CN1457094A - 半导体器件及其制造方法 - Google Patents

半导体器件及其制造方法 Download PDF

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Publication number
CN1457094A
CN1457094A CN03122392A CN03122392A CN1457094A CN 1457094 A CN1457094 A CN 1457094A CN 03122392 A CN03122392 A CN 03122392A CN 03122392 A CN03122392 A CN 03122392A CN 1457094 A CN1457094 A CN 1457094A
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mentioned
leads
semiconductor chip
lead
sealing body
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Pending
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CN03122392A
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Chinese (zh)
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伊藤富士夫
铃木博通
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Hitachi Ltd
Hitachi Solutions Technology Ltd
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Hitachi Ltd
Hitachi ULSI Systems Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/014—Manufacture or treatment using batch processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/042—Etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H10W70/413—Insulating or insulated substrates serving as die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/601—Marks applied to devices, e.g. for alignment or identification for use after dicing
    • H—ELECTRICITY
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
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    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07352—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in structures or sizes
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07353—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in shapes
    • H—ELECTRICITY
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
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    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/331—Shapes of die-attach connectors
    • H10W72/332—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
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    • H10W74/00—Encapsulations, e.g. protective coatings
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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CN03122392A 2002-05-10 2003-05-09 半导体器件及其制造方法 Pending CN1457094A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002134952A JP4095827B2 (ja) 2002-05-10 2002-05-10 半導体装置
JP134952/2002 2002-05-10

Publications (1)

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CN1457094A true CN1457094A (zh) 2003-11-19

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US (1) US20030209815A1 (https=)
JP (1) JP4095827B2 (https=)
KR (1) KR20040007244A (https=)
CN (1) CN1457094A (https=)
TW (1) TW200405529A (https=)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100435302C (zh) * 2004-05-31 2008-11-19 新光电气工业株式会社 芯片内置基板的制造方法
CN100463166C (zh) * 2005-11-18 2009-02-18 鸿富锦精密工业（深圳）有限公司 一种芯片
CN101189712B (zh) * 2005-06-07 2010-08-11 英泰克普拉斯有限公司 用于检验半导体封装的标记的方法及设备
CN101540309B (zh) * 2008-03-14 2011-06-29 日月光半导体制造股份有限公司 半导体封装及其制作方法
CN101548372B (zh) * 2006-12-08 2012-04-18 夏普株式会社 Ic芯片封装和具有该ic芯片封装的图像显示装置
CN101416303B (zh) * 2006-01-30 2012-06-20 马维尔国际贸易有限公司 热增强型封装
CN103165557A (zh) * 2011-12-16 2013-06-19 瑞萨电子株式会社 半导体装置
CN103229285A (zh) * 2010-09-27 2013-07-31 吉林克斯公司 用于集成电路芯片的角结构
CN103390604A (zh) * 2012-05-10 2013-11-13 瑞萨电子株式会社 半导体器件制造方法以及半导体器件
CN103828038A (zh) * 2011-07-25 2014-05-28 京瓷株式会社 布线基板、电子装置及电子模块
CN110246826A (zh) * 2018-03-08 2019-09-17 艾普凌科有限公司 半导体装置以及其制造方法
CN114300420A (zh) * 2020-10-08 2022-04-08 联发科技股份有限公司 半导体封装

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005093494A (ja) * 2003-09-12 2005-04-07 Sanyo Electric Co Ltd 半導体装置およびその製造方法
JP4421934B2 (ja) * 2004-04-30 2010-02-24 株式会社ルネサステクノロジ 半導体装置の製造方法
JP4646661B2 (ja) * 2005-03-18 2011-03-09 株式会社リコー プリント配線基板印刷方法と実装方法ならびにプログラム
KR101012943B1 (ko) * 2006-04-25 2011-02-08 엘지전자 주식회사 실내 구석 청소가 가능한 흡입 장치
JP4939583B2 (ja) * 2009-09-09 2012-05-30 日東電工株式会社 回路付きサスペンション基板集合体シートおよびその製造方法
JP5618873B2 (ja) * 2011-03-15 2014-11-05 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP5851897B2 (ja) * 2012-03-19 2016-02-03 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP6150469B2 (ja) * 2012-07-12 2017-06-21 株式会社三井ハイテック リードフレームの製造方法
US8937379B1 (en) * 2013-07-03 2015-01-20 Stats Chippac Ltd. Integrated circuit packaging system with trenched leadframe and method of manufacture thereof
JP5910950B2 (ja) * 2014-09-29 2016-04-27 大日本印刷株式会社 樹脂封止型半導体装置、多面付樹脂封止型半導体装置、リードフレーム、および樹脂封止型半導体装置の製造方法
US10950511B2 (en) * 2018-10-30 2021-03-16 Medtronic, Inc. Die carrier package and method of forming same
JP7185502B2 (ja) * 2018-11-16 2022-12-07 ローム株式会社 半導体装置、表示ドライバ及び表示装置
CN114287176B (zh) * 2019-08-30 2024-03-12 株式会社富士 作业机

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0895287A3 (en) * 1997-07-31 2006-04-05 Matsushita Electric Industrial Co., Ltd. Semiconductor device and lead frame for the same

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100435302C (zh) * 2004-05-31 2008-11-19 新光电气工业株式会社 芯片内置基板的制造方法
CN101189712B (zh) * 2005-06-07 2010-08-11 英泰克普拉斯有限公司 用于检验半导体封装的标记的方法及设备
CN100463166C (zh) * 2005-11-18 2009-02-18 鸿富锦精密工业（深圳）有限公司 一种芯片
CN101416303B (zh) * 2006-01-30 2012-06-20 马维尔国际贸易有限公司 热增强型封装
CN101548372B (zh) * 2006-12-08 2012-04-18 夏普株式会社 Ic芯片封装和具有该ic芯片封装的图像显示装置
CN101540309B (zh) * 2008-03-14 2011-06-29 日月光半导体制造股份有限公司 半导体封装及其制作方法
CN103229285B (zh) * 2010-09-27 2016-03-09 吉林克斯公司 用于集成电路芯片的角结构
CN103229285A (zh) * 2010-09-27 2013-07-31 吉林克斯公司 用于集成电路芯片的角结构
CN103828038B (zh) * 2011-07-25 2016-07-06 京瓷株式会社 布线基板、电子装置及电子模块
CN103828038A (zh) * 2011-07-25 2014-05-28 京瓷株式会社 布线基板、电子装置及电子模块
CN103165557B (zh) * 2011-12-16 2017-05-10 瑞萨电子株式会社 半导体装置
CN103165557A (zh) * 2011-12-16 2013-06-19 瑞萨电子株式会社 半导体装置
CN103390604A (zh) * 2012-05-10 2013-11-13 瑞萨电子株式会社 半导体器件制造方法以及半导体器件
CN103390604B (zh) * 2012-05-10 2018-12-21 瑞萨电子株式会社 半导体器件制造方法以及半导体器件
CN110246826A (zh) * 2018-03-08 2019-09-17 艾普凌科有限公司 半导体装置以及其制造方法
CN114300420A (zh) * 2020-10-08 2022-04-08 联发科技股份有限公司 半导体封装

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KR20040007244A (ko) 2004-01-24
JP4095827B2 (ja) 2008-06-04
US20030209815A1 (en) 2003-11-13
JP2003332513A (ja) 2003-11-21
TW200405529A (en) 2004-04-01

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