CN1223411C - 附着膜回收装置和附着膜的回收方法 - Google Patents

附着膜回收装置和附着膜的回收方法 Download PDF

Info

Publication number
CN1223411C
CN1223411C CNB021198357A CN02119835A CN1223411C CN 1223411 C CN1223411 C CN 1223411C CN B021198357 A CNB021198357 A CN B021198357A CN 02119835 A CN02119835 A CN 02119835A CN 1223411 C CN1223411 C CN 1223411C
Authority
CN
China
Prior art keywords
film
liquid
coherent film
coherent
adherent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB021198357A
Other languages
English (en)
Chinese (zh)
Other versions
CN1396042A (zh
Inventor
泽江清
迫野郁夫
冈博史
山本圭三
咲花由和
上野睦弘
上野龙三
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Publication of CN1396042A publication Critical patent/CN1396042A/zh
Application granted granted Critical
Publication of CN1223411C publication Critical patent/CN1223411C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
    • B08B2203/002—Details of cleaning machines or methods involving the use or presence of liquid or steam the liquid being a degassed liquid

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Chemical Vapour Deposition (AREA)
CNB021198357A 2001-03-29 2002-03-29 附着膜回收装置和附着膜的回收方法 Expired - Fee Related CN1223411C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001097306A JP2002292346A (ja) 2001-03-29 2001-03-29 付着膜回収装置および付着膜の回収方法
JP97306/2001 2001-03-29
JP97306/01 2001-03-29

Publications (2)

Publication Number Publication Date
CN1396042A CN1396042A (zh) 2003-02-12
CN1223411C true CN1223411C (zh) 2005-10-19

Family

ID=18951109

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB021198357A Expired - Fee Related CN1223411C (zh) 2001-03-29 2002-03-29 附着膜回收装置和附着膜的回收方法

Country Status (5)

Country Link
JP (1) JP2002292346A (ko)
KR (1) KR100447369B1 (ko)
CN (1) CN1223411C (ko)
SG (1) SG97232A1 (ko)
TW (1) TW531452B (ko)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050028838A1 (en) * 2002-11-25 2005-02-10 Karl Brueckner Cleaning tantalum-containing deposits from process chamber components
US7964085B1 (en) 2002-11-25 2011-06-21 Applied Materials, Inc. Electrochemical removal of tantalum-containing materials
KR100629073B1 (ko) 2004-12-29 2006-09-26 엘지전자 주식회사 조립식 방착판
JP4895859B2 (ja) * 2007-02-23 2012-03-14 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
KR101324131B1 (ko) * 2007-06-28 2013-11-01 삼성코닝정밀소재 주식회사 산화 주석 분말, 그 제조 방법 및 그 제조용 반응 장치
US20090000641A1 (en) * 2007-06-28 2009-01-01 Applied Materials, Inc. Methods and apparatus for cleaning deposition chamber parts using selective spray etch
JP5180661B2 (ja) * 2008-04-18 2013-04-10 株式会社ディスコ スピンナ洗浄装置および加工装置
ITLE20100001A1 (it) * 2010-03-19 2010-06-18 Antonio Andrea Gentile Sistema a palette per la raccolta-recupero di metalli in apparati per deposizione di film sottili.
JP5726450B2 (ja) * 2010-07-16 2015-06-03 信越化学工業株式会社 反応炉洗浄装置および反応炉洗浄方法
CN103270186B (zh) 2010-12-23 2015-01-14 夏普株式会社 成膜材料的回收方法
CN103270187A (zh) 2010-12-27 2013-08-28 夏普株式会社 蒸镀装置和回收装置
KR101260657B1 (ko) 2011-09-16 2013-05-10 주식회사 에스엠이씨 관절 로봇형 수직 승강장치
CN103302598B (zh) * 2012-03-09 2016-06-08 海纳微加工股份有限公司 真空压差式微加工装置及方法
JP5779132B2 (ja) * 2012-03-28 2015-09-16 株式会社日立産機システム クリーンシステム
KR102034763B1 (ko) * 2012-10-09 2019-10-22 삼성디스플레이 주식회사 공기압을 이용한 라미네이션 장치 및 이를 이용한 비접촉식 라미네이션 방법
CN103170486B (zh) * 2013-03-29 2016-01-06 北京七星华创电子股份有限公司 一种自清洗腔体
CN105834917B (zh) * 2016-04-28 2018-09-18 浙江工业大学 一种气液固三相磨粒流循环加工方法
DE102017208329A1 (de) * 2017-05-17 2018-11-22 Ejot Gmbh & Co. Kg Berührungsfreie Reinigungsvorrichtung
US11486042B2 (en) * 2018-01-18 2022-11-01 Viavi Solutions Inc. Silicon coating on hard shields
CN108972363A (zh) * 2018-07-20 2018-12-11 合肥研新离合器有限公司 一种离合器连接盘用抛丸加工设备
CN109018578B (zh) * 2018-07-27 2024-05-03 江苏云天高胜机器人科技有限公司 蓄电池上外壳保护膜的去膜装置
CN113878501B (zh) * 2021-09-02 2023-12-19 宁海县勇昊汽车部件有限公司 一种基于电磁波监测的表面处理系统及控制方法
CN115138626A (zh) * 2022-07-28 2022-10-04 美的集团股份有限公司 物件的漆膜清理方法及装置
KR102549958B1 (ko) 2023-04-24 2023-06-30 신만영 공기 압축기용 수분분리장치
CN118061090B (zh) * 2024-04-16 2024-07-09 成都晨发泰达航空科技股份有限公司 一种用于apu燃烧室的热障涂层修复装置及方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2912763A1 (de) * 1979-03-30 1980-10-09 Licentia Gmbh Verfahren zum abtrennen photoleitender schichten von schichttraegern
JPS6118958A (ja) * 1984-07-04 1986-01-27 Mitsubishi Electric Corp 半導体装置用ガラスマスクの洗浄方法
JPS61113061A (ja) * 1984-11-07 1986-05-30 Mitsubishi Electric Corp マスク洗浄装置
DE4123199C2 (de) * 1991-07-12 1994-09-01 Georg Witt Verfahren und Vorrichtung zum mechanischen Entfernen von Fremdstoffen vom Basismaterial eines plattenförmigen Informationsträgers
JPH0594268U (ja) * 1992-05-22 1993-12-24 東芝硝子株式会社 薄膜形成装置
JPH06196465A (ja) * 1992-12-24 1994-07-15 Kawasaki Steel Corp 半導体ウエハの洗浄装置
JPH0747483A (ja) * 1993-08-05 1995-02-21 Nachi Fujikoshi Corp 産業用ロボット制御装置
JPH07153729A (ja) * 1993-08-18 1995-06-16 Air Prod And Chem Inc 固体表面の洗浄装置
JP3351082B2 (ja) * 1994-01-14 2002-11-25 ソニー株式会社 基板乾燥方法と、基板乾燥槽と、ウェーハ洗浄装置および半導体装置の製造方法
JP3298326B2 (ja) * 1994-09-19 2002-07-02 富士通株式会社 石英上のリンを含有するシリコン酸化膜の除去方法
JPH0969509A (ja) * 1995-09-01 1997-03-11 Matsushita Electron Corp 半導体ウェーハの洗浄・エッチング・乾燥装置及びその使用方法
JPH09289185A (ja) * 1996-04-22 1997-11-04 Hitachi Ltd 半導体ウェハ洗浄装置
JP3394143B2 (ja) * 1996-12-16 2003-04-07 大日本スクリーン製造株式会社 基板洗浄方法及びその装置
US6120614A (en) * 1997-11-14 2000-09-19 Ez Environmental Solutions Corporation Method and apparatus for pressure washing
JP3013932B2 (ja) * 1997-12-26 2000-02-28 キヤノン株式会社 半導体部材の製造方法および半導体部材
JPH11297652A (ja) * 1998-04-14 1999-10-29 Dainippon Screen Mfg Co Ltd 基板処理装置
JPH11340144A (ja) * 1998-05-22 1999-12-10 Hitachi Ltd 半導体装置の製造方法
JP3772056B2 (ja) * 1998-10-12 2006-05-10 株式会社東芝 半導体基板の洗浄方法

Also Published As

Publication number Publication date
CN1396042A (zh) 2003-02-12
JP2002292346A (ja) 2002-10-08
KR100447369B1 (ko) 2004-09-08
SG97232A1 (en) 2003-07-18
KR20020077165A (ko) 2002-10-11
TW531452B (en) 2003-05-11

Similar Documents

Publication Publication Date Title
CN1223411C (zh) 附着膜回收装置和附着膜的回收方法
CN1265425C (zh) 基片处理装置
TWI438304B (zh) A ceramic spray member and a method for manufacturing the same, and a polishing medium for a ceramic spray member
CN1072739A (zh) 清洗金属工件的工艺及装备
CN1572911A (zh) 用于镀敷基片的装置和方法
CN1277676C (zh) 绘图装置、其中的喷嘴的异常辨别方法以及电光学装置、电光学装置的制造方法和电子器械
CN1712333A (zh) 基板翻转装置及方法、基板运送装置及方法、基板处理装置及方法
CN1291243A (zh) 具有在用于接触清洗操作的主反应室外部的辅助电极的电镀系统
CN1653211A (zh) 电解抛光和/或电镀设备及方法
CN1473357A (zh) 基片加工方法
CN112267099A (zh) 一种靶材表面的清洗方法
CN1900358A (zh) 用于将金属无电镀沉积到半导体衬底上的装置
CN101234853B (zh) 平板玻璃基板的减薄方法及装置
KR20090068175A (ko) 기판 처리 장치
JP2007332435A (ja) 自動金属皮膜形成装置及びウェーハへの金属皮膜の形成方法
CN102468206A (zh) 晶圆基座及其使用、清洗方法
CN1501439A (zh) 基板处理方法、基板处理装置和基板处理系统
CN1788337A (zh) 电镀设备和电镀方法
CN101296553B (zh) 等离子体处理设备
CN110571134B (zh) 一种挡板上钼及其氧化物的清洗工艺
CN1808187A (zh) 滤色器用玻璃基板的再生方法
CN104379526B (zh) 化学研磨装置
CN111591055B (zh) 一种玻璃装饰面板的清洗防护工艺
KR20140059480A (ko) 엘씨디 유리기판 세정장치
CN106098865B (zh) 一种改善led用蓝宝石衬底研磨掉边的方法

Legal Events

Date Code Title Description
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20051019

Termination date: 20150329

EXPY Termination of patent right or utility model