TW200420701A - Silicone rubber sheet for thermo compression bonding - Google Patents

Silicone rubber sheet for thermo compression bonding

Info

Publication number
TW200420701A
TW200420701A TW093105918A TW93105918A TW200420701A TW 200420701 A TW200420701 A TW 200420701A TW 093105918 A TW093105918 A TW 093105918A TW 93105918 A TW93105918 A TW 93105918A TW 200420701 A TW200420701 A TW 200420701A
Authority
TW
Taiwan
Prior art keywords
silicone rubber
weight
parts
rubber layer
metal
Prior art date
Application number
TW093105918A
Other languages
Chinese (zh)
Other versions
TWI307659B (en
Inventor
Ikuo Sakurai
Takeo Yoshida
Hisaharu Yamaguchi
Takeshi Hashimoto
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW200420701A publication Critical patent/TW200420701A/en
Application granted granted Critical
Publication of TWI307659B publication Critical patent/TWI307659B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/04—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B25/042—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material of natural rubber or synthetic rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/20—Layered products comprising a layer of natural or synthetic rubber comprising silicone rubber
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C08K3/14—Carbides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/006—Additives being defined by their surface area
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/16—Applications used for films
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H01L2224/75315—Elastomer inlay

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Wire Bonding (AREA)

Abstract

A flexible thermo compression bonding silicone rubber sheet has a low production cost, and has the following properties: good surface demolding property, non-tacky to the surrounding device and bonded adhesion, non-tacky to anisotropic electrically conductive bonding agent, durable, high thermal resistance, high strength, and capable uniformly transmitting compression force. A silicone rubber sheet is formed of a plurality of silicone rubber layers in which at least one face of a first silicone rubber layer is installed with a second silicone rubber layer. The first silicone rubber layer comprises: (A) 100 parts by weight of an organopolysiloxane with an average polymerization degree of over 200; (B) carbon black removed of moisture and containing less than 0.5 wt% of volatiles; (C) fine silica with a BET specific surface area of above 50 m2/g; (D) 0~1,600 parts by weight of at least one component selected from the following group: using metal as an ingredient, metal oxide of a compound other than the above ingredient (C), metal nitride, and metal carbide; and (E) a hardener, thereby forming a silicone rubber layer with a composition consisting of 10~1,600 parts by weight of the ingredients (B), (C) and (D), and 0~150 parts by weight of the ingredients (B) and (C). The second silicone rubber layer is formed of a composition consisting of (F) 100 parts by weight of an organopolysiloxane with an average degree of polymerization of more than 100, (G) 0~100 parts by weight of fine silica with a BET specific surface area of above 50 m2/g, and (H) a hardener.
TW093105918A 2003-03-07 2004-03-05 Silicone rubber sheet for thermo compression bonding TW200420701A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003061136A JP3902558B2 (en) 2003-03-07 2003-03-07 Silicone rubber sheet for thermocompression bonding

Publications (2)

Publication Number Publication Date
TW200420701A true TW200420701A (en) 2004-10-16
TWI307659B TWI307659B (en) 2009-03-21

Family

ID=33123432

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093105918A TW200420701A (en) 2003-03-07 2004-03-05 Silicone rubber sheet for thermo compression bonding

Country Status (4)

Country Link
JP (1) JP3902558B2 (en)
KR (1) KR101010765B1 (en)
CN (1) CN1247375C (en)
TW (1) TW200420701A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI474923B (en) * 2008-03-27 2015-03-01 Shinetsu Chemical Co Thermal conductive laminate and method of manufacturing the same
TWI576236B (en) * 2010-11-17 2017-04-01 信越化學工業股份有限公司 Thermos viscous use of silicone rubber sheet

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006080445A1 (en) * 2005-01-31 2006-08-03 Nitto Denko Corporation Release sheet for compression bonding
JP2006281670A (en) * 2005-04-01 2006-10-19 Shin Etsu Chem Co Ltd Sheet for thermo-compression bonding
JP4561989B2 (en) * 2005-04-22 2010-10-13 信越化学工業株式会社 Multi-layer rubber sheet for thermocompression bonding
JP5386200B2 (en) * 2008-04-30 2014-01-15 中興化成工業株式会社 Composite sheet
JP5058938B2 (en) * 2008-10-22 2012-10-24 信越化学工業株式会社 Silicone rubber sheet for thermocompression bonding
US20120012153A1 (en) * 2009-03-11 2012-01-19 Shin-Etsu Chemical Co., Ltd. Connection sheet for solar battery cell electrode, process for manufacturing solar cell module, and solar cell module
JP5272866B2 (en) 2009-04-15 2013-08-28 信越化学工業株式会社 Silicone rubber sheet for thermocompression bonding
JP5581764B2 (en) * 2010-03-24 2014-09-03 信越化学工業株式会社 Silicone rubber composition and method for improving compression set resistance of cured antistatic silicone rubber
JP5363401B2 (en) * 2010-04-13 2013-12-11 信越化学工業株式会社 Silicone rubber laminated sheet for thermocompression bonding and method for producing the same
JP2013175492A (en) * 2010-06-14 2013-09-05 Panasonic Corp Semiconductor device and method of manufacturing the same
CN101879820B (en) * 2010-06-24 2012-01-25 中国乐凯胶片集团公司 Ink-jet recording material used for full-face spray light box film
JP5673444B2 (en) * 2010-10-19 2015-02-18 信越化学工業株式会社 Silicone rubber sheet for thermocompression bonding and joining method of electrical / electronic equipment parts
CN102529230B (en) * 2010-10-19 2015-04-22 信越化学工业株式会社 Silicon rubber sheet for thermal compression and method for joining electrical and/or electronic device members
JP5679211B2 (en) * 2011-12-02 2015-03-04 信越ポリマー株式会社 Transfer sheet for transfer printing and manufacturing method thereof
KR101641561B1 (en) 2014-10-01 2016-07-21 한국전기연구원 Conductive silicon coating agent for connector and a method of manufacturing thereof
KR102471724B1 (en) * 2015-08-28 2022-11-25 쇼와덴코머티리얼즈가부시끼가이샤 Composition for buffer sheets, and buffer sheet
JP6627681B2 (en) 2016-07-27 2020-01-08 信越化学工業株式会社 Thermal conductive composite sheet for thermocompression bonding and method for producing the same
WO2018026035A1 (en) * 2016-08-04 2018-02-08 (주)피코팩 Semiconductor packaging structure comprising metal plate and manufacturing method therefor
FR3058148A1 (en) * 2016-10-31 2018-05-04 Compagnie Generale Des Etablissements Michelin RUBBER COMPOSITION COMPRISING A SPECIFIC REINFORCING LOAD
CN108172436A (en) * 2018-01-29 2018-06-15 苏州市信天游光电材料有限公司 A kind of mobile phone side key panel and preparation method thereof
JP7139281B2 (en) * 2019-04-24 2022-09-20 信越化学工業株式会社 thermally conductive composite tape
CN110920178B (en) * 2019-12-05 2022-03-15 北京航空材料研究院有限公司 Variable-rigidity conductive composite material and preparation method thereof
KR102650410B1 (en) * 2022-01-20 2024-03-25 박현배 Manufacturing method of hot lamination type cushion pad and manufacturing method of flexible printed circuit board using thereof
KR102650400B1 (en) * 2022-01-20 2024-03-26 박현배 A hot lamination type cushion pad and manufacturing method of flexible printed circuit board
CN115160790A (en) * 2022-07-12 2022-10-11 苏州昌和应用材料有限公司 Sintered iron plate for press and manufacturing method thereof

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2631771B2 (en) * 1991-01-18 1997-07-16 信越化学工業株式会社 Release silicone rubber composition and cured product thereof
JPH1076606A (en) * 1996-09-02 1998-03-24 Shin Etsu Chem Co Ltd Silicone rubber laminate and manufacture thereof
JPH10219199A (en) * 1997-02-05 1998-08-18 Shin Etsu Chem Co Ltd Silicone rubber sheet for thermal contact bonding
JP3734243B2 (en) * 2000-01-28 2006-01-11 信越化学工業株式会社 Adhesive silicone rubber sheet

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI474923B (en) * 2008-03-27 2015-03-01 Shinetsu Chemical Co Thermal conductive laminate and method of manufacturing the same
TWI576236B (en) * 2010-11-17 2017-04-01 信越化學工業股份有限公司 Thermos viscous use of silicone rubber sheet

Also Published As

Publication number Publication date
CN1247375C (en) 2006-03-29
CN1526547A (en) 2004-09-08
TWI307659B (en) 2009-03-21
KR101010765B1 (en) 2011-01-25
JP3902558B2 (en) 2007-04-11
JP2004273669A (en) 2004-09-30
KR20040078908A (en) 2004-09-13

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees