WO2022127432A1 - 电子设备 - Google Patents

电子设备 Download PDF

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Publication number
WO2022127432A1
WO2022127432A1 PCT/CN2021/129084 CN2021129084W WO2022127432A1 WO 2022127432 A1 WO2022127432 A1 WO 2022127432A1 CN 2021129084 W CN2021129084 W CN 2021129084W WO 2022127432 A1 WO2022127432 A1 WO 2022127432A1
Authority
WO
WIPO (PCT)
Prior art keywords
chip
heat dissipation
heat
shell
shell wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2021/129084
Other languages
English (en)
French (fr)
Chinese (zh)
Inventor
彭耀锋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Priority to EP21905361.8A priority Critical patent/EP4255140A4/en
Priority to JP2023535973A priority patent/JP2023552884A/ja
Publication of WO2022127432A1 publication Critical patent/WO2022127432A1/zh
Anticipated expiration legal-status Critical
Priority to JP2025117337A priority patent/JP2025165951A/ja
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/2049—Pressing means used to urge contact, e.g. springs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20881—Liquid coolant with phase change

Definitions

  • the elastic member is compressed between the heat-conducting member and the first shell wall, which can reduce most of the gap between the chip and the heat-conducting member and improve the degree of adhesion between the chip and the heat-conducting member.
  • the heat transfer speed between the chip and the heat-conducting member is also improved, and the heat-conducting member can quickly absorb the heat of the chip, and pass the absorbed heat through the elasticity of heat transfer.
  • the components are transferred to the heat dissipation housing, thereby improving the heat dissipation effect of the electronic device.
  • the elastic member includes a spring and a heat pipe; the spring is compressed between the heat-conducting member and the first shell wall, so as to reduce the friction between the chip and the heat-conducting member a gap; the heat pipe is connected between the heat-conducting member and the first shell wall to transfer the heat absorbed by the heat-conducting member from the chip to the heat dissipation shell; the heat pipe has elasticity, the A heat pipe is compressed between the surface of the thermally conductive member remote from the chip and the inner surface of the first shell wall of the heat dissipation housing.
  • the elastic member is a bent heat-conducting sheet, which is compressed and disposed between the surface of the heat-conducting member away from the chip and the inner surface of the first shell wall. Pieces provide elasticity through bending properties and heat transfer through thermal conductivity properties.
  • the circuit board is fixed on the shell wall of the heat dissipation shell.
  • an electronic device which includes a heat dissipation shell, a circuit board, a chip, an elastic member and a heat dissipation device; the circuit board and the chip are both located in a cavity formed by the heat dissipation shell and the chip is located on the surface of the circuit board; the first shell wall of the heat dissipation shell has an opening at a position corresponding to the chip, and the first shell wall is the surface of the heat dissipation shell and the the shell wall opposite to the chip; the heat dissipation device includes a heat dissipation seat and a mounting plate, and the mounting plate is located on the outer surface of the side wall of the heat dissipation seat; the heat dissipation seat is matched with the opening, and the heat dissipation seat can be The disassembly is arranged in the opening, the heat sink is located on the surface of the chip away from the circuit board, the hanging board is located on the outer surface of the first shell wall; the
  • the heat dissipation fins can increase the total heat dissipation area of the heat dissipation base, thereby speeding up the dissipation of heat from the chip.
  • the electronic device further includes a thermal interface material layer; the thermal interface material layer is filled in the gap between the chip and the first shell wall; the elastic member can also The thickness of the thermal interface material layer filled in the gap is reduced.
  • the heat pipe 62 may include three sections, namely a first pipe section 621 , a second pipe section 622 and a third pipe section 623 , and the first pipe section 621 is attached to the heat conducting member 5 On the surface away from the chip 3 , the third tube section 623 is attached to the inner surface of the first shell wall 11 , and the second tube section 622 is connected obliquely between the first tube section 621 and the second tube section 622 .
  • the electronic device includes not only a heat dissipation shell 1, a circuit board 2 and a chip 3, but also a thermal interface material layer 4, a thermally conductive member 5 and an elastic member 6.
  • the thermally conductive member 5 is located on the surface of the chip 3 facing away from the circuit board 2, and the thermal interface material
  • the layer 4 is located on the surface of the thermally conductive member 5 facing away from the chip 3 , and the elastic member 6 with heat transfer performance is compressed between the thermally conductive member 5 and the first shell wall 11 .
  • the heat dissipation device 7 may include a heat dissipation base 71 and a hanging plate 72 , the heat dissipation base 71 may have a plate-like structure and a certain thickness, and the hanging plate 72 may be located at the side wall of the heat dissipation base 71 and hangs The bottom of the connecting plate 72 is higher than the bottom of the heat sink 71 .
  • the heat dissipation base 71 is used for contacting with the chip 3
  • the hanger plate 72 is used to realize the detachable installation of the heat dissipation device 7 and the heat dissipation case 1 .
  • the positional relationship and installation relationship between the heat dissipation device 7 and the heat dissipation housing 1 may be as follows:
  • a thermal interface material layer 4 is filled between the chip 3 and the first shell wall 11 .
  • the thermal interface material layer 4 is a flexible material and has a certain thermal conductivity.
  • the thermal interface material layer 4 may be silica gel, silicone grease, gel, etc.
  • the specific material of the thermal interface material layer 4 is not limited in this embodiment, as long as an absorption gap and heat conduction effects can be achieved.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
PCT/CN2021/129084 2020-12-15 2021-11-05 电子设备 Ceased WO2022127432A1 (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP21905361.8A EP4255140A4 (en) 2020-12-15 2021-11-05 Electronic device
JP2023535973A JP2023552884A (ja) 2020-12-15 2021-11-05 電子デバイス
JP2025117337A JP2025165951A (ja) 2020-12-15 2025-07-11 電子デバイス

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202011478901.3A CN114641177B (zh) 2020-12-15 2020-12-15 电子设备
CN202011478901.3 2020-12-15

Publications (1)

Publication Number Publication Date
WO2022127432A1 true WO2022127432A1 (zh) 2022-06-23

Family

ID=81945564

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2021/129084 Ceased WO2022127432A1 (zh) 2020-12-15 2021-11-05 电子设备

Country Status (4)

Country Link
EP (1) EP4255140A4 (https=)
JP (2) JP2023552884A (https=)
CN (3) CN118175804A (https=)
WO (1) WO2022127432A1 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115866998A (zh) * 2022-12-27 2023-03-28 湖南海博智控科技有限公司 一种紧凑型车载影音设备
CN116247013A (zh) * 2022-12-16 2023-06-09 超聚变数字技术有限公司 芯片封装模组及电子设备
DE102024200416A1 (de) 2024-01-17 2025-07-17 Robert Bosch Gesellschaft mit beschränkter Haftung Vorrichtung zur Entwärmung eines Elektronikbauteils eines Kraftfahrzeugs und Verfahren zur Herstellung der Vorrichtung
EP4543148A4 (en) * 2022-09-19 2025-10-22 Samsung Electronics Co Ltd PCB ASSEMBLY INCLUDING A THERMAL MODULE

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115542124A (zh) * 2022-10-17 2022-12-30 英特尔产品（成都）有限公司 老化测试机的测试板的导热部件、测试板和老化测试机
EP4633016A4 (en) * 2022-12-22 2026-02-18 Shenzhen Yinwang Intelligent Technology Co Ltd HEAT DISSIPATION DEVICE, ELECTRONIC DEVICE AND VEHICLE
TWI866444B (zh) * 2023-09-05 2024-12-11 英研智能移動股份有限公司 電子裝置
WO2026034952A1 (ko) * 2024-08-06 2026-02-12 주식회사 케이엠더블유 증발부 조립체 및 이를 포함하는 방열 장치와 그 방열 장치를 포함하는 전자기기 조립체

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4543148A4 (en) * 2022-09-19 2025-10-22 Samsung Electronics Co Ltd PCB ASSEMBLY INCLUDING A THERMAL MODULE
CN116247013A (zh) * 2022-12-16 2023-06-09 超聚变数字技术有限公司 芯片封装模组及电子设备
CN115866998A (zh) * 2022-12-27 2023-03-28 湖南海博智控科技有限公司 一种紧凑型车载影音设备
DE102024200416A1 (de) 2024-01-17 2025-07-17 Robert Bosch Gesellschaft mit beschränkter Haftung Vorrichtung zur Entwärmung eines Elektronikbauteils eines Kraftfahrzeugs und Verfahren zur Herstellung der Vorrichtung

Also Published As

Publication number Publication date
CN118250968A (zh) 2024-06-25
JP2025165951A (ja) 2025-11-05
CN114641177A (zh) 2022-06-17
EP4255140A4 (en) 2025-01-08
CN118175804A (zh) 2024-06-11
JP2023552884A (ja) 2023-12-19
CN114641177B (zh) 2024-02-13
EP4255140A1 (en) 2023-10-04

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