CN1258984A - 移动电话键板及其制作方法 - Google Patents
移动电话键板及其制作方法 Download PDFInfo
- Publication number
- CN1258984A CN1258984A CN99127403A CN99127403A CN1258984A CN 1258984 A CN1258984 A CN 1258984A CN 99127403 A CN99127403 A CN 99127403A CN 99127403 A CN99127403 A CN 99127403A CN 1258984 A CN1258984 A CN 1258984A
- Authority
- CN
- China
- Prior art keywords
- key
- key plate
- film
- flatted membrane
- slit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
- H01H13/702—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2083/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as moulding material
- B29K2083/005—LSR, i.e. liquid silicone rubbers, or derivatives thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2219/00—Legends
- H01H2219/028—Printed information
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2219/00—Legends
- H01H2219/028—Printed information
- H01H2219/03—Printed information in transparent keyboard
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2229/00—Manufacturing
- H01H2229/044—Injection moulding
- H01H2229/047—Preformed layer in mould
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2231/00—Applications
- H01H2231/022—Telephone handset
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
- Y10T156/1051—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina by folding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1062—Prior to assembly
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/108—Flash, trim or excess removal
Landscapes
- Push-Button Switches (AREA)
- Manufacture Of Switches (AREA)
- Telephone Set Structure (AREA)
- Switch Cases, Indication, And Locking (AREA)
- Mobile Radio Communication Systems (AREA)
- Telephone Function (AREA)
Abstract
本方面公开了一种移动电话键板及其制作方法。此方法包括的步骤有:将字符印在透明、平面膜上;通过一挤压工序预成型平面膜,以便平面膜具有包括多个凹窝的预定形状;围绕各凹窝在挤压平面膜上冲出狭缝;将液体硅橡胶注入挤压平面膜的凹窝中;通过在一金属模具中挤压硅橡胶形成键板以制作各键互相连接的整体键板;根据预先确定的键板形状修整成形键板的外周边。
Description
本发明涉及一种移动电话键板及其制作方法,更具体地说,本发明涉及这样一种键板,其中,膜和硅橡胶结合在一个单体结构中以制作键板。
某类电子设备,如计算器、电话或移动电话,需要输入数据的装置。提供这种能力的通常结构包括一个前壳和一个键板,键板被装入壳体,从而键板的按钮或键通过前壳的孔凸出。
移动电话使用的传统键板挤压各拱形开关,它们响应键操作接触一印刷电路板。这种传统的键板可由塑料(膜式键板)或硅橡胶(硅橡胶式键板)制成。
硅橡胶式键板是通过使用硅橡胶的注射模制过程形成的。在注射模制之后,诸如数码、字母及符号之类的字符被印在键板的外表面上。硅橡胶式键板的缺点是,在使用一段时间以后,这些字符将会褪色或磨掉。
膜式键板是通过使用塑料的注射模制过程形成的。在注射模制过程之后,印有各种字符的膜被固定在键板上。由于各种字符被印在膜的内表面,它们不会由于使用而褪色或磨掉。然而,由于膜式键板是由硬塑料制成的,接触起来不如硅橡胶这样的软材料制成的键板舒适。
本申请的发明者揭示了一种键板和方法,克服了1999年12月31日提交的韩国专利申请9863310号中的上述问题。在该专利申请的方法中,在预成型为键形的膜被涂以环氧树脂之后,膜被注入硅橡胶。然而,在环氧树脂固化后,环氧树脂变得过硬,以至键很难操作。键板的制备也需要很长时间。
考虑到上述现有技术,本发明的目的之一是提供一种键板及其制作方法,其中,制备键板的时间通过在单一模具中挤压膜和硅橡胶而得以最小化。
本发明的另一个目的是提供一种键板及其制造方法,其中,围绕键形成有狭缝,以便为用户提供提高的操作感,并防止与用户目标键邻近的键被压。
为达到这些目的,象这里所具体化和描述的那样,本发明包括的步骤有:
将字符印在平的透明膜上;
通过一压制工序预成型平膜,使得平膜具有包括多个凹窝的预定形状;
围绕各凹窝在压制的成平膜上冲出各狭缝;
将液体硅橡胶注入压制的平面膜的各凹窝;
在一金属模具中挤压硅橡胶形成键板,以便制成各键相互连接的整体键板;以及
根据预先确定的键板形状修整已成形的键板外周边。
在预成型工序中,在平面膜上形成各发光装置置放其中的各凹沟。在预成型工序中,最好使用热压机,它被加热到一个预先确定的温度以便保持均匀的膜厚度,并防止由于膜的伸胀而造成的字符的变形。
同样,为达到这些目的,本发明提供了一种移动电话的键板,它包括具有多个触点的印刷电路板;多个设置在印刷电路板上的拱形开关;用于按压多个拱形开关的多个键;以设置在多个键之间、用作背光的多个发光装置。
在该键板中,各凹沟在多个键之间形成,以便能够将多个发光装置放置其上。
无论是以上的概述还是下面的详述都是例示性的,旨在对本发明提供进一步的解释。
下面结合附图和实施例对本发明作进一步详细的说明,其中:
图1是本发明一优选实施例的制作移动电话键板的方法的流程图;
图2A-2D是本发明一优选实施例的键板在顺序制作程序中的键板剖示图;
图3A-3D是图2D中所示键板、一前壳,一拱形开关组件和一个印刷电路板的分解透示图;以及
图4是图3A和3B所示的键板、前壳、拱形开关组件和印刷电路板组装状态下的剖视图。
下面结合附图详细描述本发明。
参考图1,将对本发明一优选实施例的移动电话键板的制作方法作出解释。
首先,在步骤S1中,诸如数码、字母、符号之类的字符被印在透明、平面的模上。在步骤S1中,字符被印在平面模的背面(内表面)。因此,用户不直接接触印刷字符,由此避免了褪色和磨掉问题。
接着,在步骤S2中,膜的背面用粘接剂涂上,这样,在接下来的程序中,硅橡胶就可以粘在膜的背面。随后,在步骤S3中,利用一压机就膜压成预定的键形。这个步骤被称为膜预成型过程,是由一个被加热到预定温度的热压机或由膜的直接加热来执行的。这两种方法使得均匀的膜厚得以维持并防止由于膜伸胀造成的符号的变形。在执行步骤S3的预成型程序中,拱形凹沟也在各键之间形成,以便使用于背光照明的光发光二极管(LED)得以定位。
以上步骤之后,在步骤S4中,围绕各键在膜上形成狭缝,以便避免由于膜的硬度造成的操作困难。特别是,围绕各键冲出两个狭缝,以便防止与用户目标键相邻的键被无意压下并提高操作的舒适性。就是说,优选地,一对狭缝以预定长度围绕各键的周边形成,这样,两个非切割部分在各键的狭缝端部之间保留下来。因此,每个键都没有与膜分开,膜保持了单体结构。各狭缝端部之间的非切割部分有一个预定宽度。
带有预定键形的预成型膜被嵌入一个形状与膜相同的第一金属模具中,然后,在步骤S5中,各键由一填充器注入液体硅橡胶。在步骤S5中,各键中硅橡胶的填充量需使硅橡胶略微溢出各键(即,注入各键的硅橡胶体积略大于各键的体积)。继步骤S5的填充程序之后,一第二个金属模具放在第一个金属模具上并随后挤压,由此在步骤S6中得到一个完成的键板形状。这个步骤称为键板形成程序。由于各键中的硅橡胶体积略大于各键的体积,当第二个金属模具被压入第一个金属模具时,硅橡胶便在各键之间散布开来。因此,各键得以相互连接,导致带膜的单体结构。同样,由于如上所述膜在步骤S2中施加了粘接剂,硅橡胶紧紧地粘附于膜,进一步加强并确保了带膜的单体结构。
在步骤S6的键板形成程序之后,硅橡胶以一个预定时间加以固化。在键板固化后,进行修整和成型,其中,形成的键板在步骤S7中被切成其最终形状,由此完成了键板的制作。在这个步骤中,键板的外边缘被切除,并形成用来将键板固定到移动电话前壳上所需的洞孔。图2A-2D是当键板经历各顺序制作程序中本发明优选实施例的键板剖示图。
首先参见图2A,字符被印在透明、平面膜2的表面4上,平面膜2的厚度约为0.25~0.5mm。接下来,把粘接剂涂在印刷表面4上以形成一个粘接层6。
膜2可由合成树脂如聚碳酸脂或任何具有预定强度和柔软性的材料做成。最好是,粘接层6在膜2和硅橡胶之间提供良好的粘接作用,并且涂以最小厚度,只要达到预定的粘接作用。
如图2B所示,一个被加热到预定温度的热压机(未表明)用来将膜2、印刷表面4和粘接层6压成预定的形状。这就是说,膜成型过程如此执行,其中,膜2、印刷表面4和粘接层6被热压机挤压,以便多个键形凹窝7得以形成。
在膜预成型过程中还形成了拱形凹沟8。拱形凹沟8是在凹窝7之间形成的,用来定位LED,以便向键板提供背光。由于LED至少部分地放在凹沟8上,被LED占据的移动电话空间得以减小,产生了紧凑的移动电话。
在预成型过程完成以后,如图2C所示,各狭缝10围绕各凹窝7(或键)被冲出来。狭缝10防止与用户目标键相邻的键受到无意的挤压。
当各狭缝10形成时,两个没切部分保留在各凹窝7处的每对狭缝10的端部之间。因此,每个凹窝7都不与膜2分开,膜2与印刷表面4和粘接层6一道保持一单体结构。狭缝10端部之间的没切部分有一个预定的宽度。
然后,膜2被嵌入形状与膜2相同的第一金属模具。接下来,如图2D所示,凹窝7被液体硅橡胶填充。此时,填充到各凹窝7中的硅橡胶的量是,硅橡胶略微溢出每个凹窝7(即,填充到各凹窝7中的硅橡胶的体积略大于每个凹窝7的体积)。
接下来,第二金属模具置放在主金属模局之上。第二金属模具成型键板的背面。通过将第二金属模具压向第一金属具,最终键17形成。每个键17的三个边侧是由预成型膜2的、印刷表面4和粘接层6的各凹窝7限定的;在键板的背面,由用硅橡胶填充各凹窝7和将第二金属模具压向第一金属模具形成,每个键17都包括一个内侧12、一个接触凸起14和一个裙部16。接触凸起14沿着与凹窝7形成的方向相反的方向从各键内侧12的中央延伸。裙部16围绕各接触凸起7的近侧端的周缘形成。裙部16向每个键17提供了弹性以提高操作舒适性,并有助于各键17被按压后回复到初始位置。
由于填充到各凹窝7中的硅橡胶的体积略大于每个凹窝7的体积,第二金属模具向第一金属模具的挤压将硅橡胶在凹窝7之间散布开来。因此,橡胶连接部分19也在各键17之间形成。每个键17通过各橡胶连接部分19得以连接起来,因此形成了一个集成的单体键板。另外,还在与预成型膜2的凹沟8相应的区域处贯穿橡胶连接部分19形成有洞孔18。这使得LED定位在凹沟8上。最后,键板的外周边被切割,贯穿橡胶连接部分19和膜2(即膜2、印刷表面4和粘接层6)形成了多个固定孔20。固定孔20形成于各预定位置处,并用来将键板固定到移动电话的前壳。由于膜2被涂上了粘接层6,每个键17的内侧12以及橡胶连接部分19牢靠地粘到膜2上。这就是说,膜2与硅橡胶连在一起,由此得到一单体结构。因此,将键板组装到移动电话的壳体并不难。
参见图3A-3B和图4,已制成的键板组装到移动电话中。键板被嵌入移动电话的前壳22,每个键17被放入在前壳22上形成的对应孔口24中。
一印刷电路板26位于键板的下面。另外,拱形开关32被放置在印刷电路板26和键板之间。印刷电路板26和拱形开关32是由在前壳22上形成的凸起28支撑的,如图4所示。整体形成并从前壳22延伸的支撑棒30通过键板的固定孔20也支撑着印刷电路板26和拱形开关32。
组装后,各键17的接触凸起14接触印刷电路板26上的一相应拱形开关32。当拱形开关32之一被键17的相应接触凸起14挤压时,它就接触到印刷电路板26上的一接触点(未示)。拱形开关32最好选用具有预定程度的弹性的材料,这样,拱形开关32就可以在用户取消对键17的压力时回复到其原始形状。
当用户按压键17时,接触凸起14就挤压一拱形开关32,由此导致了拱形开关32与印刷电路板接触,这样,一个键输入信号就产生了。当用户停止按压时,拱形开关32和键17回复到其原始位置。
键板的各件最好具备适当的强度和弹性,以便使它们能够发挥所述的特定功能。
对业内人士来说,显而易见的是,对本发明的设计,可有多种修正和变化,而不易脱离本发明的实质和范围。
Claims (8)
1.一种制作键板的方法,包括如下步骤:
将字符印在一透明的平整膜上;
通过一压制工序预成型所述平整膜,使得平整膜具有一包括多个凹窝的预定形状,;
围绕各凹窝在压制过的平整膜上冲出狭缝;
将液体硅橡胶注入压制平整膜的各凹窝;
通过在一金属模具中挤压硅橡胶形成键板,以制作出一个各键相互连接的整体键板;以及
根据预先确定的键板形状修整成型键板的外周边。
2.如权利要求1所述的方法,其中,将字符印在平整膜的背面。
3.如权利要求1所述的方法,其中,在预成型平整膜的步骤中使用一热压机,热压机被加热到一个预定温度,使得一均匀的膜厚得以保持并防止由于膜伸胀所引起的字符变形。
4.如权利要求1所述的方法,其中,在预成型平整膜的步骤中,在平整膜上形成各凹沟,光发射装置设置在各凹沟中。
5.如权利要求1所述的方法,其中,在冲狭缝的步骤中,各没切割的连接部分留在各狭缝之间,使得膜保持一单体结构。
6.一种移动电话键板,包括:
一个具有多个触点的印刷电路板;
多个设置在印刷电路板上的拱形开关;
用于按压多个拱形开关的多个键;以及
多个光发射装置,设置在多个键之间用作背光照明;
其中,在多个键之间形成有各凹沟以使在其上放置多个光发射装置。
7.如权利要求6所述的键板,其中,围绕多个键冲有各狭缝,以便防止各键相互干扰。
8.如权利要求7所述的键板,其中,没切割的连接部分形成在各狭缝端部之间,以便各键不与键板分开,各连接部分均匀一个预定宽度。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR19980063310 | 1998-12-31 | ||
KR63310/1998 | 1998-12-31 | ||
KR47619/1999 | 1999-10-29 | ||
KR1019990047619A KR100342959B1 (ko) | 1998-12-31 | 1999-10-29 | 휴대폰용 키패드와 그 제작방법 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN1258984A true CN1258984A (zh) | 2000-07-05 |
Family
ID=36746280
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN99127403A Pending CN1258984A (zh) | 1998-12-31 | 1999-12-29 | 移动电话键板及其制作方法 |
Country Status (8)
Country | Link |
---|---|
US (2) | US6423171B1 (zh) |
EP (1) | EP1017075B1 (zh) |
JP (1) | JP3455707B2 (zh) |
KR (1) | KR100342959B1 (zh) |
CN (1) | CN1258984A (zh) |
AT (1) | ATE311658T1 (zh) |
BR (1) | BR9906296A (zh) |
DE (1) | DE69928637T2 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1925082B (zh) * | 2005-09-01 | 2012-09-05 | 保力马科技株式会社 | 按键板的制造方法 |
Families Citing this family (52)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100342959B1 (ko) * | 1998-12-31 | 2002-07-05 | 양윤홍 | 휴대폰용 키패드와 그 제작방법 |
FI108096B (fi) * | 1999-12-28 | 2001-11-15 | Nokia Mobile Phones Ltd | Kapasitiivisesti kytketty näppäimistörakenne |
KR100359519B1 (ko) * | 2000-03-16 | 2002-10-31 | 주식회사 동남 실리콘 | 키패드 일체형 통신기기용 전면 커버 |
KR100337786B1 (ko) * | 2000-08-19 | 2002-05-24 | 윤종용 | 와이드 키패드 및 정전기 방지용 와이드 키패드 결합구조 |
US20020094838A1 (en) * | 2001-01-12 | 2002-07-18 | Hsiang-Hua Wang | Structure of film type keyboard of cellular phones |
KR20020080027A (ko) * | 2001-04-10 | 2002-10-23 | 김영호 | 셀룰라폰용 키패드 제조방법 |
KR100384993B1 (ko) | 2001-05-22 | 2003-05-23 | 주식회사 유일전자 | 이엘램프 내장 일체형 키패드 |
KR100417463B1 (ko) * | 2001-07-24 | 2004-02-05 | 주식회사 유일전자 | 이엘 램프 일체형 키패드와 그 제조방법 |
KR100412965B1 (ko) * | 2001-08-08 | 2003-12-31 | 주식회사 유일전자 | 휴대폰용 키패드와 이의 제조방법 및 장치 |
JP2003178639A (ja) * | 2001-12-12 | 2003-06-27 | Sunarrow Ltd | ハードベース・キーユニット |
KR100458858B1 (ko) * | 2002-05-14 | 2004-12-03 | 주식회사 모센 | 난접착성 물체 접착방법 |
KR20040008297A (ko) * | 2002-07-18 | 2004-01-31 | 주식회사 소림 | 휴대폰용 키패드 제작방법 |
KR100486634B1 (ko) * | 2002-09-18 | 2005-04-29 | 주식회사 유일전자 | 휴대폰용 키패드 제조방법 및 장치 |
KR100467157B1 (ko) * | 2002-09-19 | 2005-01-24 | 주식회사 유일전자 | 휴대폰용 키패드 제조방법 및 장치 |
KR20040047316A (ko) * | 2002-11-29 | 2004-06-05 | 엘지전자 주식회사 | 이동통신 단말기의 키패드 |
KR100793776B1 (ko) * | 2002-12-11 | 2008-01-10 | 엘지전자 주식회사 | 이동통신 단말기 |
KR100502198B1 (ko) * | 2003-01-24 | 2005-07-21 | 한성엘컴텍 주식회사 | 이엘을 적용한 일체형 키패드 및 그의 제조방법 |
US7379720B2 (en) * | 2003-02-20 | 2008-05-27 | Sony Ericsson Mobile Communications Ab | Keypad lighting using polymer light emitting devices |
WO2004088694A1 (en) * | 2003-04-03 | 2004-10-14 | Danfoss Drives A/S | A cover for a push button switch |
KR100525222B1 (ko) * | 2003-11-06 | 2005-10-28 | 주식회사 소림 | 휴대기기용 키패드 및 이에 적합한 제조 방법 |
KR100708780B1 (ko) * | 2004-03-23 | 2007-04-20 | 주식회사 투엔테크 | 휴대폰의 네비게이션 키패드 금형 제작방법 및 그 금형 |
KR100664163B1 (ko) * | 2004-10-26 | 2007-01-04 | 엘지전자 주식회사 | 일체형 키패드 및 이를 구비한 휴대 단말기 |
KR100540780B1 (ko) * | 2004-12-15 | 2006-01-11 | 주식회사 삼영테크놀로지 | 일체형 아크릴 터치패드가 구비된 일체형 아크릴 키패드 |
JP4684830B2 (ja) * | 2005-02-25 | 2011-05-18 | 京セラ株式会社 | 携帯電子機器 |
KR100604609B1 (ko) | 2005-03-11 | 2006-07-28 | 주식회사 신화엠에스 | 휴대폰용 키패드의 제조방법 및 이에 의해 제조되는 휴대폰용 키패드 |
US20070051590A1 (en) * | 2005-09-06 | 2007-03-08 | Chin-Te Chiu | Keypad device |
KR100809561B1 (ko) | 2005-10-19 | 2008-03-18 | 디케이유테크 주식회사 | 키패드의 제조방법 |
TWI315077B (en) * | 2006-01-20 | 2009-09-21 | Hon Hai Prec Ind Co Ltd | Dome sheet and switch with the dome sheet |
KR100761087B1 (ko) * | 2006-04-19 | 2007-09-28 | 주식회사 삼영테크놀로지 | 휴대용 단말기의 일체형 금속 전면 커버의 제조방법 |
JP4151849B2 (ja) | 2006-04-20 | 2008-09-17 | ポリマテック株式会社 | キーシート |
JP4146866B2 (ja) * | 2006-06-06 | 2008-09-10 | サンアロー株式会社 | 押釦スイッチ用部材及びその製造方法 |
WO2007145424A1 (en) * | 2006-06-14 | 2007-12-21 | Mogem Co., Ltd. | One body type keypad comprising window and wireless telephone having the same |
CN101473394B (zh) * | 2006-06-22 | 2012-03-28 | 日本小林株式会社 | 用于往复键的开关 |
KR100650515B1 (ko) | 2006-06-22 | 2006-11-30 | (주)에이원이노텍 | 휴대폰용 키패드 |
WO2007148852A1 (en) * | 2006-06-23 | 2007-12-27 | Insung Corporation | Stereotyped metal key having the function of back-lighting, metal keypad with metal key, method of stereotyped metal key having the function of back-lighting, method of metal keypad with metal key |
US7825899B2 (en) * | 2006-07-18 | 2010-11-02 | Research In Motion Limited | Piano-style keypad employing a light guide |
KR101255010B1 (ko) * | 2006-10-13 | 2013-04-16 | 엘지전자 주식회사 | 일체형의 키버튼부를 갖는 키패드 및 이를 구비한이동단말기 |
JP2008117660A (ja) * | 2006-11-06 | 2008-05-22 | Shin Etsu Polymer Co Ltd | 押釦スイッチ用部材 |
KR100737762B1 (ko) * | 2006-11-20 | 2007-07-13 | 주식회사 모젬 | 윈도우 일체형 키패드 및 이를 구비한 무선단말기 |
US20080191904A1 (en) * | 2007-02-12 | 2008-08-14 | Kai-Jie Tsao | Method For Manufacturing Thin Keypad Assembly And Such Assembly |
KR100860458B1 (ko) * | 2007-03-09 | 2008-09-25 | 주식회사 팬택 | 일체형 버튼이 구비된 키패드 및 이를 포함하는개인휴대단말기 |
KR200446579Y1 (ko) * | 2007-09-27 | 2009-11-11 | 엔아이티 주식회사 | 키버튼 |
CN101573234B (zh) * | 2007-12-17 | 2012-07-18 | 东莞万德电子制品有限公司 | 超薄型弹性按键之加工方法 |
KR100937019B1 (ko) | 2008-03-14 | 2010-01-15 | 한국성전(주) | 휴대전화용 자판형 입력 장치의 엑츄에이터 형성 방법 및장치 |
JP5083078B2 (ja) * | 2008-07-11 | 2012-11-28 | ソニー株式会社 | キーボード及びキーボードの製造方法 |
EP2269795B1 (de) * | 2009-06-09 | 2013-07-31 | Abatek International AG | Verfahren zur Herstellung einer Folientastatur und Folientastatur |
TWI415153B (zh) * | 2010-03-15 | 2013-11-11 | Ichia Tech Inc | A key shell and a keyboard with a key shell |
KR101065987B1 (ko) * | 2011-01-07 | 2011-09-19 | (주)서원인텍 | 키 입력기 제조방법 |
CN102572044A (zh) * | 2012-01-17 | 2012-07-11 | 广东步步高电子工业有限公司 | 一种移动通信终端及其按键装置 |
US8760406B2 (en) | 2012-04-03 | 2014-06-24 | Motorola Mobility Llc | Edge to edge qwerty keypad for a handheld device |
CN111105948A (zh) * | 2018-10-25 | 2020-05-05 | 北京小米移动软件有限公司 | 金属按键的加工排版结构及金属按键的加工方法 |
US11086407B2 (en) | 2019-10-10 | 2021-08-10 | Motorola Solutions, Inc. | Device with a keypad that includes a bezel assembled with a flexible substrate |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3144084C2 (de) * | 1981-11-06 | 1988-08-18 | Preh, Elektrofeinmechanische Werke Jakob Preh Nachf. Gmbh & Co, 8740 Bad Neustadt | Verfahren zur Herstellung einer für ein Drucktastenfeld geeigneten Kontaktmatte |
US4636593A (en) * | 1985-03-13 | 1987-01-13 | Motorola Inc. | Light conducting, elastomeric membrane keypad |
US4916262A (en) * | 1988-11-03 | 1990-04-10 | Motorola, Inc. | Low-profile, rubber keypad |
DE69133106T2 (de) * | 1990-10-30 | 2003-04-30 | Teikoku Tsushin Kogyo Kk | Taste und Verfahren zur Herstellung der Taste |
US5311656A (en) * | 1991-03-12 | 1994-05-17 | Mitel Corporation | Keypad method of manufacture |
US5475192A (en) * | 1993-03-15 | 1995-12-12 | Teikoku Tsushin Kogyo Co., Ltd. | Keytop sheet for push-button switches |
JP2772760B2 (ja) * | 1994-07-12 | 1998-07-09 | 帝国通信工業株式会社 | 図柄付き合成樹脂フイルムの図柄拡大方法 |
JP2686596B2 (ja) * | 1994-07-12 | 1997-12-08 | 帝国通信工業株式会社 | 合成樹脂フイルムとモールド樹脂の固着方法 |
US5514319A (en) * | 1994-07-27 | 1996-05-07 | Young; Wen-Kuei | Method of fabricating a rubber keypad |
TW304272B (en) * | 1995-08-16 | 1997-05-01 | Hi Glory Corp | Manufacturing method and product for rubber and resin keypad |
GB2308499B (en) * | 1995-12-22 | 2000-03-15 | Nokia Mobile Phones Ltd | A contact membrane for a keypad assembly |
US5681515A (en) * | 1996-04-12 | 1997-10-28 | Motorola, Inc. | Method of fabricating an elastomeric keypad |
TW388895B (en) * | 1996-09-12 | 2000-05-01 | Alpha Techno Co Ltd | Keypad and its manufacturing processes |
JP3151553B2 (ja) * | 1996-11-29 | 2001-04-03 | 帝国通信工業株式会社 | キートップ板及びその製造方法 |
US6180048B1 (en) * | 1996-12-06 | 2001-01-30 | Polymatech Co., Ltd. | Manufacturing method of color keypad for a contact of character illumination rubber switch |
US5708428A (en) * | 1996-12-10 | 1998-01-13 | Ericsson Inc. | Method and apparatus for providing backlighting for keypads and LCD panels |
JP4037483B2 (ja) * | 1997-04-14 | 2008-01-23 | ポリマテック株式会社 | シート状キートップおよびその製造方法 |
US5847336A (en) * | 1997-05-02 | 1998-12-08 | Telefonaktiebolaget L M Ericsson (Publ) | Direct keypad backlighting |
US5909021A (en) * | 1997-08-19 | 1999-06-01 | The Sas Group, Llc | Keypads: Apparatus and methods of making |
KR100270881B1 (ko) * | 1997-12-24 | 2000-11-01 | 양윤홍 | 휴대전화기용 키패드 제조방법 |
US6044152A (en) * | 1998-01-15 | 2000-03-28 | Ericsson Inc. | Shielded keyboard for a portable communication device |
KR100275297B1 (ko) * | 1998-02-17 | 2000-12-15 | 양윤홍 | 필름성형 키캡과 실리콘 고무 조합 키패드 제작방법 |
JPH11329139A (ja) * | 1998-05-18 | 1999-11-30 | Nissha Printing Co Ltd | シリコーンゴムキーパッドとその製造方法 |
US5960942A (en) * | 1998-07-08 | 1999-10-05 | Ericsson, Inc. | Thin profile keypad with integrated LEDs |
KR100342959B1 (ko) * | 1998-12-31 | 2002-07-05 | 양윤홍 | 휴대폰용 키패드와 그 제작방법 |
-
1999
- 1999-10-29 KR KR1019990047619A patent/KR100342959B1/ko not_active IP Right Cessation
- 1999-12-22 US US09/470,272 patent/US6423171B1/en not_active Expired - Fee Related
- 1999-12-27 JP JP36863099A patent/JP3455707B2/ja not_active Expired - Fee Related
- 1999-12-28 AT AT99125984T patent/ATE311658T1/de not_active IP Right Cessation
- 1999-12-28 DE DE69928637T patent/DE69928637T2/de not_active Expired - Lifetime
- 1999-12-28 EP EP99125984A patent/EP1017075B1/en not_active Expired - Lifetime
- 1999-12-29 BR BR9906296-8A patent/BR9906296A/pt not_active IP Right Cessation
- 1999-12-29 CN CN99127403A patent/CN1258984A/zh active Pending
-
2001
- 2001-04-23 US US09/840,321 patent/US20010014152A1/en not_active Abandoned
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1925082B (zh) * | 2005-09-01 | 2012-09-05 | 保力马科技株式会社 | 按键板的制造方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20000047574A (ko) | 2000-07-25 |
EP1017075A2 (en) | 2000-07-05 |
KR100342959B1 (ko) | 2002-07-05 |
JP2000200523A (ja) | 2000-07-18 |
BR9906296A (pt) | 2000-10-17 |
DE69928637T2 (de) | 2006-08-17 |
DE69928637D1 (de) | 2006-01-05 |
JP3455707B2 (ja) | 2003-10-14 |
US6423171B1 (en) | 2002-07-23 |
ATE311658T1 (de) | 2005-12-15 |
EP1017075B1 (en) | 2005-11-30 |
US20010014152A1 (en) | 2001-08-16 |
EP1017075A3 (en) | 2001-05-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1258984A (zh) | 移动电话键板及其制作方法 | |
EP1139363B1 (en) | Sheet shaped key top and manufacturing method thereof | |
CN101361149A (zh) | 按键用部件及其制造方法 | |
CN101080795A (zh) | 一体式触摸板的生产方法和具有用该方法生产的触摸板的一体式键板 | |
US7294033B1 (en) | Method for fabricating luminescent solid key | |
CN100440405C (zh) | 薄型按键制造方法 | |
KR100637384B1 (ko) | 휴대폰용 키패드 및 그 제조방법 | |
US20070023262A1 (en) | Keypad and manufacturing method thereof | |
KR100310040B1 (ko) | 휴대폰용 키패드와 그 제작방법 | |
KR20030056830A (ko) | 증착필름을 이용한 키패드 및 그 제조방법 | |
JP3211127B2 (ja) | 押釦スイッチのキートップ板 | |
US20010024702A1 (en) | Method of manufacturing a shell element provided with an opening in an angled part and a shell element manufactured by said method | |
KR20020088178A (ko) | 필름삽입형 키와 실리콘 고무 조합형 휴대폰용 키패드 및그 제조방법 | |
KR100397956B1 (ko) | 다수의 버튼을 갖는 버튼집합체 | |
KR100275297B1 (ko) | 필름성형 키캡과 실리콘 고무 조합 키패드 제작방법 | |
KR100289034B1 (ko) | 이동 통신기용 키패드 제작방법 | |
JP2011243555A (ja) | キーパッドプランジャー構造およびその製造方法 | |
KR100417463B1 (ko) | 이엘 램프 일체형 키패드와 그 제조방법 | |
KR200375006Y1 (ko) | 이엘램프가 내장된 메탈 일체형 키패드 | |
KR100685142B1 (ko) | 휴대폰용 키패드 및 그 제작방법 | |
JPH06267369A (ja) | 押釦スイッチのキートップ板 | |
KR100344970B1 (ko) | 휴대폰용 키패드와 그 제작방법 | |
KR20040060495A (ko) | 휴대폰용 키패드와 그 제작방법 | |
KR20050122042A (ko) | 인쇄를 이용한 휴대폰용 키패드 및 그 제조방법 | |
KR100590217B1 (ko) | 휴대폰용 키패드 제조방법 및 그 제조방법에 의해 제조된키패드 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C06 | Publication | ||
PB01 | Publication | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |