JP2023552884A - 電子デバイス - Google Patents

電子デバイス Download PDF

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Publication number
JP2023552884A
JP2023552884A JP2023535973A JP2023535973A JP2023552884A JP 2023552884 A JP2023552884 A JP 2023552884A JP 2023535973 A JP2023535973 A JP 2023535973A JP 2023535973 A JP2023535973 A JP 2023535973A JP 2023552884 A JP2023552884 A JP 2023552884A
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JP
Japan
Prior art keywords
heat dissipation
chip
housing
heat
housing wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023535973A
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English (en)
Japanese (ja)
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JP2023552884A5 (https=
Inventor
ペン、ヤオフェン
Original Assignee
ホアウェイ・テクノロジーズ・カンパニー・リミテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ホアウェイ・テクノロジーズ・カンパニー・リミテッド filed Critical ホアウェイ・テクノロジーズ・カンパニー・リミテッド
Publication of JP2023552884A publication Critical patent/JP2023552884A/ja
Priority to JP2025117337A priority Critical patent/JP2025165951A/ja
Publication of JP2023552884A5 publication Critical patent/JP2023552884A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/2049—Pressing means used to urge contact, e.g. springs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20881—Liquid coolant with phase change

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2023535973A 2020-12-15 2021-11-05 電子デバイス Pending JP2023552884A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025117337A JP2025165951A (ja) 2020-12-15 2025-07-11 電子デバイス

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN202011478901.3A CN114641177B (zh) 2020-12-15 2020-12-15 电子设备
CN202011478901.3 2020-12-15
PCT/CN2021/129084 WO2022127432A1 (zh) 2020-12-15 2021-11-05 电子设备

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025117337A Division JP2025165951A (ja) 2020-12-15 2025-07-11 電子デバイス

Publications (2)

Publication Number Publication Date
JP2023552884A true JP2023552884A (ja) 2023-12-19
JP2023552884A5 JP2023552884A5 (https=) 2025-08-01

Family

ID=81945564

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2023535973A Pending JP2023552884A (ja) 2020-12-15 2021-11-05 電子デバイス
JP2025117337A Pending JP2025165951A (ja) 2020-12-15 2025-07-11 電子デバイス

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025117337A Pending JP2025165951A (ja) 2020-12-15 2025-07-11 電子デバイス

Country Status (4)

Country Link
EP (1) EP4255140A4 (https=)
JP (2) JP2023552884A (https=)
CN (3) CN118175804A (https=)
WO (1) WO2022127432A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026034952A1 (ko) * 2024-08-06 2026-02-12 주식회사 케이엠더블유 증발부 조립체 및 이를 포함하는 방열 장치와 그 방열 장치를 포함하는 전자기기 조립체

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119836848A (zh) * 2022-09-19 2025-04-15 三星电子株式会社 包括热模块的pcb组件
CN115542124A (zh) * 2022-10-17 2022-12-30 英特尔产品（成都）有限公司 老化测试机的测试板的导热部件、测试板和老化测试机
CN116247013A (zh) * 2022-12-16 2023-06-09 超聚变数字技术有限公司 芯片封装模组及电子设备
EP4633016A4 (en) * 2022-12-22 2026-02-18 Shenzhen Yinwang Intelligent Technology Co Ltd HEAT DISSIPATION DEVICE, ELECTRONIC DEVICE AND VEHICLE
CN115866998B (zh) * 2022-12-27 2025-08-05 湖南海博智控科技有限公司 一种紧凑型车载影音设备
TWI866444B (zh) * 2023-09-05 2024-12-11 英研智能移動股份有限公司 電子裝置
DE102024200416A1 (de) 2024-01-17 2025-07-17 Robert Bosch Gesellschaft mit beschränkter Haftung Vorrichtung zur Entwärmung eines Elektronikbauteils eines Kraftfahrzeugs und Verfahren zur Herstellung der Vorrichtung

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JPH0566095A (ja) * 1991-04-09 1993-03-19 Akutoronikusu Kk 熱接続装置とその製造方法
JPH0794912A (ja) * 1993-07-12 1995-04-07 Nec Corp マイクロ波回路の実装構造
JPH07106475A (ja) * 1993-07-06 1995-04-21 Hewlett Packard Co <Hp> ヒートシンク・アセンブリ
JPH0864731A (ja) * 1994-08-19 1996-03-08 Hitachi Ltd 熱伝導部材及びそれを用いた冷却装置、電子機器
US5896269A (en) * 1996-11-27 1999-04-20 Gateway 2000, Inc. Positive pressure heat sink conduit
JP2001110969A (ja) * 1999-10-12 2001-04-20 Fujikura Ltd 電子素子の放熱構造
JP2002217343A (ja) * 2001-01-16 2002-08-02 Denso Corp 電子装置
JP2004186294A (ja) * 2002-12-02 2004-07-02 Denso Corp 電子装置
JP2007059608A (ja) * 2005-08-24 2007-03-08 Denso Corp 電子制御装置
US20080068805A1 (en) * 2006-09-15 2008-03-20 Foxconn Technology Co., Ltd. Heat sink assembly for multiple electronic components
US20090195984A1 (en) * 2008-02-04 2009-08-06 Meyer Iv George Anthony Cooling device
US20090223647A1 (en) * 2008-03-05 2009-09-10 Sinan Alousi Modular heat sink assembly comprising a larger main heat sink member thermally connected to smaller additional floating heat sink members
WO2014148026A1 (ja) * 2013-03-21 2014-09-25 日本電気株式会社 ヒートシンク構造、半導体装置及びヒートシンク搭載方法
JP2019087609A (ja) * 2017-11-06 2019-06-06 日立オートモティブシステムズ株式会社 電子制御装置

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Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0566095A (ja) * 1991-04-09 1993-03-19 Akutoronikusu Kk 熱接続装置とその製造方法
JPH07106475A (ja) * 1993-07-06 1995-04-21 Hewlett Packard Co <Hp> ヒートシンク・アセンブリ
JPH0794912A (ja) * 1993-07-12 1995-04-07 Nec Corp マイクロ波回路の実装構造
JPH0864731A (ja) * 1994-08-19 1996-03-08 Hitachi Ltd 熱伝導部材及びそれを用いた冷却装置、電子機器
US5896269A (en) * 1996-11-27 1999-04-20 Gateway 2000, Inc. Positive pressure heat sink conduit
JP2001110969A (ja) * 1999-10-12 2001-04-20 Fujikura Ltd 電子素子の放熱構造
JP2002217343A (ja) * 2001-01-16 2002-08-02 Denso Corp 電子装置
JP2004186294A (ja) * 2002-12-02 2004-07-02 Denso Corp 電子装置
JP2007059608A (ja) * 2005-08-24 2007-03-08 Denso Corp 電子制御装置
US20080068805A1 (en) * 2006-09-15 2008-03-20 Foxconn Technology Co., Ltd. Heat sink assembly for multiple electronic components
US20090195984A1 (en) * 2008-02-04 2009-08-06 Meyer Iv George Anthony Cooling device
US20090223647A1 (en) * 2008-03-05 2009-09-10 Sinan Alousi Modular heat sink assembly comprising a larger main heat sink member thermally connected to smaller additional floating heat sink members
WO2014148026A1 (ja) * 2013-03-21 2014-09-25 日本電気株式会社 ヒートシンク構造、半導体装置及びヒートシンク搭載方法
JP2019087609A (ja) * 2017-11-06 2019-06-06 日立オートモティブシステムズ株式会社 電子制御装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026034952A1 (ko) * 2024-08-06 2026-02-12 주식회사 케이엠더블유 증발부 조립체 및 이를 포함하는 방열 장치와 그 방열 장치를 포함하는 전자기기 조립체

Also Published As

Publication number Publication date
CN118250968A (zh) 2024-06-25
JP2025165951A (ja) 2025-11-05
CN114641177A (zh) 2022-06-17
EP4255140A4 (en) 2025-01-08
CN118175804A (zh) 2024-06-11
CN114641177B (zh) 2024-02-13
EP4255140A1 (en) 2023-10-04
WO2022127432A1 (zh) 2022-06-23

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