CN1200136C - 电镀方法及其使用的镀液前体 - Google Patents
电镀方法及其使用的镀液前体 Download PDFInfo
- Publication number
- CN1200136C CN1200136C CNB001088866A CN00108886A CN1200136C CN 1200136 C CN1200136 C CN 1200136C CN B001088866 A CNB001088866 A CN B001088866A CN 00108886 A CN00108886 A CN 00108886A CN 1200136 C CN1200136 C CN 1200136C
- Authority
- CN
- China
- Prior art keywords
- plating bath
- plating
- metal ion
- electro
- ion species
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1617—Purification and regeneration of coating baths
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9335—Product by special process
- Y10S428/934—Electrical process
- Y10S428/935—Electroplating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12681—Ga-, In-, Tl- or Group VA metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12701—Pb-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12785—Group IIB metal-base component
- Y10T428/12792—Zn-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12806—Refractory [Group IVB, VB, or VIB] metal-base component
- Y10T428/12819—Group VB metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12806—Refractory [Group IVB, VB, or VIB] metal-base component
- Y10T428/12826—Group VIB metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12806—Refractory [Group IVB, VB, or VIB] metal-base component
- Y10T428/12826—Group VIB metal-base component
- Y10T428/12847—Cr-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12875—Platinum group metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12889—Au-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12896—Ag-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12944—Ni-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12951—Fe-base component
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
Description
Claims (16)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP98996/1999 | 1999-04-06 | ||
JP9899699 | 1999-04-06 | ||
JP029349/2000 | 2000-02-07 | ||
JP2000029349A JP3455709B2 (ja) | 1999-04-06 | 2000-02-07 | めっき方法とそれに用いるめっき液前駆体 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1275636A CN1275636A (zh) | 2000-12-06 |
CN1200136C true CN1200136C (zh) | 2005-05-04 |
Family
ID=26440076
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB001088866A Expired - Fee Related CN1200136C (zh) | 1999-04-06 | 2000-04-06 | 电镀方法及其使用的镀液前体 |
Country Status (3)
Country | Link |
---|---|
US (2) | US6338787B1 (zh) |
JP (1) | JP3455709B2 (zh) |
CN (1) | CN1200136C (zh) |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040065540A1 (en) * | 2002-06-28 | 2004-04-08 | Novellus Systems, Inc. | Liquid treatment using thin liquid layer |
US6331237B1 (en) * | 1999-09-01 | 2001-12-18 | International Business Machines Corporation | Method of improving contact reliability for electroplating |
JP3482402B2 (ja) * | 2001-06-29 | 2003-12-22 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | 置換金メッキ液 |
DE10132478C1 (de) * | 2001-07-03 | 2003-04-30 | Atotech Deutschland Gmbh | Verfahren zum Abscheiden einer Metallschicht sowie Verfahren zum Regenerieren einer Metallionen in einer hohen Oxidationsstufe enthaltenden Lösung |
US7148342B2 (en) * | 2002-07-24 | 2006-12-12 | The Trustees Of The University Of Pennyslvania | Compositions and methods for sirna inhibition of angiogenesis |
US6875260B2 (en) * | 2002-12-10 | 2005-04-05 | Enthone Inc. | Copper activator solution and method for semiconductor seed layer enhancement |
US7306662B2 (en) * | 2006-05-11 | 2007-12-11 | Lam Research Corporation | Plating solution for electroless deposition of copper |
US7297190B1 (en) * | 2006-06-28 | 2007-11-20 | Lam Research Corporation | Plating solutions for electroless deposition of copper |
JP4663243B2 (ja) * | 2004-01-13 | 2011-04-06 | 上村工業株式会社 | 無電解銅めっき浴 |
US20050194255A1 (en) * | 2004-03-04 | 2005-09-08 | Tiwari Chandra S. | Self-activated electroless metal deposition |
US7410899B2 (en) * | 2005-09-20 | 2008-08-12 | Enthone, Inc. | Defectivity and process control of electroless deposition in microelectronics applications |
JP5073998B2 (ja) * | 2006-08-28 | 2012-11-14 | 眞 八藤 | 銀器類の改良方法 |
US7892413B2 (en) * | 2006-09-27 | 2011-02-22 | Solopower, Inc. | Electroplating methods and chemistries for deposition of copper-indium-gallium containing thin films |
US9439293B2 (en) * | 2007-11-21 | 2016-09-06 | Xerox Corporation | Galvanic process for making printed conductive metal markings for chipless RFID applications |
US8425753B2 (en) * | 2008-05-19 | 2013-04-23 | Solopower, Inc. | Electroplating methods and chemistries for deposition of copper-indium-gallium containing thin films |
US8177956B2 (en) * | 2008-03-12 | 2012-05-15 | Micyus Nicole J | Method of electrolytically dissolving nickel into electroless nickel plating solutions |
JP2010150606A (ja) * | 2008-12-25 | 2010-07-08 | Ishihara Chem Co Ltd | 電解再生式の無電解スズメッキ方法 |
EP2305856A1 (en) * | 2009-09-28 | 2011-04-06 | ATOTECH Deutschland GmbH | Process for applying a metal coating to a non-conductive substrate |
US9269982B2 (en) | 2011-01-13 | 2016-02-23 | Imergy Power Systems, Inc. | Flow cell stack |
EP2481835B1 (en) | 2011-01-28 | 2013-09-11 | Atotech Deutschland GmbH | Autocatalytic plating bath composition for deposition of tin and tin alloys |
EP2671968B1 (en) * | 2012-06-05 | 2014-11-26 | ATOTECH Deutschland GmbH | Method and regeneration apparatus for regenerating a plating composition |
TWI482878B (zh) * | 2012-11-09 | 2015-05-01 | Ind Tech Res Inst | 酸性化學鍍銅系統及其鍍銅方法 |
CN103705894B (zh) * | 2013-12-24 | 2016-04-20 | 李媛春 | 一种治疗风湿性关节炎的中药汤剂 |
US9469902B2 (en) * | 2014-02-18 | 2016-10-18 | Lam Research Corporation | Electroless deposition of continuous platinum layer |
US9499913B2 (en) * | 2014-04-02 | 2016-11-22 | Lam Research Corporation | Electroless deposition of continuous platinum layer using complexed Co2+ metal ion reducing agent |
US9428836B2 (en) * | 2014-04-29 | 2016-08-30 | Lam Research Corporation | Electroless deposition of continuous cobalt layer using complexed Ti3+ metal ions as reducing agents |
US20150307994A1 (en) * | 2014-04-29 | 2015-10-29 | Lam Research Corporation | ELECTROLESS DEPOSITION OF CONTINUOUS NICKEL LAYER USING COMPLEXED Ti3+ METAL IONS AS REDUCING AGENTS |
CN103996828B (zh) * | 2014-05-16 | 2016-05-11 | 江苏师范大学 | 用于锂电池的硫-多孔碳毛毡复合正极材料 |
EP3026143A1 (en) * | 2014-11-26 | 2016-06-01 | ATOTECH Deutschland GmbH | Plating bath and method for electroless deposition of nickel layers |
FR3057709B1 (fr) * | 2016-10-19 | 2018-11-23 | IFP Energies Nouvelles | Batterie a flux redox comportant un systeme de reduction des courants de derivation |
US11274375B2 (en) | 2016-12-28 | 2022-03-15 | Atotech Deutschland Gmbh | Tin plating bath and a method for depositing tin or tin alloy onto a surface of a substrate |
EP3770298A1 (en) | 2019-07-24 | 2021-01-27 | ATOTECH Deutschland GmbH | Tin plating bath and a method for depositing tin or tin alloy onto a surface of a substrate |
TW202106928A (zh) | 2019-05-28 | 2021-02-16 | 德商德國艾托特克公司 | 錫電鍍浴及於基板表面上沉積錫或錫合金之方法 |
CN113737233A (zh) * | 2021-06-23 | 2021-12-03 | 中国科学院深圳先进技术研究院 | 一种Fe-Ni-P合金电镀液、Fe-Ni-P合金镀层的电沉积方法及合金镀层 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4230542A (en) * | 1978-10-13 | 1980-10-28 | Oronzio De Nora Impianti Elettrochimici S.P.A. | Electrolytic process for treating ilmenite leach solution |
JPS5881985A (ja) * | 1981-11-06 | 1983-05-17 | Chiba Enso Kagaku Kk | 電解用触媒陰極の製造法 |
US4425205A (en) * | 1982-03-13 | 1984-01-10 | Kanto Kasei Co., Ltd. | Process for regenerating electroless plating bath and a regenerating apparatus of electroless plating bath |
JPS60125379A (ja) | 1983-12-07 | 1985-07-04 | Shinko Electric Ind Co Ltd | 無電解金めっき液 |
DE3668914D1 (de) * | 1986-04-11 | 1990-03-15 | Ibm Deutschland | Verfahren zur regenerierung eines stromlosen verkupferungsbades und vorrichtung zur durchfuehrung desselben. |
JPH03191070A (ja) | 1989-12-19 | 1991-08-21 | Murata Mfg Co Ltd | 無電解めっき浴 |
US5529680A (en) * | 1990-06-29 | 1996-06-25 | Electroplating Engineers Of Japan, Limited | Platinum electroforming and platinum electroplating |
JPH04325688A (ja) | 1991-04-26 | 1992-11-16 | Murata Mfg Co Ltd | 無電解めっき浴 |
JPH06101056A (ja) | 1992-08-05 | 1994-04-12 | Murata Mfg Co Ltd | 無電解半田めっき浴 |
JP3191070B2 (ja) | 1993-01-12 | 2001-07-23 | ダウ化工株式会社 | 断熱スラブの構築方法 |
JP3116637B2 (ja) | 1993-03-12 | 2000-12-11 | 株式会社村田製作所 | 無電解めっき液 |
JP3243889B2 (ja) | 1993-06-01 | 2002-01-07 | 株式会社村田製作所 | 無電解銅めっき浴 |
JP2911393B2 (ja) * | 1995-07-25 | 1999-06-23 | 日本テクノ株式会社 | 無電解ニッケルめっき廃液から肥料水溶液を製造する方法と装置 |
DE19719020A1 (de) * | 1997-05-07 | 1998-11-12 | Km Europa Metal Ag | Verfahren und Vorrichtung zum Regenerieren von Verzinnungslösungen |
-
2000
- 2000-02-07 JP JP2000029349A patent/JP3455709B2/ja not_active Expired - Fee Related
- 2000-04-05 US US09/543,356 patent/US6338787B1/en not_active Expired - Lifetime
- 2000-04-06 CN CNB001088866A patent/CN1200136C/zh not_active Expired - Fee Related
-
2002
- 2002-01-07 US US10/036,506 patent/US6852210B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2000355774A (ja) | 2000-12-26 |
US6338787B1 (en) | 2002-01-15 |
US6852210B2 (en) | 2005-02-08 |
JP3455709B2 (ja) | 2003-10-14 |
CN1275636A (zh) | 2000-12-06 |
US20020079226A1 (en) | 2002-06-27 |
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