CN1183838A - 具有容纳元件的凹槽的硅衬底及其制造这种凹槽的方法 - Google Patents
具有容纳元件的凹槽的硅衬底及其制造这种凹槽的方法 Download PDFInfo
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Abstract
在硅衬底(1)中具有用于容纳元件的凹槽(2),与衬底成一体的至少一个固定部件(3)至少部分地延伸到凹槽(2)上使凹槽(2)内的容纳元件固定就位。
Description
技术领域
本发明涉及具有容纳元件的凹槽的硅衬底以及在这种硅衬底中制造容纳元件的凹槽的方法,包括在硅衬底中计划形成的凹槽的任何一侧上形成掩膜区域,然后腐蚀出凹槽。
发明背景
一般来说,在光电子领域内,用硅衬底内腐蚀的凹槽,即所谓的V形槽,容纳光导纤维进行高精确度的校准,这已是公知常识。
然而,在这种凹槽内安装光导纤维时,很难使每个凹槽中光导纤维在整个安装过程中固定就位。
当将光导纤维粘在凹槽上时,可观察到由于胶层的厚度,光导纤维在凹槽内会有一定程度的升高,因此,将不能确定每个光导纤维在垂直方向以及水平方向上的位置。
发明概述
本发明的一般目的是提供一种用于在硅衬底中的凹槽内容纳元件的简单的固定部件。
该目的可用根据本发明的衬底达到,其中与衬底成一体的至少一个固定部件至少部分地延伸到凹槽上使凹槽内的容纳元件固定就位。
根据本发明在硅衬底内制造凹槽的方法的主要特征在于掩蔽衬底上至少一个区域,该区域至少部分地延伸跨过计划形成的凹槽,腐蚀出对应于该区域的固定部件,用于将凹槽内的容纳元件固定就位。
附图简述
下面结合附图更详细地介绍本发明。
图1为根据本发明的固定部件的第一实施例具有V形凹槽的硅衬底的透视图,
图2为根据本发明的固定部件的第二实施例具有V形凹槽的硅衬底的剖面示意图,以及
图3为根据本发明的固定部件的第三实施例具有V形凹槽的硅衬底的剖面示意图。
优选实施例
图1为具有V形凹槽2用于容纳元件(未显示)的硅衬底1的透视图,例如相对于另一元件(未显示)被校准的一个光导纤维,将被接合的两个光导纤维,将旋转的旋转轴,将在凹槽内往复移动的活塞等等。应该明白可以在一个和相同的衬底上形成多个这种凹槽。
这种凹槽2的制造方法为,具有第一掺杂类型(n型或p型)的硅衬底1的计划形成的凹槽2的一面上掺杂第二掺杂类型的掺杂剂(分别为p型和n型),于是用已知的方式腐蚀出计划形成的凹槽2。
关于这一方面,应该指出的是凹槽不必为V形,为了能够容纳例如半导体芯片形式的电子元件,凹槽可以为任何形式。
在本发明图1的实施例中,与衬底1成一体的两个固定部件3部分地延伸跨过凹槽2,形成桥,该凹槽用于将固定凹槽内容纳的例如光导纤维(未显示)固定就位,利用例如纤维接合工艺将其连接。
显示在图1中的固定部件或桥3根据本发明的方法的第一实施例制得,其中衬底1上对应桥3的区域也掺杂以上所述第二掺杂类型,腐蚀桥3从而腐蚀出凹槽2。
桥3不必只有一个并且宽度相同,但可以为任何形状。
应该指出的是垂直地延伸跨过凹槽的桥不能在(100)取向的硅上腐蚀出,但桥的形状和桥关于衬底上凹槽的上横向边缘的角度之间存在着某种预定的关系,以便通过腐蚀形成桥。
桥3的厚度取决于要形成桥3的区域内衬底1的掺杂深度。
图2为具有凹槽2’和固定部件4的衬底1’的部分平面示意图,该固定部件4为舌形,由凹槽2’的左侧延伸到凹槽2’上该实施例显示的小于凹槽2’的一半的宽度处。
就此,应该指出的是没有完全延伸跨过凹槽的固定部件与凹槽的边缘垂直。
同样,图3为具有凹槽2”和多个固定部件5的衬底1”的部分平面示意图,该固定部件5为舌形,由凹槽2”的任意一侧垂直地延伸到凹槽2”上该实施例显示的稍大于凹槽2”的一半的宽度处。
制得的图2和3中的舌形的厚度要使舌形有一定的柔韧性,以便可以将它们手工地抬起以便将要固定的某种元件放置在凹槽内。
因此,根据本发明的固定部件与衬底成一体,用以上介绍的方式在衬底上腐蚀形成槽和/或凹槽,可以用简单的方式制成所需厚度将光导纤维固定在适当位置。
在以上介绍的本发明的方法的实施例中,可以制出这种厚度和柔韧性的桥,可手工地按压接触下面的元件以进一步的改善固定作用。
Claims (7)
1.一种具有用于容纳元件的凹槽(2,2’,2”)的硅衬底(1,1’,1”),其特征在于至少一个与衬底成一体的固定部件(3,4,5)至少部分延伸到凹槽(2,2’,2”)上将凹槽(2,2’,2”)内的元件固定就位。
2.根据权利要求1的衬底,其特征在于所述至少一个固定部件(3)形成完全延伸跨过凹槽(2)的桥。
3.根据权利要求1的衬底,其特征在于所述至少一个固定部件(4,5)形成舌形,部分地延伸到凹槽(2’,2”)上。
4.根据权利要求1-3中任意一个的衬底,其特征在于所述至少一个固定部件(3)倾斜地延伸到凹槽(2)上。
5.一种在硅衬底(1,1’,1”)中制造用于容纳元件的凹槽(2,2’,2”)的方法,包括掩蔽硅衬底(1,1’,1”)上计划形成的凹槽的区域的任意一侧,此后腐蚀出凹槽,其特征在于还掩蔽衬底上至少部分延伸到计划形成的凹槽上的至少一个区域,腐蚀出对应于将凹槽内的元件固定就位的那部分区域的固定部件。
6.根据权利要求5的方法,其中衬底为第一掺杂类型,其特征在于在所述区域内用第二掺杂类型的掺杂剂掺杂衬底进行掩蔽。
7.根据权利要求6的方法,其特征在于衬底上所述部分延伸到计划形成的凹槽上的至少一个区域掺杂深度对应于固定部件的所需厚度。
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SE9501591A SE506163C2 (sv) | 1995-04-27 | 1995-04-27 | Anordning vid ett kiselsubstrat med ett urtag för upptagande av ett element jämte förfarande för framställande av en dylik anordning |
SE9501591-3 | 1995-04-27 | ||
SE95015913 | 1995-04-27 |
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CN1183838A true CN1183838A (zh) | 1998-06-03 |
CN1083108C CN1083108C (zh) | 2002-04-17 |
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CN96193525A Expired - Lifetime CN1083108C (zh) | 1995-04-27 | 1996-04-23 | 具有容纳元件的凹槽的硅衬底及其制造这种凹槽的方法 |
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US (2) | US6100576A (zh) |
EP (1) | EP0823063B1 (zh) |
JP (1) | JP3649740B2 (zh) |
KR (1) | KR100402555B1 (zh) |
CN (1) | CN1083108C (zh) |
AU (1) | AU5520696A (zh) |
CA (1) | CA2218751C (zh) |
DE (1) | DE69634877T2 (zh) |
HK (1) | HK1011225A1 (zh) |
SE (1) | SE506163C2 (zh) |
WO (1) | WO1996034305A1 (zh) |
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US3880684A (en) * | 1973-08-03 | 1975-04-29 | Mitsubishi Electric Corp | Process for preparing semiconductor |
JPS54142988A (en) * | 1978-04-28 | 1979-11-07 | Hitachi Ltd | Photo semiconductor device |
US4210923A (en) * | 1979-01-02 | 1980-07-01 | Bell Telephone Laboratories, Incorporated | Edge illuminated photodetector with optical fiber alignment |
JPS597913A (ja) * | 1982-07-07 | 1984-01-17 | Fujitsu Ltd | 光フアイバ固定装置およびその製造方法 |
US4945400A (en) * | 1988-03-03 | 1990-07-31 | At&T Bell Laboratories | Subassembly for optoelectronic devices |
DE4213118C1 (zh) * | 1992-04-21 | 1993-06-24 | Ant Nachrichtentechnik Gmbh, 7150 Backnang, De | |
US5328559A (en) * | 1992-09-08 | 1994-07-12 | Ic Sensors, Inc. | Groove width trimming |
US5412748A (en) * | 1992-12-04 | 1995-05-02 | Kabushiki Kaisha Toshiba | Optical semiconductor module |
DE4424017C1 (de) * | 1994-07-08 | 1995-11-23 | Ant Nachrichtentech | Vorrichtung zum Halten einer mikrooptischen Komponente |
-
1995
- 1995-04-27 SE SE9501591A patent/SE506163C2/sv not_active IP Right Cessation
-
1996
- 1996-04-23 CN CN96193525A patent/CN1083108C/zh not_active Expired - Lifetime
- 1996-04-23 JP JP53242996A patent/JP3649740B2/ja not_active Expired - Fee Related
- 1996-04-23 AU AU55206/96A patent/AU5520696A/en not_active Abandoned
- 1996-04-23 KR KR1019970707639A patent/KR100402555B1/ko not_active IP Right Cessation
- 1996-04-23 EP EP96912374A patent/EP0823063B1/en not_active Expired - Lifetime
- 1996-04-23 CA CA002218751A patent/CA2218751C/en not_active Expired - Lifetime
- 1996-04-23 DE DE69634877T patent/DE69634877T2/de not_active Expired - Lifetime
- 1996-04-23 WO PCT/SE1996/000531 patent/WO1996034305A1/en active IP Right Grant
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1997
- 1997-10-27 US US08/957,983 patent/US6100576A/en not_active Expired - Lifetime
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1998
- 1998-11-25 HK HK98112308A patent/HK1011225A1/xx not_active IP Right Cessation
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EP0823063A1 (en) | 1998-02-11 |
CN1083108C (zh) | 2002-04-17 |
WO1996034305A1 (en) | 1996-10-31 |
JPH11504134A (ja) | 1999-04-06 |
KR100402555B1 (ko) | 2004-02-11 |
JP3649740B2 (ja) | 2005-05-18 |
KR19990008114A (ko) | 1999-01-25 |
DE69634877T2 (de) | 2006-05-11 |
EP0823063B1 (en) | 2005-06-22 |
DE69634877D1 (de) | 2005-07-28 |
CA2218751C (en) | 2008-06-17 |
SE506163C2 (sv) | 1997-11-17 |
SE9501591L (sv) | 1996-10-28 |
US6100576A (en) | 2000-08-08 |
US6482663B1 (en) | 2002-11-19 |
AU5520696A (en) | 1996-11-18 |
CA2218751A1 (en) | 1996-10-31 |
HK1011225A1 (en) | 1999-07-09 |
SE9501591D0 (sv) | 1995-04-27 |
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