CN101573234B - 超薄型弹性按键之加工方法 - Google Patents

超薄型弹性按键之加工方法 Download PDF

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CN101573234B
CN101573234B CN200780015539.2A CN200780015539A CN101573234B CN 101573234 B CN101573234 B CN 101573234B CN 200780015539 A CN200780015539 A CN 200780015539A CN 101573234 B CN101573234 B CN 101573234B
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CN101573234A (zh
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白毅松
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WIDER International CO Ltd
WANDE ELECTRONIC PRODUCTS CO Ltd DONGGUAN
Dongguan Memtech Electronic Products Co Ltd
Memtech International Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
    • H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
    • H01H13/702—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches
    • H01H13/704—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches characterised by the layers, e.g. by their material or structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2375/00—Polyureas; Polyurethanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/04—Punching, slitting or perforating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/14—Printing or colouring
    • B32B38/145—Printing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2227/00—Dimensions; Characteristics
    • H01H2227/036—Minimise height
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2229/00—Manufacturing
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1054—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing and simultaneously bonding [e.g., cut-seaming]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
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    • Y10T156/1074—Separate cutting of separate sheets or webs

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Abstract

一种超薄型弹性按键的加工方法，尤其是一种兼具有弹性薄膜、硅胶以及塑料薄膜的按键的加工方法，其主要利用印刷、冲切及热压等工艺完成。

Description

超薄型弹性按键之加工方法
技术领域
本发明涉及一种按键加工工艺，尤其是指一种超薄型弹性按键之加工方法，具体而言，尤其是一种兼具弹性薄膜、硅胶以及塑料薄膜的按键之加工方法。
背景技术
在当前各手机制造商越来越追求高难度、高技术含量、高表面花样的今天，产品需要不断推陈出新，其既要唤起消费者的购买欲，又要造价低，效益好，如此产品才能永续生产。
手机按键则是手机产品不可或缺的零件之一，目前由于其KEY型较高，在与底硅胶组装后其整体厚度约在4mm左右，甚至更厚，导致手机装机后较为笨重，不利于携带。因此，为达到上述轻薄和弹性之需求，业界常常会涉及使用各种塑胶材料，尤其是市面上应用TPU材料(ThermoplasticUrethene中文为热塑性基胺聚甲酸酯)、塑料材料(Polycarbonate)结合硅胶形成按键，其传统做法会涉及到诸如普通P+R的喷涂工序或IMD产品的成型或硅胶产品的喷涂切割等复杂繁多的工序，使制作成本居高不下，并且不良率也较高，不利于市场竞争。
发明内容
本发明主要目的在于提供一种超薄型弹性按键之加工方法，其加工简单、成本低。
为实现上述之目的，本发明采取如下技术方案：
一种超薄型弹性按键之加工方法，其中：
(I)塑料薄膜单片加工步聚如下：
①裁片：先利用自动裁片机将加工的塑料薄膜分条后再切割成塑料薄膜单片；
②预缩：将上述切割好的塑料薄膜单片进行预缩；
③冲孔：预缩后的塑料薄膜单片送入冲床内切出印刷定位孔；
④印刷：在冲孔后的塑料薄膜单片正面先印刷图案或文字，再印上结合剂；
⑤涂硅胶：在塑料薄膜单片正面的结合剂上涂上硅胶即完成塑料薄膜单片的加工；
(II)弹性薄膜单片加工步聚如下：
①裁片：先利用自动裁片机将加工的弹性薄膜分条后再切割成弹性薄膜单片；
②预缩：将上述切割好的弹性薄膜单片进行预缩；
③印刷：预缩后的弹性薄膜单片背面印刷结合剂即完成弹性薄膜单片加工；
(III)成型按键
①备料：准备上述加工好的塑料薄膜单片和弹性薄膜单片；
②贴合：将塑料薄膜单片上印刷结合剂并涂有硅胶的那面和弹性薄膜单片上印刷结合剂的那面相向贴合在一起；
③油压：贴合后一并送入已预热一定温度的油压设备中热压成型；
④冲切：成型后的半成品送入冲床中切除毛边即可。
上述塑料薄膜单片加工步骤④中，可根据市场需求加工出各种工艺效果，如预先在塑料薄膜单片背面依次印套黑字符、溅渡金属层面或者印刷不同的金属效果、印上用于衬托金属层面的黑油、退渡以及印刷底色等等。
上述弹性薄膜单片加工步聚中弹性薄膜正表面为光亮面效果。
本发明之优点在于主要利用印刷、冲切及油压等简单工艺完成，无普通P+R的喷涂烦琐工序及不良，无IMD产品的成型偏位不良，无硅胶产品的喷涂切割不良，无复杂繁多的工序，并且所涉及模具也只需油压模及冲模等较少设备进实施，使得人员及场地投入量少；因此本发明之工艺简单、成本低。
附图说明
图1本发明工艺流程示意图。
具体实施方式
下面结合附图与具体实施方式对本发明作进一步描述。
一种超薄型弹性按键之加工方法如下：
(I)塑料薄膜单片加工步聚如下，其中本实施例中塑料薄膜选用PC薄膜进行说明：
裁片10：其先用一自动裁片机将一定厚度的PC薄膜分条，然后再用另外一台裁片机切割成PC薄膜单片，以方便加工。
预缩11：将上述切割好的PC薄膜单片进行预缩，以增加薄膜表面的附着力，保证印刷油墨不脱落；可以避免产品因高温变形导致产品尺寸有偏差，因为物质都有热胀冷缩的物理特性，在产品印刷前先将产品预缩，则印刷后产品就可以杜绝严重的偏位现象，提高良品率，降低成本，增加利润率。
冲孔12：预缩后的PC薄膜单片送入冲床内切出印刷定位孔；冲孔时薄膜放置位置不用很准确，主要薄膜在冲模范围之内即可，因定位孔一旦在薄膜区域内成型后印刷就不会有偏位的现象。
印刷13：在冲孔后，先在塑料薄膜单片背面依次印套黑字符、溅渡金属层面或者印刷不同的金属效果、印压盖油、印用于衬托金属层面的黑油、退渡以及印刷底色，然后在PC薄膜单片正面印刷图案或文字，再印上结合剂；其中印套黑字符主要是使键面更加遮光，另外可以完成客户要求的正面筋条黑色效果，并留出空心字符、筋条和导航键周围的环型部分；溅镀主要是将金属层(例如铝层)加工到塑料薄膜上(环型等位置)，以达到筋条高亮金属感效果，给人以眼前一亮的感觉；印刷压盖油主要是将环型部分遮盖保护，防止退镀；印刷黑油可以衬托金属层(铝层)，使溅镀金属层(铝层)从正面视觉上感觉亮度更高，同时也有保护压盖油和镀层的作用；退镀主要是将除环型部分需要保留以外的其它部分全部退掉(即腐蚀溶解)；印刷白底主要是将字符部分加工成白色，其中可根据客户要求做成各种颜色，并达到透光效果；印刷结合剂主要是在PC薄膜单片正面与硅胶之间增加一层粘合剂，起连接作用，因硅胶与塑料薄膜不能直接粘合。
涂硅胶14：在PC薄膜单片正面的结合剂上涂上硅胶，并且用工具(如小刀)刮平，即完成PC薄膜单片的加工；
(II)弹性薄膜单片加工步聚如下，其中本实施例中弹性薄膜选用TPU薄膜进行说明：
裁片20：选用TPU薄膜正面为光亮面材料，并附有保护膜；然后将TPU薄膜利用自动裁片机将加工一定厚度的TPU薄膜分条后再切割成TPU薄膜单片，其工艺同(I)中加工方法，在此不加予阐述。
预缩21：将上述切割好的TPU薄膜单片进行预缩；其目的同(I)中加工方法，在此不加予阐述。
印刷22：预缩后的TPU薄膜单片背面印刷结合剂，以使TPU薄膜与硅胶之间能够连接；印刷完成后即完成TPU薄膜单片加工。
(III)成型按键
备料：准备上述加工好的PC薄膜单片和TPU薄膜单片；当然上述(I)、(II)两准备可先可后，也可以是同步进行。
贴合30：将PC薄膜单片上印刷结合剂并涂有硅胶的那面和TPU薄膜单片上印刷有结合剂的那面相向贴合在一起，其可采用手工贴法。
油压31：贴合后一并送入已预热一定温度的油压设备中热压成型；其中油压前将模具温度加热到预定温度，利用油压定位孔将贴合好的PC薄膜单片和TPU薄膜单片套到定位孔上，再将TPU薄膜正面的保护膜剥离，然后合上模具，入模，油压机会自动将薄膜片热压成型。利用油压工艺可通过不同的模面可以实现不同的表面效果，例如可以与印刷图案相结合加工成各种各样的立体效果(花形、人物、建筑物等)。总之，超薄按键工艺的表面工艺是千变万化的，客户可以根据自身的需求任意选用各种不同的效果。
冲切32：主要是将上述油压后的半成品边缘的毛边利用冲床通过特定的模具冲切开；进而完成本发明按键之加工。
以上所述，仅是本发明较佳实施例而已，并非对本发明的技术范围作任何限制，故凡是依据本发明的技术实质对以上实施例所作的任何细微修改、等同变化与修饰，均仍属于本发明技术方案的范围内。

Claims (5)

1.一种超薄型弹性按键之加工方法，其特征在于：
(I)塑料薄膜单片加工步聚如下：
①裁片：先利用自动裁片机将加工的塑料薄膜分条后再切割成塑料薄膜单片；
②预缩：将上述切割好的塑料薄膜单片进行预缩；
③冲孔：预缩后的塑料薄膜单片送入冲床内切出印刷定位孔；
④印刷：在冲孔后的塑料薄膜单片正面先印刷图案或文字，再印上结合剂；
⑤涂硅胶：在塑料薄膜单片正面的结合剂上涂上硅胶即完成塑料薄膜单片的加工；
(II)弹性薄膜单片加工步聚如下：
①裁片：先利用自动裁片机将加工的弹性薄膜分条后再切割成弹性薄膜单片；
②预缩：将上述切割好的弹性薄膜单片进行预缩；
③印刷：预缩后的弹性薄膜单片背面印刷结合剂即完成弹性薄膜单片加工；
(III)成型按键
①备料：准备上述加工好的塑料薄膜单片和弹性薄膜单片；
②贴合：将塑料薄膜单片上涂有硅胶的那面和弹性薄膜单片上印刷有结合剂的那面相向贴合在一起；
③油压：贴合后一并送入已预热一定温度的油压设备中热压成型；
④冲切：成型后的半成品送入冲床中切除毛边即可。
2.根据权利要求1所述的超薄型弹性按键之加工方法，其特征在于：上述塑料薄膜单片加工步骤④中，可预先在弹性薄膜单片背面依次印套黑字符、溅渡金属层面或者印刷不同的金属效果、印上用于衬托金属层面的黑油、退渡以及印刷底色，然后再处理塑料薄膜单片。
3.根据权利要求1所述的超薄型弹性按键之加工方法，其特征在于：上述弹性薄膜单片加工步聚中弹性薄膜正表面为光亮面。
4.根据权利要求1至3中任何一项所述的超薄型弹性按键之加工方法，其特征在于：上述弹性薄膜选用TPU材料。
5.根据权利要求1至3中任何一项所述的超薄型弹性按键之加工方法，其特征在于：上述塑料薄膜选用PC材料。
CN200780015539.2A 2007-12-17 2007-12-17 超薄型弹性按键之加工方法 Expired - Fee Related CN101573234B (zh)

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