TW200518256A - Substrate processing apparatus and substrate processing method - Google Patents

Substrate processing apparatus and substrate processing method

Info

Publication number
TW200518256A
TW200518256A TW093121762A TW93121762A TW200518256A TW 200518256 A TW200518256 A TW 200518256A TW 093121762 A TW093121762 A TW 093121762A TW 93121762 A TW93121762 A TW 93121762A TW 200518256 A TW200518256 A TW 200518256A
Authority
TW
Taiwan
Prior art keywords
substrate
substrate processing
attract
angular
holding surface
Prior art date
Application number
TW093121762A
Other languages
Chinese (zh)
Other versions
TWI244721B (en
Inventor
Yoshinori Takagi
Hiroki Mizuno
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW200518256A publication Critical patent/TW200518256A/en
Application granted granted Critical
Publication of TWI244721B publication Critical patent/TWI244721B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor

Abstract

The present invention provides a substrate processing apparatus which can satisfactorily attract a substrate to its substrate-placing part even when the size of the substrate is increased and, at the same time, from which the substrate attracted to the substrate-placing section can be removed satisfactorily. A plurality of adsorption grooves 75 formed on the holding surface of the substrate treating device in a grid-like state are connected to each other at grid points 76. A part of the grid points 76 communicates with the suction holes 72. The suction holes 72 are connected to a vacuum pump in communicating states through piping. End-section lifter pins 71a and central-part lifter pins 71b are independently provided in vertically movable states. Consequently, (1) the substrate treating device can attract the whole bottom surface of an angular substrate W even when the device does not have many attraction holes in the holding surface, and, (2) it can attract the angular substrate W onto the holding surface from the vicinity of the central part of the substrate W to the end section of the angular substrate W.
TW093121762A 2003-09-05 2004-07-21 Substrate processing apparatus and substrate processing method TWI244721B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003314209A JP4080401B2 (en) 2003-09-05 2003-09-05 Substrate processing apparatus and substrate processing method

Publications (2)

Publication Number Publication Date
TW200518256A true TW200518256A (en) 2005-06-01
TWI244721B TWI244721B (en) 2005-12-01

Family

ID=34414899

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093121762A TWI244721B (en) 2003-09-05 2004-07-21 Substrate processing apparatus and substrate processing method

Country Status (4)

Country Link
JP (1) JP4080401B2 (en)
KR (1) KR100591568B1 (en)
CN (1) CN1328780C (en)
TW (1) TWI244721B (en)

Cited By (1)

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EP3479958A1 (en) * 2017-11-07 2019-05-08 Ebara Corporation Substrate polishing device and polishing method

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KR100943433B1 (en) * 2005-12-30 2010-02-19 주식회사 에이디피엔지니어링 Method Thereof Lifting and Glass Lifting Modules
KR100682739B1 (en) * 2005-08-12 2007-02-15 주식회사 아이피에스 Substrate lifting apparatus and method for dechucking substrate using the same
KR101186517B1 (en) * 2005-12-07 2012-10-08 티이씨 주식회사 Up-down apparatus and method of fabricating liquid crystal display device using the same
JP4707593B2 (en) 2006-03-23 2011-06-22 大日本スクリーン製造株式会社 Heat treatment apparatus and substrate adsorption method
JP5117052B2 (en) * 2006-04-26 2013-01-09 株式会社オーク製作所 Exposure apparatus and exposure method
TW200817758A (en) * 2006-06-13 2008-04-16 Shibaura Mechatronics Corp Sticking and holding apparatus and sticking and holding method thereof
JP4795899B2 (en) * 2006-08-31 2011-10-19 東京エレクトロン株式会社 Substrate mounting mechanism and substrate delivery method
JP4799325B2 (en) * 2006-09-05 2011-10-26 東京エレクトロン株式会社 Substrate delivery apparatus, substrate processing apparatus, and substrate delivery method
JP5009101B2 (en) * 2006-10-06 2012-08-22 株式会社荏原製作所 Substrate polishing equipment
JP5044332B2 (en) * 2007-09-04 2012-10-10 大日本スクリーン製造株式会社 Processing equipment
JP4469006B2 (en) * 2007-09-25 2010-05-26 キヤノンアネルバ株式会社 Manufacturing method of display substrate
TWI439351B (en) * 2008-09-29 2014-06-01 Nitto Denko Corp Adsorption tablets
KR101004434B1 (en) 2008-11-26 2010-12-28 세메스 주식회사 Substrate supporting unit, and apparatus and method for polishing substrate using the same
US20100184290A1 (en) 2009-01-16 2010-07-22 Applied Materials, Inc. Substrate support with gas introduction openings
KR101011932B1 (en) 2009-06-25 2011-02-08 에이피시스템 주식회사 Apparatus for holding large substrate
WO2012108263A1 (en) * 2011-02-08 2012-08-16 シャープ株式会社 Substrate holding device and exposure device
CN102179881A (en) * 2011-04-01 2011-09-14 石金精密科技（深圳）有限公司 System for adsorbing and fixing plane thin plate
US8593613B2 (en) * 2011-09-13 2013-11-26 Shenzhen China Star Optoelectronics Technology Co., Ltd. LCD exposure stage device and exposure system
CN202257028U (en) * 2011-09-13 2012-05-30 深圳市华星光电技术有限公司 Lcd exposure platform device and exposure system
KR101389005B1 (en) * 2011-12-20 2014-04-28 삼성디스플레이 주식회사 Laser processing apparatus and control method thereof
JP6057599B2 (en) * 2012-08-09 2017-01-11 タツモ株式会社 Adsorption surface plate and manufacturing method thereof
JP5993710B2 (en) * 2012-10-26 2016-09-14 株式会社ディスコ Cleaning device and square plate work transfer method
CN103172271B (en) * 2013-03-15 2015-11-25 京东方科技集团股份有限公司 A kind of coating process
JP2015115528A (en) * 2013-12-13 2015-06-22 Ntn株式会社 Substrate processing device and substrate processing method
CN103913902A (en) * 2014-03-25 2014-07-09 京东方科技集团股份有限公司 Mask assembly device and mask assembly method
JP6535206B2 (en) * 2014-05-08 2019-06-26 株式会社ブイ・テクノロジー Exposure method and exposure apparatus
KR101958397B1 (en) * 2015-05-15 2019-03-15 주식회사 다원시스 An apparatus, method for depositing organic layer and an organic layer device
JP6709457B2 (en) * 2016-05-26 2020-06-17 株式会社タカトリ Processing method and processing apparatus for workpiece
JP6615643B2 (en) * 2016-03-03 2019-12-04 株式会社タカトリ Processing method and processing apparatus for workpiece
WO2017086339A1 (en) * 2015-11-16 2017-05-26 株式会社タカトリ Wire saw device, and processing method and processing device for workpiece
CN106915023A (en) * 2015-12-24 2017-07-04 中国科学院理化技术研究所 The vacuum pumping board that degasification is fixed in a kind of molding process for Liquid Injection
JP6591916B2 (en) * 2016-03-07 2019-10-16 株式会社ブイ・テクノロジー Mask manufacturing equipment
KR102401363B1 (en) * 2017-10-30 2022-05-24 세메스 주식회사 Vacuum table for vacuum-adsorbing semiconductor packages
CN109759721A (en) * 2018-12-28 2019-05-17 武汉华星光电技术有限公司 Cutting equipment and cutting method
DE102019107477B4 (en) * 2019-03-22 2021-03-04 Homag Gmbh Console, clamping device and vacuum clamping device
TWI822993B (en) * 2019-05-08 2023-11-21 日商尼康股份有限公司 Substrate bonding device and substrate bonding method
CN111158218A (en) * 2020-01-03 2020-05-15 Tcl华星光电技术有限公司 Exposure platform device and exposure system
JP7438018B2 (en) 2020-05-11 2024-02-26 東京エレクトロン株式会社 Substrate mounting method and substrate mounting mechanism
CN111817497B (en) * 2020-07-10 2022-01-21 深圳市汇顶科技股份有限公司 Control device and movement mechanism

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JPH06333799A (en) * 1993-05-21 1994-12-02 Toshiba Corp Semiconductor manufacturing device
JP3881062B2 (en) * 1996-08-14 2007-02-14 大日本スクリーン製造株式会社 Substrate holding mechanism and substrate processing apparatus
JPH1086085A (en) * 1996-09-19 1998-04-07 Dainippon Screen Mfg Co Ltd Substrate adsorption device and method
JP3509538B2 (en) * 1998-03-17 2004-03-22 松下電器産業株式会社 Chip pushing device
JP2002313902A (en) * 2001-04-18 2002-10-25 Canon Inc Electrostatic chuck and method of dismounting substrate therefrom

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3479958A1 (en) * 2017-11-07 2019-05-08 Ebara Corporation Substrate polishing device and polishing method
US11331766B2 (en) 2017-11-07 2022-05-17 Ebara Corporation Substrate polishing device and polishing method

Also Published As

Publication number Publication date
KR20050024250A (en) 2005-03-10
KR100591568B1 (en) 2006-06-19
JP2005085881A (en) 2005-03-31
JP4080401B2 (en) 2008-04-23
TWI244721B (en) 2005-12-01
CN1591816A (en) 2005-03-09
CN1328780C (en) 2007-07-25

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