CN118175804A - 电子设备 - Google Patents

电子设备 Download PDF

Info

Publication number
CN118175804A
CN118175804A CN202410334109.2A CN202410334109A CN118175804A CN 118175804 A CN118175804 A CN 118175804A CN 202410334109 A CN202410334109 A CN 202410334109A CN 118175804 A CN118175804 A CN 118175804A
Authority
CN
China
Prior art keywords
heat
chip
heat dissipation
shell
wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202410334109.2A
Other languages
English (en)
Chinese (zh)
Inventor
彭耀锋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Yinwang Intelligent Technology Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Priority to CN202410334109.2A priority Critical patent/CN118175804A/zh
Publication of CN118175804A publication Critical patent/CN118175804A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/2049—Pressing means used to urge contact, e.g. springs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20881—Liquid coolant with phase change

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN202410334109.2A 2020-12-15 2020-12-15 电子设备 Pending CN118175804A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202410334109.2A CN118175804A (zh) 2020-12-15 2020-12-15 电子设备

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202011478901.3A CN114641177B (zh) 2020-12-15 2020-12-15 电子设备
CN202410334109.2A CN118175804A (zh) 2020-12-15 2020-12-15 电子设备

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN202011478901.3A Division CN114641177B (zh) 2020-12-15 2020-12-15 电子设备

Publications (1)

Publication Number Publication Date
CN118175804A true CN118175804A (zh) 2024-06-11

Family

ID=81945564

Family Applications (3)

Application Number Title Priority Date Filing Date
CN202410334109.2A Pending CN118175804A (zh) 2020-12-15 2020-12-15 电子设备
CN202410339294.4A Pending CN118250968A (zh) 2020-12-15 2020-12-15 电子设备
CN202011478901.3A Active CN114641177B (zh) 2020-12-15 2020-12-15 电子设备

Family Applications After (2)

Application Number Title Priority Date Filing Date
CN202410339294.4A Pending CN118250968A (zh) 2020-12-15 2020-12-15 电子设备
CN202011478901.3A Active CN114641177B (zh) 2020-12-15 2020-12-15 电子设备

Country Status (4)

Country Link
EP (1) EP4255140A4 (https=)
JP (2) JP2023552884A (https=)
CN (3) CN118175804A (https=)
WO (1) WO2022127432A1 (https=)

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* Cited by examiner, † Cited by third party
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CN119836848A (zh) * 2022-09-19 2025-04-15 三星电子株式会社 包括热模块的pcb组件
CN115542124A (zh) * 2022-10-17 2022-12-30 英特尔产品（成都）有限公司 老化测试机的测试板的导热部件、测试板和老化测试机
CN116247013A (zh) * 2022-12-16 2023-06-09 超聚变数字技术有限公司 芯片封装模组及电子设备
EP4633016A4 (en) * 2022-12-22 2026-02-18 Shenzhen Yinwang Intelligent Technology Co Ltd HEAT DISSIPATION DEVICE, ELECTRONIC DEVICE AND VEHICLE
CN115866998B (zh) * 2022-12-27 2025-08-05 湖南海博智控科技有限公司 一种紧凑型车载影音设备
TWI866444B (zh) * 2023-09-05 2024-12-11 英研智能移動股份有限公司 電子裝置
DE102024200416A1 (de) 2024-01-17 2025-07-17 Robert Bosch Gesellschaft mit beschränkter Haftung Vorrichtung zur Entwärmung eines Elektronikbauteils eines Kraftfahrzeugs und Verfahren zur Herstellung der Vorrichtung
WO2026034952A1 (ko) * 2024-08-06 2026-02-12 주식회사 케이엠더블유 증발부 조립체 및 이를 포함하는 방열 장치와 그 방열 장치를 포함하는 전자기기 조립체

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Also Published As

Publication number Publication date
CN118250968A (zh) 2024-06-25
JP2025165951A (ja) 2025-11-05
CN114641177A (zh) 2022-06-17
EP4255140A4 (en) 2025-01-08
JP2023552884A (ja) 2023-12-19
CN114641177B (zh) 2024-02-13
EP4255140A1 (en) 2023-10-04
WO2022127432A1 (zh) 2022-06-23

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Legal Events

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PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right

Effective date of registration: 20241113

Address after: 518129 Huawei Headquarters Office Building 101, Wankecheng Community, Bantian Street, Longgang District, Shenzhen, Guangdong

Applicant after: Shenzhen Yinwang Intelligent Technology Co.,Ltd.

Country or region after: China

Address before: 518129 Bantian HUAWEI headquarters office building, Longgang District, Guangdong, Shenzhen

Applicant before: HUAWEI TECHNOLOGIES Co.,Ltd.

Country or region before: China

TA01 Transfer of patent application right
CB02 Change of applicant information

Country or region after: China

Address after: 518110 Guangdong Province Shenzhen City Longhua District Fucheng Street Jiulianshan Community Jingyue Road No. 1 Building A1 101

Applicant after: Yinwang Intelligent Technology Co., Ltd.

Address before: 518129 Huawei Headquarters Office Building 101, Wankecheng Community, Bantian Street, Longgang District, Shenzhen, Guangdong

Applicant before: Shenzhen Yinwang Intelligent Technology Co.,Ltd.

Country or region before: China