732599B2 (ja) * | 2001-01-26 | 2011-07-27 | 株式会社日立製作所 | 薄膜トランジスタ装置 |
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JP4358998B2 (ja) * | 2001-02-01 | 2009-11-04 | 株式会社日立製作所 | 薄膜トランジスタ装置およびその製造方法 |
US6819481B2 (en) * | 2001-06-04 | 2004-11-16 | Lucent Technologies Inc. | Bidirectional wave division multiplex systems |
JP3496763B2 (ja) | 2001-06-26 | 2004-02-16 | シャープ株式会社 | 薄膜トランジスタおよびその製造方法並びに液晶表示装置 |
US6933527B2 (en) * | 2001-12-28 | 2005-08-23 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and semiconductor device production system |
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JP2003204067A (ja) * | 2001-12-28 | 2003-07-18 | Semiconductor Energy Lab Co Ltd | 表示装置およびそれを用いた電子機器 |
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US7273026B2 (en) * | 2002-10-18 | 2007-09-25 | Maclean-Fogg Company | Roller follower body |
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2002
- 2002-05-17 JP JP2002142368A patent/JP2003332350A/ja active Pending
-
2003
- 2003-04-10 KR KR1020030022514A patent/KR101060418B1/ko active IP Right Grant
- 2003-05-06 TW TW092112328A patent/TWI301329B/zh not_active IP Right Cessation
- 2003-05-15 CN CNB031367348A patent/CN100377365C/zh not_active Expired - Fee Related
- 2003-05-16 US US10/438,843 patent/US6969871B2/en not_active Expired - Lifetime
-
2005
- 2005-07-22 US US11/186,907 patent/US7256423B2/en not_active Expired - Lifetime
-
2007
- 2007-06-26 US US11/768,588 patent/US7442958B2/en not_active Expired - Fee Related
-
2008
- 2008-10-27 US US12/258,738 patent/US7939826B2/en not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101038867B (zh) * | 2006-03-13 | 2011-11-23 | 索尼株式会社 | 结晶半导体薄膜的方法 |
US8884304B2 (en) | 2008-09-04 | 2014-11-11 | Au Optronics Corporation | Thin film transistor array substrate having polysilicon |
CN102543997A (zh) * | 2008-09-19 | 2012-07-04 | 友达光电股份有限公司 | 薄膜晶体管阵列基板 |
CN101355090B (zh) * | 2008-09-19 | 2012-08-29 | 友达光电股份有限公司 | 薄膜晶体管阵列基板及其制作方法 |
CN102543997B (zh) * | 2008-09-19 | 2015-03-11 | 友达光电股份有限公司 | 薄膜晶体管阵列基板 |
Also Published As
Publication number | Publication date |
---|---|
KR20030089424A (ko) | 2003-11-21 |
US20030213957A1 (en) | 2003-11-20 |
JP2003332350A (ja) | 2003-11-21 |
TWI301329B (en) | 2008-09-21 |
KR101060418B1 (ko) | 2011-08-29 |
US7939826B2 (en) | 2011-05-10 |
US20090057676A1 (en) | 2009-03-05 |
US20070246709A1 (en) | 2007-10-25 |
CN100377365C (zh) | 2008-03-26 |
US20050255679A1 (en) | 2005-11-17 |
US6969871B2 (en) | 2005-11-29 |
TW200408134A (en) | 2004-05-16 |
US7256423B2 (en) | 2007-08-14 |
US7442958B2 (en) | 2008-10-28 |
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