CN1319171C - 具有改进的静电放电耐压的半导体装置 - Google Patents
具有改进的静电放电耐压的半导体装置 Download PDFInfo
- Publication number
- CN1319171C CN1319171C CNB028027817A CN02802781A CN1319171C CN 1319171 C CN1319171 C CN 1319171C CN B028027817 A CNB028027817 A CN B028027817A CN 02802781 A CN02802781 A CN 02802781A CN 1319171 C CN1319171 C CN 1319171C
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- Prior art keywords
- diffusion region
- protection circuit
- semiconductor substrate
- electrically connected
- esd protection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 101
- 238000009792 diffusion process Methods 0.000 claims description 97
- 239000000758 substrate Substances 0.000 claims description 49
- 239000002184 metal Substances 0.000 claims description 24
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 19
- 239000011248 coating agent Substances 0.000 claims description 13
- 238000000576 coating method Methods 0.000 claims description 13
- 230000003068 static effect Effects 0.000 claims description 13
- 230000015572 biosynthetic process Effects 0.000 claims description 7
- 230000005669 field effect Effects 0.000 claims description 2
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 claims 1
- 230000001681 protective effect Effects 0.000 abstract description 7
- 230000002093 peripheral effect Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 238000004088 simulation Methods 0.000 description 7
- 101100489713 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) GND1 gene Proteins 0.000 description 3
- 101100489717 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) GND2 gene Proteins 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- FGRBYDKOBBBPOI-UHFFFAOYSA-N 10,10-dioxo-2-[4-(N-phenylanilino)phenyl]thioxanthen-9-one Chemical compound O=C1c2ccccc2S(=O)(=O)c2ccc(cc12)-c1ccc(cc1)N(c1ccccc1)c1ccccc1 FGRBYDKOBBBPOI-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
- H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
- H01L27/0266—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using field effect transistors as protective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
- H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Integrated Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Abstract
Description
Claims (7)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP214111/2001 | 2001-07-13 | ||
JP2001214111A JP2003031669A (ja) | 2001-07-13 | 2001-07-13 | 半導体装置 |
JP214111/01 | 2001-07-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1473362A CN1473362A (zh) | 2004-02-04 |
CN1319171C true CN1319171C (zh) | 2007-05-30 |
Family
ID=19048985
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB028027817A Expired - Fee Related CN1319171C (zh) | 2001-07-13 | 2002-07-12 | 具有改进的静电放电耐压的半导体装置 |
Country Status (6)
Country | Link |
---|---|
US (4) | US6744100B2 (zh) |
EP (1) | EP1325519B1 (zh) |
JP (1) | JP2003031669A (zh) |
CN (1) | CN1319171C (zh) |
DE (1) | DE60227040D1 (zh) |
WO (1) | WO2003007380A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101888085B (zh) * | 2009-05-11 | 2012-11-28 | 晶致半导体股份有限公司 | 具有esd的马达控制芯片 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003031669A (ja) * | 2001-07-13 | 2003-01-31 | Ricoh Co Ltd | 半導体装置 |
EP1432035B1 (en) * | 2002-12-20 | 2018-07-25 | IMEC vzw | Device for electrostatic discharge protection |
JP5008840B2 (ja) * | 2004-07-02 | 2012-08-22 | ローム株式会社 | 半導体装置 |
TWI271851B (en) * | 2005-07-15 | 2007-01-21 | Silicon Integrated Sys Corp | Seal-ring structure of electrostatic discharge circuitry |
US7940499B2 (en) * | 2006-09-15 | 2011-05-10 | Semiconductor Components Industries, Llc | Multi-pad shared current dissipation with heterogenic current protection structures |
JP5505499B2 (ja) * | 2010-06-04 | 2014-05-28 | 富士電機株式会社 | 半導体装置および駆動回路 |
KR101161743B1 (ko) * | 2010-12-29 | 2012-07-02 | 에스케이하이닉스 주식회사 | 플라즈마 유발 손상 방지 반도체 장치 및 그 레이아웃 |
JP2013030573A (ja) | 2011-07-28 | 2013-02-07 | Elpida Memory Inc | 半導体装置 |
US8786021B2 (en) * | 2012-09-04 | 2014-07-22 | Macronix International Co., Ltd. | Semiconductor structure having an active device and method for manufacturing and manipulating the same |
EP3312875A4 (en) * | 2015-06-19 | 2019-01-23 | Renesas Electronics Corporation | SEMICONDUCTOR DEVICE |
CN108022911A (zh) * | 2016-10-31 | 2018-05-11 | 深圳市中兴微电子技术有限公司 | 一种倒装芯片封装的片上系统 |
CN115825705B (zh) * | 2023-02-15 | 2023-05-09 | 芯动微电子科技(珠海)有限公司 | 一种esd事件检测电路和检测方法 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US473182A (en) * | 1892-04-19 | Packing for pistons | ||
US4994874A (en) * | 1988-10-28 | 1991-02-19 | Kabushiki Kaisha Toshiba | Input protection circuit for semiconductor integrated circuit device |
GB2259606A (en) * | 1991-09-16 | 1993-03-17 | Samsung Electronics Co Ltd | Electrostatic discharge protection in a semiconductor memory |
JPH06112422A (ja) * | 1992-09-30 | 1994-04-22 | Nec Corp | 半導体集積回路装置 |
JPH11121750A (ja) * | 1997-10-09 | 1999-04-30 | Mitsubishi Electric Corp | 半導体装置 |
US5909046A (en) * | 1997-03-26 | 1999-06-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor integrated circuit device having stable input protection circuit |
CN1256516A (zh) * | 1998-11-30 | 2000-06-14 | 摩托罗拉公司 | 在静电放电期间减少寄生双极效应的电路和方法 |
JP2000164807A (ja) * | 1998-11-25 | 2000-06-16 | Matsushita Electric Ind Co Ltd | 半導体装置 |
JP2001044374A (ja) * | 1999-08-03 | 2001-02-16 | Hitachi Ltd | 外部端子保護回路および半導体集積回路 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4996626A (en) * | 1988-10-14 | 1991-02-26 | National Semiconductor Corp. | Resistorless electrostatic discharge protection device for high speed integrated circuits |
JPH061802B2 (ja) * | 1989-03-14 | 1994-01-05 | 株式会社東芝 | 半導体装置 |
JP3028855B2 (ja) * | 1991-02-14 | 2000-04-04 | 株式会社東芝 | 半導体集積回路装置 |
JP2953192B2 (ja) * | 1991-05-29 | 1999-09-27 | 日本電気株式会社 | 半導体集積回路 |
JP3010911B2 (ja) * | 1992-07-01 | 2000-02-21 | 日本電気株式会社 | 半導体装置 |
JPH0837299A (ja) | 1994-07-21 | 1996-02-06 | Sony Corp | 半導体集積回路の保護回路 |
JP3288545B2 (ja) | 1995-02-22 | 2002-06-04 | 川崎マイクロエレクトロニクス株式会社 | 半導体装置 |
DE59510495D1 (de) * | 1995-04-06 | 2003-01-16 | Infineon Technologies Ag | Integrierte Halbleiterschaltung mit einem Schutzmittel |
US5637900A (en) | 1995-04-06 | 1997-06-10 | Industrial Technology Research Institute | Latchup-free fully-protected CMOS on-chip ESD protection circuit |
KR100211539B1 (ko) | 1995-12-29 | 1999-08-02 | 김영환 | 반도체소자의 정전기방전 보호장치 및 그 제조방법 |
JP3161508B2 (ja) * | 1996-07-25 | 2001-04-25 | 日本電気株式会社 | 半導体装置 |
US6078068A (en) * | 1998-07-15 | 2000-06-20 | Adaptec, Inc. | Electrostatic discharge protection bus/die edge seal |
JP2000208718A (ja) * | 1999-01-19 | 2000-07-28 | Matsushita Electric Ind Co Ltd | 半導体装置 |
US6455898B1 (en) * | 1999-03-15 | 2002-09-24 | Macronix International Co., Ltd. | Electrostatic discharge input protection for reducing input resistance |
US6678133B2 (en) * | 2001-03-09 | 2004-01-13 | Micron Technology, Inc. | Electrostatic discharge protection with input impedance |
US6573566B2 (en) * | 2001-07-09 | 2003-06-03 | United Microelectronics Corp. | Low-voltage-triggered SOI-SCR device and associated ESD protection circuit |
JP2003031669A (ja) * | 2001-07-13 | 2003-01-31 | Ricoh Co Ltd | 半導体装置 |
-
2001
- 2001-07-13 JP JP2001214111A patent/JP2003031669A/ja active Pending
-
2002
- 2002-07-12 EP EP02747664A patent/EP1325519B1/en not_active Expired - Fee Related
- 2002-07-12 CN CNB028027817A patent/CN1319171C/zh not_active Expired - Fee Related
- 2002-07-12 DE DE60227040T patent/DE60227040D1/de not_active Expired - Lifetime
- 2002-07-12 WO PCT/JP2002/007126 patent/WO2003007380A1/en active IP Right Grant
- 2002-07-12 US US10/363,226 patent/US6744100B2/en not_active Expired - Fee Related
-
2004
- 2004-03-12 US US10/798,356 patent/US6946708B2/en not_active Expired - Fee Related
-
2005
- 2005-05-10 US US11/125,311 patent/US7242062B2/en not_active Expired - Fee Related
-
2007
- 2007-06-12 US US11/761,522 patent/US7638848B2/en not_active Expired - Fee Related
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US473182A (en) * | 1892-04-19 | Packing for pistons | ||
US4994874A (en) * | 1988-10-28 | 1991-02-19 | Kabushiki Kaisha Toshiba | Input protection circuit for semiconductor integrated circuit device |
GB2259606A (en) * | 1991-09-16 | 1993-03-17 | Samsung Electronics Co Ltd | Electrostatic discharge protection in a semiconductor memory |
JPH06112422A (ja) * | 1992-09-30 | 1994-04-22 | Nec Corp | 半導体集積回路装置 |
US5909046A (en) * | 1997-03-26 | 1999-06-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor integrated circuit device having stable input protection circuit |
JPH11121750A (ja) * | 1997-10-09 | 1999-04-30 | Mitsubishi Electric Corp | 半導体装置 |
JP2000164807A (ja) * | 1998-11-25 | 2000-06-16 | Matsushita Electric Ind Co Ltd | 半導体装置 |
CN1256516A (zh) * | 1998-11-30 | 2000-06-14 | 摩托罗拉公司 | 在静电放电期间减少寄生双极效应的电路和方法 |
JP2001044374A (ja) * | 1999-08-03 | 2001-02-16 | Hitachi Ltd | 外部端子保護回路および半導体集積回路 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101888085B (zh) * | 2009-05-11 | 2012-11-28 | 晶致半导体股份有限公司 | 具有esd的马达控制芯片 |
Also Published As
Publication number | Publication date |
---|---|
US7638848B2 (en) | 2009-12-29 |
CN1473362A (zh) | 2004-02-04 |
US7242062B2 (en) | 2007-07-10 |
US20080036004A1 (en) | 2008-02-14 |
EP1325519B1 (en) | 2008-06-11 |
DE60227040D1 (de) | 2008-07-24 |
WO2003007380A1 (en) | 2003-01-23 |
EP1325519A1 (en) | 2003-07-09 |
US20050282340A1 (en) | 2005-12-22 |
US6946708B2 (en) | 2005-09-20 |
JP2003031669A (ja) | 2003-01-31 |
US20040169232A1 (en) | 2004-09-02 |
EP1325519A4 (en) | 2006-06-21 |
US6744100B2 (en) | 2004-06-01 |
US20030183843A1 (en) | 2003-10-02 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: RICOH MICROELECTRONICS CO., LTD. Free format text: FORMER OWNER: RICOH CO. LTD. Effective date: 20150331 |
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TR01 | Transfer of patent right |
Effective date of registration: 20150331 Address after: Osaka Patentee after: Ricoh Microelectronics Co., Ltd. Address before: Tokyo, Japan, Japan Patentee before: Ricoh Co., Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070530 Termination date: 20150712 |
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EXPY | Termination of patent right or utility model |