TW200420701A - Silicone rubber sheet for thermo compression bonding - Google Patents

Silicone rubber sheet for thermo compression bonding

Info

Publication number
TW200420701A
TW200420701A TW093105918A TW93105918A TW200420701A TW 200420701 A TW200420701 A TW 200420701A TW 093105918 A TW093105918 A TW 093105918A TW 93105918 A TW93105918 A TW 93105918A TW 200420701 A TW200420701 A TW 200420701A
Authority
TW
Taiwan
Prior art keywords
silicone rubber
weight
parts
rubber layer
metal
Prior art date
Application number
TW093105918A
Other languages
English (en)
Chinese (zh)
Other versions
TWI307659B (enrdf_load_stackoverflow
Inventor
Ikuo Sakurai
Takeo Yoshida
Hisaharu Yamaguchi
Takeshi Hashimoto
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW200420701A publication Critical patent/TW200420701A/zh
Application granted granted Critical
Publication of TWI307659B publication Critical patent/TWI307659B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/04—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B25/042—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material of natural rubber or synthetic rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/20—Layered products comprising a layer of natural or synthetic rubber comprising silicone rubber
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C08K3/14—Carbides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/006—Additives being defined by their surface area
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/16—Applications used for films
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H01L2224/75315—Elastomer inlay

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Wire Bonding (AREA)
TW093105918A 2003-03-07 2004-03-05 Silicone rubber sheet for thermo compression bonding TW200420701A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003061136A JP3902558B2 (ja) 2003-03-07 2003-03-07 熱圧着用シリコーンゴムシート

Publications (2)

Publication Number Publication Date
TW200420701A true TW200420701A (en) 2004-10-16
TWI307659B TWI307659B (enrdf_load_stackoverflow) 2009-03-21

Family

ID=33123432

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093105918A TW200420701A (en) 2003-03-07 2004-03-05 Silicone rubber sheet for thermo compression bonding

Country Status (4)

Country Link
JP (1) JP3902558B2 (enrdf_load_stackoverflow)
KR (1) KR101010765B1 (enrdf_load_stackoverflow)
CN (1) CN1247375C (enrdf_load_stackoverflow)
TW (1) TW200420701A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI474923B (zh) * 2008-03-27 2015-03-01 Shinetsu Chemical Co Thermal conductive laminate and method of manufacturing the same
TWI576236B (zh) * 2010-11-17 2017-04-01 信越化學工業股份有限公司 Thermos viscous use of silicone rubber sheet

Families Citing this family (27)

* Cited by examiner, † Cited by third party
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WO2006080445A1 (ja) * 2005-01-31 2006-08-03 Nitto Denko Corporation 圧着離型シート
JP2006281670A (ja) * 2005-04-01 2006-10-19 Shin Etsu Chem Co Ltd 熱圧着用シート
JP4561989B2 (ja) * 2005-04-22 2010-10-13 信越化学工業株式会社 熱圧着用複層ゴムシート
CN100532485C (zh) * 2005-07-04 2009-08-26 李伟强 一种耐高温绝缘胶带
JP5386200B2 (ja) * 2008-04-30 2014-01-15 中興化成工業株式会社 複合シート
JP5058938B2 (ja) * 2008-10-22 2012-10-24 信越化学工業株式会社 熱圧着用シリコーンゴムシート
MY157233A (en) * 2009-03-11 2016-05-13 Shinetsu Chemical Co Connection sheet for solar battery cell electrode, process for manufacturing solar cell module, and solar cell module
JP5272866B2 (ja) 2009-04-15 2013-08-28 信越化学工業株式会社 熱圧着用シリコーンゴムシート
JP5581764B2 (ja) * 2010-03-24 2014-09-03 信越化学工業株式会社 シリコーンゴム組成物及び帯電防止性シリコーンゴム硬化物の耐圧縮永久歪性を向上する方法
JP5363401B2 (ja) * 2010-04-13 2013-12-11 信越化学工業株式会社 熱圧着用シリコーンゴム積層シート及びその製造方法
JP2013175492A (ja) * 2010-06-14 2013-09-05 Panasonic Corp 半導体装置およびその製造方法
CN101879820B (zh) * 2010-06-24 2012-01-25 中国乐凯胶片集团公司 一种用于正喷灯箱胶片的喷墨记录材料
CN102529230B (zh) * 2010-10-19 2015-04-22 信越化学工业株式会社 热压合用硅橡胶片材及电气和/或电子设备部件的接合方法
JP5673444B2 (ja) * 2010-10-19 2015-02-18 信越化学工業株式会社 熱圧着用シリコーンゴムシート及び電気・電子機器部品の接合方法
JP5679211B2 (ja) * 2011-12-02 2015-03-04 信越ポリマー株式会社 転写印刷用転写シートおよびその製造方法
KR101641561B1 (ko) 2014-10-01 2016-07-21 한국전기연구원 접속재용 전도성 실리콘 코팅 접착제 및 그 제조방법
TWI756181B (zh) * 2015-08-28 2022-03-01 日商昭和電工材料股份有限公司 緩衝片用組成物及緩衝片
JP6627681B2 (ja) 2016-07-27 2020-01-08 信越化学工業株式会社 熱圧着用熱伝導性複合シート及びその製造方法
WO2018026035A1 (ko) * 2016-08-04 2018-02-08 (주)피코팩 금속 판을 포함하는 반도체 패키징 구조 및 이의 제조방법
FR3058148A1 (fr) * 2016-10-31 2018-05-04 Compagnie Generale Des Etablissements Michelin Composition de caoutchouc comprenant une charge renforcante specifique
CN108172436A (zh) * 2018-01-29 2018-06-15 苏州市信天游光电材料有限公司 一种手机侧键板及其制作方法
JP7139281B2 (ja) * 2019-04-24 2022-09-20 信越化学工業株式会社 熱伝導性複合テープ
CN110920178B (zh) * 2019-12-05 2022-03-15 北京航空材料研究院有限公司 一种变刚度导电复合材料及其制备方法
KR102650410B1 (ko) * 2022-01-20 2024-03-25 박현배 다회성 열압착용 실리콘 쿠션패드의 제조방법 및 이를 이용한 연성 인쇄회로기판 제조방법
KR102650400B1 (ko) * 2022-01-20 2024-03-26 박현배 다회성 열압착용 실리콘 쿠션패드 및 이를 이용한 연성 인쇄회로기판 제조방법
CN115160790A (zh) * 2022-07-12 2022-10-11 苏州昌和应用材料有限公司 压合机用烧付铁板及其制造方法
KR102835920B1 (ko) * 2023-02-09 2025-07-18 주식회사리온 패턴 구조를 갖는 반도체 제조용 실리콘 패드 및 그 제조방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2631771B2 (ja) * 1991-01-18 1997-07-16 信越化学工業株式会社 離型性シリコーンゴム組成物及びその硬化物
JPH1076606A (ja) * 1996-09-02 1998-03-24 Shin Etsu Chem Co Ltd シリコーンゴム積層体及びその製造方法
JPH10219199A (ja) * 1997-02-05 1998-08-18 Shin Etsu Chem Co Ltd 熱圧着用シリコーンゴムシート
JP3734243B2 (ja) * 2000-01-28 2006-01-11 信越化学工業株式会社 接着性シリコーンゴムシート

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI474923B (zh) * 2008-03-27 2015-03-01 Shinetsu Chemical Co Thermal conductive laminate and method of manufacturing the same
TWI576236B (zh) * 2010-11-17 2017-04-01 信越化學工業股份有限公司 Thermos viscous use of silicone rubber sheet

Also Published As

Publication number Publication date
KR101010765B1 (ko) 2011-01-25
JP3902558B2 (ja) 2007-04-11
CN1247375C (zh) 2006-03-29
TWI307659B (enrdf_load_stackoverflow) 2009-03-21
CN1526547A (zh) 2004-09-08
KR20040078908A (ko) 2004-09-13
JP2004273669A (ja) 2004-09-30

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees