CN1328780C - 基板处理装置及基板处理方法 - Google Patents
基板处理装置及基板处理方法 Download PDFInfo
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- CN1328780C CN1328780C CNB2004100575931A CN200410057593A CN1328780C CN 1328780 C CN1328780 C CN 1328780C CN B2004100575931 A CNB2004100575931 A CN B2004100575931A CN 200410057593 A CN200410057593 A CN 200410057593A CN 1328780 C CN1328780 C CN 1328780C
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
Abstract
Description
Claims (16)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003314209 | 2003-09-05 | ||
JP2003314209A JP4080401B2 (ja) | 2003-09-05 | 2003-09-05 | 基板処理装置および基板処理方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1591816A CN1591816A (zh) | 2005-03-09 |
CN1328780C true CN1328780C (zh) | 2007-07-25 |
Family
ID=34414899
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100575931A Active CN1328780C (zh) | 2003-09-05 | 2004-08-23 | 基板处理装置及基板处理方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4080401B2 (zh) |
KR (1) | KR100591568B1 (zh) |
CN (1) | CN1328780C (zh) |
TW (1) | TWI244721B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101399175B (zh) * | 2007-09-25 | 2010-06-23 | 佳能安内华股份有限公司 | 显示基板制造方法 |
Families Citing this family (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7292428B2 (en) * | 2005-04-26 | 2007-11-06 | Applied Materials, Inc. | Electrostatic chuck with smart lift-pin mechanism for a plasma reactor |
CN100409424C (zh) * | 2005-04-26 | 2008-08-06 | 大日本网目版制造株式会社 | 基板处理装置 |
KR100943433B1 (ko) * | 2005-12-30 | 2010-02-19 | 주식회사 에이디피엔지니어링 | 기판 리프팅 모듈 및 리프팅 방법 |
KR100682739B1 (ko) * | 2005-08-12 | 2007-02-15 | 주식회사 아이피에스 | 기판 리프팅 장치 및 이를 이용한 기판 디척킹 방법 |
KR101186517B1 (ko) * | 2005-12-07 | 2012-10-08 | 티이씨 주식회사 | 글라스 승강장치 및 이를 이용한 액정표시장치의 제조방법 |
JP4827569B2 (ja) | 2006-03-23 | 2011-11-30 | 大日本スクリーン製造株式会社 | 基板支持構造とこれを用いた熱処理装置と基板支持構造に用いられるシート状物と基板支持構造の製造方法 |
JP5117052B2 (ja) * | 2006-04-26 | 2013-01-09 | 株式会社オーク製作所 | 露光装置および露光方法 |
CN101490835B (zh) * | 2006-06-13 | 2010-11-03 | 芝浦机械电子装置股份有限公司 | 吸附保持装置以及吸附保持方法 |
JP4795899B2 (ja) * | 2006-08-31 | 2011-10-19 | 東京エレクトロン株式会社 | 基板載置機構および基板受け渡し方法 |
JP4799325B2 (ja) * | 2006-09-05 | 2011-10-26 | 東京エレクトロン株式会社 | 基板受け渡し装置,基板処理装置,基板受け渡し方法 |
JP5009101B2 (ja) * | 2006-10-06 | 2012-08-22 | 株式会社荏原製作所 | 基板研磨装置 |
JP5044332B2 (ja) * | 2007-09-04 | 2012-10-10 | 大日本スクリーン製造株式会社 | 処理装置 |
TWI439351B (zh) * | 2008-09-29 | 2014-06-01 | Nitto Denko Corp | Adsorption tablets |
KR101004434B1 (ko) | 2008-11-26 | 2010-12-28 | 세메스 주식회사 | 기판 지지 유닛과, 이를 이용한 기판 연마 장치 및 방법 |
US20100184290A1 (en) * | 2009-01-16 | 2010-07-22 | Applied Materials, Inc. | Substrate support with gas introduction openings |
KR101011932B1 (ko) | 2009-06-25 | 2011-02-08 | 에이피시스템 주식회사 | 대형 기판 안착장치 |
WO2012108263A1 (ja) * | 2011-02-08 | 2012-08-16 | シャープ株式会社 | 基板保持装置および露光装置 |
CN102179881A (zh) * | 2011-04-01 | 2011-09-14 | 石金精密科技(深圳)有限公司 | 平面薄板吸附固定系统 |
US8593613B2 (en) * | 2011-09-13 | 2013-11-26 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | LCD exposure stage device and exposure system |
CN202257028U (zh) * | 2011-09-13 | 2012-05-30 | 深圳市华星光电技术有限公司 | Lcd曝光平台装置及曝光系统 |
KR101389005B1 (ko) * | 2011-12-20 | 2014-04-28 | 삼성디스플레이 주식회사 | 레이저 가공장치 및 그 제어방법 |
JP6057599B2 (ja) * | 2012-08-09 | 2017-01-11 | タツモ株式会社 | 吸着定盤及びその製造方法 |
JP5993710B2 (ja) * | 2012-10-26 | 2016-09-14 | 株式会社ディスコ | 洗浄装置と四角板状ワークの搬送方法 |
CN103172271B (zh) * | 2013-03-15 | 2015-11-25 | 京东方科技集团股份有限公司 | 一种涂布方法 |
JP2015115528A (ja) * | 2013-12-13 | 2015-06-22 | Ntn株式会社 | 基板処理装置および基板処理方法 |
CN103913902A (zh) * | 2014-03-25 | 2014-07-09 | 京东方科技集团股份有限公司 | 一种掩膜板组装装置及组装方法 |
JP6535206B2 (ja) * | 2014-05-08 | 2019-06-26 | 株式会社ブイ・テクノロジー | 露光方法及び露光装置 |
KR101929408B1 (ko) * | 2015-05-15 | 2019-03-14 | 주식회사 다원시스 | 유기 발광 소자의 인라인 제조 시스템과, 인라인 제조 방법과, 유기막 장치 및 도너 기판 세트 |
WO2017086339A1 (ja) * | 2015-11-16 | 2017-05-26 | 株式会社タカトリ | ワイヤソー装置並びに被加工物の加工方法及び加工装置 |
JP6709457B2 (ja) * | 2016-05-26 | 2020-06-17 | 株式会社タカトリ | 被加工部材の加工方法及び加工装置 |
JP6615643B2 (ja) * | 2016-03-03 | 2019-12-04 | 株式会社タカトリ | 被加工部材の加工方法及び加工装置 |
CN106915023A (zh) * | 2015-12-24 | 2017-07-04 | 中国科学院理化技术研究所 | 一种用于液体注模成型加工过程中除气固定的真空抽板 |
JP6591916B2 (ja) * | 2016-03-07 | 2019-10-16 | 株式会社ブイ・テクノロジー | マスク製造装置 |
KR102401363B1 (ko) * | 2017-10-30 | 2022-05-24 | 세메스 주식회사 | 반도체 패키지들을 진공 흡착하기 위한 진공 테이블 |
JP6986930B2 (ja) | 2017-11-07 | 2021-12-22 | 株式会社荏原製作所 | 基板研磨装置および研磨方法 |
CN109759721A (zh) * | 2018-12-28 | 2019-05-17 | 武汉华星光电技术有限公司 | 切割设备及切割方法 |
DE102019107477B4 (de) * | 2019-03-22 | 2021-03-04 | Homag Gmbh | Konsole, Spannmittel und Unterdruckspanneinrichtung |
TWI822993B (zh) * | 2019-05-08 | 2023-11-21 | 日商尼康股份有限公司 | 基板貼合裝置及基板貼合方法 |
CN111158218A (zh) * | 2020-01-03 | 2020-05-15 | Tcl华星光电技术有限公司 | 曝光平台装置及曝光系统 |
JP7438018B2 (ja) | 2020-05-11 | 2024-02-26 | 東京エレクトロン株式会社 | 基板載置方法及び基板載置機構 |
CN111817497B (zh) * | 2020-07-10 | 2022-01-21 | 深圳市汇顶科技股份有限公司 | 控制装置和运动机构 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06333799A (ja) * | 1993-05-21 | 1994-12-02 | Toshiba Corp | 半導体製造装置 |
JPH1064982A (ja) * | 1996-08-14 | 1998-03-06 | Dainippon Screen Mfg Co Ltd | 基板保持機構及び基板処理装置 |
JPH1086085A (ja) * | 1996-09-19 | 1998-04-07 | Dainippon Screen Mfg Co Ltd | 基板吸着装置および基板吸着方法 |
JPH11265927A (ja) * | 1998-03-17 | 1999-09-28 | Matsushita Electric Ind Co Ltd | チップの突き上げ装置 |
JP2002313902A (ja) * | 2001-04-18 | 2002-10-25 | Canon Inc | 静電チャック、該静電チャックから基板を離脱する方法 |
-
2003
- 2003-09-05 JP JP2003314209A patent/JP4080401B2/ja not_active Expired - Lifetime
-
2004
- 2004-07-21 TW TW093121762A patent/TWI244721B/zh active
- 2004-08-23 CN CNB2004100575931A patent/CN1328780C/zh active Active
- 2004-09-02 KR KR1020040069809A patent/KR100591568B1/ko active IP Right Grant
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06333799A (ja) * | 1993-05-21 | 1994-12-02 | Toshiba Corp | 半導体製造装置 |
JPH1064982A (ja) * | 1996-08-14 | 1998-03-06 | Dainippon Screen Mfg Co Ltd | 基板保持機構及び基板処理装置 |
JPH1086085A (ja) * | 1996-09-19 | 1998-04-07 | Dainippon Screen Mfg Co Ltd | 基板吸着装置および基板吸着方法 |
JPH11265927A (ja) * | 1998-03-17 | 1999-09-28 | Matsushita Electric Ind Co Ltd | チップの突き上げ装置 |
JP2002313902A (ja) * | 2001-04-18 | 2002-10-25 | Canon Inc | 静電チャック、該静電チャックから基板を離脱する方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101399175B (zh) * | 2007-09-25 | 2010-06-23 | 佳能安内华股份有限公司 | 显示基板制造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2005085881A (ja) | 2005-03-31 |
JP4080401B2 (ja) | 2008-04-23 |
KR20050024250A (ko) | 2005-03-10 |
KR100591568B1 (ko) | 2006-06-19 |
TW200518256A (en) | 2005-06-01 |
CN1591816A (zh) | 2005-03-09 |
TWI244721B (en) | 2005-12-01 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: DAINIPPON SCREEN MFG. CO., LTD. Free format text: FORMER NAME: DAINIPPON MESH PLATE MFR. CO., LTD. Owner name: SCREEN GROUP CO., LTD. Free format text: FORMER NAME: DAINIPPON SCREEN MFG. CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Kyoto City, Kyoto, Japan Patentee after: Skilling Group Address before: Kyoto City, Kyoto, Japan Patentee before: DAINIPPON SCREEN MFG Co.,Ltd. Address after: Kyoto City, Kyoto, Japan Patentee after: DAINIPPON SCREEN MFG Co.,Ltd. Address before: Kyoto City, Kyoto, Japan Patentee before: Dainippon Screen Mfg. Co.,Ltd. |