JP2023552884A5 - - Google Patents

Info

Publication number
JP2023552884A5
JP2023552884A5 JP2023535973A JP2023535973A JP2023552884A5 JP 2023552884 A5 JP2023552884 A5 JP 2023552884A5 JP 2023535973 A JP2023535973 A JP 2023535973A JP 2023535973 A JP2023535973 A JP 2023535973A JP 2023552884 A5 JP2023552884 A5 JP 2023552884A5
Authority
JP
Japan
Prior art keywords
heat dissipation
chip
housing
heat
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023535973A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023552884A (ja
Filing date
Publication date
Priority claimed from CN202011478901.3A external-priority patent/CN114641177B/zh
Application filed filed Critical
Publication of JP2023552884A publication Critical patent/JP2023552884A/ja
Priority to JP2025117337A priority Critical patent/JP2025165951A/ja
Publication of JP2023552884A5 publication Critical patent/JP2023552884A5/ja
Pending legal-status Critical Current

Links

JP2023535973A 2020-12-15 2021-11-05 電子デバイス Pending JP2023552884A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025117337A JP2025165951A (ja) 2020-12-15 2025-07-11 電子デバイス

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN202011478901.3A CN114641177B (zh) 2020-12-15 2020-12-15 电子设备
CN202011478901.3 2020-12-15
PCT/CN2021/129084 WO2022127432A1 (zh) 2020-12-15 2021-11-05 电子设备

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025117337A Division JP2025165951A (ja) 2020-12-15 2025-07-11 電子デバイス

Publications (2)

Publication Number Publication Date
JP2023552884A JP2023552884A (ja) 2023-12-19
JP2023552884A5 true JP2023552884A5 (https=) 2025-08-01

Family

ID=81945564

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2023535973A Pending JP2023552884A (ja) 2020-12-15 2021-11-05 電子デバイス
JP2025117337A Pending JP2025165951A (ja) 2020-12-15 2025-07-11 電子デバイス

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025117337A Pending JP2025165951A (ja) 2020-12-15 2025-07-11 電子デバイス

Country Status (4)

Country Link
EP (1) EP4255140A4 (https=)
JP (2) JP2023552884A (https=)
CN (3) CN118175804A (https=)
WO (1) WO2022127432A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119836848A (zh) * 2022-09-19 2025-04-15 三星电子株式会社 包括热模块的pcb组件
CN115542124A (zh) * 2022-10-17 2022-12-30 英特尔产品（成都）有限公司 老化测试机的测试板的导热部件、测试板和老化测试机
CN116247013A (zh) * 2022-12-16 2023-06-09 超聚变数字技术有限公司 芯片封装模组及电子设备
EP4633016A4 (en) * 2022-12-22 2026-02-18 Shenzhen Yinwang Intelligent Technology Co Ltd HEAT DISSIPATION DEVICE, ELECTRONIC DEVICE AND VEHICLE
CN115866998B (zh) * 2022-12-27 2025-08-05 湖南海博智控科技有限公司 一种紧凑型车载影音设备
TWI866444B (zh) * 2023-09-05 2024-12-11 英研智能移動股份有限公司 電子裝置
DE102024200416A1 (de) 2024-01-17 2025-07-17 Robert Bosch Gesellschaft mit beschränkter Haftung Vorrichtung zur Entwärmung eines Elektronikbauteils eines Kraftfahrzeugs und Verfahren zur Herstellung der Vorrichtung
WO2026034952A1 (ko) * 2024-08-06 2026-02-12 주식회사 케이엠더블유 증발부 조립체 및 이를 포함하는 방열 장치와 그 방열 장치를 포함하는 전자기기 조립체

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4004457A1 (de) * 1990-02-14 1991-08-22 Telefunken Systemtechnik Waermesenke fuer ein elektronisches leiterplattenbauelement
JPH0566095A (ja) * 1991-04-09 1993-03-19 Akutoronikusu Kk 熱接続装置とその製造方法
US5430611A (en) * 1993-07-06 1995-07-04 Hewlett-Packard Company Spring-biased heat sink assembly for a plurality of integrated circuits on a substrate
US5396403A (en) * 1993-07-06 1995-03-07 Hewlett-Packard Company Heat sink assembly with thermally-conductive plate for a plurality of integrated circuits on a substrate
DE69401040T2 (de) * 1993-07-12 1997-06-05 Nippon Electric Co Gehäusestruktur für Mikrowellenschaltung
JP2927184B2 (ja) * 1993-07-12 1999-07-28 日本電気株式会社 マイクロ波回路の実装構造
JPH0864731A (ja) * 1994-08-19 1996-03-08 Hitachi Ltd 熱伝導部材及びそれを用いた冷却装置、電子機器
US5896269A (en) * 1996-11-27 1999-04-20 Gateway 2000, Inc. Positive pressure heat sink conduit
JP2001110969A (ja) * 1999-10-12 2001-04-20 Fujikura Ltd 電子素子の放熱構造
JP2002217343A (ja) * 2001-01-16 2002-08-02 Denso Corp 電子装置
JP2004186294A (ja) * 2002-12-02 2004-07-02 Denso Corp 電子装置
JP2007059608A (ja) * 2005-08-24 2007-03-08 Denso Corp 電子制御装置
US20080068805A1 (en) * 2006-09-15 2008-03-20 Foxconn Technology Co., Ltd. Heat sink assembly for multiple electronic components
KR20080029510A (ko) * 2006-09-29 2008-04-03 삼성전자주식회사 방송수신장치용 사용자인증카드 접속장치 및 이를 갖춘방송수신장치
TWM336672U (en) * 2008-02-04 2008-07-11 Celsia Technologies Taiwan Inc Heat sink module
US8109321B2 (en) * 2008-03-05 2012-02-07 Alcatel Lucent Modular heat sink assembly comprising a larger main heat sink member thermally connected to smaller additional floating heat sink members
US8970029B2 (en) * 2009-07-30 2015-03-03 Taiwan Semiconductor Manufacturing Company, Ltd. Thermally enhanced heat spreader for flip chip packaging
DE202009018077U1 (de) * 2009-08-06 2010-12-16 Siemens Aktiengesellschaft Leistungselektronikanordnung
KR101239284B1 (ko) * 2011-05-31 2013-03-06 삼성에스디에스 주식회사 증강현실 컨텐츠를 통해 타겟장치를 제어하는 제어단말기 및 서버
JP6090429B2 (ja) * 2013-03-21 2017-03-08 日本電気株式会社 ヒートシンク構造、半導体装置及びヒートシンク搭載方法
CN104216477A (zh) * 2013-05-29 2014-12-17 英业达科技有限公司 固定组件
KR102105463B1 (ko) * 2013-09-02 2020-04-28 엘지전자 주식회사 이동 단말기 및 그것의 제어 방법
CN104977904B (zh) * 2014-04-04 2018-06-19 浙江大学 一种可见即可控的智能家居控制系统及控制方法
JP2016045635A (ja) * 2014-08-21 2016-04-04 京セラドキュメントソリューションズ株式会社 端末機器、電子機器、画像形成システム、及び表示制御プログラム
JP5915721B1 (ja) * 2014-11-25 2016-05-11 日本電気株式会社 冷却装置
US9583408B1 (en) * 2015-08-21 2017-02-28 International Business Machines Corporation Reducing directional stress in an orthotropic encapsulation member of an electronic package
CN106793669B (zh) * 2015-11-20 2019-04-19 华为技术有限公司 一种散热组件及通信设备
CN105843054A (zh) * 2016-03-22 2016-08-10 美的集团股份有限公司 控制家居设备的方法、智能家居系统及移动设备
JP6839897B2 (ja) * 2017-11-06 2021-03-10 日立Astemo株式会社 電子制御装置
US10980151B2 (en) * 2018-07-31 2021-04-13 Hewlett Packard Enterprise Development Lp Flexible heat transfer mechanism configurations
CN210325761U (zh) * 2018-12-29 2020-04-14 华为技术有限公司 一种芯片装置及电子设备
CN111787752B (zh) * 2019-04-06 2023-02-24 胡俊喜 一种分体式导热器及具有散热结构的电子装置
US10811800B1 (en) * 2019-08-05 2020-10-20 Te Connectivity Corporation Cable connector assembly for an integrated circuit assembly
CN112020279B (zh) * 2020-08-31 2022-11-18 维沃移动通信有限公司 散热装置

Similar Documents

Publication Publication Date Title
JP2023552884A5 (https=)
JP2023552884A (ja) 電子デバイス
JP4892527B2 (ja) 電子制御装置
US20120085520A1 (en) Heat spreader with flexibly supported heat pipe
US10398019B2 (en) Circuit structure and electrical junction box
WO2021037206A1 (zh) 车载设备和车辆
CN102246616A (zh) 电路模块
JP2001332670A (ja) 半導体装置の実装構造
JP2010057345A (ja) 電子制御装置
EP3883353B1 (en) Automotive electronic device
EP1178594B1 (en) Electronic apparatus provided with an electronic circuit substrate
WO2014140098A1 (en) Heat spreader with flat pipe cooling element
WO2017038419A1 (ja) 回路構成体および電気接続箱
US12127376B2 (en) Heat sink, board, electronic device, and manufacturing method
JPH0680911B2 (ja) 電子部品を搭載したプリント配線板の放熱構造
JP6177510B2 (ja) 電子制御装置
JP2022165571A (ja) 電子機器および電子機器筺体
JP2017162860A (ja) 電子制御装置
CN116235297B (zh) 基板单元
JP2003297990A (ja) 半導体装置およびその固定構造ならびに半導体装置の固定方法
CN110520981A (zh) 功率转换装置
JP7844931B2 (ja) 端子カバー付き半導体スイッチ装置および電源システム
CN222108414U (zh) 具有屏蔽与散热结构的车载终端
JP2007216823A (ja) 車載制御装置のケース収容構造
CN213342514U (zh) 散热器固定组件及电视盒子