CN1236203A - 电子部件和制造这种电子部件的方法 - Google Patents

电子部件和制造这种电子部件的方法 Download PDF

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CN1236203A
CN1236203A CN99104820A CN99104820A CN1236203A CN 1236203 A CN1236203 A CN 1236203A CN 99104820 A CN99104820 A CN 99104820A CN 99104820 A CN99104820 A CN 99104820A CN 1236203 A CN1236203 A CN 1236203A
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synthetic resin
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山本惠造
山木知尚
栉比裕一
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Murata Manufacturing Co Ltd
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Abstract

本发明提供了一种电子部件,包含:电子部件主体,它包含复合材料主体,所述复合材料主体是由其中散布有作为功能材料的陶瓷粉末和使电镀成为可实行的催化剂的合成树脂制成的;及一层其中散布有作为功能材料的陶瓷粉末的合成树脂复合材料层;所述层覆盖所述复合材料主体上除了要配置电极的部分之外的外表面;以及配置在所述电子部件主体的外表面上的电极。上面描述的电子部件的形状极为灵活,尺寸精度高,并且易于实现所要求的电特性。

Description

电子部件和制造这种电子部件的方法
本发明涉及用于例如介质天线和线圈部件的各种目的的一种电子部件，以及生产这种电子部件的方法，尤其涉及使用复合材料的电子部件，所述复合材料是由合成树脂和陶瓷粉末作为功能材料而制成的，以及生产这种电子部件的方法。
陶瓷和合成树脂已经广泛地用作构成电子部件的材料。
但是，当使用陶瓷时，由于电子部件通过烧制而形成，故难以方便地得到不同形状的电子部件。例如，在第5-55529号未审查的日本实用新型申请中，示出一种由陶瓷制成，并具有三维形状的陶瓷电子部件。这里，使用的是经过烧结的陶瓷材料，其中需要电镀的部分由具有催化作用的陶瓷材料构成，从而这部分能够被电镀，而不需电镀的部分由不允许电镀的陶瓷材料构成。因此，即使使用复杂的三维形状的烧结材料，我们知道能够在所需的部分通过化学镀成功地形成电极。
但是，由于使用陶瓷，故需要复杂的过程以获得三维形状，并且由此得到的三维电子部件的尺寸的总精度是不够的。
另一方面，已经提出使用合成树脂生产三维电路板的一种方法。例如，第63-128181号日本未审查的专利申请和第2603828号日本专利揭示了这样一种得到三维电路板的方法，即通过两次模制处理而得到模制产品，使用含诸如钯之类的催化剂的树脂以便电镀和不允许电镀的树脂以及模制产品上的电极通过光刻或一般的电镀法形成。
由于合成树脂有极好的成型性，通过这些使用合成树脂的方法，可以得到高度精密的三维形状电路板。
但是，这些使用合成树脂的三维电路板只用作支承导电路径的一部分，诸如介质常数、磁导性等等的合成树脂的电特性未被积极地应用。
另外，第3-4581号未审查的日本专利申请中揭示了一种复合电路板，它是通过使用其中散布有陶瓷粉末的合成树脂的复合树脂材料整主体地形成的。这里，板由两部分组成，树脂的复合材料中散布有介质陶瓷粉末制成第一部分和树脂的复合材料中散布有磁性材料粉末制成第二部分，即，电路板如此地由第一和第二部分构成，而它们彼此具有不同的电特性。由第一和第二电路元件获得复合电路，其中第一和第二电路元件由第一和第二部分构成。
但是第一和第二电路元件分别只由第一和第二部分制成。
即，迄今为止，还未发现任何利用合成树脂的电特性和容易成型性的片型电子部件。
本发明的目的是提供一种新的电子部件，不仅使用合成树脂的易于成型性，还使用其电特性，以及生产这种电子部件的方法。
本发明提供了一种电子部件，包含：电子部件主体，包含：由合成树脂制成的复合材料主体，其中散布有陶瓷粉末作为功能材料以及使电镀成为可实行的以及一层合成树脂的复合材料层，其中散布有作为功能材料的陶瓷粉末，所述复合材料主体上除配置电极处之外的外表面都被所述层覆盖；以及配置在所述电子部件主体的外表面上的电极。
根据上述结构和安排，由于电子部件由合成树脂的的复合材料制成，并且其中散布有功能陶瓷粉末或触须，故电子部件能够制得较轻，同时由于复合材料的成型性极好，故可以容易地得到尺寸精度极好和各种形状的电子部件。相应地，能够轻易地得到不同形状的电子部件。另外，通过调节上述合成树脂和作为功能材料的陶瓷粉末或触须的种类和混合比，能够容易地实现想要的电特性。
由此，和使用传统烧结的陶瓷材料的电子部件相比，在需要时可以容易地提供具有各种形状和电特性的电子部件。
在上面描述的电子部件中，可以从由介质陶瓷粉末和磁性陶瓷粉末组成的组中选出作为功能材料的所述陶瓷粉末。
根据上面描述的结构和安排，使用介质陶瓷粉末或磁性陶瓷粉末作为功能材料的陶瓷粉末。相应地，例如当使用介质陶瓷粉末时，有可能提供电容器和介质天线。当使用磁性陶瓷粉末时，有可能提供线圈部件和其它部件。
在上面描述的电子部件中，所述电子部件可以由其中散布有介质陶瓷粉末的合成树脂制成，并且在所述电子部件主体的外表面上配置多个所述电极，由此，所述电子部件构成介质天线。
根据上述结构和安排，能够容易地提供较轻的、尺寸精度高的、并具有所要求的特性的介质天线。
在上面描述的电子部件中，所述电子部件可以由其中散布有磁性陶瓷粉末的合成树脂构成，并且所述电极配置在所述电子部件主体的外表面上，由此所述电子部件构成线圈部件。
根据上面描述的结构和安排，能够容易地提供较轻的、尺寸精度极好的、并给出所要求的电感的线圈部件。
本发明还提供了一种电子部件的制造方法，包含步骤：得到由合成树脂制成的主要模制产品，在合成树脂中散布有作为功能材料的陶瓷粉末和使电镀成为可实行的催化剂；通过形成一层，在合成树脂中散布有作为功能材料的陶瓷粉末的合成树脂的复合材料层，以覆盖主要模制产品上除形成电极部分之外的部分外表面；并将第二模制产品上除了形成一层复合材料层的部分之外的部分进行电镀，和在其上形成电极以得到第二产品。
根据上面描述的方法，当通过电镀在第二模制产品的外表面上形成电极时，复合材料层不能被电镀，起掩模的作用，并且相应地，电极能够容易而精确地形成在没有形成复合材料层的部分。结果，能够容易地制造本发明的每一种上面描述的电子部件。
在上面描述的方法中，可以从由介质陶瓷粉末和磁性陶瓷粉末组成的组中选出作为功能材料的所述陶瓷粉末。
当使用介质陶瓷粉末时，能够容易地提供诸如介质天线和电容器之类的介质元件，而当使用磁性陶瓷粉末时，能够容易地提供诸如线圈部件和其它的部件之类的电感部件。
下面参照附图描述本发明，本发明的其它特点和优点将是显然的。
图1示出介质天线透视图，它作为和本发明的第一较佳实施例相关的电子部件。
图2示出主要模制产品透视图，用于制造第一较佳实施例的介质天线。
图3示出第二模制产品透视图，由图2中所示的主要模制产品制成，在其外表面上形成一层复合材料层。
图4是沿图1中的X-X线的截面图。
图5是介质天线透视图，作为和本发明的第二较佳实施例相关的电子部件。
图6是图5所示的介质天线颠倒过来的透视图。
图7是解释在第二较佳实施例的制造中所制备的母板透视图。
图8示出在第二较佳实施例的介质天线的制造中所制备的作为第二模制产品的电子部件透视图。
图9是从图8所示的电子部件的下表面一侧看的透视图。
图10是线圈透视图，作为和第三较佳实施例相关的电子部件。
第一较佳实施例
参照图1，介质天线1具有电子部件主体2，为合成树脂的矩形板的形状，合成树脂中散布有介质陶瓷粉末和使电镀成为可实行的催化剂。并不特别限制上述合成树脂和介质陶瓷粉末，选择每一种材料，从而使之具有适当的介质常数，以构成介质天线1。
对如上所述的合成树脂，可以使用例如，SPS(syndiotactic polystyrene间同立构聚苯乙烯)、LCP(liquid crystal polymer液晶聚合物)等等，对介质陶瓷粉末，可以使用CaTiO3,BaTiO3等等。
还有，并不特别限制介质陶瓷粉末与散布有介质陶瓷粉末的合成树脂的比例，但介质陶瓷粉末最好为总的合成树脂的70vol.％或更少，或当考虑到电子部件的成型性时，最好是50vol.％或者更少。当介质陶瓷粉末的含量超过70vol.％时，成型性可能削弱。
在第一较佳实施例中，构成上述电子部件主体2的复合材料的相对介质常数定为4到20级。即，为了实现这一相对介质常数，选择上述合成树脂和介质陶瓷粉末的种类和混合比例。
在电子部件主体2的外表面上，形成电极3到7。形成电极3到7，以便通过电子部件2的侧表面2b,2c使上表面2a延伸到下表面2d。
形成电极3到7，以构成片型介质天线，并且并不特别限于附图中所示的形状。即，根据所要求的介质天线，适当选择电极的数量和形式。另外，在随后描述的第二实施例中，解释片型介质天线的更为具体的例子。
电极3到7能够以诸如电镀、真空蒸镀和溅镀等适当的方法形成，构成电极3到7的材料没有特别的限制，可以使用Ag,Cu,Ni,Al，等合适的金属或合金。
当电极部件主体2由散布有介质陶瓷粉末的合成树脂的复合材料制成时，片型天线1和用烧结的陶瓷材料制成的相比可制得较轻。另外，由于成型性极好，可得到各种形状的天线，同时和用烧结陶瓷材料的天线相比，尺寸精度有所提高。另外，通过改变合成树脂和介质陶瓷粉末的种类以及它们的混合比例，可容易地实现所要求的相对介质常数，并容易地提供具有所要求的电特性的介质天线。
介质天线1的制造方法没有特别的限制，在构成了电子部件主体2后，电极3到7可以以适当的方式形成。但是，最好使用参照附图2到4解释的下述制造方法。
在这个较佳的制造方法中，首先，得到图2的透视图所示的主要模制产品8。通过适当的模制方法，诸如注模法，可以得到主要的模制产品8，采用散布有介质陶瓷粉末和催化剂使电镀成为可实行的合成树脂的复合材料。如上所述的催化剂，可以使用合适的催化剂，使得可通过电镀在电子部件主体2的外表面上形成电极3到7。这些催化剂没有特别的限制，但可以例举出钯和金。
接着形成一层其中散布有介质陶瓷粉末的合成树脂的复合材料层，以覆盖主要模制产品8的外表面上除形成电极3到7的部分之外的一个部分，以得到第二产品。
图3中示出按照这种方法得到的第二模制产品。在第二模制产品9中，形成一层复合材料层10，以便覆盖除形成图1所示的电极3到7的部分之外的一个部分。这层复合材料层10不含催化剂，故相应地不能电镀这层复合材料层10的外表面。可通过将主要模制产品8安置在模具中，并注入复合材料，形成这层复合材料层10，其中模具具有相应于形成电极3到7的凸出部分。或者可通过将炙热的复合材料涂复在主要模制产品8的外表面上，形成复合材料层，然后通过冷却使之固化，在这种情况下，除了要形成电极3到7的部分之外，具有开口的掩模和主要的模制产品8接触。然后，接下来的具体方法没有特别的限制。
上面描述述的电极部件主体2由第二模制产品9构成，所述模制产品9按照上述方法得到。通过将上述金属电镀到如此得到的电子部件主体2的外表面上，形成电极3到7(见图4)。在这种情况下，在电子部件主体2的外表面是，即，上述第二模制产品9，由于只有主要模制产品8的外表面能够电镀，故能够容易的通过电镀形成电极3到7，而不需任何掩模。
第二较佳实施例
根据上述第一较佳实施例，第二较佳实施例是更为具体的片型介质天线的例子。
参照图5和6，片型介质天线11由电子部件主体12构成，具有矩形板的形状。电子部件主体12由和第一较佳实施例中的电子部件主体2相同的材料制成。
在电子部件主体12的上表面12a上形成电极13。还有，在下表面12d上形成电极14。另外，在电子部件主体12的下表面的中间形成凹入部分，而在下表面的整个表面上形成电极14，以致延伸到凹入部分的内部。
另一方面，在电子部件主体12的上表面12a上，沿对角线方向相对的一对拐角部分分别形成有切割的部分12e、12f，在切割部分12e,12f形成电极15a,15b。
另外，在上表面12a的较长的边缘中间形成切割部分12g、12h，以便沿宽度方向相互面对，并且在切割部分12g、12h形成电极16a、16b。
另外，在上表面12a上另外一对沿对角线方向相对的拐角部分形成切害部分12i、12j，它们沿电子部件主体12的厚度方向切割，并且在切割部分12i、12j形成电极17a、17b。电极17a、17b电气连接到形成在电子部件主体12的下表面12d上的电极14。
另外，在下表面12d的一侧上，在不同于其中形成有电极17a、17b的拐角部分的另一对拐角部分中，分别形成切割部分12k、12l。在切割部分12k、12l中分别形成电极19a、19b，并且电极19a、19b电气连接到电极14。
另外，在下表面12d上沿较长边方向延伸的边缘的中间形成切割部分12m、12n，并形成电极14，以延伸到切割部分12m、12n。另外，使切割部分12m、12n分别沿厚度方向对着形成在上侧侧面上的切割部分12g、12h。
在上述介质天线11的制造中，首先，制备矩形的母板21，如图7的透视图所示。母板21可以以适当的模制方法形成，诸如注模法，这种方法使用其中散布有介质陶瓷粉末的合成树脂的复合材料。在母板21中，形成多个在图7中注有加号标记的通孔23，以及注有减号标记的孔24。形成通孔23，以便沿厚度方向穿透母板，形成孔24，以便具有底部表面。另外，在形成孔24的部分中，还形成从下表面的侧面延伸，并具有其底部表面的孔。
另外，在作为构成母板21的功能材料的合成树脂和陶瓷粉末的复合材料中，散布有催化剂，从而母板能够如前所述地电镀。
接着，通过沿图7中的虚线B,C切割母板而得到主要模制产品21。主要模制产品21A的外表面可以被电镀。
接着，通过形成一层其中散布有介质陶瓷粉末的合成树脂的复合材料层，以便覆盖主要模制产品21A的外表面上，除要电镀形成上述电极之外的一部分，得到如图8中所示的电子部件主体12。在图8中，电子部件主体12上未由复合材料层覆盖的部分，即形成上述各电极的部分，用没有圆点标记来表示。
接着，在上述电子部件主体12的外表面上电镀诸如Ag,Cu等金属材料，能够得到图5和6中所示的片型介质天线11。在这种情况下，能够电镀无复合材料层覆盖的部分，但不能电镀有复合材料层覆盖的部分。相应地，在第一较佳实施例的情况下，不需使用任何掩模，能够通过电镀容易地形成每一个电极。
第三较佳实施例
第三较佳实施例被应用到线圈部件。
参照图10，线圈部件31由形成在柱形电子部件32的外表面上的线圈形状的电极33构成。电极部件32由其中散布有磁性陶瓷粉末的合成树脂的复合材料制成。作为合成树脂，可以使用例如聚苯撑硫、LCP等等，虽然对它们没有特别的限制。另外，作为磁性陶瓷粉末，最好可以使用适当的铁氧主体粉末，诸如NiZn组、MnZn组等等，虽然对它们没有特别的限制。
在这种情况下，当将铁氧主体粉末散布到合成树脂中时，混合比例没有特别的限制，并且能够进行选择，以便实现线圈部件31所需的磁导率。
较好地，当采用聚苯撑硫作为合成树脂，并且采用NiZn组铁氧主体粉末作为铁氧主体粉末时，铁氧主体粉末的含量最好为70vol.％或更少，更好地是50vol.％或更少。如果含量超过70vol.％，当用上述复合材料形成电子部件32时，可能削弱成型性。
关于构成上述电子部件32的复合材料的磁导率，虽然磁导率是根据所要求的线圈部件适当地确定的，但在本实施例中磁导率μ大约为10。
线圈形状的电极33能够通过电镀适当的材料或合金，诸如Ag,Cu,Ni等等形成。在这种情况下，用和第一和第二实施例相同的方法，当得到电子部件31时，最好采用得到主要模制产品的方法，这种方法是通过使用其中散布有催化剂的复合材料，从而可电镀主要模制产品的表面，以及得到第二模制产品的方法，这种方法是通过用复合材料覆盖主要模制产品的外表面上除了形成电极33的部分之外的部分，并电镀第二模制产品的外表面。
即，可较好地使用上述制造方法，这种方法使用一层复合材料层作为掩模，不允许不需要电镀的部分暴露。但是，在第三实施例中，线圈部件31的制造方法也没有特殊的限制。
当电极部件32由其中散布有磁性陶瓷粉末的合成树脂的复合材料制成时，本实施例的线圈部件31能够制得较轻，可容易地变化电子部件32的形状，并且可改善尺寸精度。另外，通过改变合成树脂和磁性陶瓷粉末的种类和混合比例，能够容易地实现所要求的磁导率。
其它实施例
在第一到第三较佳实施例中，示出将介质陶瓷粉末和磁性陶瓷粉末用作功能陶瓷粉末的例子，但在本发明中，其它功能陶瓷粉末，诸如压电陶瓷粉末等等可用为功能陶瓷粉末。另外，不仅可使用粉末状的材料，还可使用触须。
另外，在电子部件上形成电极的方法没有特殊的限制，除电镀外，可使用其它方法，诸如真空蒸镀和溅镀。
另外，在第一到第三实施例中，只在电子部件的外表面上形成电极，但也可在电子部件的内部形成内部电极。
虽然已经参照本发明的较佳实施例，详细地示出和描述了本发明，对熟悉本领域的人可知道在本发明中可对上述的和其它的细节上和形式上作出变化，而不背离本发明的主旨。

Claims (6)

1．一种电子部件，其特征在于包含：
电子部件主体，包含：其中散布有作为功能材料的陶瓷粉末和使电镀成为可实行的催化剂的合成树脂制成的复合材料主体；一层其中散布有作为功能材料的陶瓷粉末的合成树脂复合材料层，所述层覆盖所述复合材料主体的外表面上除了要配置电极的那部分；及
配置在所述电子部件主体的外表面上的电极。
2．如权利要求1所述的电子部件，其特征在于所述作为功能材料的陶瓷粉末是从由介质陶瓷粉末和磁性陶瓷粉末组成的组中选出的。
3．如权利要求1所述的电子部件，其特征在于所述电子部件由其中散布有介质陶瓷粉末的合成树脂制成，并且多个所述电极配置在所述电子部件主体的外表面上，由此所述电子部件构成介质天线。
4．如权利要求1所述的电子部件，其特征在于所述电子部件由其中散布有磁性陶瓷粉末的合成树脂制成，所述电极配置在所述电子部件主体的外表面上，由此所述电子部件构成线圈部件。
5．一种制造电子部件的方法，其特征在于包含步骤：
得到由合成树脂制成的主要模制产品，在所述合成树脂中散布有作为功能材料的陶瓷粉末以及使电镀成为可实行的催化剂；
通过形成一层合成树脂的复合材料层得到第二产品，在所述合成树脂中散布有作为功能材料的陶瓷粉末，以覆盖主要模制产品上除了要形成电极的部分之外的部分外表面；及
电镀第二模制产品上除了形成复合材料层的部分，并在其上形成电极。
6．如权利要求5所述的方法，其特征在于所述作为功能材料的陶瓷粉末从由介质陶瓷粉末和磁性陶瓷粉末组成的组中选出。
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