CN1270439C - 压电振动装置及其制造方法、陶瓷封装体及实时时钟 - Google Patents

压电振动装置及其制造方法、陶瓷封装体及实时时钟 Download PDF

Info

Publication number
CN1270439C
CN1270439C CNB021481342A CN02148134A CN1270439C CN 1270439 C CN1270439 C CN 1270439C CN B021481342 A CNB021481342 A CN B021481342A CN 02148134 A CN02148134 A CN 02148134A CN 1270439 C CN1270439 C CN 1270439C
Authority
CN
China
Prior art keywords
recess
chip
real
equipment used
mentioned
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB021481342A
Other languages
English (en)
Chinese (zh)
Other versions
CN1415431A (zh
Inventor
下平和彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of CN1415431A publication Critical patent/CN1415431A/zh
Application granted granted Critical
Publication of CN1270439C publication Critical patent/CN1270439C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0542—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a lateral arrangement

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
CNB021481342A 2001-10-31 2002-10-30 压电振动装置及其制造方法、陶瓷封装体及实时时钟 Expired - Fee Related CN1270439C (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP334144/2001 2001-10-31
JP2001334144 2001-10-31
JP334144/01 2001-10-31
JP264141/2002 2002-09-10
JP2002264141A JP4058760B2 (ja) 2001-10-31 2002-09-10 圧電振動デバイスおよびリアルタイムクロック
JP264141/02 2002-09-10

Publications (2)

Publication Number Publication Date
CN1415431A CN1415431A (zh) 2003-05-07
CN1270439C true CN1270439C (zh) 2006-08-16

Family

ID=26624234

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB021481342A Expired - Fee Related CN1270439C (zh) 2001-10-31 2002-10-30 压电振动装置及其制造方法、陶瓷封装体及实时时钟

Country Status (4)

Country Link
US (1) US7429814B2 (OSRAM)
JP (1) JP4058760B2 (OSRAM)
KR (1) KR100473969B1 (OSRAM)
CN (1) CN1270439C (OSRAM)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4572383B2 (ja) * 2004-12-13 2010-11-04 セイコーエプソン株式会社 圧電デバイス
JP2007243536A (ja) * 2006-03-08 2007-09-20 Epson Toyocom Corp 圧電デバイス及びその製造方法
JP4998620B2 (ja) * 2009-09-14 2012-08-15 株式会社村田製作所 圧電振動装置の製造方法
JP2011139024A (ja) * 2009-12-04 2011-07-14 Seiko Epson Corp パッケージ、および、それを用いた振動デバイス
JP2012120014A (ja) * 2010-12-02 2012-06-21 Seiko Epson Corp 圧電振動素子、その製造方法、圧電振動子及び圧電発振器
TWI446125B (zh) * 2012-05-25 2014-07-21 Ubiq Semiconductor Corp 即時時鐘模組之封裝體及其封裝方法
DE102013102210B4 (de) * 2013-03-06 2016-04-07 Epcos Ag Zur Miniaturisierung geeignetes elektrisches Bauelement mit verringerter Verkopplung

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5138214A (en) * 1989-12-27 1992-08-11 Matsushita Electric Industrial Co., Ltd. Piezoelectric transducer and method of adjusting oscillation frequency thereof
JPH03243010A (ja) 1990-02-21 1991-10-30 Seiko Electronic Components Ltd 小型水晶振動子
JPH08316732A (ja) 1995-05-22 1996-11-29 Toyo Commun Equip Co Ltd 発振器およびその製造方法
JP3248410B2 (ja) 1995-10-25 2002-01-21 松下電器産業株式会社 発振装置
JPH09298440A (ja) 1996-04-26 1997-11-18 Nippon Dempa Kogyo Co Ltd 表面実装用容器並びにこれを用いた圧電装置及びその 製造方法
US5893726A (en) * 1997-12-15 1999-04-13 Micron Technology, Inc. Semiconductor package with pre-fabricated cover and method of fabrication
US6229249B1 (en) * 1998-08-31 2001-05-08 Kyocera Corporation Surface-mount type crystal oscillator
JP3523502B2 (ja) 1998-09-28 2004-04-26 京セラ株式会社 圧電振動子用容器ならびに圧電振動子およびその製造方法
JP2000134037A (ja) * 1998-10-21 2000-05-12 Nippon Dempa Kogyo Co Ltd 表面実装用の水晶発振器
JP2000134058A (ja) * 1998-10-21 2000-05-12 Toyo Commun Equip Co Ltd 圧電発振器
JP2000269741A (ja) 1999-03-17 2000-09-29 Nippon Dempa Kogyo Co Ltd 表面実装用水晶発振器及び製造方法
JP2000295039A (ja) * 1999-04-02 2000-10-20 Toyo Commun Equip Co Ltd 圧電発振器
JP2000307368A (ja) 1999-04-26 2000-11-02 Seiko Epson Corp 圧電振動子の製造方法
JP2001028517A (ja) * 1999-07-14 2001-01-30 Nippon Dempa Kogyo Co Ltd 水晶発振器
JP2001044760A (ja) * 1999-07-26 2001-02-16 Nippon Dempa Kogyo Co Ltd 水晶振動子及び電圧制御発振器並びにその製造方法
JP2002118423A (ja) * 2000-10-06 2002-04-19 Seiko Epson Corp 圧電デバイス及びその製造方法
JP2002151994A (ja) * 2000-11-10 2002-05-24 Citizen Watch Co Ltd 水晶振動子のパッケージ構造およびその製造方法
JP2002319838A (ja) * 2001-02-19 2002-10-31 Seiko Epson Corp 圧電デバイス及びそのパッケージ
JP2002280865A (ja) * 2001-03-16 2002-09-27 Seiko Epson Corp 圧電デバイス
JP3444420B2 (ja) * 2001-03-26 2003-09-08 セイコーエプソン株式会社 弾性表面波装置及びその製造方法
US6777613B2 (en) * 2001-08-28 2004-08-17 Nihon Dempa Kogyo Co., Ltd Multifunctional crystal unit and method of manufacturing the same
JP3783235B2 (ja) * 2003-06-16 2006-06-07 セイコーエプソン株式会社 圧電発振器とその製造方法ならびに圧電発振器を利用した携帯電話装置および圧電発振器を利用した電子機器

Also Published As

Publication number Publication date
US20070200461A1 (en) 2007-08-30
KR20030036033A (ko) 2003-05-09
JP2003204222A (ja) 2003-07-18
KR100473969B1 (ko) 2005-03-10
JP4058760B2 (ja) 2008-03-12
CN1415431A (zh) 2003-05-07
US7429814B2 (en) 2008-09-30

Similar Documents

Publication Publication Date Title
KR101591130B1 (ko) Ｍｅｍｓ 마이크로폰
CN101946317B (zh) 电子元器件、电子设备及底座构件制造方法
US6492194B1 (en) Method for the packaging of electronic components
US7436272B2 (en) Piezoelectric device
US20020033652A1 (en) Piezoelectric device, manufacturing method therefor, and method for manufacturing piezoelectric oscillator
CN1534869A (zh) 表面声波器件及其制造方法
CN1495999A (zh) 声波器件及其制作方法
CN1371763A (zh) 压电元件及其封装
CN1533031A (zh) 压电振子
CN1270439C (zh) 压电振动装置及其制造方法、陶瓷封装体及实时时钟
CN1536763A (zh) 表面声波器件及其制造方法
TWI822418B (zh) 搭載熱敏電阻的壓電振動裝置
US20060290238A1 (en) Electronic part having high sealing performance and method of manufacturing the same
JP2002334954A (ja) 電子装置およびその製造方法ならびに電子部品保護用キャップおよびその製造方法
JP3870931B2 (ja) 圧電デバイス
JP2008205761A (ja) 圧電振動デバイス
JP2002033636A (ja) 圧電振動デバイス用パッケージ
JP2003032042A (ja) リアルタイムクロックモジュール及び電子機器
JP4144036B2 (ja) 電子部品用パッケージ及び当該電子部品用パッケージを用いた圧電振動デバイス
KR100843419B1 (ko) 반도체 칩 패키지 및 제조방법
JP2003051719A (ja) リアルタイムクロックモジュール及び電子機器
CN1784829A (zh) 压电器件
JP2004328553A (ja) 電子部品用パッケージおよび当該パッケージを用いた圧電振動デバイス
JP2001127576A (ja) 圧電振動子用パッケージの構造及び製造方法
JPH0878955A (ja) 表面実装型圧電発振器およびその製造方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20060816

Termination date: 20151030

EXPY Termination of patent right or utility model