CN1381072A - 基于发光二极管的发射白光的照明设备 - Google Patents

基于发光二极管的发射白光的照明设备 Download PDF

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CN1381072A
CN1381072A CN01801487A CN01801487A CN1381072A CN 1381072 A CN1381072 A CN 1381072A CN 01801487 A CN01801487 A CN 01801487A CN 01801487 A CN01801487 A CN 01801487A CN 1381072 A CN1381072 A CN 1381072A
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A·埃伦斯
F·杰尔曼
F·库默
M·奥斯特塔格
F·茨瓦施卡
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Abstract

在一种发射白光的光转换二极管(LED)中,采用一种氯硅酸盐荧光剂,这种荧光剂中除了Ca和Mg以外还包含掺杂的铕,在该LED中也采用稀土,特别是Y和/或Tb的石榴石荧光剂,以这种方式,能够获得高的色彩再现和在不同温度条件下的高度稳定的照明性能。

Description

基于发光二极管的发射白光的照明设备
                        技术领域
本发明涉及基于发光二极管的发射白光的照明设备,其中LED主要发射UV辐射或蓝光。此外,还采用至少一种发射黄光的荧光剂和一种发射绿光的荧光剂对主辐射进行部分转换。所采用的黄色荧光剂是Ce-活化的柘榴石,特别是包含Y和/或Tb的柘榴石。所采用的绿色荧光剂是Eu-活化的钙-镁-氯硅酸盐(Ca8Mg(SiO4)4Cl2)。
                        现有技术
电化学会志(J.Electrochem.Soc.)1992,p.622已公开一种氯硅酸盐荧光剂和它对UV和蓝光激发的应用,这种荧光剂中掺杂Eu(掺杂Eu2+的Ca8Mg(SiO4)4Cl2荧光剂的发光性能和能量转换)。它发出的光在光谱的绿色区域。该文没有说明这种荧光剂的具体应用领域。
发射白光的发光转换-LED,目前是将在约460nm发射的蓝色Ga(In)N LED与发射黄光的YAG:Ce3+荧光剂结合起来生产的(美国专利5,998,925和欧洲专利862 794)。然而,由于缺乏颜色成分(主要是红色成分),造成差的色彩再现,所以这些发射白光的LED只能有限地应用于一般照明目的。另一种方法是混合三种颜色RGB(红、绿、蓝),它们合起来产生白光,参见例如WO 98/39805。
                      发明概述
本发明的目的是提供一种按照权利要求1的前述部分的基于LED的照明设备,该设备发射白光,特别是具有高的色彩再现。
这些目的是利用权利要求1的特征部分实现的。在从属 中,给出特别有利的实施方案。
以前制造发射白光的LED的方法,主要是基于RGB配料,即基于三种颜色,也就是红、绿和蓝的混合物,在这种情况下,该后一种成分可由荧光剂或由LED的主发射提供。第二种简化的方法中,如在序言中所讨论的,是基于混合蓝色和黄色(BG配料)。
根据本发明,首次采用基于BGG混合物——即蓝、黄、和绿色的组合——的全新概念。最重要的因素是,黄色荧光剂的光带是如此之宽,以致它们在光谱的红色区域也有足够的发射比例,特别是其在可见光区域总发射比例的至少20%处在≥620nm的光谱区域。
已经证明,Ce-活化的稀土(RE)柘榴石是一种特别适宜的发射黄光的荧光剂,其中RE优选自Y、Tb、Gd、Lu和/或La。Y和Tb组合是优选的。在这种情况下,为了达到足够的红色比例,Tb引起的长波位移具有特别有利的作用。
优选特别适合发射绿光的荧光剂(其发射波长峰值位于500-525nm区域)的CaMg氯硅酸盐结构根据本发明它掺杂以铕(Eu)。如果适宜,还可将少量的其它掺杂剂,特别是锰(Mn),以小比例加入,用于细调。另一种方案是SrAl2O4:Eu2+或Sr4Al14O25:Eu2+类型的绿色荧光剂。
在色图中,绿色荧光剂的色品位置与黄色荧光剂的色品位置以及蓝色LED的色品位置(或蓝色荧光剂颜色的色品位置)一起,封闭成很宽的三角形,产生适合特殊要求的更多的可能性。相比之下,不同的柘榴石的色品位置变化的范围明显较小。因此,对于可能达到的色温也可在很宽的范围,一般在4000-10 000K内散射。
在开发发射白光的照明设备方面,本发明是特别有利的。这是一种既基于LED阵列又基于单个LED的照明设备,或者是一种直接进行发光转换的LED,其中的荧光剂直接或间接地与芯片接触,即将荧光剂直接施加到芯片上,或嵌在包围它的树脂中。
将发射发射波长(峰)为300-470nm的发UV或蓝光(在本说明书中全都称作“短波”光)的LED,与根据本发明的荧光剂混合物组合起来,可以产生白光,这种荧光剂混合物能完全或部分地吸收LED的辐射,并且本身在光谱范围内发光,它与LED光的加成混合物产生有优良色彩再现的白光。可能还需要加入另一种发射蓝光的荧光剂成分(例如BAM)。在UV-LED的情况下,在发射波长(峰)约330-350nm处,和在蓝色LED的情况下,在发射波长(峰)约450-470nm处,达到特别有效的激发。
例如,通过混合20-50重量%的氯硅酸盐荧光剂,结果改善了基于柘榴石荧光剂的这种已知的白色LED的色彩再现。发射黄光的荧光剂是按照通式RE3(Al,Ga)5O12:Ce的稀土(RE)Y、Gd、Lu、La和/或Tb的柘榴石,特别是按照通式YAG:Ce或TbAG:Ce,其中特别是RE=Y和/或Tb。
从科学文献中获悉荧光剂Ca8Mg(SiO4)4Cl2:Eu2+,但该文献并没有指出这种荧光剂的具体应用。根据本发明,这种荧光剂在白色LED的应用中有好的性能,基于三色混合物的荧光剂是特别方便的,这种混合物是由主UV光源(300-390nm)激发的。然而,它也适合在有蓝色主光源(430-470nm)的白色LED中的特殊应用。铕的比例x,在x=0.005至x=1.6之间,特别是在x=0.01至x=1.0之间是有利的。在这种情况下,具有经验式Ca8-xEuxMg(SiO4)4Cl2
除了Eu以外,加入少量的Mn(达到Eu mol比例约20%)作为另一种掺杂剂,能有目的的将发射从光谱的绿色区域移向长波区域,即进入光谱的黄色区域。这具有使发射更适于人眼的优点,因此也改善了视觉的有效效果。Mn的比例y,至多为y=0.1。在不加锰的情况下,特别优选铕的比例为x=0.05至x=0.8。
当在光源中,特别是在LED中使用时,铕的浓度影响发射光的色品位置。这种荧光剂的色品位置,可采用二种浓度Eu∶Mn的比例另行细调,这简化或最佳化LED中其它(黄色或蓝色)荧光剂的匹配。
例如在设备中也可采用根据本发明的荧光剂也可用于其中LED阵列(UV或蓝色主发射)照射透明板上的荧光剂的设备,或其中各个LED照射涂敷在透镜上的荧光剂的设备。
为产生有高的色彩再现的白色LED,采用根据本发明的荧光剂是特别方便的。为此,可以单独地或以混合物的形式施加这些荧光剂,如果适宜,可将这些荧光剂与尽可能是透明的粘合剂混合(欧洲专利862 794)。这些荧光剂能全部或部分地吸收发射UV/蓝光的LED的光,并在光谱的其它区域(主要是黄色和绿色),以足够宽的带(即具有显著的红色比例)再发射光,形成具有所需色品位置的总发射。迄今为止,几乎没有任何如这里所述的以其组合形式的荧光剂那样好的能满足这些要求的荧光剂。它们具有高的量子效率(约70%),同时,其发射光谱是基于眼睛灵敏度那样的明亮。色品的位置可在很宽的范围内调节。
适宜的光源是一种LED(发光二极管),它产生白光,是通过直接将发射绿光或发射黄光的荧光剂与在光谱蓝色区域(430-470nm)的主辐射混合,或利用多种荧光剂(采用三种荧光剂混合形成的BGG),将主发射的UV辐射转换成白色。在本文中,术语蓝、黄和绿的含义,一般应理解为在蓝色区域:430-470nm,绿色区域:490-525nm,和黄色区域:545-590nm发射最大。
所采用的主光源是发射UV或发射蓝光芯片的辐射。采用在330-370nm发射最大的UV-LED能得到特别好的结果。特别是在考虑到柘榴石和氯硅酸盐的激发光谱时,在355-365nm得到了最佳结果。这里所用的蓝色荧光剂是例如BAM。在蓝色芯片的情况下,采用峰值波长430-470nm能获得特别好的结果。特别是在考虑到柘榴石和氯硅酸盐的激发光谱时,在445-460nm得到了最佳结果。
色彩再现特别优良的方案是将二种荧光剂结合使用,即一种Tb含量高的荧光剂,优选纯的TbAG:Ce与氯硅酸盐:Eu结合起来。温度稳定性特别好的方案是将二种荧光剂结合使用,即一种Y含量高的荧光剂,优选纯的YAG:Ce与氯硅酸盐:Eu结合起来。
特别适合作为主辐射的发射UV或蓝色辐射(为了简化起见,下面称作短波辐射)的LED是Ga(In)N-LED,或采用另一种方案,是在发射区域300-470nm发射其它短波的LED。特别推荐主发射区域在UV区域(320-360nm)和在蓝色区域(430-470nm),因为这是效率最高的区域。
                        附图
下面将参照若干典型的实施方案更详细地说明本发明。在附图中:
图1示出掺杂铕的氯硅酸盐的激发光谱和发射光谱;
图2示出另一种掺杂铕的氯硅酸盐的反射光谱和发射光谱;
图3示出一种作为白光光源(LED)使用的半导体元件;
图4示出图3中的LED的发射光谱,这种LED采用根据本发明的荧光剂TbAG和CS:Eu;
图5示出另一种LED的发射光谱,这种LED采用根据本发明的荧光剂TbAG和CS:Eu;
图6示出一种LED的温度行为,该LED采用根据本发明的荧光剂YAG和CS:Eu;
图7示出一种LED的发射光谱,该LED采用根据本发明的荧光剂YAG和CS:Eu;
图8示出一种采用根据本发明的荧光剂的照明设备。
                         对附图的说明
下文采用实例对掺杂Eu和掺杂Mn的氯硅酸盐Ca8Mg(SiO4)4Cl2:(Eu2+,Mn2+)的合成进行更详细地说明。然后在若干典型测定的基础上,证明这种荧光剂的适宜性。
荧光剂粉末是采用高温固体反应生产的。为此所举的实例是,将高纯度的原料CaCO3、MgO、SiO2、和CaCl2,按照摩尔比7∶1∶4∶1.5混合起来。为了掺杂,加入少量的Eu2O3或MnCO3,取代相应摩尔量的CaCO3。这相应于经验式Ca8-x-yEuxMnxMg(SiO4)4Cl2加0.5CaCl2
在将各个成分充分混合之后,在还原性气氛(H2/N2)中,在1000-1200℃下将该粉末加热1-4小时,使其反应以得上述的化合物。为了除去过量的CaCl2和其它能水溶的夹杂相,可采用充分脱离子的水再次洗涤该粉末。获得的荧光剂粉末在波长约400nm的短波区域激发时具有高量子效率(一般约70%)。
图1示出掺杂铕的粉末典型的激发光谱和发射光谱。加入的Eu2O3的量为0.03摩尔,即x=0.06。从该图可以看到,在300-470nm非常宽的波长范围内,主要是360-400nm范围内的有效激发十分清晰。在更大的波长下,由于Eu2+吸收带引起激发性能的下降。然而,测定的460nm下的量子效率仍可与在400nm或甚至更短波长(短到约340nm)下的量子效率相当。
发射光谱表明在约507nm具有最大的Eu2+发射带。这种发射眼睛看上去是绿色的。如果需要,共掺杂少量的锰,可使这种荧光剂的发射行为与眼睛的灵敏度更好地适配。
图2示出掺杂Eu的氯硅酸盐Ca8Mg(SiO4)4Cl2:Eu2+(简缩为CS:Eu)的另一个典型的实施方案。加入的Eu2O3量为0.2摩尔,即x=0.4。峰的波长为509nm,平均波长为522nm。色坐标是x=0.185,y=0.615。采用图2a中任选的单位,表示在400nm照射时的发射。此外,在图2b中还示出反射率(以%表示)。
为了与GaInN-芯片一起用于白色LED,作为实例,采用与在美国专利5,998,925中所述相似的结构。在图3中详细地示出用于白光的这种类型的光源结构。这种光源是一种InGaN型的半导体元件(芯片1),峰的发射波长为450nm,它具有第一和第二个电连接件2,3,并嵌在不透光的底外壳8中间隙9的区域内,连接件3中之一通过焊接导线14与芯片1连接。该间隙具有壁17,壁17用作芯片1蓝色主辐射的反射器。间隙9中充满封装化合物5,其主要成分是铸塑环氧树脂(80-90重量%)和荧光剂颜料6(<15重量%)。此外,其它少量的成分是甲基醚和一种高度分散的硅胶。
第二个实施方案的氯硅酸盐荧光剂(CS:Eu)与TbAG:Ce一起作为荧光剂颜料。(CS:Eu)与TbAG的混合比例是4∶6(重量比例)。这个实施方案的特征是特别高的色彩再现,其Ra=85。在图4中示出这个实施方案的发射光谱。
常规方法(BG)和根据本发明的方法(BGG)的直接对比,得到以下结果:所选的BG方法,是将发射蓝光的InGaN芯片(峰为450nm)与常规的YAG:Ce结合起来。所选的根据本发明的BGG方法,是将相同的LED与TbAG:Ce和CS:Eu结合起来。在每一种情况下,这都会导致在x=0.322,y=0.366的色品位置上的色温达到6000K。简单的BG方法色彩再现只达到Ra=72时,而BGG方法的色彩再现达到Ra=80。红色再现也有明显的改善,即从R9=-22到R9=10。在图5中示出BGG方法的发射光谱。
另一个优选的白色LED的实施方案,除了采用InGaN芯片(在450nm发射蓝色)以外,还采用上述的氯硅酸盐荧光剂(CS:Eu)与YAG:Ce组合。如从图6所看到的,这个实施方案的特征是,这二种荧光剂具有极其相似的温度衰减行为。在容许采用的范围内(达到约100℃),这二种荧光剂的温度衰减行为实际上是相同的,仅仅是略微与温度有关。为了与研究的混合柘榴石(Y0.33Gd0.63Ce0.04)Al5O12对比的其它柘榴石,具有明显较差的温度常数(在图6中,这种混合的柘榴石被称作(Y,Gd)AG:Ce)。因此,在这个实施方案中,在不同的温度条件下,能确保色品位置和其它照明数据特别稳定,这个实施方案包含高含量的Y(或采用Tb代替)作为RE(至少60摩尔%的RE晶格位置)。在图7中示出这个实施方案的发射光谱。它相应于色温8000K,和坐标为x=0.294,y=0.309的色品位置。色彩再现Ra=77。这二种荧光剂的混合比例为4.6∶1。
图8示出一个作为发光设备的表面照明灯具20。它包括公共底座21,立方形的外壳22通过粘接固定在底座上。其上面具有一个公共顶盖23。这个立方形的外壳具有一些凹坑,其中容纳单个的半导体元件24。它们是发射UV的LED,发射峰为360nm。采用一些转换层25,将其转换成白光,转换层配置在UV辐射可达到的所有表面上。这些表面包括外壳侧壁、顶盖、和底部的内表面。转换层25由三种荧光剂组成,在采用根据本发明的荧光剂时,这三种荧光剂能在黄色、绿色和蓝色光谱区发射。

Claims (10)

1.一种发射白光的照明设备,其具有至少一个作为光源的LED,该LED在300-470nm区域发出主辐射,采用暴露在LED主辐射中的荧光剂,将这种辐射部分或全部转换成长波辐射,这种设备的特征在于,至少借助一种发射绿色的荧光剂,和至少一种发射黄色的荧光剂进行转换,前者来源于Eu-活化的钙镁氯硅酸盐类,后者来源于Ce-活化的稀土柘榴石类。
2.权利要求1的发射白光的照明设备,其特征在于,发射绿光的荧光剂满足了经验式Ca8-x-yEuxMnyMg(SiO4)4Cl2,式中x=0.005至x=1.6,y=0至y=0.1(在每一种情况下,都包括截止值)。
3.权利要求1的发射白光的照明设备,其特征在于,发射黄光的荧光剂,是按照通式RE3(Al,Ga)5O12:Ce的稀土(RE)Y、Gd、Lu、La和/或Tb的柘榴石,特别是按照通式YAG:Ce或TbAG:Ce,式中RE=Y和/或Tb。
4.权利要求1的发射白光的照明设备,其特征在于,发射的主辐射在波长范围330-370nm,该主辐射照射到在蓝色区域(430-470nm)、绿色区域(490-525nm)、和黄色区域(545-590nm)有最大发射的三种荧光剂上。
5.权利要求1的发射白光的照明设备,其特征在于,发射的主辐射在蓝色波长范围430-470nm,如前述权利要求之一所述,该主蓝色辐射照射到在黄色区域(545-590nm)、和在绿色区域(490-525nm)有最大发射的二种荧光剂上。
6.权利要求1中所述的发射白光的发光转换LED,其特征在于,采用发射短波光的二极管,特别是基于Ga(In)N的二极管作为主辐射源。
7.权利要求1的发射白光的照明设备,其特征在于,在不另外采用锰的条件下,铕的比例为x=0.1至x=1.0。
8.权利要求1的发射白光的照明设备,其特征在于,这种照明设备是一种发光转换LED,其中荧光剂直接或间接地与芯片接触。
9.权利要求1的发射白光的照明设备,其特征在于,这种照明设备是一种LED阵列。
10.权利要求9的发射白光的照明设备,其特征在于,将至少一种荧光剂配置在一种光学装置上,该光学装置配置在LED阵列的前面。
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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100448004C (zh) * 2006-06-06 2008-12-31 任慰 白光二极管光源的荧光粉及其制造方法
US7479732B2 (en) 2003-03-13 2009-01-20 Osram Opto Semiconductors Gmbh Luminescence conversion of LED with phosphorescence effect, and use thereof and operational method associated therewith
US7531956B2 (en) 2004-04-07 2009-05-12 Lg Innotek Co., Ltd. Light emitting device and phosphor for the same
CN101019241B (zh) * 2004-08-04 2010-09-29 英特曼帝克司公司 用于白光发光二极管(led)的新颖磷光体系统
TWI408210B (zh) * 2007-05-17 2013-09-11 Nec Lighting Ltd 綠色發光螢光體、其製造方法以及使用該螢光體之發光元件
CN103682030A (zh) * 2012-09-07 2014-03-26 深圳市龙岗区横岗光台电子厂 Led 、led装置及led制作工艺
CN102132424B (zh) * 2008-05-23 2016-09-07 克利公司 固态照明部件
CN110352318A (zh) * 2017-02-27 2019-10-18 西铁城电子株式会社 半导体发光装置和照明装置

Families Citing this family (171)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100431398B1 (ko) * 1999-07-23 2004-05-14 파텐트-트로이한트-게젤샤프트 퓌어 엘렉트리쉐 글뤼람펜 엠베하 광원용 인광물질 및 해당 광원
CA2343909C (en) 1999-07-23 2013-04-02 Osram Opto Semiconductors Gmbh & Co. Ohg Arrangement of luminescent materials, wavelength-converting casting compound and light source
CA2317319A1 (en) 2000-03-14 2001-09-14 The Litebook Company Ltd Light therapy device
US20050073839A1 (en) * 2003-09-18 2005-04-07 The Litebook Company Ltd Light therapy device
DE10026435A1 (de) * 2000-05-29 2002-04-18 Osram Opto Semiconductors Gmbh Kalzium-Magnesium-Chlorosilikat-Leuchtstoff und seine Anwendung bei Lumineszenz-Konversions-LED
US20030015708A1 (en) * 2001-07-23 2003-01-23 Primit Parikh Gallium nitride based diodes with low forward voltage and low reverse current operation
DE20115914U1 (de) * 2001-09-27 2003-02-13 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH, 81543 München Beleuchtungseinheit mit mindestens einer LED als Lichtquelle
WO2003032984A1 (en) * 2001-10-19 2003-04-24 Ortho-Mcneil Pharmaceutical,Inc. 2-phenyl benzimidazoles and imidazo-[4,5]-pyridines as cdsi/chk2-inhibitors and adjuvants to chemotherapy or radiation therapy in the treatment of cancer
JP2003147351A (ja) * 2001-11-09 2003-05-21 Taiwan Lite On Electronics Inc 白色光光源の製作方法
WO2003069686A1 (fr) * 2002-02-15 2003-08-21 Mitsubishi Chemical Corporation Dispositif electroluminescent et dispositif d'eclairage faisant appel a ce dernier
JP4191937B2 (ja) * 2002-02-15 2008-12-03 株式会社日立製作所 白色光源及びそれを用いた画像表示装置
KR100457864B1 (ko) * 2002-02-23 2004-11-18 삼성전기주식회사 백색 발광 램프용 형광체.
AU2003221442A1 (en) * 2002-03-22 2003-10-08 Nichia Corporation Nitride phosphor and method for preparation thereof, and light emitting device
JP2003306674A (ja) 2002-04-15 2003-10-31 Sumitomo Chem Co Ltd 白色led用蛍光体とそれを用いた白色led
KR100554453B1 (ko) * 2002-08-21 2006-03-03 서울반도체 주식회사 백색 발광 소자
JP3498290B1 (ja) * 2002-12-19 2004-02-16 俊二 岸村 白色led照明装置
US20040142098A1 (en) * 2003-01-21 2004-07-22 Eastman Kodak Company Using compacted organic materials in making white light emitting oleds
US6885033B2 (en) * 2003-03-10 2005-04-26 Cree, Inc. Light emitting devices for light conversion and methods and semiconductor chips for fabricating the same
JP2006523245A (ja) * 2003-03-28 2006-10-12 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング 粒子または原材料上に被覆物を形成させる方法および属する製品
US7279832B2 (en) * 2003-04-01 2007-10-09 Innovalight, Inc. Phosphor materials and illumination devices made therefrom
US20040252488A1 (en) * 2003-04-01 2004-12-16 Innovalight Light-emitting ceiling tile
JP2004317891A (ja) * 2003-04-17 2004-11-11 Nec Saitama Ltd カメラ付き携帯型電子機器
KR20040092512A (ko) * 2003-04-24 2004-11-04 (주)그래픽테크노재팬 방열 기능을 갖는 반사판이 구비된 반도체 발광장치
DE10319091A1 (de) * 2003-04-28 2004-09-09 Siemens Ag Leuchtstoff zum Umwandeln einer Primärstrahlung in eine Sekundärstrahlung
US7884804B2 (en) * 2003-04-30 2011-02-08 Microsoft Corporation Keyboard with input-sensitive display device
US7005679B2 (en) 2003-05-01 2006-02-28 Cree, Inc. Multiple component solid state white light
US6869812B1 (en) * 2003-05-13 2005-03-22 Heng Liu High power AllnGaN based multi-chip light emitting diode
US7145125B2 (en) 2003-06-23 2006-12-05 Advanced Optical Technologies, Llc Integrating chamber cone light using LED sources
US7521667B2 (en) * 2003-06-23 2009-04-21 Advanced Optical Technologies, Llc Intelligent solid state lighting
US7088038B2 (en) * 2003-07-02 2006-08-08 Gelcore Llc Green phosphor for general illumination applications
US7026755B2 (en) * 2003-08-07 2006-04-11 General Electric Company Deep red phosphor for general illumination applications
CN100383988C (zh) * 2003-08-20 2008-04-23 刘行仁 白光发光二极管及其光转换用荧光体
JP2005093913A (ja) * 2003-09-19 2005-04-07 Nichia Chem Ind Ltd 発光装置
JP2005093912A (ja) * 2003-09-19 2005-04-07 Nichia Chem Ind Ltd 発光装置
EP1670069A4 (en) * 2003-09-29 2011-09-21 Panasonic Corp LINEAR LIGHT SOURCE AND MANUFACTURING METHOD AND SURFACE EMISSION ELEMENT
JP4834827B2 (ja) * 2003-10-03 2011-12-14 独立行政法人物質・材料研究機構 酸窒化物蛍光体
US7442326B2 (en) 2003-10-29 2008-10-28 Lumination Llc Red garnet phosphors for use in LEDs
US7094362B2 (en) 2003-10-29 2006-08-22 General Electric Company Garnet phosphor materials having enhanced spectral characteristics
US7252787B2 (en) 2003-10-29 2007-08-07 General Electric Company Garnet phosphor materials having enhanced spectral characteristics
DE10360546A1 (de) 2003-12-22 2005-07-14 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Leuchtstoff und Lichtquelle mit derartigem Leuchtstoff
TW200525779A (en) * 2004-01-27 2005-08-01 Super Nova Optoelectronics Corp White-like light emitting device and its manufacturing method
KR100605212B1 (ko) * 2004-04-07 2006-07-31 엘지이노텍 주식회사 형광체 및 이를 이용한 백색 발광다이오드
US20050236958A1 (en) * 2004-04-23 2005-10-27 Harvatek Corporation White light-emitting device
KR101157313B1 (ko) * 2004-04-27 2012-06-18 파나소닉 주식회사 형광체 조성물과 그 제조방법, 및 그 형광체 조성물을 이용한 발광 장치
TWI228841B (en) * 2004-04-29 2005-03-01 Lite On Technology Corp Luminescence method and apparatus for color temperature adjustable white light
US7534633B2 (en) * 2004-07-02 2009-05-19 Cree, Inc. LED with substrate modifications for enhanced light extraction and method of making same
WO2006005005A2 (en) * 2004-07-06 2006-01-12 Sarnoff Corporation Efficient, green-emitting phosphors, and combinations with red-emitting phosphors
US8017035B2 (en) * 2004-08-04 2011-09-13 Intematix Corporation Silicate-based yellow-green phosphors
DE102004038199A1 (de) * 2004-08-05 2006-03-16 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH LED mit niedriger Farbtemperatur
US7750352B2 (en) * 2004-08-10 2010-07-06 Pinion Technologies, Inc. Light strips for lighting and backlighting applications
KR100485673B1 (ko) * 2004-10-11 2005-04-27 씨엠에스테크놀로지(주) 백색 발광장치
KR100666265B1 (ko) * 2004-10-18 2007-01-09 엘지이노텍 주식회사 형광체 및 이를 이용한 발광소자
US20060097385A1 (en) * 2004-10-25 2006-05-11 Negley Gerald H Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same
US7564180B2 (en) * 2005-01-10 2009-07-21 Cree, Inc. Light emission device and method utilizing multiple emitters and multiple phosphors
US8125137B2 (en) 2005-01-10 2012-02-28 Cree, Inc. Multi-chip light emitting device lamps for providing high-CRI warm white light and light fixtures including the same
US7648649B2 (en) * 2005-02-02 2010-01-19 Lumination Llc Red line emitting phosphors for use in led applications
US7358542B2 (en) * 2005-02-02 2008-04-15 Lumination Llc Red emitting phosphor materials for use in LED and LCD applications
US20070114562A1 (en) * 2005-11-22 2007-05-24 Gelcore, Llc Red and yellow phosphor-converted LEDs for signal applications
US7497973B2 (en) 2005-02-02 2009-03-03 Lumination Llc Red line emitting phosphor materials for use in LED applications
US7274045B2 (en) 2005-03-17 2007-09-25 Lumination Llc Borate phosphor materials for use in lighting applications
TWI249867B (en) * 2005-03-24 2006-02-21 Lighthouse Technology Co Ltd Light-emitting diode package, cold cathode fluorescence lamp and photoluminescence material thereof
US7276183B2 (en) * 2005-03-25 2007-10-02 Sarnoff Corporation Metal silicate-silica-based polymorphous phosphors and lighting devices
US7329371B2 (en) 2005-04-19 2008-02-12 Lumination Llc Red phosphor for LED based lighting
US20060279196A1 (en) * 2005-06-02 2006-12-14 Wei-Jen Hsu White LED
KR100533922B1 (ko) * 2005-08-05 2005-12-06 알티전자 주식회사 황색 형광체 및 이를 이용한 백색 발광 장치
KR100704267B1 (ko) * 2005-10-17 2007-04-06 타이완 오아시스 테크놀러지 컴퍼니 리미티드 백색 다파장 발광 다이오드 및 그 제조 방법
US20070125984A1 (en) * 2005-12-01 2007-06-07 Sarnoff Corporation Phosphors protected against moisture and LED lighting devices
US8906262B2 (en) * 2005-12-02 2014-12-09 Lightscape Materials, Inc. Metal silicate halide phosphors and LED lighting devices using the same
BRPI0620413A2 (pt) * 2005-12-21 2011-11-08 Cree Led Lighting Solutions dispositivo de iluminação e método de iluminação
EP1963743B1 (en) * 2005-12-21 2016-09-07 Cree, Inc. Lighting device
BRPI0620397A2 (pt) * 2005-12-22 2011-11-16 Cree Led Lighting Solutions dispositivo de iluminação
US20070145879A1 (en) * 2005-12-22 2007-06-28 Abramov Vladimir S Light emitting halogen-silicate photophosphor compositions and systems
CN101385145B (zh) * 2006-01-05 2011-06-08 伊鲁米特克斯公司 用于引导来自led的光的分立光学装置
JP2007231250A (ja) 2006-02-02 2007-09-13 Nichia Chem Ind Ltd 蛍光体及びそれを用いた発光装置
JP2007227573A (ja) * 2006-02-22 2007-09-06 Harison Toshiba Lighting Corp 発光デバイス
CN101410479A (zh) * 2006-03-23 2009-04-15 皇家飞利浦电子股份有限公司 具有陶瓷石榴石材料的发光器件
US7821194B2 (en) * 2006-04-18 2010-10-26 Cree, Inc. Solid state lighting devices including light mixtures
US9084328B2 (en) 2006-12-01 2015-07-14 Cree, Inc. Lighting device and lighting method
WO2007123938A2 (en) 2006-04-18 2007-11-01 Cree Led Lighting Solutions, Inc. Lighting device and lighting method
US8513875B2 (en) 2006-04-18 2013-08-20 Cree, Inc. Lighting device and lighting method
BRPI0710461A2 (pt) 2006-04-20 2011-08-16 Cree Led Lighting Solutions dispositivo de iluminação e método de iluminação
JP4944948B2 (ja) 2006-05-05 2012-06-06 クリー インコーポレイテッド 照明装置
EP2027412B1 (en) * 2006-05-23 2018-07-04 Cree, Inc. Lighting device
JP2009539227A (ja) * 2006-05-31 2009-11-12 クリー エル イー ディー ライティング ソリューションズ インコーポレイテッド 照明装置、および照明方法
US9659493B2 (en) 2006-06-06 2017-05-23 R.D. Jones, Stop Experts, Inc. Traffic beacon
DE102006029203B9 (de) * 2006-06-26 2023-06-22 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Lichtemittierende Vorrichtung
KR101303179B1 (ko) * 2006-07-21 2013-09-09 삼성전자주식회사 백색 발광소자용 형광체 및 이를 포함한 백색 발광 소자
DE102007020782A1 (de) * 2006-09-27 2008-04-03 Osram Opto Semiconductors Gmbh Strahlungsemittierende Vorrichtung
US20090275266A1 (en) * 2006-10-02 2009-11-05 Illumitex, Inc. Optical device polishing
US8087960B2 (en) * 2006-10-02 2012-01-03 Illumitex, Inc. LED system and method
CN101605867B (zh) * 2006-10-03 2013-05-08 渲染材料公司 金属硅酸盐卤化物磷光体以及使用它们的led照明器件
US8029155B2 (en) * 2006-11-07 2011-10-04 Cree, Inc. Lighting device and lighting method
US7769066B2 (en) * 2006-11-15 2010-08-03 Cree, Inc. Laser diode and method for fabricating same
US9441793B2 (en) 2006-12-01 2016-09-13 Cree, Inc. High efficiency lighting device including one or more solid state light emitters, and method of lighting
CN101611259B (zh) 2006-12-07 2012-06-27 科锐公司 照明装置和照明方法
US7834367B2 (en) 2007-01-19 2010-11-16 Cree, Inc. Low voltage diode with reduced parasitic resistance and method for fabricating
US20080197378A1 (en) * 2007-02-20 2008-08-21 Hua-Shuang Kong Group III Nitride Diodes on Low Index Carrier Substrates
EP2122231B1 (en) * 2007-02-22 2014-10-01 Cree, Inc. Lighting devices, methods of lighting, light filters and methods of filtering light
US8203260B2 (en) * 2007-04-13 2012-06-19 Intematix Corporation Color temperature tunable white light source
US20080252609A1 (en) * 2007-04-16 2008-10-16 Yan-Zhi Lu Image display and touch input integration module
US7703943B2 (en) * 2007-05-07 2010-04-27 Intematix Corporation Color tunable light source
CN101711326B (zh) 2007-05-08 2012-12-05 科锐公司 照明装置和照明方法
EP2153113B1 (en) 2007-05-08 2016-01-06 Cree, Inc. Lighting device and lighting method
JP2010527510A (ja) 2007-05-08 2010-08-12 クリー エル イー ディー ライティング ソリューションズ インコーポレイテッド 照明デバイスおよび照明方法
JP5325208B2 (ja) 2007-05-08 2013-10-23 クリー インコーポレイテッド 照明デバイスおよび照明方法
CN101711325B (zh) 2007-05-08 2013-07-10 科锐公司 照明装置和照明方法
US10389736B2 (en) 2007-06-12 2019-08-20 Icontrol Networks, Inc. Communication protocols in integrated systems
TWI365546B (en) * 2007-06-29 2012-06-01 Ind Tech Res Inst Light emitting diode device and fabrication method thereof
TWI429731B (zh) * 2007-07-16 2014-03-11 Lumination Llc 由4價錳離子活化之發紅光錯合氟化磷光體
US20090039375A1 (en) * 2007-08-07 2009-02-12 Cree, Inc. Semiconductor light emitting devices with separated wavelength conversion materials and methods of forming the same
US7863635B2 (en) * 2007-08-07 2011-01-04 Cree, Inc. Semiconductor light emitting devices with applied wavelength conversion materials
US7591564B1 (en) * 2007-08-28 2009-09-22 Ball Bradley A Underwater lighting system
JP5122268B2 (ja) * 2007-08-30 2013-01-16 凸版印刷株式会社 液晶表示装置およびそれに用いるカラーフィルタ
US8384092B2 (en) * 2007-08-30 2013-02-26 Nichia Corporation Light emitting device
US8519437B2 (en) * 2007-09-14 2013-08-27 Cree, Inc. Polarization doping in nitride based diodes
DE102008012316B4 (de) * 2007-09-28 2023-02-02 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Halbleiterlichtquelle mit einer Primärstrahlungsquelle und einem Lumineszenzkonversionselement
US9012937B2 (en) * 2007-10-10 2015-04-21 Cree, Inc. Multiple conversion material light emitting diode package and method of fabricating same
EP2210036B1 (en) * 2007-10-10 2016-11-23 Cree, Inc. Lighting device and method of making
US8119028B2 (en) * 2007-11-14 2012-02-21 Cree, Inc. Cerium and europium doped single crystal phosphors
CN101878280B (zh) 2007-11-30 2013-05-01 日亚化学工业株式会社 荧光体及使用其的发光装置以及荧光体的制造方法
US8040041B2 (en) * 2008-01-21 2011-10-18 Nichia Corporation Light emitting apparatus
US20090189168A1 (en) * 2008-01-29 2009-07-30 Kai-Shon Tsai White Light Emitting Device
DE102008029191A1 (de) * 2008-01-31 2009-08-06 Osram Opto Semiconductors Gmbh Beleuchtungseinrichtung zur Hinterleuchtung eines Displays sowie ein Display mit einer solchen Beleuchtungseinrichtung
KR20100122485A (ko) * 2008-02-08 2010-11-22 일루미텍스, 인크. 발광체층 쉐이핑을 위한 시스템 및 방법
US9287469B2 (en) * 2008-05-02 2016-03-15 Cree, Inc. Encapsulation for phosphor-converted white light emitting diode
US8240875B2 (en) * 2008-06-25 2012-08-14 Cree, Inc. Solid state linear array modules for general illumination
KR101266205B1 (ko) 2008-07-08 2013-05-21 우시오덴키 가부시키가이샤 발광 장치 및 발광 장치의 제조 방법
JP2010027645A (ja) * 2008-07-15 2010-02-04 Ushio Inc 発光装置及び発光装置の製造方法
JP2010021202A (ja) * 2008-07-08 2010-01-28 Ushio Inc 発光装置
KR101266226B1 (ko) 2008-07-09 2013-05-21 우시오덴키 가부시키가이샤 발광 장치 및 발광 장치의 제조 방법
JP5301904B2 (ja) * 2008-07-09 2013-09-25 ウシオ電機株式会社 発光装置
DE102008047933A1 (de) 2008-09-19 2010-04-15 Osram Gesellschaft mit beschränkter Haftung Beleuchtungsvorrichtung mit einer Leuchtdiode
TW201034256A (en) * 2008-12-11 2010-09-16 Illumitex Inc Systems and methods for packaging light-emitting diode devices
KR20100070731A (ko) 2008-12-18 2010-06-28 삼성전자주식회사 할로실리케이트 형광체, 이를 포함하는 백색 발광 소자
JP5310087B2 (ja) * 2009-02-26 2013-10-09 日亜化学工業株式会社 蛍光体及びこれを用いた発光装置
KR101004713B1 (ko) * 2009-04-22 2011-01-04 주식회사 에피밸리 디스플레이의 디밍 제어방법
JP5326777B2 (ja) * 2009-04-27 2013-10-30 日亜化学工業株式会社 蛍光体及びその製造方法
US8921876B2 (en) * 2009-06-02 2014-12-30 Cree, Inc. Lighting devices with discrete lumiphor-bearing regions within or on a surface of remote elements
US8415692B2 (en) 2009-07-06 2013-04-09 Cree, Inc. LED packages with scattering particle regions
US8585253B2 (en) 2009-08-20 2013-11-19 Illumitex, Inc. System and method for color mixing lens array
US8449128B2 (en) * 2009-08-20 2013-05-28 Illumitex, Inc. System and method for a lens and phosphor layer
TWI361216B (en) * 2009-09-01 2012-04-01 Ind Tech Res Inst Phosphors, fabricating method thereof, and light emitting device employing the same
WO2011036614A2 (en) * 2009-09-24 2011-03-31 Koninklijke Philips Electronics N.V. Floor covering system comprising a lighting system
WO2011037877A1 (en) 2009-09-25 2011-03-31 Cree, Inc. Lighting device with low glare and high light level uniformity
US9435493B2 (en) 2009-10-27 2016-09-06 Cree, Inc. Hybrid reflector system for lighting device
RU2511030C2 (ru) * 2009-12-04 2014-04-10 Анатолий Васильевич Вишняков Композиционный люминесцирующий материал для твердотельных источников белого света
US8604461B2 (en) * 2009-12-16 2013-12-10 Cree, Inc. Semiconductor device structures with modulated doping and related methods
US8536615B1 (en) 2009-12-16 2013-09-17 Cree, Inc. Semiconductor device structures with modulated and delta doping and related methods
CN102141721B (zh) * 2010-02-01 2012-07-18 鸿富锦精密工业(深圳)有限公司 投影机
US9275979B2 (en) 2010-03-03 2016-03-01 Cree, Inc. Enhanced color rendering index emitter through phosphor separation
US8684559B2 (en) 2010-06-04 2014-04-01 Cree, Inc. Solid state light source emitting warm light with high CRI
US8304797B2 (en) 2010-07-29 2012-11-06 Osram Sylvania Inc. Light emitting diode light source having a ceramic substrate
US8829777B2 (en) * 2010-09-27 2014-09-09 Osram Sylvania Inc. Ceramic wavelength converter and LED light source containing same
WO2012043567A1 (ja) 2010-09-28 2012-04-05 三菱化学株式会社 蛍光体、およびそれを用いた発光装置
US8556469B2 (en) 2010-12-06 2013-10-15 Cree, Inc. High efficiency total internal reflection optic for solid state lighting luminaires
US11251164B2 (en) 2011-02-16 2022-02-15 Creeled, Inc. Multi-layer conversion material for down conversion in solid state lighting
CN104241262B (zh) 2013-06-14 2020-11-06 惠州科锐半导体照明有限公司 发光装置以及显示装置
LT6215B (lt) 2013-10-22 2015-08-25 Vilniaus Universitetas Fotobiologiškai draugiškas konversijos fosfore šviestukas
US10069046B2 (en) * 2013-11-13 2018-09-04 Lg Innotek Co., Ltd. Bluish green phosphor and light emitting device package including the same
JP2015188050A (ja) * 2014-03-12 2015-10-29 株式会社東芝 発光装置
DE102015206972A1 (de) * 2015-04-17 2016-10-20 Tridonic Jennersdorf Gmbh LED-Modul zur Abgabe von Weißlicht
US9871173B2 (en) 2015-06-18 2018-01-16 Cree, Inc. Light emitting devices having closely-spaced broad-spectrum and narrow-spectrum luminescent materials and related methods
US9735323B2 (en) 2015-06-30 2017-08-15 Nichia Corporation Light emitting device having a triple phosphor fluorescent member
JP6384468B2 (ja) 2015-12-22 2018-09-05 日亜化学工業株式会社 発光装置
EP3460860A4 (en) 2016-05-20 2020-02-12 Kabushiki Kaisha Toshiba SOURCE OF WHITE LIGHT
JP2019016632A (ja) 2017-07-04 2019-01-31 日亜化学工業株式会社 発光装置
JP6940764B2 (ja) 2017-09-28 2021-09-29 日亜化学工業株式会社 発光装置
JP7164800B2 (ja) 2017-09-28 2022-11-02 日亜化学工業株式会社 発光装置
US10541353B2 (en) 2017-11-10 2020-01-21 Cree, Inc. Light emitting devices including narrowband converters for outdoor lighting applications
JP6891797B2 (ja) * 2017-12-21 2021-06-18 日亜化学工業株式会社 ディスプレイ装置
BR112022018956A2 (pt) 2020-03-27 2022-12-06 Nichia Corp Dispositivo emissor de luz, e, aparelho de iluminação

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3875449A (en) * 1969-10-02 1975-04-01 U S Radium Corp Coated phosphors
US3602753A (en) * 1970-02-02 1971-08-31 Sylvania Electric Prod Cathode ray tube screen comprising a single phosphor system
US4405880A (en) * 1981-06-11 1983-09-20 North American Philips Consumer Electronics Corp. Data display CRT having a yellow-emitting screen
DE3248448A1 (de) * 1982-12-29 1984-07-05 Philips Patentverwaltung Gmbh, 2000 Hamburg Leuchtstoff fuer kathodenstrahlroehren
DE3669728D1 (de) * 1985-05-01 1990-04-26 Philips Corp Lumineszentes erdalkalimetallsilikat und ein solches silikat enthaltende niederdruckquecksilberdampflampe.
JPH0586364A (ja) * 1991-09-27 1993-04-06 Toshiba Lighting & Technol Corp 蛍光ランプ
KR100277050B1 (ko) * 1995-08-31 2001-01-15 이시즈까 가즈오 녹색-방출 인광물질 및 그를 사용하는 음극선관
DE19638667C2 (de) * 1996-09-20 2001-05-17 Osram Opto Semiconductors Gmbh Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
TW383508B (en) 1996-07-29 2000-03-01 Nichia Kagaku Kogyo Kk Light emitting device and display
JPH10163535A (ja) * 1996-11-27 1998-06-19 Kasei Optonix Co Ltd 白色発光素子
EP0907970B1 (de) * 1997-03-03 2007-11-07 Koninklijke Philips Electronics N.V. Weisse lumineszenzdiode
US6255670B1 (en) * 1998-02-06 2001-07-03 General Electric Company Phosphors for light generation from light emitting semiconductors
US6278135B1 (en) * 1998-02-06 2001-08-21 General Electric Company Green-light emitting phosphors and light sources using the same
US6294800B1 (en) * 1998-02-06 2001-09-25 General Electric Company Phosphors for white light generation from UV emitting diodes
WO2000057490A1 (de) * 1999-03-19 2000-09-28 Eurolight Illumination Technologies Gmbh Leuchte
KR20010080796A (ko) * 2000-01-07 2001-08-25 허영덕 백색광용 형광체 및 그 제조방법, 그리고 이를 이용한백색광 발생방법

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7479732B2 (en) 2003-03-13 2009-01-20 Osram Opto Semiconductors Gmbh Luminescence conversion of LED with phosphorescence effect, and use thereof and operational method associated therewith
CN100479204C (zh) * 2003-03-13 2009-04-15 奥斯兰姆奥普托半导体有限责任公司 具有磷光效应的荧光转化发光二极管及其应用
US7531956B2 (en) 2004-04-07 2009-05-12 Lg Innotek Co., Ltd. Light emitting device and phosphor for the same
CN1788361B (zh) * 2004-04-07 2013-02-06 Lg伊诺特有限公司 发光器件及其磷光体
CN101019241B (zh) * 2004-08-04 2010-09-29 英特曼帝克司公司 用于白光发光二极管(led)的新颖磷光体系统
CN100448004C (zh) * 2006-06-06 2008-12-31 任慰 白光二极管光源的荧光粉及其制造方法
TWI408210B (zh) * 2007-05-17 2013-09-11 Nec Lighting Ltd 綠色發光螢光體、其製造方法以及使用該螢光體之發光元件
CN102132424B (zh) * 2008-05-23 2016-09-07 克利公司 固态照明部件
CN103682030A (zh) * 2012-09-07 2014-03-26 深圳市龙岗区横岗光台电子厂 Led 、led装置及led制作工艺
CN103682030B (zh) * 2012-09-07 2017-05-31 深圳市龙岗区横岗光台电子厂 Led、led装置及led制作工艺
CN110352318A (zh) * 2017-02-27 2019-10-18 西铁城电子株式会社 半导体发光装置和照明装置
CN110352318B (zh) * 2017-02-27 2021-02-05 西铁城电子株式会社 半导体发光装置和照明装置

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