EP1285467A1 - Weiss emittierende beleuchtungseinheit auf led-basis - Google Patents
Weiss emittierende beleuchtungseinheit auf led-basisInfo
- Publication number
- EP1285467A1 EP1285467A1 EP01943068A EP01943068A EP1285467A1 EP 1285467 A1 EP1285467 A1 EP 1285467A1 EP 01943068 A EP01943068 A EP 01943068A EP 01943068 A EP01943068 A EP 01943068A EP 1285467 A1 EP1285467 A1 EP 1285467A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- lighting unit
- white
- emitting
- led
- phosphors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/77342—Silicates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
- C09K11/7774—Aluminates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
Definitions
- SE rare earths
- a direct comparison between a conventional solution (BG) and a solution according to the invention (BGG) shows the following result: a blue-emitting InGaN chip (peak at 450 nm) together with conventional YAG: Ce was chosen as the BG solution.
- the emission spectrum of the BGG Solution is shown in Figure 5.
Abstract
Description
Claims
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10026435A DE10026435A1 (de) | 2000-05-29 | 2000-05-29 | Kalzium-Magnesium-Chlorosilikat-Leuchtstoff und seine Anwendung bei Lumineszenz-Konversions-LED |
DE10026435 | 2000-05-29 | ||
PCT/DE2001/001821 WO2001093341A1 (de) | 2000-05-29 | 2001-05-11 | Weiss emittierende beleuchtungseinheit auf led-basis |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1285467A1 true EP1285467A1 (de) | 2003-02-26 |
Family
ID=7643861
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP01943068A Withdrawn EP1285467A1 (de) | 2000-05-29 | 2001-05-11 | Weiss emittierende beleuchtungseinheit auf led-basis |
Country Status (9)
Country | Link |
---|---|
US (3) | US20030146690A1 (de) |
EP (1) | EP1285467A1 (de) |
JP (1) | JP5097999B2 (de) |
KR (1) | KR20030007742A (de) |
CN (1) | CN1432198A (de) |
CA (1) | CA2410668A1 (de) |
DE (1) | DE10026435A1 (de) |
TW (1) | TW554030B (de) |
WO (1) | WO2001093341A1 (de) |
Families Citing this family (85)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6596195B2 (en) * | 2001-06-01 | 2003-07-22 | General Electric Company | Broad-spectrum terbium-containing garnet phosphors and white-light sources incorporating the same |
DE20115914U1 (de) | 2001-09-27 | 2003-02-13 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Beleuchtungseinheit mit mindestens einer LED als Lichtquelle |
CA2464000C (en) * | 2001-10-19 | 2011-04-19 | Ortho-Mcneil Pharmaceutical, Inc. | 2-phenyl benzimidazoles and imidazo-[4,5]-pyridines as cdsi/chk2-inhibitors and adjuvants to chemotherapy or radiation therapy in the treatment of cancer |
US7800121B2 (en) * | 2002-08-30 | 2010-09-21 | Lumination Llc | Light emitting diode component |
US7224000B2 (en) | 2002-08-30 | 2007-05-29 | Lumination, Llc | Light emitting diode component |
US7224910B2 (en) * | 2002-10-25 | 2007-05-29 | Gennum Corporation | Direct attach optical receiver module and method of testing |
US6765237B1 (en) * | 2003-01-15 | 2004-07-20 | Gelcore, Llc | White light emitting device based on UV LED and phosphor blend |
DE102004003135A1 (de) | 2003-02-20 | 2004-09-02 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Beschichteter Leuchtstoff und lichtemittierende Vorrichtung mit derartigem Leuchtstoff |
CN1768122A (zh) * | 2003-03-28 | 2006-05-03 | 奥斯兰姆奥普托半导体有限责任公司 | 在颗粒或材料表面上制备涂层的方法及所得的产品 |
DE10319091A1 (de) * | 2003-04-28 | 2004-09-09 | Siemens Ag | Leuchtstoff zum Umwandeln einer Primärstrahlung in eine Sekundärstrahlung |
US7484860B2 (en) * | 2003-07-02 | 2009-02-03 | S.C. Johnson & Son, Inc. | Combination white light and colored LED light device with active ingredient emission |
US6933535B2 (en) * | 2003-10-31 | 2005-08-23 | Lumileds Lighting U.S., Llc | Light emitting devices with enhanced luminous efficiency |
KR100540848B1 (ko) * | 2004-01-02 | 2006-01-11 | 주식회사 메디아나전자 | 이중 몰드로 구성된 백색 발광다이오드 소자 및 그 제조방법 |
JP4534513B2 (ja) * | 2004-02-17 | 2010-09-01 | 豊田合成株式会社 | 発光装置 |
EP1571715A1 (de) * | 2004-03-04 | 2005-09-07 | Nan Ya Plastics Corporation | Verfahren zur Erzeugung weissen Lichts durch sekundäre Lichtanregung und entsprechendes Produkt |
KR100887489B1 (ko) * | 2004-04-27 | 2009-03-10 | 파나소닉 주식회사 | 형광체 조성물과 그 제조 방법, 및 그 형광체 조성물을이용한 발광 장치 |
US7837348B2 (en) | 2004-05-05 | 2010-11-23 | Rensselaer Polytechnic Institute | Lighting system using multiple colored light emitting sources and diffuser element |
KR101433343B1 (ko) * | 2004-05-05 | 2014-08-22 | 렌슬러 폴리테크닉 인스티튜트 | 고체-상태 에미터 및 하향-변환 재료를 이용한 고효율 광 소스 |
EP1769050B1 (de) | 2004-07-06 | 2013-01-16 | Lightscape Materials Inc. | Effiziente grünemittierende leuchtstoffe und kombinationen mit rotemittierenden leuchtstoffen |
KR100565075B1 (ko) | 2004-07-27 | 2006-03-30 | 삼성전자주식회사 | 조명유니트 및 이를 채용한 화상투사장치 |
DE102004038199A1 (de) * | 2004-08-05 | 2006-03-16 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | LED mit niedriger Farbtemperatur |
KR100666265B1 (ko) * | 2004-10-18 | 2007-01-09 | 엘지이노텍 주식회사 | 형광체 및 이를 이용한 발광소자 |
CN100472827C (zh) * | 2004-11-18 | 2009-03-25 | 皇家飞利浦电子股份有限公司 | 具有转换结构的发光设备 |
DE112006000694B4 (de) * | 2005-03-24 | 2013-10-17 | Kyocera Corp. | Gehäuse für Lichtemissionsvorrichtung, lichtemittierende Vorrichtung und Beleuchtungsvorrichtung |
US7276183B2 (en) * | 2005-03-25 | 2007-10-02 | Sarnoff Corporation | Metal silicate-silica-based polymorphous phosphors and lighting devices |
EP1726631A1 (de) * | 2005-05-23 | 2006-11-29 | SuperNova Optoelectronics Corporation | Weiss emittierende Beleuchtungseinrichtung |
CN101138104B (zh) * | 2005-06-23 | 2011-08-24 | 伦斯勒工业学院 | 利用短波长led和下变频材料产生白光的封装设计 |
US20070125984A1 (en) * | 2005-12-01 | 2007-06-07 | Sarnoff Corporation | Phosphors protected against moisture and LED lighting devices |
US8906262B2 (en) * | 2005-12-02 | 2014-12-09 | Lightscape Materials, Inc. | Metal silicate halide phosphors and LED lighting devices using the same |
KR20080106402A (ko) | 2006-01-05 | 2008-12-05 | 일루미텍스, 인크. | Led로부터 광을 유도하기 위한 개별 광학 디바이스 |
JP2007231250A (ja) * | 2006-02-02 | 2007-09-13 | Nichia Chem Ind Ltd | 蛍光体及びそれを用いた発光装置 |
US20070217184A1 (en) * | 2006-03-16 | 2007-09-20 | James Berry | LED light assembly |
US8282986B2 (en) * | 2006-05-18 | 2012-10-09 | Osram Sylvania, Inc. | Method of applying phosphor coatings |
DE102006029203B9 (de) | 2006-06-26 | 2023-06-22 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Lichtemittierende Vorrichtung |
US7703942B2 (en) * | 2006-08-31 | 2010-04-27 | Rensselaer Polytechnic Institute | High-efficient light engines using light emitting diodes |
US7842960B2 (en) * | 2006-09-06 | 2010-11-30 | Lumination Llc | Light emitting packages and methods of making same |
DE102007020782A1 (de) * | 2006-09-27 | 2008-04-03 | Osram Opto Semiconductors Gmbh | Strahlungsemittierende Vorrichtung |
EP2070123A2 (de) * | 2006-10-02 | 2009-06-17 | Illumitex, Inc. | Led-system und -verfahren |
US20090275266A1 (en) * | 2006-10-02 | 2009-11-05 | Illumitex, Inc. | Optical device polishing |
CN101605867B (zh) | 2006-10-03 | 2013-05-08 | 渲染材料公司 | 金属硅酸盐卤化物磷光体以及使用它们的led照明器件 |
US7889421B2 (en) * | 2006-11-17 | 2011-02-15 | Rensselaer Polytechnic Institute | High-power white LEDs and manufacturing method thereof |
US7968900B2 (en) * | 2007-01-19 | 2011-06-28 | Cree, Inc. | High performance LED package |
US8203260B2 (en) * | 2007-04-13 | 2012-06-19 | Intematix Corporation | Color temperature tunable white light source |
DE102007028120A1 (de) | 2007-06-19 | 2008-12-24 | Osram Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung eines Chlorosilikat-Leuchtstoffs und damit hergestellter Leuchtstoff |
US7905618B2 (en) * | 2007-07-19 | 2011-03-15 | Samsung Led Co., Ltd. | Backlight unit |
KR100951274B1 (ko) * | 2007-07-19 | 2010-05-06 | 삼성엘이디 주식회사 | 백라이트 유닛 |
CN104183688B (zh) * | 2007-07-26 | 2017-05-24 | 晶元光电股份有限公司 | 波长转换系统 |
WO2009069345A1 (ja) | 2007-11-30 | 2009-06-04 | Nichia Corporation | 蛍光体及びこれを用いた発光装置並びに蛍光体の製造方法 |
WO2009093427A1 (ja) * | 2008-01-21 | 2009-07-30 | Nichia Corporation | 発光装置 |
DE102008029191A1 (de) * | 2008-01-31 | 2009-08-06 | Osram Opto Semiconductors Gmbh | Beleuchtungseinrichtung zur Hinterleuchtung eines Displays sowie ein Display mit einer solchen Beleuchtungseinrichtung |
EP2240968A1 (de) * | 2008-02-08 | 2010-10-20 | Illumitex, Inc. | System und verfahren zur bildung einer emitterschicht |
US9339191B2 (en) * | 2008-07-08 | 2016-05-17 | Hitachi, Ltd. | Optical measurement apparatus |
US8525207B2 (en) * | 2008-09-16 | 2013-09-03 | Osram Sylvania Inc. | LED package using phosphor containing elements and light source containing same |
JPWO2010044239A1 (ja) | 2008-10-17 | 2012-03-15 | 株式会社小糸製作所 | 発光モジュール、発光モジュールの製造方法、および灯具ユニット |
KR101539246B1 (ko) * | 2008-11-10 | 2015-07-24 | 삼성전자 주식회사 | 광추출 효율이 향상된 발광 장치의 제조 방법 및 그 방법으로 제조된 발광 장치 |
TW201034256A (en) * | 2008-12-11 | 2010-09-16 | Illumitex Inc | Systems and methods for packaging light-emitting diode devices |
KR20100070731A (ko) * | 2008-12-18 | 2010-06-28 | 삼성전자주식회사 | 할로실리케이트 형광체, 이를 포함하는 백색 발광 소자 |
JP5326777B2 (ja) * | 2009-04-27 | 2013-10-30 | 日亜化学工業株式会社 | 蛍光体及びその製造方法 |
WO2011022399A1 (en) | 2009-08-17 | 2011-02-24 | Osram Sylvania Inc. | Phosphor blend for an led light source and led light source incorporating same |
US8592829B2 (en) * | 2009-08-17 | 2013-11-26 | Osram Sylvania Inc. | Phosphor blend for an LED light source and LED light source incorporating same |
US8585253B2 (en) | 2009-08-20 | 2013-11-19 | Illumitex, Inc. | System and method for color mixing lens array |
US8449128B2 (en) * | 2009-08-20 | 2013-05-28 | Illumitex, Inc. | System and method for a lens and phosphor layer |
US8593040B2 (en) | 2009-10-02 | 2013-11-26 | Ge Lighting Solutions Llc | LED lamp with surface area enhancing fins |
DE102010028949A1 (de) | 2010-05-12 | 2011-11-17 | Osram Gesellschaft mit beschränkter Haftung | Scheinwerfermodul |
DE102010031237A1 (de) | 2010-07-12 | 2012-01-12 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
US8304797B2 (en) | 2010-07-29 | 2012-11-06 | Osram Sylvania Inc. | Light emitting diode light source having a ceramic substrate |
US8829777B2 (en) * | 2010-09-27 | 2014-09-09 | Osram Sylvania Inc. | Ceramic wavelength converter and LED light source containing same |
CN102071014A (zh) * | 2010-11-29 | 2011-05-25 | 湖南信多利新材料有限公司 | 一种近紫外光激发单一基质白光荧光粉及其制备方法 |
US10522518B2 (en) | 2010-12-23 | 2019-12-31 | Bench Walk Lighting, LLC | Light source with tunable CRI |
US8579451B2 (en) | 2011-09-15 | 2013-11-12 | Osram Sylvania Inc. | LED lamp |
US9500355B2 (en) | 2012-05-04 | 2016-11-22 | GE Lighting Solutions, LLC | Lamp with light emitting elements surrounding active cooling device |
TWI518948B (zh) * | 2012-06-08 | 2016-01-21 | Unity Opto Technology Co Ltd | To enhance the luminous angle of the small size of the LED package to improve the structure |
WO2015072766A1 (ko) * | 2013-11-13 | 2015-05-21 | 엘지이노텍(주) | 청녹색 형광체, 이를 포함하는 발광 소자 패키지 및 조명 장치 |
US9735323B2 (en) | 2015-06-30 | 2017-08-15 | Nichia Corporation | Light emitting device having a triple phosphor fluorescent member |
JP6384468B2 (ja) | 2015-12-22 | 2018-09-05 | 日亜化学工業株式会社 | 発光装置 |
US10256374B2 (en) | 2016-03-04 | 2019-04-09 | Nichia Corporation | Light emitting device |
JP6460040B2 (ja) * | 2016-03-04 | 2019-01-30 | 日亜化学工業株式会社 | 発光装置 |
US10414976B2 (en) * | 2016-03-28 | 2019-09-17 | Nichia Corporation | Method for producing fluorescent material, fluorescent material, and light emitting device using the same |
EP3249703B1 (de) | 2016-05-26 | 2021-08-04 | Nichia Corporation | Lichtemittierende vorrichtung |
JP6477779B2 (ja) | 2016-05-26 | 2019-03-06 | 日亜化学工業株式会社 | 発光装置 |
JP7237815B2 (ja) * | 2017-02-27 | 2023-03-13 | シチズン電子株式会社 | 半導体発光装置及び照明装置 |
JP2019016632A (ja) | 2017-07-04 | 2019-01-31 | 日亜化学工業株式会社 | 発光装置 |
JP7164800B2 (ja) | 2017-09-28 | 2022-11-02 | 日亜化学工業株式会社 | 発光装置 |
JP6940764B2 (ja) | 2017-09-28 | 2021-09-29 | 日亜化学工業株式会社 | 発光装置 |
CN115315821A (zh) | 2020-03-27 | 2022-11-08 | 日亚化学工业株式会社 | 发光装置及具备该发光装置的灯具 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19638667C2 (de) * | 1996-09-20 | 2001-05-17 | Osram Opto Semiconductors Gmbh | Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
TW383508B (en) * | 1996-07-29 | 2000-03-01 | Nichia Kagaku Kogyo Kk | Light emitting device and display |
JP2000509912A (ja) * | 1997-03-03 | 2000-08-02 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 白色光発光ダイオード |
US6051925A (en) * | 1997-03-03 | 2000-04-18 | U.S. Philips Corporation | Diode-addressed color display with molecular phosphor |
US6294800B1 (en) * | 1998-02-06 | 2001-09-25 | General Electric Company | Phosphors for white light generation from UV emitting diodes |
US6255670B1 (en) * | 1998-02-06 | 2001-07-03 | General Electric Company | Phosphors for light generation from light emitting semiconductors |
WO2000057490A1 (de) * | 1999-03-19 | 2000-09-28 | Eurolight Illumination Technologies Gmbh | Leuchte |
EP1206802B1 (de) * | 2000-05-29 | 2008-03-19 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Weiss emittierende beleuchtungseinheit auf led-basis |
DE10147040A1 (de) * | 2001-09-25 | 2003-04-24 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Beleuchtungseinheit mit mindestens einer LED als Lichtquelle |
-
2000
- 2000-05-29 DE DE10026435A patent/DE10026435A1/de not_active Withdrawn
-
2001
- 2001-05-11 WO PCT/DE2001/001821 patent/WO2001093341A1/de not_active Application Discontinuation
- 2001-05-11 CA CA002410668A patent/CA2410668A1/en not_active Abandoned
- 2001-05-11 CN CN01810321A patent/CN1432198A/zh active Pending
- 2001-05-11 EP EP01943068A patent/EP1285467A1/de not_active Withdrawn
- 2001-05-11 US US10/296,847 patent/US20030146690A1/en not_active Abandoned
- 2001-05-11 KR KR1020027016158A patent/KR20030007742A/ko not_active Application Discontinuation
- 2001-05-11 JP JP2002500458A patent/JP5097999B2/ja not_active Expired - Lifetime
- 2001-05-28 TW TW090112779A patent/TW554030B/zh not_active IP Right Cessation
-
2004
- 2004-12-22 US US11/022,439 patent/US7002291B2/en not_active Expired - Lifetime
-
2005
- 2005-12-29 US US11/321,822 patent/US7183706B2/en not_active Expired - Lifetime
Non-Patent Citations (2)
Title |
---|
None * |
See also references of WO0193341A1 * |
Also Published As
Publication number | Publication date |
---|---|
WO2001093341A1 (de) | 2001-12-06 |
KR20030007742A (ko) | 2003-01-23 |
DE10026435A1 (de) | 2002-04-18 |
US20050104503A1 (en) | 2005-05-19 |
US20060103291A1 (en) | 2006-05-18 |
US20030146690A1 (en) | 2003-08-07 |
CA2410668A1 (en) | 2002-11-27 |
JP5097999B2 (ja) | 2012-12-12 |
US7183706B2 (en) | 2007-02-27 |
TW554030B (en) | 2003-09-21 |
CN1432198A (zh) | 2003-07-23 |
US7002291B2 (en) | 2006-02-21 |
JP2003535477A (ja) | 2003-11-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP1206802B1 (de) | Weiss emittierende beleuchtungseinheit auf led-basis | |
WO2001093341A1 (de) | Weiss emittierende beleuchtungseinheit auf led-basis | |
EP1116419B1 (de) | Leuchtstoffanordnung wellenlängenkonvertierende vergussmasse und lichtquelle | |
DE10241140A1 (de) | Beleuchtungseinheit mit mindestens einer LED als Lichtquelle | |
DE60307411T2 (de) | Fotolumineszentes material und leuchtdiode | |
DE10105800B4 (de) | Hocheffizienter Leuchtstoff und dessen Verwendung | |
EP2264762B1 (de) | Beleuchtungseinheit mit mindestens einer LED als Lichtquelle | |
EP1278250B1 (de) | Beleuchtungseinheit mit mindestens einer LED als Lichtquelle | |
DE102006007799B4 (de) | Licht emittierendes Halbleiterbauteil | |
EP1970970B1 (de) | Beleuchtungseinheit mit mindestens einer LED als Lichtquelle | |
DE10146719A1 (de) | Beleuchtungseinheit mit mindestens einer LED als Lichtquelle | |
DE102006016548B4 (de) | Blau bis Gelb-Orange emittierender Leuchtstoff und Lichtquelle mit derartigem Leuchtstoff | |
EP1095998B1 (de) | Leuchtstoff für Lichtquellen und zugehörige Lichtquelle | |
WO2006081803A1 (de) | Gelb emittierender leuchtstoff und lichtquelle mit derartigem leuchtstoff | |
DE102004038199A1 (de) | LED mit niedriger Farbtemperatur | |
DE102006036577A1 (de) | Rot emittierender Leuchtstoff und Lichtquelle mit derartigem Leuchtstoff | |
EP3305872A1 (de) | Konversions-led mit hoher effizienz | |
WO2010020495A1 (de) | Alpha-sialon-leuchtstoff | |
WO2007068592A1 (de) | Rot emittierender leuchtstoff und lichtquelle mit einem derartigen leuchtstoff | |
DE102004051395A1 (de) | Hocheffizienter stabiler Oxinitrid-Leuchtstoff | |
EP3077478B1 (de) | Leuchtstoffmischung, licht emittierendes halbleiterbauelement mit einer leuchtstoffmischung und strassenlaterne mit einer leuchtstoffmischung | |
DE102005037455A1 (de) | Weißlicht-Leuchtdiode | |
DE20218718U1 (de) | Leuchtstoff für Lumineszenzkonversions-LED | |
DE20122557U1 (de) | Beleuchtungseinheit mit mindestens einer LED als Lichtquelle |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20021011 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR |
|
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: OSTERTAG, MICHAEL Inventor name: JERMANN, FRANK Inventor name: ELLENS, ANDRIES |
|
17Q | First examination report despatched |
Effective date: 20061012 |
|
17Q | First examination report despatched |
Effective date: 20061012 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20070720 |