KR101010765B1 - 열압착용 실리콘 고무 시트 - Google Patents

열압착용 실리콘 고무 시트 Download PDF

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Publication number
KR101010765B1
KR101010765B1 KR1020040014903A KR20040014903A KR101010765B1 KR 101010765 B1 KR101010765 B1 KR 101010765B1 KR 1020040014903 A KR1020040014903 A KR 1020040014903A KR 20040014903 A KR20040014903 A KR 20040014903A KR 101010765 B1 KR101010765 B1 KR 101010765B1
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KR
South Korea
Prior art keywords
silicone rubber
weight
component
rubber layer
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020040014903A
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English (en)
Korean (ko)
Other versions
KR20040078908A (ko
Inventor
이꾸오 사꾸라이
다께오 요시다
히사하루 야마구찌
다께시 하시모또
Original Assignee
신에쓰 가가꾸 고교 가부시끼가이샤
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Publication of KR20040078908A publication Critical patent/KR20040078908A/ko
Application granted granted Critical
Publication of KR101010765B1 publication Critical patent/KR101010765B1/ko
Anticipated expiration legal-status Critical
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/04—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B25/042—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material of natural rubber or synthetic rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/20—Layered products comprising a layer of natural or synthetic rubber comprising silicone rubber
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C08K3/14—Carbides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/006—Additives being defined by their surface area
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/16—Applications used for films
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H01L2224/75315—Elastomer inlay

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Wire Bonding (AREA)
KR1020040014903A 2003-03-07 2004-03-05 열압착용 실리콘 고무 시트 Expired - Fee Related KR101010765B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2003-00061136 2003-03-07
JP2003061136A JP3902558B2 (ja) 2003-03-07 2003-03-07 熱圧着用シリコーンゴムシート

Publications (2)

Publication Number Publication Date
KR20040078908A KR20040078908A (ko) 2004-09-13
KR101010765B1 true KR101010765B1 (ko) 2011-01-25

Family

ID=33123432

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020040014903A Expired - Fee Related KR101010765B1 (ko) 2003-03-07 2004-03-05 열압착용 실리콘 고무 시트

Country Status (4)

Country Link
JP (1) JP3902558B2 (enrdf_load_stackoverflow)
KR (1) KR101010765B1 (enrdf_load_stackoverflow)
CN (1) CN1247375C (enrdf_load_stackoverflow)
TW (1) TW200420701A (enrdf_load_stackoverflow)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006080445A1 (ja) * 2005-01-31 2006-08-03 Nitto Denko Corporation 圧着離型シート
JP2006281670A (ja) * 2005-04-01 2006-10-19 Shin Etsu Chem Co Ltd 熱圧着用シート
JP4561989B2 (ja) * 2005-04-22 2010-10-13 信越化学工業株式会社 熱圧着用複層ゴムシート
CN100532485C (zh) * 2005-07-04 2009-08-26 李伟强 一种耐高温绝缘胶带
JP4572243B2 (ja) * 2008-03-27 2010-11-04 信越化学工業株式会社 熱伝導性積層体およびその製造方法
JP5386200B2 (ja) * 2008-04-30 2014-01-15 中興化成工業株式会社 複合シート
JP5058938B2 (ja) * 2008-10-22 2012-10-24 信越化学工業株式会社 熱圧着用シリコーンゴムシート
MY157233A (en) * 2009-03-11 2016-05-13 Shinetsu Chemical Co Connection sheet for solar battery cell electrode, process for manufacturing solar cell module, and solar cell module
JP5272866B2 (ja) 2009-04-15 2013-08-28 信越化学工業株式会社 熱圧着用シリコーンゴムシート
JP5581764B2 (ja) * 2010-03-24 2014-09-03 信越化学工業株式会社 シリコーンゴム組成物及び帯電防止性シリコーンゴム硬化物の耐圧縮永久歪性を向上する方法
JP5363401B2 (ja) * 2010-04-13 2013-12-11 信越化学工業株式会社 熱圧着用シリコーンゴム積層シート及びその製造方法
JP2013175492A (ja) * 2010-06-14 2013-09-05 Panasonic Corp 半導体装置およびその製造方法
CN101879820B (zh) * 2010-06-24 2012-01-25 中国乐凯胶片集团公司 一种用于正喷灯箱胶片的喷墨记录材料
CN102529230B (zh) * 2010-10-19 2015-04-22 信越化学工业株式会社 热压合用硅橡胶片材及电气和/或电子设备部件的接合方法
JP5673444B2 (ja) * 2010-10-19 2015-02-18 信越化学工業株式会社 熱圧着用シリコーンゴムシート及び電気・電子機器部品の接合方法
JP5381964B2 (ja) * 2010-11-17 2014-01-08 信越化学工業株式会社 熱圧着用シリコーンゴムシート
JP5679211B2 (ja) * 2011-12-02 2015-03-04 信越ポリマー株式会社 転写印刷用転写シートおよびその製造方法
KR101641561B1 (ko) 2014-10-01 2016-07-21 한국전기연구원 접속재용 전도성 실리콘 코팅 접착제 및 그 제조방법
TWI756181B (zh) * 2015-08-28 2022-03-01 日商昭和電工材料股份有限公司 緩衝片用組成物及緩衝片
JP6627681B2 (ja) 2016-07-27 2020-01-08 信越化学工業株式会社 熱圧着用熱伝導性複合シート及びその製造方法
WO2018026035A1 (ko) * 2016-08-04 2018-02-08 (주)피코팩 금속 판을 포함하는 반도체 패키징 구조 및 이의 제조방법
FR3058148A1 (fr) * 2016-10-31 2018-05-04 Compagnie Generale Des Etablissements Michelin Composition de caoutchouc comprenant une charge renforcante specifique
CN108172436A (zh) * 2018-01-29 2018-06-15 苏州市信天游光电材料有限公司 一种手机侧键板及其制作方法
JP7139281B2 (ja) * 2019-04-24 2022-09-20 信越化学工業株式会社 熱伝導性複合テープ
CN110920178B (zh) * 2019-12-05 2022-03-15 北京航空材料研究院有限公司 一种变刚度导电复合材料及其制备方法
KR102650410B1 (ko) * 2022-01-20 2024-03-25 박현배 다회성 열압착용 실리콘 쿠션패드의 제조방법 및 이를 이용한 연성 인쇄회로기판 제조방법
KR102650400B1 (ko) * 2022-01-20 2024-03-26 박현배 다회성 열압착용 실리콘 쿠션패드 및 이를 이용한 연성 인쇄회로기판 제조방법
CN115160790A (zh) * 2022-07-12 2022-10-11 苏州昌和应用材料有限公司 压合机用烧付铁板及其制造方法
KR102835920B1 (ko) * 2023-02-09 2025-07-18 주식회사리온 패턴 구조를 갖는 반도체 제조용 실리콘 패드 및 그 제조방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04236265A (ja) * 1991-01-18 1992-08-25 Shin Etsu Chem Co Ltd 離型性シリコーンゴム組成物及びその硬化物
JPH1076606A (ja) * 1996-09-02 1998-03-24 Shin Etsu Chem Co Ltd シリコーンゴム積層体及びその製造方法
JPH10219199A (ja) * 1997-02-05 1998-08-18 Shin Etsu Chem Co Ltd 熱圧着用シリコーンゴムシート
JP2001207141A (ja) * 2000-01-28 2001-07-31 Shin Etsu Chem Co Ltd 接着性シリコーンゴムシート

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04236265A (ja) * 1991-01-18 1992-08-25 Shin Etsu Chem Co Ltd 離型性シリコーンゴム組成物及びその硬化物
JPH1076606A (ja) * 1996-09-02 1998-03-24 Shin Etsu Chem Co Ltd シリコーンゴム積層体及びその製造方法
JPH10219199A (ja) * 1997-02-05 1998-08-18 Shin Etsu Chem Co Ltd 熱圧着用シリコーンゴムシート
JP2001207141A (ja) * 2000-01-28 2001-07-31 Shin Etsu Chem Co Ltd 接着性シリコーンゴムシート

Also Published As

Publication number Publication date
JP3902558B2 (ja) 2007-04-11
CN1247375C (zh) 2006-03-29
TWI307659B (enrdf_load_stackoverflow) 2009-03-21
CN1526547A (zh) 2004-09-08
KR20040078908A (ko) 2004-09-13
TW200420701A (en) 2004-10-16
JP2004273669A (ja) 2004-09-30

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