CN1266750C - 在绝缘衬底上形成的场效应晶体管以及集成电路 - Google Patents
在绝缘衬底上形成的场效应晶体管以及集成电路 Download PDFInfo
- Publication number
- CN1266750C CN1266750C CNB021443785A CN02144378A CN1266750C CN 1266750 C CN1266750 C CN 1266750C CN B021443785 A CNB021443785 A CN B021443785A CN 02144378 A CN02144378 A CN 02144378A CN 1266750 C CN1266750 C CN 1266750C
- Authority
- CN
- China
- Prior art keywords
- region
- field effect
- insulating substrate
- effect transistor
- gate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
- H10D30/6708—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device for preventing the kink effect or the snapback effect, e.g. discharging the minority carriers of the channel region for preventing bipolar effect
- H10D30/6711—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device for preventing the kink effect or the snapback effect, e.g. discharging the minority carriers of the channel region for preventing bipolar effect by using electrodes contacting the supplementary regions or layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
- H10D30/6733—Multi-gate TFTs
Landscapes
- Thin Film Transistor (AREA)
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP258334/01 | 2001-08-28 | ||
| JP2001258334 | 2001-08-28 | ||
| JP258334/2001 | 2001-08-28 | ||
| JP276805/01 | 2001-09-12 | ||
| JP276805/2001 | 2001-09-12 | ||
| JP2001276805A JP5001494B2 (ja) | 2001-08-28 | 2001-09-12 | 絶縁性基板上に形成された電界効果トランジスタ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1407609A CN1407609A (zh) | 2003-04-02 |
| CN1266750C true CN1266750C (zh) | 2006-07-26 |
Family
ID=26621140
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB021443785A Expired - Fee Related CN1266750C (zh) | 2001-08-28 | 2002-08-28 | 在绝缘衬底上形成的场效应晶体管以及集成电路 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7282763B2 (enExample) |
| JP (1) | JP5001494B2 (enExample) |
| KR (2) | KR100919081B1 (enExample) |
| CN (1) | CN1266750C (enExample) |
| TW (1) | TW556317B (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100542986B1 (ko) | 2003-04-29 | 2006-01-20 | 삼성에스디아이 주식회사 | 박막 트랜지스터, 상기 박막 트랜지스터 제조 방법 및 이를 이용한 표시장치 |
| KR100543004B1 (ko) * | 2003-09-18 | 2006-01-20 | 삼성에스디아이 주식회사 | 평판표시장치 |
| WO2005050712A2 (en) * | 2003-11-18 | 2005-06-02 | Halliburton Energy Services, Inc. | High-temperature memory systems |
| US7045873B2 (en) * | 2003-12-08 | 2006-05-16 | International Business Machines Corporation | Dynamic threshold voltage MOSFET on SOI |
| US7084462B1 (en) * | 2005-04-15 | 2006-08-01 | International Business Machines Corporation | Parallel field effect transistor structure having a body contact |
| KR100741976B1 (ko) | 2005-08-25 | 2007-07-23 | 삼성에스디아이 주식회사 | 박막트랜지스터 및 그 제조 방법 |
| KR100878284B1 (ko) | 2007-03-09 | 2009-01-12 | 삼성모바일디스플레이주식회사 | 박막트랜지스터와 그 제조 방법 및 이를 구비한유기전계발광표시장치 |
| DE102007012380A1 (de) * | 2007-03-14 | 2008-09-18 | Austriamicrosystems Ag | MOSFET mit Kanalanschluss und Verfahren zur Herstellung eines MOSFETs mit Kanalanschluss |
| US7652339B2 (en) * | 2007-04-06 | 2010-01-26 | Xerox Corporation | Ambipolar transistor design |
| US8450799B2 (en) * | 2007-10-22 | 2013-05-28 | Seiko Instruments Inc. | Field effect transistor formed on an insulating substrate and integrated circuit thereof |
| US7939865B2 (en) * | 2009-01-22 | 2011-05-10 | Honeywell International Inc. | Metal semiconductor field effect transistor (MESFET) silicon-on-insulator structure having partial trench spacers |
| JP2011009579A (ja) * | 2009-06-26 | 2011-01-13 | Seiko Instruments Inc | 絶縁性基板上の電界効果トランジスタおよびその集積回路 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2461360A1 (fr) * | 1979-07-10 | 1981-01-30 | Thomson Csf | Procede de fabrication d'un transistor a effet de champ du type dmos a fonctionnement vertical et transistor obtenu par ce procede |
| JPS61278164A (ja) * | 1985-06-03 | 1986-12-09 | Hitachi Ltd | 双方向型薄膜半導体装置 |
| JPH04252075A (ja) * | 1991-01-28 | 1992-09-08 | Nec Corp | 半導体装置およびその製造方法 |
| EP0654829A1 (en) * | 1993-11-12 | 1995-05-24 | STMicroelectronics, Inc. | Increased density MOS-gated double diffused semiconductor devices |
| JPH0982969A (ja) * | 1995-09-12 | 1997-03-28 | Toshiba Corp | 薄膜トランジスタおよび液晶表示装置 |
| JP3364559B2 (ja) * | 1995-10-11 | 2003-01-08 | 三菱電機株式会社 | 半導体装置 |
| JPH09283752A (ja) * | 1996-04-12 | 1997-10-31 | Hitachi Ltd | Mis型半導体装置 |
| TW417256B (en) * | 1997-01-31 | 2001-01-01 | Seiko Epson Corp | Semiconductor MOS device and its manufacturing method |
| JP3379376B2 (ja) * | 1997-03-14 | 2003-02-24 | 松下電器産業株式会社 | 電界効果トランジスタおよびそれを用いた電力増幅器 |
| JP3216591B2 (ja) * | 1997-10-29 | 2001-10-09 | 日本電気株式会社 | 電界効果型トランジスタ |
| JP2000031289A (ja) * | 1998-07-08 | 2000-01-28 | Oki Electric Ind Co Ltd | 半導体集積回路装置 |
| JP3463593B2 (ja) * | 1999-03-01 | 2003-11-05 | 日本電気株式会社 | 電界効果型トランジスタ及びその製造方法 |
| JP2000332250A (ja) * | 1999-05-18 | 2000-11-30 | Sony Corp | 半導体装置およびその製造方法 |
| JP3573056B2 (ja) * | 1999-07-16 | 2004-10-06 | セイコーエプソン株式会社 | 半導体装置、半導体ゲートアレイおよび電気光学装置および電子機器 |
| US6441434B1 (en) * | 2000-03-31 | 2002-08-27 | Advanced Micro Devices, Inc. | Semiconductor-on-insulator body-source contact and method |
-
2001
- 2001-09-12 JP JP2001276805A patent/JP5001494B2/ja not_active Expired - Fee Related
-
2002
- 2002-08-27 TW TW091119429A patent/TW556317B/zh not_active IP Right Cessation
- 2002-08-27 US US10/228,847 patent/US7282763B2/en not_active Expired - Lifetime
- 2002-08-28 CN CNB021443785A patent/CN1266750C/zh not_active Expired - Fee Related
- 2002-08-28 KR KR1020020051214A patent/KR100919081B1/ko not_active Expired - Fee Related
-
2007
- 2007-08-23 KR KR1020070085014A patent/KR100922914B1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP5001494B2 (ja) | 2012-08-15 |
| KR100919081B1 (ko) | 2009-09-28 |
| US7282763B2 (en) | 2007-10-16 |
| KR20030019179A (ko) | 2003-03-06 |
| JP2003152184A (ja) | 2003-05-23 |
| KR20070091259A (ko) | 2007-09-10 |
| TW556317B (en) | 2003-10-01 |
| KR100922914B1 (ko) | 2009-10-22 |
| CN1407609A (zh) | 2003-04-02 |
| US20030052373A1 (en) | 2003-03-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160406 Address after: Chiba County, Japan Patentee after: DynaFine Semiconductor Co.,Ltd. Patentee after: Lin Feng Address before: Chiba County, Japan Patentee before: Seiko Instruments Inc. Patentee before: Lin Feng |
|
| CP01 | Change in the name or title of a patent holder |
Address after: Chiba County, Japan Co-patentee after: Lin Feng Patentee after: ABLIC Inc. Address before: Chiba County, Japan Co-patentee before: Lin Feng Patentee before: DynaFine Semiconductor Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060726 Termination date: 20210828 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |