DE20108013U1 - Weiß emittierende Beleuchtungseinheit auf LED-Basis - Google Patents
Weiß emittierende Beleuchtungseinheit auf LED-BasisInfo
- Publication number
- DE20108013U1 DE20108013U1 DE20108013U DE20108013U DE20108013U1 DE 20108013 U1 DE20108013 U1 DE 20108013U1 DE 20108013 U DE20108013 U DE 20108013U DE 20108013 U DE20108013 U DE 20108013U DE 20108013 U1 DE20108013 U1 DE 20108013U1
- Authority
- DE
- Germany
- Prior art keywords
- lighting unit
- white
- emitting
- unit according
- radiation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000005855 radiation Effects 0.000 claims 9
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 4
- 238000006243 chemical reaction Methods 0.000 claims 3
- 238000004020 luminiscence type Methods 0.000 claims 2
- 229910052693 Europium Inorganic materials 0.000 claims 1
- 229910052688 Gadolinium Inorganic materials 0.000 claims 1
- 229910004283 SiO 4 Inorganic materials 0.000 claims 1
- VYZCLCPZAJLOBI-UHFFFAOYSA-N calcium magnesium chloro(trioxido)silane Chemical class [Mg+2].[Ca+2].[O-][Si]([O-])([O-])Cl VYZCLCPZAJLOBI-UHFFFAOYSA-N 0.000 claims 1
- OGPBJKLSAFTDLK-UHFFFAOYSA-N europium atom Chemical compound [Eu] OGPBJKLSAFTDLK-UHFFFAOYSA-N 0.000 claims 1
- 229910052733 gallium Inorganic materials 0.000 claims 1
- 239000002223 garnet Substances 0.000 claims 1
- 239000011777 magnesium Substances 0.000 claims 1
- 230000003287 optical effect Effects 0.000 claims 1
- 229910052761 rare earth metal Inorganic materials 0.000 claims 1
- 150000002910 rare earth metals Chemical class 0.000 claims 1
- 229910052727 yttrium Inorganic materials 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
- C09K11/7774—Aluminates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/77342—Silicates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Description
Claims (10)
Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE20108013U DE20108013U1 (de) | 2001-05-11 | 2001-05-11 | Weiß emittierende Beleuchtungseinheit auf LED-Basis |
JP2002500459A JP4695819B2 (ja) | 2000-05-29 | 2001-05-23 | Ledをベースとする白色発光照明ユニット |
DE50113755T DE50113755D1 (de) | 2000-05-29 | 2001-05-23 | Weiss emittierende beleuchtungseinheit auf led-basis |
KR1020027001040A KR100784573B1 (ko) | 2000-05-29 | 2001-05-23 | 발광다이오드에 기반을 둔 백색광을 방출하는 조명 기구 |
CA002380444A CA2380444A1 (en) | 2000-05-29 | 2001-05-23 | Led-based white-emitting illumination unit |
PCT/DE2001/001955 WO2001093342A1 (de) | 2000-05-29 | 2001-05-23 | Weiss emittierende beleuchtungseinheit auf led-basis |
CNB018014879A CN1203557C (zh) | 2000-05-29 | 2001-05-23 | 基于发光二极管的发射白光的照明设备 |
EP01943141A EP1206802B1 (de) | 2000-05-29 | 2001-05-23 | Weiss emittierende beleuchtungseinheit auf led-basis |
US10/031,578 US6504179B1 (en) | 2000-05-29 | 2001-05-23 | Led-based white-emitting illumination unit |
TW090112781A TW555832B (en) | 2000-05-29 | 2001-05-28 | White-emitting lighting-unit on LED-basis |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE20108013U DE20108013U1 (de) | 2001-05-11 | 2001-05-11 | Weiß emittierende Beleuchtungseinheit auf LED-Basis |
Publications (1)
Publication Number | Publication Date |
---|---|
DE20108013U1 true DE20108013U1 (de) | 2001-08-02 |
Family
ID=7956803
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE20108013U Expired - Lifetime DE20108013U1 (de) | 2000-05-29 | 2001-05-11 | Weiß emittierende Beleuchtungseinheit auf LED-Basis |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE20108013U1 (de) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6759804B2 (en) | 2001-09-27 | 2004-07-06 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Illumination device with at least one LED as light source |
WO2006012833A2 (de) * | 2004-08-05 | 2006-02-09 | Patent-Treuhand- Gesellschaft Für Elektrische Glühlampen Mbh | Lichtquelle mit niedriger farbtemperatur |
US7267786B2 (en) | 2003-12-22 | 2007-09-11 | Patent-Treuhand-Gesellschaft Fuer Elektrische Gluehlampen Mbh | Phosphor and light source comprising such a phosphor |
DE102008012316A1 (de) * | 2007-09-28 | 2009-04-02 | Osram Opto Semiconductors Gmbh | Halbleiterlichtquelle mit einer Primärstrahlungsquelle und einem Lumineszenzkonversionselement |
DE202009003105U1 (de) | 2009-03-09 | 2009-05-07 | Semperlux Aktiengesellschaft - Lichttechnische Werke - | Elektrisch betriebenes Austausch-Leuchtmittel zum Ersatz von Glasglühkörpern |
DE10233050B4 (de) * | 2002-07-19 | 2012-06-14 | Osram Opto Semiconductors Gmbh | Lichtquelle auf LED-Basis für die Erzeugung von Licht unter Ausnutzung des Farbmischprinzips |
US8256947B2 (en) | 2006-06-26 | 2012-09-04 | Osram Opto Semiconductors Gmbh | Light-emitting device |
US9523035B2 (en) | 2006-07-26 | 2016-12-20 | Grirem Advanced Materials Co., Ltd. | Silicon-containing phosphor for LED, its preparation and the light emitting devices using the same |
-
2001
- 2001-05-11 DE DE20108013U patent/DE20108013U1/de not_active Expired - Lifetime
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6759804B2 (en) | 2001-09-27 | 2004-07-06 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Illumination device with at least one LED as light source |
DE10233050B4 (de) * | 2002-07-19 | 2012-06-14 | Osram Opto Semiconductors Gmbh | Lichtquelle auf LED-Basis für die Erzeugung von Licht unter Ausnutzung des Farbmischprinzips |
US7267786B2 (en) | 2003-12-22 | 2007-09-11 | Patent-Treuhand-Gesellschaft Fuer Elektrische Gluehlampen Mbh | Phosphor and light source comprising such a phosphor |
WO2006012833A2 (de) * | 2004-08-05 | 2006-02-09 | Patent-Treuhand- Gesellschaft Für Elektrische Glühlampen Mbh | Lichtquelle mit niedriger farbtemperatur |
WO2006012833A3 (de) * | 2004-08-05 | 2006-06-01 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Lichtquelle mit niedriger farbtemperatur |
US8979318B2 (en) | 2004-08-05 | 2015-03-17 | Osram Opto Semiconductors Gmbh | Light source with a low color temperature |
US8256947B2 (en) | 2006-06-26 | 2012-09-04 | Osram Opto Semiconductors Gmbh | Light-emitting device |
US9523035B2 (en) | 2006-07-26 | 2016-12-20 | Grirem Advanced Materials Co., Ltd. | Silicon-containing phosphor for LED, its preparation and the light emitting devices using the same |
DE102008012316A1 (de) * | 2007-09-28 | 2009-04-02 | Osram Opto Semiconductors Gmbh | Halbleiterlichtquelle mit einer Primärstrahlungsquelle und einem Lumineszenzkonversionselement |
US8564185B2 (en) | 2007-09-28 | 2013-10-22 | Osram Opto Semiconductors Gmbh | Semiconductor light source having a primary radiation source and a luminescence conversion element |
DE102008012316B4 (de) | 2007-09-28 | 2023-02-02 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Halbleiterlichtquelle mit einer Primärstrahlungsquelle und einem Lumineszenzkonversionselement |
DE202009003105U1 (de) | 2009-03-09 | 2009-05-07 | Semperlux Aktiengesellschaft - Lichttechnische Werke - | Elektrisch betriebenes Austausch-Leuchtmittel zum Ersatz von Glasglühkörpern |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R207 | Utility model specification |
Effective date: 20010906 |
|
R081 | Change of applicant/patentee |
Owner name: OSRAM GESELLSCHAFT MIT BESCHRAENKTER HAFTUNG, DE Free format text: FORMER OWNER: PATENT-TREUHAND-GESELLSCHAFT FUE, OSRAM OPTO SEMICONDUCTORS GMBH, , DE Effective date: 20020930 Owner name: OSRAM OPTO SEMICONDUCTORS GMBH, DE Free format text: FORMER OWNER: PATENT-TREUHAND-GESELLSCHAFT FUE, OSRAM OPTO SEMICONDUCTORS GMBH, , DE Effective date: 20020930 |
|
R150 | Utility model maintained after payment of first maintenance fee after three years |
Effective date: 20040905 |
|
R151 | Utility model maintained after payment of second maintenance fee after six years |
Effective date: 20070803 |
|
R081 | Change of applicant/patentee |
Owner name: OSRAM GESELLSCHAFT MIT BESCHRAENKTER HAFTUNG, DE Free format text: FORMER OWNER: PATENT-TREUHAND-GESELLSCHAFT FUE, OSRAM OPTO SEMICONDUCTORS GMBH, , DE Effective date: 20080819 Owner name: OSRAM OPTO SEMICONDUCTORS GMBH, DE Free format text: FORMER OWNER: PATENT-TREUHAND-GESELLSCHAFT FUE, OSRAM OPTO SEMICONDUCTORS GMBH, , DE Effective date: 20080819 |
|
R158 | Lapse of ip right after 8 years |
Effective date: 20091201 |