CN1247375C - 热压合用硅橡胶片材 - Google Patents
热压合用硅橡胶片材 Download PDFInfo
- Publication number
- CN1247375C CN1247375C CNB2004100282108A CN200410028210A CN1247375C CN 1247375 C CN1247375 C CN 1247375C CN B2004100282108 A CNB2004100282108 A CN B2004100282108A CN 200410028210 A CN200410028210 A CN 200410028210A CN 1247375 C CN1247375 C CN 1247375C
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- China
- Prior art keywords
- composition
- layer
- silastic
- rubber sheet
- silicone rubber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 238000007906 compression Methods 0.000 title 1
- 239000000203 mixture Substances 0.000 claims abstract description 155
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- 239000004945 silicone rubber Substances 0.000 claims abstract description 77
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 48
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 44
- 238000002156 mixing Methods 0.000 claims abstract description 41
- 239000000843 powder Substances 0.000 claims abstract description 40
- 239000006229 carbon black Substances 0.000 claims abstract description 25
- 238000000465 moulding Methods 0.000 claims abstract description 22
- 229910052751 metal Inorganic materials 0.000 claims abstract description 20
- 239000002184 metal Substances 0.000 claims abstract description 20
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 20
- 150000004767 nitrides Chemical class 0.000 claims abstract description 7
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- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 6
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims description 96
- -1 polysiloxane Polymers 0.000 claims description 61
- 238000010438 heat treatment Methods 0.000 claims description 44
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 31
- 239000003795 chemical substances by application Substances 0.000 claims description 23
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 20
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- 239000004744 fabric Substances 0.000 claims description 17
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- 125000000217 alkyl group Chemical group 0.000 claims description 15
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- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 9
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- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 7
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- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 claims description 6
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- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical group [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 239000000454 talc Substances 0.000 description 4
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- 229910002012 Aerosil® Inorganic materials 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 3
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- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
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- 239000010949 copper Substances 0.000 description 3
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
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- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
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- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
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- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000004017 vitrification Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000011667 zinc carbonate Substances 0.000 description 1
- 235000004416 zinc carbonate Nutrition 0.000 description 1
- 229910000010 zinc carbonate Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B25/00—Layered products comprising a layer of natural or synthetic rubber
- B32B25/04—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B25/042—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material of natural rubber or synthetic rubber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B25/00—Layered products comprising a layer of natural or synthetic rubber
- B32B25/20—Layered products comprising a layer of natural or synthetic rubber comprising silicone rubber
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
- C08K3/14—Carbides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2383/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/006—Additives being defined by their surface area
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/16—Applications used for films
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75301—Bonding head
- H01L2224/75314—Auxiliary members on the pressing surface
- H01L2224/75315—Elastomer inlay
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP061136/2003 | 2003-03-07 | ||
| JP2003061136A JP3902558B2 (ja) | 2003-03-07 | 2003-03-07 | 熱圧着用シリコーンゴムシート |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1526547A CN1526547A (zh) | 2004-09-08 |
| CN1247375C true CN1247375C (zh) | 2006-03-29 |
Family
ID=33123432
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100282108A Expired - Fee Related CN1247375C (zh) | 2003-03-07 | 2004-03-08 | 热压合用硅橡胶片材 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP3902558B2 (enrdf_load_stackoverflow) |
| KR (1) | KR101010765B1 (enrdf_load_stackoverflow) |
| CN (1) | CN1247375C (enrdf_load_stackoverflow) |
| TW (1) | TW200420701A (enrdf_load_stackoverflow) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006080445A1 (ja) * | 2005-01-31 | 2006-08-03 | Nitto Denko Corporation | 圧着離型シート |
| JP2006281670A (ja) * | 2005-04-01 | 2006-10-19 | Shin Etsu Chem Co Ltd | 熱圧着用シート |
| JP4561989B2 (ja) * | 2005-04-22 | 2010-10-13 | 信越化学工業株式会社 | 熱圧着用複層ゴムシート |
| CN100532485C (zh) * | 2005-07-04 | 2009-08-26 | 李伟强 | 一种耐高温绝缘胶带 |
| JP4572243B2 (ja) * | 2008-03-27 | 2010-11-04 | 信越化学工業株式会社 | 熱伝導性積層体およびその製造方法 |
| JP5386200B2 (ja) * | 2008-04-30 | 2014-01-15 | 中興化成工業株式会社 | 複合シート |
| JP5058938B2 (ja) * | 2008-10-22 | 2012-10-24 | 信越化学工業株式会社 | 熱圧着用シリコーンゴムシート |
| MY157233A (en) * | 2009-03-11 | 2016-05-13 | Shinetsu Chemical Co | Connection sheet for solar battery cell electrode, process for manufacturing solar cell module, and solar cell module |
| JP5272866B2 (ja) | 2009-04-15 | 2013-08-28 | 信越化学工業株式会社 | 熱圧着用シリコーンゴムシート |
| JP5581764B2 (ja) * | 2010-03-24 | 2014-09-03 | 信越化学工業株式会社 | シリコーンゴム組成物及び帯電防止性シリコーンゴム硬化物の耐圧縮永久歪性を向上する方法 |
| JP5363401B2 (ja) * | 2010-04-13 | 2013-12-11 | 信越化学工業株式会社 | 熱圧着用シリコーンゴム積層シート及びその製造方法 |
| JP2013175492A (ja) * | 2010-06-14 | 2013-09-05 | Panasonic Corp | 半導体装置およびその製造方法 |
| CN101879820B (zh) * | 2010-06-24 | 2012-01-25 | 中国乐凯胶片集团公司 | 一种用于正喷灯箱胶片的喷墨记录材料 |
| CN102529230B (zh) * | 2010-10-19 | 2015-04-22 | 信越化学工业株式会社 | 热压合用硅橡胶片材及电气和/或电子设备部件的接合方法 |
| JP5673444B2 (ja) * | 2010-10-19 | 2015-02-18 | 信越化学工業株式会社 | 熱圧着用シリコーンゴムシート及び電気・電子機器部品の接合方法 |
| JP5381964B2 (ja) * | 2010-11-17 | 2014-01-08 | 信越化学工業株式会社 | 熱圧着用シリコーンゴムシート |
| JP5679211B2 (ja) * | 2011-12-02 | 2015-03-04 | 信越ポリマー株式会社 | 転写印刷用転写シートおよびその製造方法 |
| KR101641561B1 (ko) | 2014-10-01 | 2016-07-21 | 한국전기연구원 | 접속재용 전도성 실리콘 코팅 접착제 및 그 제조방법 |
| TWI756181B (zh) * | 2015-08-28 | 2022-03-01 | 日商昭和電工材料股份有限公司 | 緩衝片用組成物及緩衝片 |
| JP6627681B2 (ja) | 2016-07-27 | 2020-01-08 | 信越化学工業株式会社 | 熱圧着用熱伝導性複合シート及びその製造方法 |
| WO2018026035A1 (ko) * | 2016-08-04 | 2018-02-08 | (주)피코팩 | 금속 판을 포함하는 반도체 패키징 구조 및 이의 제조방법 |
| FR3058148A1 (fr) * | 2016-10-31 | 2018-05-04 | Compagnie Generale Des Etablissements Michelin | Composition de caoutchouc comprenant une charge renforcante specifique |
| CN108172436A (zh) * | 2018-01-29 | 2018-06-15 | 苏州市信天游光电材料有限公司 | 一种手机侧键板及其制作方法 |
| JP7139281B2 (ja) * | 2019-04-24 | 2022-09-20 | 信越化学工業株式会社 | 熱伝導性複合テープ |
| CN110920178B (zh) * | 2019-12-05 | 2022-03-15 | 北京航空材料研究院有限公司 | 一种变刚度导电复合材料及其制备方法 |
| KR102650410B1 (ko) * | 2022-01-20 | 2024-03-25 | 박현배 | 다회성 열압착용 실리콘 쿠션패드의 제조방법 및 이를 이용한 연성 인쇄회로기판 제조방법 |
| KR102650400B1 (ko) * | 2022-01-20 | 2024-03-26 | 박현배 | 다회성 열압착용 실리콘 쿠션패드 및 이를 이용한 연성 인쇄회로기판 제조방법 |
| CN115160790A (zh) * | 2022-07-12 | 2022-10-11 | 苏州昌和应用材料有限公司 | 压合机用烧付铁板及其制造方法 |
| KR102835920B1 (ko) * | 2023-02-09 | 2025-07-18 | 주식회사리온 | 패턴 구조를 갖는 반도체 제조용 실리콘 패드 및 그 제조방법 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2631771B2 (ja) * | 1991-01-18 | 1997-07-16 | 信越化学工業株式会社 | 離型性シリコーンゴム組成物及びその硬化物 |
| JPH1076606A (ja) * | 1996-09-02 | 1998-03-24 | Shin Etsu Chem Co Ltd | シリコーンゴム積層体及びその製造方法 |
| JPH10219199A (ja) * | 1997-02-05 | 1998-08-18 | Shin Etsu Chem Co Ltd | 熱圧着用シリコーンゴムシート |
| JP3734243B2 (ja) * | 2000-01-28 | 2006-01-11 | 信越化学工業株式会社 | 接着性シリコーンゴムシート |
-
2003
- 2003-03-07 JP JP2003061136A patent/JP3902558B2/ja not_active Expired - Fee Related
-
2004
- 2004-03-05 TW TW093105918A patent/TW200420701A/zh not_active IP Right Cessation
- 2004-03-05 KR KR1020040014903A patent/KR101010765B1/ko not_active Expired - Fee Related
- 2004-03-08 CN CNB2004100282108A patent/CN1247375C/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR101010765B1 (ko) | 2011-01-25 |
| JP3902558B2 (ja) | 2007-04-11 |
| TWI307659B (enrdf_load_stackoverflow) | 2009-03-21 |
| CN1526547A (zh) | 2004-09-08 |
| KR20040078908A (ko) | 2004-09-13 |
| TW200420701A (en) | 2004-10-16 |
| JP2004273669A (ja) | 2004-09-30 |
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