CN1199253C - 树脂密封型半导体器件及液晶显示组件 - Google Patents

树脂密封型半导体器件及液晶显示组件 Download PDF

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Publication number
CN1199253C
CN1199253C CNB001319833A CN00131983A CN1199253C CN 1199253 C CN1199253 C CN 1199253C CN B001319833 A CNB001319833 A CN B001319833A CN 00131983 A CN00131983 A CN 00131983A CN 1199253 C CN1199253 C CN 1199253C
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CN
China
Prior art keywords
resin
semiconductor device
elasticity
encapsulated semiconductor
modulus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB001319833A
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English (en)
Chinese (zh)
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CN1303086A (zh
Inventor
山本诚一
藤吉干
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
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Sharp Corp
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Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Publication of CN1303086A publication Critical patent/CN1303086A/zh
Application granted granted Critical
Publication of CN1199253C publication Critical patent/CN1199253C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
CNB001319833A 1999-10-29 2000-10-26 树脂密封型半导体器件及液晶显示组件 Expired - Fee Related CN1199253C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP31043299A JP3441412B2 (ja) 1999-10-29 1999-10-29 樹脂封止型半導体装置およびこれを用いた液晶表示モジュール
JP310432/1999 1999-10-29

Publications (2)

Publication Number Publication Date
CN1303086A CN1303086A (zh) 2001-07-11
CN1199253C true CN1199253C (zh) 2005-04-27

Family

ID=18005186

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB001319833A Expired - Fee Related CN1199253C (zh) 1999-10-29 2000-10-26 树脂密封型半导体器件及液晶显示组件

Country Status (7)

Country Link
US (1) US6388339B1 (fr)
EP (1) EP1096565B1 (fr)
JP (1) JP3441412B2 (fr)
KR (1) KR20010060214A (fr)
CN (1) CN1199253C (fr)
DE (1) DE60037383T2 (fr)
TW (1) TW495947B (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104425632A (zh) * 2013-08-21 2015-03-18 佳能株式会社 光学装置及其制造方法

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4002112B2 (ja) * 2001-03-22 2007-10-31 シチズンホールディングス株式会社 液晶表示装置
JP4880838B2 (ja) * 2001-09-05 2012-02-22 株式会社東芝 液晶表示装置の組立て方法及び組立て装置
US6969914B2 (en) * 2002-08-29 2005-11-29 Micron Technology, Inc. Electronic device package
JP2004327920A (ja) * 2003-04-28 2004-11-18 Sharp Corp 半導体装置の製造方法、フレキシブル基板及び半導体装置
US7646095B2 (en) * 2003-09-30 2010-01-12 Panasonic Corporation Semiconductor device
KR101075599B1 (ko) * 2004-06-23 2011-10-20 삼성전자주식회사 표시장치
JP2006216720A (ja) * 2005-02-02 2006-08-17 Sharp Corp 半導体装置及びその製造方法
KR101119153B1 (ko) 2005-02-07 2012-03-19 삼성전자주식회사 표시장치
JP5057321B2 (ja) * 2006-03-14 2012-10-24 株式会社ジャパンディスプレイウェスト 表示装置の製造方法
JP5014945B2 (ja) * 2007-10-17 2012-08-29 シャープ株式会社 半導体装置
TWI400509B (zh) * 2008-06-13 2013-07-01 Prime View Int Co Ltd 可撓性顯示模組及其製作方法
TWI476738B (zh) * 2010-09-07 2015-03-11 Ind Tech Res Inst 軟性顯示面板及其組裝方法
WO2012067003A1 (fr) * 2010-11-17 2012-05-24 シャープ株式会社 Substrat de circuit et procédé de fabrication de celui-ci
JP5296116B2 (ja) * 2011-02-16 2013-09-25 シャープ株式会社 半導体装置
JP6055275B2 (ja) * 2012-11-05 2016-12-27 ローム株式会社 半導体集積回路装置および電子機器
JP6519112B2 (ja) * 2014-07-24 2019-05-29 Tdk株式会社 薄膜キャパシタ
WO2017082000A1 (fr) * 2015-11-09 2017-05-18 積水化学工業株式会社 Produit d'étanchéité pour élément d'affichage à cristaux liquides, matériau à conduction verticale, et élément d'affichage à cristaux liquides
CN112909062B (zh) * 2021-02-03 2024-03-15 京东方科技集团股份有限公司 一种显示模组的制备方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60238817A (ja) * 1984-05-12 1985-11-27 Citizen Watch Co Ltd 液晶表示装置
US4917466A (en) * 1987-08-13 1990-04-17 Shin-Etsu Polymer Co., Ltd. Method for electrically connecting IC chips, a resinous bump-forming composition used therein and a liquid-crystal display unit electrically connected thereby
JPH0193155A (ja) 1987-10-05 1989-04-12 Sumitomo Bakelite Co Ltd 樹脂封止型半導体装置
JPH03125443A (ja) * 1989-10-09 1991-05-28 Sharp Corp 実装基板の電極及び該実装基板の電極を有する液晶表示装置
JPH06236899A (ja) 1992-09-29 1994-08-23 Toshiba Corp 樹脂封止型半導体装置
JPH06224239A (ja) 1993-01-21 1994-08-12 Toshiba Corp 樹脂封止型半導体装置の製造方法
JPH0897334A (ja) 1994-09-29 1996-04-12 Hitachi Ltd 樹脂封止型半導体装置
US5864178A (en) * 1995-01-12 1999-01-26 Kabushiki Kaisha Toshiba Semiconductor device with improved encapsulating resin
JP3284262B2 (ja) * 1996-09-05 2002-05-20 セイコーエプソン株式会社 液晶表示装置及びそれを用いた電子機器
WO1998015975A1 (fr) * 1996-10-08 1998-04-16 Hitachi Chemical Company, Ltd. Dispositif semi-conducteur, substrat de montage d'une puce de semi-conducteur, leurs procedes de fabrication, adhesif, et film a double couche d'adhesif
TW383435B (en) * 1996-11-01 2000-03-01 Hitachi Chemical Co Ltd Electronic device
JP3689518B2 (ja) * 1997-02-18 2005-08-31 新日鐵化学株式会社 電子材料用樹脂溶液組成物
TW459032B (en) * 1998-03-18 2001-10-11 Sumitomo Bakelite Co An anisotropic conductive adhesive and method for preparation thereof and an electronic apparatus using said adhesive
US6108210A (en) * 1998-04-24 2000-08-22 Amerasia International Technology, Inc. Flip chip devices with flexible conductive adhesive

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104425632A (zh) * 2013-08-21 2015-03-18 佳能株式会社 光学装置及其制造方法
US9570632B2 (en) 2013-08-21 2017-02-14 Canon Kabushiki Kaisha Method of manufacturing the optical apparatus
CN104425632B (zh) * 2013-08-21 2017-04-12 佳能株式会社 光学装置及其制造方法
US9887222B2 (en) 2013-08-21 2018-02-06 Canon Kabushiki Kaisha Method of manufacturing optical apparatus

Also Published As

Publication number Publication date
DE60037383D1 (de) 2008-01-24
EP1096565B1 (fr) 2007-12-12
EP1096565A3 (fr) 2003-01-08
DE60037383T2 (de) 2008-12-04
TW495947B (en) 2002-07-21
KR20010060214A (ko) 2001-07-06
JP3441412B2 (ja) 2003-09-02
US6388339B1 (en) 2002-05-14
CN1303086A (zh) 2001-07-11
JP2001127216A (ja) 2001-05-11
EP1096565A2 (fr) 2001-05-02

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