CN120089649A - 半导体器件以及用于形成半导体器件的方法 - Google Patents

半导体器件以及用于形成半导体器件的方法 Download PDF

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Publication number
CN120089649A
CN120089649A CN202510243037.5A CN202510243037A CN120089649A CN 120089649 A CN120089649 A CN 120089649A CN 202510243037 A CN202510243037 A CN 202510243037A CN 120089649 A CN120089649 A CN 120089649A
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metal layer
wafer
molding compound
die
forming
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Chinese (zh)
Inventor
迈克尔·J·塞登
野间崇
和央冈田
英章吉见
四方田尚之
林育圣
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Semiconductor Components Industries LLC
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Semiconductor Components Industries LLC
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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Preparation Of Compounds By Using Micro-Organisms (AREA)
  • Peptides Or Proteins (AREA)
CN202510243037.5A 2018-02-23 2019-02-25 半导体器件以及用于形成半导体器件的方法 Pending CN120089649A (zh)

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US15/903,677 US11114402B2 (en) 2018-02-23 2018-02-23 Semiconductor device with backmetal and related methods
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US11791212B2 (en) * 2019-12-13 2023-10-17 Micron Technology, Inc. Thin die release for semiconductor device assembly
KR102786983B1 (ko) 2020-09-29 2025-03-26 삼성전자주식회사 열 발산층을 구비한 반도체 패키지
US11728424B2 (en) 2020-10-26 2023-08-15 Semiconductor Components Industries, Llc Isolation in a semiconductor device
US11257759B1 (en) * 2020-10-26 2022-02-22 Semiconductor Components Industries, Llc Isolation in a semiconductor device
JP2023035608A (ja) 2021-09-01 2023-03-13 キオクシア株式会社 半導体装置の製造方法
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CN115332329B (zh) * 2022-08-15 2025-08-05 重庆万国半导体科技有限公司 一种深缓冲层高密度沟槽的igbt器件及其制备方法
TWI881455B (zh) * 2023-09-07 2025-04-21 台星科企業股份有限公司 於晶圓基板背面貼合異質材料的方法
EP4664511A1 (en) * 2024-06-13 2025-12-17 Deuvtek Co., Ltd. System for localized wafer thinning and method thereof

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