CN115551174A - 散热结构总成 - Google Patents
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Abstract
一种散热结构总成,应用于装设于电路载板上的热源,包含弹性限位件、膏状散热墙、密合件、相变化金属及组装板件。弹性限位件设置于电路载板上,位于热源的周缘,弹性限位件具有第一高度。膏状散热墙设置于电路载板上,位于热源与弹性限位件之间,与热源的周缘及弹性限位件接触。膏状散热墙具有第二高度,第一高度大于所述第二高度,且第二高度大于热源的高度。密合件与膏状散热墙的顶端接触,并卡接于弹性限位件的侧边。相变化金属填充于密合件、膏状散热墙与热源之间的区域,相变化金属在超过一临界温度后转变为液态。组装板件与密合件连接,且组装板件的一部分接触弹性限位件的顶端。
Description
技术领域
本发明涉及电子领域,更具体的涉及一种应用于装设于电路载板上的热源的散热结构总成。
背景技术
随着各种电子装置的效能越来越高,其产生的热能也越来越大,若不能有效地将热源导出,可能使得内部的电子组件热崩溃、失效,甚至使得电子装置整体的损毁。
以计算机为例,目前主要的热源在于中央处理器(Central Processing Unit,CPU),或是图形处理器(Graphics Processing Unit,GPU)。在其表面上,通常会以液态金属与散热的壳体接触,来将热源产生的热通过热传导的方式快速导出。然而,由于液态金属具有流动的特性,可能因为携行的角度、震动,而导致液态金属外流到其他的位置,这可能导致原先的散热效果不佳,也可能因为液态金属与其他的组件接触,导致短路等问题。
发明内容
本发明主要提供一种散热结构总成,应用于装设于电路载板上的热源。散热结构总成包含弹性限位件、膏状散热墙、密合件、相变化金属及组装板件。弹性限位件设置于电路载板上,位于热源的周缘,弹性限位件具有第一高度。膏状散热墙设置于电路载板上,位于热源与弹性限位件之间,与热源的周缘接触,且邻近弹性限位件。膏状散热墙具有第二高度,第一高度大于所述第二高度,且第二高度大于热源的高度。密合件与膏状散热墙的顶端接触,并卡接于弹性限位件的侧边。相变化金属填充于密合件、膏状散热墙与热源之间的区域,相变化金属在超过一临界温度后转变为液态。组装板件与密合件连接,且组装板件的一部分接触弹性限位件的顶端。
在一些实施例中,热源是中央处理器(CPU)或图形处理器(GPU)。
在一些实施例中,相变化金属的临界温度范围是摄氏50至65度。优选地,在一些实施例中,相变化金属的临界温度范围是摄氏54至60度。
在一些实施例中,弹性限位件是弹性泡棉。
在一些实施例中,密合件是铜块。
在一些实施例中,组装板件是金属板件。
在一些实施例中,组装板件的固定于电路载板。
在一些实施例中,密合件与组装板件焊接为一体。
在一些实施例中,组装板件的厚度大于密合件。
在一些实施例中,散热结构总成更包含第二弹性限位件,设置于电路载板上,且围绕弹性限位件。在前述实施例中可以理解的是,通过选择相变化金属,使得在具有热源电子装置未使用或冷却时,维持流动较低的状态,并通过弹性限位件的弹性与组装板件,限制相变化金属可能流动的区域,并避免其溢出而影响整体的电性。
以下结合附图和具体实施例对本发明进行详细描述,但不作为对本发明的限定。
附图说明
图1为散热结构总成的剖视图;
图2为散热结构总成的爆炸图;
图3为散热结构总成另一实施例的爆炸图。
具体实施方式
以下通过具体实施方式对本发明进一步的描述。本发明的各附图仅为示意以更容易了解本发明,其具体比例可依照设计需求进行调整。文中所描述的图形中相对元件的上下关系,在本领域技术人员应能理解是指构件的相对位置而言,对应的,以元件在上一面为正面、在下一面为背面以便于理解,因此皆可以翻转而呈现相同的构件,此皆应同属本说明书所揭露的范围。
图1为散热结构总成的剖视图。图2为散热结构总成的爆炸图。如图1及图2所示,散热结构总成1应用于装设于电路载板500上的热源510。散热结构总成1包含弹性限位件10、膏状散热墙20、密合件30、相变化金属40及组装板件50。
弹性限位件10设置于电路载板500上,位于热源510的周缘,弹性限位件10具有第一高度。膏状散热墙20设置于电路载板500上,位于热源510与弹性限位件10之间,与热源510的周缘接触,且邻近弹性限位件10。即,膏状散热墙20可与弹性限位件10接触,也可以保留有间隙。膏状散热墙20具有第二高度,第一高度大于所述第二高度,且第二高度大于热源510的高度。在一些实施例中,热源是中央处理器(CPU)或图形处理器(GPU)。膏状散热墙20可以通过一般的散热膏,或其他富含陶瓷粒子的绝缘导热膏来实验,直接涂布于热源510的周缘,或者可以在完成弹性限位件10的设置后,直接填入于弹性限位件10之间的空间。
密合件30与膏状散热墙20的顶端接触,并卡接于弹性限位件10的侧边。相变化金属40填充于密合件30、膏状散热墙20与热源510之间的区域,相变化金属40在超过一临界温度后转变为液态。在一些实施例中,相变化金属40是在完成弹性限位件10及膏状散热墙20的设置后,涂布于热源510的表面,之后再将密合件30与膏状散热墙20接触固定,而限制了相变化金属40的位置。
组装板件50与密合件30连接,且组装板件50的一部分接触弹性限位件10的顶端。在一些实施例中,密合件30是铜块、组装板件50是金属板件。热源510产生的热量,通过紧密相连的相变化金属40、密合件30、组装板件50快速地导到外部,再通过热管或是风扇(图中未示出)将热能移除。
在一些实施例中,密合件30与组装板件40焊接为一体。换言之,密合件30与组装板件40可以做为一个外盖,再完成完成弹性限位件10、膏状散热墙20及相变化金属40,直接以盖体的方式组装。进一步地,在一些实施例中,组装板件50还可以通过螺丝等方式固定于电路载板500。
在一些实施例中,相变化金属40的临界温度范围是摄氏50至65度。优选地,在一些实施例中,相变化金属40的临界温度范围是摄氏54至60度。更优选地,相变化金属的临界温度为摄氏58度+/-0.5度。换言之,若将笔记本电脑、平板计算机等电子装置,在未开机、或关机冷却一定时间的状态,相变化金属40将由液态转变回固态,从而在在移动、或受震动时,相变化金属40不会流动,而能有效地避免溢出,或是脱离热源510表面。
一般而言,热源510可能表面有凹凸、热源510也可能因为制程公差有高度差,在一些实施例中,弹性限位件10是弹性泡棉。组装板件50的厚度大于密合件30。换言之,组装板件50提供较大的重量来产生压力,无论热源510的高度较高或较低,都能通过弹性限位件10的弹性来调整,避免产生空隙,而使得相变化金属40尽量贴附热源510的表面、避免溢出。即便膏状散热墙20有空隙造成相变化金属40渗漏时,弹性泡棉也具有吸收的效果,能避免相变化金属40跑到外部,而造成其他电路载板500上的组件电气连接受到影响。
图3为散热结构总成另一实施例的爆炸图。如图3所示,在另一些实施例中,散热结构总成1更包含第二弹性限位件15。第二弹性限位件15设置于电路载板500上,且围绕弹性限位件10。第二弹性限位件15可以与弹性限位件10都以弹性泡棉形成,但不限于此,也可以是其他具有弹性及吸收的材料。通过第二弹性限位件15可以进一步防止相变化金属40扩散到外部。
综上所述,通过选择相变化金属40,使得在具有热源电子装置未使用或冷却时,维持流动较低的状态,并通过弹性限位件10的弹性与组装板件50,限制相变化金属40可能流动的区域,并避免其溢出而影响整体的电性。
当然,本发明还可有其它多种实施例,在不背离本发明精神及其实质的情况下,熟悉本领域的技术人员当可根据本发明作出各种相应的改变和变形,但这些相应的改变和变形都应属于本发明所附的权利要求的保护范围。
Claims (11)
1.一种散热结构总成,应用于装设于电路载板上的热源,其特征在于,包含:
弹性限位件,设置于所述电路载板上,位于所述热源的周缘,所述弹性限位件具有第一高度;
膏状散热墙,设置于所述电路载板上,位于所述热源与所述弹性限位件之间,与所述热源的周缘接触,且邻近所述弹性限位件,所述膏状散热墙具有第二高度,其中所述第一高度大于所述第二高度,且所述第二高度大于所述热源的高度;
密合件,与所述膏状散热墙的顶端接触,并卡接于所述弹性限位件的侧边;
相变化金属,填充于所述密合件、所述膏状散热墙与所述热源之间的区域,其中所述相变化金属在超过一临界温度后转变为液态;及
组装板件,与所述密合件连接,且所述组装板件的一部分接触所述弹性限位件的顶端。
2.如权利要求1所述的散热结构总成,其特征在于:
所述热源是中央处理器CPU或图形处理器GPU。
3.如权利要求1所述的散热结构总成,其特征在于:
所述相变化金属的临界温度范围是摄氏50至65度。
4.如权利要求1所述的散热结构总成,其特征在于:
所述相变化金属的临界温度范围是摄氏54至60度。
5.如权利要求1所述的散热结构总成,其特征在于:
所述弹性限位件是弹性泡棉。
6.如权利要求1所述的散热结构总成,其特征在于:
所述密合件是铜块。
7.如权利要求1所述的散热结构总成,其特征在于:
所述组装板件是金属板件。
8.如权利要求1所述的散热结构总成,其特征在于:
所述组装板件的固定于所述电路载板。
9.如权利要求1所述的散热结构总成,其特征在于:
所述密合件与所述组装板件焊接为一体。
10.如权利要求1所述的散热结构总成,其特征在于:
所述组装板件的厚度大于所述密合件。
11.如权利要求1所述的散热结构总成,其特征在于:
更包含第二弹性限位件,设置于所述电路载板上,且围绕所述弹性限位件。
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US17/516,098 US11818869B2 (en) | 2021-06-30 | 2021-11-01 | Heat dissipation structure assembly |
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US (1) | US11818869B2 (zh) |
EP (1) | EP4113247B1 (zh) |
CN (1) | CN115551174A (zh) |
Family Cites Families (14)
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US6752204B2 (en) * | 2001-09-18 | 2004-06-22 | Intel Corporation | Iodine-containing thermal interface material |
US7498203B2 (en) * | 2006-04-20 | 2009-03-03 | Texas Instruments Incorporated | Thermally enhanced BGA package with ground ring |
US20080001282A1 (en) * | 2006-06-30 | 2008-01-03 | Mitul Modi | Microelectronic assembly having a periphery seal around a thermal interface material |
US10373891B2 (en) * | 2013-06-14 | 2019-08-06 | Laird Technologies, Inc. | Methods for establishing thermal joints between heat spreaders or lids and heat sources |
US9420734B2 (en) * | 2014-04-01 | 2016-08-16 | Advanced Micro Devices, Inc. | Combined electromagnetic shield and thermal management device |
US20190045666A1 (en) * | 2015-12-24 | 2019-02-07 | Intel Corporation | Electronic device heat transfer system and related methods |
WO2019112582A1 (en) * | 2017-12-07 | 2019-06-13 | Intel Corporation | A heat dissipation structure for an integrated circuit package |
CN208159088U (zh) * | 2018-03-30 | 2018-11-27 | 深圳市英威腾电气股份有限公司 | 一种散热封装装置 |
US20200126887A1 (en) * | 2018-10-18 | 2020-04-23 | Intel Corporation | Thin line dam on underfill material to contain thermal interface materials |
US11581240B2 (en) * | 2018-12-21 | 2023-02-14 | Intel Corporation | Liquid thermal interface material in electronic packaging |
US20200260609A1 (en) * | 2019-02-12 | 2020-08-13 | Intel Corporation | Thermal management solutions for integrated circuit packages |
TWM579819U (zh) * | 2019-03-04 | 2019-06-21 | 華碩電腦股份有限公司 | 散熱結構 |
US11784108B2 (en) * | 2019-08-06 | 2023-10-10 | Intel Corporation | Thermal management in integrated circuit packages |
US20220216127A1 (en) * | 2021-01-04 | 2022-07-07 | Infinera Corp. | Thermal interface material containment |
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- 2021-06-30 CN CN202110748402.XA patent/CN115551174A/zh active Pending
- 2021-11-01 US US17/516,098 patent/US11818869B2/en active Active
- 2021-11-05 EP EP21206725.0A patent/EP4113247B1/en active Active
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US11818869B2 (en) | 2023-11-14 |
EP4113247A1 (en) | 2023-01-04 |
EP4113247B1 (en) | 2024-02-28 |
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