CN1223411C - 附着膜回收装置和附着膜的回收方法 - Google Patents
附着膜回收装置和附着膜的回收方法 Download PDFInfo
- Publication number
- CN1223411C CN1223411C CNB021198357A CN02119835A CN1223411C CN 1223411 C CN1223411 C CN 1223411C CN B021198357 A CNB021198357 A CN B021198357A CN 02119835 A CN02119835 A CN 02119835A CN 1223411 C CN1223411 C CN 1223411C
- Authority
- CN
- China
- Prior art keywords
- film
- liquid
- coherent film
- coherent
- adherent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/002—Details of cleaning machines or methods involving the use or presence of liquid or steam the liquid being a degassed liquid
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Physical Vapour Deposition (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001097306A JP2002292346A (ja) | 2001-03-29 | 2001-03-29 | 付着膜回収装置および付着膜の回収方法 |
JP97306/2001 | 2001-03-29 | ||
JP97306/01 | 2001-03-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1396042A CN1396042A (zh) | 2003-02-12 |
CN1223411C true CN1223411C (zh) | 2005-10-19 |
Family
ID=18951109
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB021198357A Expired - Fee Related CN1223411C (zh) | 2001-03-29 | 2002-03-29 | 附着膜回收装置和附着膜的回收方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP2002292346A (ko) |
KR (1) | KR100447369B1 (ko) |
CN (1) | CN1223411C (ko) |
SG (1) | SG97232A1 (ko) |
TW (1) | TW531452B (ko) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050028838A1 (en) * | 2002-11-25 | 2005-02-10 | Karl Brueckner | Cleaning tantalum-containing deposits from process chamber components |
US7964085B1 (en) | 2002-11-25 | 2011-06-21 | Applied Materials, Inc. | Electrochemical removal of tantalum-containing materials |
KR100629073B1 (ko) | 2004-12-29 | 2006-09-26 | 엘지전자 주식회사 | 조립식 방착판 |
JP4895859B2 (ja) * | 2007-02-23 | 2012-03-14 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
KR101324131B1 (ko) * | 2007-06-28 | 2013-11-01 | 삼성코닝정밀소재 주식회사 | 산화 주석 분말, 그 제조 방법 및 그 제조용 반응 장치 |
US20090000641A1 (en) * | 2007-06-28 | 2009-01-01 | Applied Materials, Inc. | Methods and apparatus for cleaning deposition chamber parts using selective spray etch |
JP5180661B2 (ja) * | 2008-04-18 | 2013-04-10 | 株式会社ディスコ | スピンナ洗浄装置および加工装置 |
ITLE20100001A1 (it) * | 2010-03-19 | 2010-06-18 | Antonio Andrea Gentile | Sistema a palette per la raccolta-recupero di metalli in apparati per deposizione di film sottili. |
JP5726450B2 (ja) * | 2010-07-16 | 2015-06-03 | 信越化学工業株式会社 | 反応炉洗浄装置および反応炉洗浄方法 |
CN103270186B (zh) | 2010-12-23 | 2015-01-14 | 夏普株式会社 | 成膜材料的回收方法 |
CN103270187A (zh) | 2010-12-27 | 2013-08-28 | 夏普株式会社 | 蒸镀装置和回收装置 |
KR101260657B1 (ko) | 2011-09-16 | 2013-05-10 | 주식회사 에스엠이씨 | 관절 로봇형 수직 승강장치 |
CN103302598B (zh) * | 2012-03-09 | 2016-06-08 | 海纳微加工股份有限公司 | 真空压差式微加工装置及方法 |
JP5779132B2 (ja) * | 2012-03-28 | 2015-09-16 | 株式会社日立産機システム | クリーンシステム |
KR102034763B1 (ko) * | 2012-10-09 | 2019-10-22 | 삼성디스플레이 주식회사 | 공기압을 이용한 라미네이션 장치 및 이를 이용한 비접촉식 라미네이션 방법 |
CN103170486B (zh) * | 2013-03-29 | 2016-01-06 | 北京七星华创电子股份有限公司 | 一种自清洗腔体 |
CN105834917B (zh) * | 2016-04-28 | 2018-09-18 | 浙江工业大学 | 一种气液固三相磨粒流循环加工方法 |
DE102017208329A1 (de) * | 2017-05-17 | 2018-11-22 | Ejot Gmbh & Co. Kg | Berührungsfreie Reinigungsvorrichtung |
US11486042B2 (en) * | 2018-01-18 | 2022-11-01 | Viavi Solutions Inc. | Silicon coating on hard shields |
CN108972363A (zh) * | 2018-07-20 | 2018-12-11 | 合肥研新离合器有限公司 | 一种离合器连接盘用抛丸加工设备 |
CN109018578B (zh) * | 2018-07-27 | 2024-05-03 | 江苏云天高胜机器人科技有限公司 | 蓄电池上外壳保护膜的去膜装置 |
CN113878501B (zh) * | 2021-09-02 | 2023-12-19 | 宁海县勇昊汽车部件有限公司 | 一种基于电磁波监测的表面处理系统及控制方法 |
CN115138626A (zh) * | 2022-07-28 | 2022-10-04 | 美的集团股份有限公司 | 物件的漆膜清理方法及装置 |
KR102549958B1 (ko) | 2023-04-24 | 2023-06-30 | 신만영 | 공기 압축기용 수분분리장치 |
CN118061090B (zh) * | 2024-04-16 | 2024-07-09 | 成都晨发泰达航空科技股份有限公司 | 一种用于apu燃烧室的热障涂层修复装置及方法 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2912763A1 (de) * | 1979-03-30 | 1980-10-09 | Licentia Gmbh | Verfahren zum abtrennen photoleitender schichten von schichttraegern |
JPS6118958A (ja) * | 1984-07-04 | 1986-01-27 | Mitsubishi Electric Corp | 半導体装置用ガラスマスクの洗浄方法 |
JPS61113061A (ja) * | 1984-11-07 | 1986-05-30 | Mitsubishi Electric Corp | マスク洗浄装置 |
DE4123199C2 (de) * | 1991-07-12 | 1994-09-01 | Georg Witt | Verfahren und Vorrichtung zum mechanischen Entfernen von Fremdstoffen vom Basismaterial eines plattenförmigen Informationsträgers |
JPH0594268U (ja) * | 1992-05-22 | 1993-12-24 | 東芝硝子株式会社 | 薄膜形成装置 |
JPH06196465A (ja) * | 1992-12-24 | 1994-07-15 | Kawasaki Steel Corp | 半導体ウエハの洗浄装置 |
JPH0747483A (ja) * | 1993-08-05 | 1995-02-21 | Nachi Fujikoshi Corp | 産業用ロボット制御装置 |
JPH07153729A (ja) * | 1993-08-18 | 1995-06-16 | Air Prod And Chem Inc | 固体表面の洗浄装置 |
JP3351082B2 (ja) * | 1994-01-14 | 2002-11-25 | ソニー株式会社 | 基板乾燥方法と、基板乾燥槽と、ウェーハ洗浄装置および半導体装置の製造方法 |
JP3298326B2 (ja) * | 1994-09-19 | 2002-07-02 | 富士通株式会社 | 石英上のリンを含有するシリコン酸化膜の除去方法 |
JPH0969509A (ja) * | 1995-09-01 | 1997-03-11 | Matsushita Electron Corp | 半導体ウェーハの洗浄・エッチング・乾燥装置及びその使用方法 |
JPH09289185A (ja) * | 1996-04-22 | 1997-11-04 | Hitachi Ltd | 半導体ウェハ洗浄装置 |
JP3394143B2 (ja) * | 1996-12-16 | 2003-04-07 | 大日本スクリーン製造株式会社 | 基板洗浄方法及びその装置 |
US6120614A (en) * | 1997-11-14 | 2000-09-19 | Ez Environmental Solutions Corporation | Method and apparatus for pressure washing |
JP3013932B2 (ja) * | 1997-12-26 | 2000-02-28 | キヤノン株式会社 | 半導体部材の製造方法および半導体部材 |
JPH11297652A (ja) * | 1998-04-14 | 1999-10-29 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JPH11340144A (ja) * | 1998-05-22 | 1999-12-10 | Hitachi Ltd | 半導体装置の製造方法 |
JP3772056B2 (ja) * | 1998-10-12 | 2006-05-10 | 株式会社東芝 | 半導体基板の洗浄方法 |
-
2001
- 2001-03-29 JP JP2001097306A patent/JP2002292346A/ja active Pending
-
2002
- 2002-03-28 KR KR10-2002-0016910A patent/KR100447369B1/ko not_active IP Right Cessation
- 2002-03-29 TW TW091106325A patent/TW531452B/zh not_active IP Right Cessation
- 2002-03-29 CN CNB021198357A patent/CN1223411C/zh not_active Expired - Fee Related
- 2002-03-30 SG SG200201807A patent/SG97232A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN1396042A (zh) | 2003-02-12 |
JP2002292346A (ja) | 2002-10-08 |
KR100447369B1 (ko) | 2004-09-08 |
SG97232A1 (en) | 2003-07-18 |
KR20020077165A (ko) | 2002-10-11 |
TW531452B (en) | 2003-05-11 |
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