WO2022242510A1 - 散热装置及车载模块 - Google Patents

散热装置及车载模块 Download PDF

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Publication number
WO2022242510A1
WO2022242510A1 PCT/CN2022/092032 CN2022092032W WO2022242510A1 WO 2022242510 A1 WO2022242510 A1 WO 2022242510A1 CN 2022092032 W CN2022092032 W CN 2022092032W WO 2022242510 A1 WO2022242510 A1 WO 2022242510A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
heat dissipation
main
chip
main circuit
Prior art date
Application number
PCT/CN2022/092032
Other languages
English (en)
French (fr)
Inventor
彭耀锋
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to EP22803832.9A priority Critical patent/EP4333578A4/en
Publication of WO2022242510A1 publication Critical patent/WO2022242510A1/zh
Priority to US18/512,344 priority patent/US20240090117A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0217—Mechanical details of casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/069—Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/2049—Pressing means used to urge contact, e.g. springs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Definitions

  • the present application relates to the technical field of vehicle-mounted electronic equipment, in particular to a heat dissipation device and a vehicle-mounted module.
  • the vehicle-mounted module includes a metal case and a circuit board set inside the metal case.
  • Various high-power devices are connected to the circuit board, and a soft thermal interface material is filled between the high-power device and the case, such as thermal gel or thermal pad etc., the heat of high power consumption devices can be transferred to the metal casing through the thermal interface material, and then dissipated to the environment.
  • thermal conductive gels or thermal pads cannot meet the heat dissipation requirements.
  • Embodiments of the present application provide a heat dissipation device and a vehicle-mounted module, which can improve heat dissipation efficiency of high power consumption devices.
  • An embodiment of the present application provides a heat dissipation device on the one hand, including: a radiator shell, a main circuit board, an adapter circuit board, and a chip; the radiator shell includes an upper shell and a lower shell, and the upper shell and the lower shell are sealed and connected, and the upper shell includes The main heat sink, the main circuit board is fixed in the upper shell, the main circuit board and the main heat sink are arranged oppositely, the chip is fixed on the transfer circuit board, the transfer circuit board is electrically connected to the main circuit board through flexible conductive parts, and the transfer circuit The board is connected to the main circuit board or the main heat sink through elastic supports.
  • the elastic supports are used to press the transfer circuit board so that the chip is closely attached to the main heat sink of the upper case.
  • the gap between the chip and the main heat sink is filled with heat conduction layer, the thermal conduction layer is used to reduce the contact thermal resistance between the chip and the main heat sink.
  • the chips with high power consumption are separately fixed on the transfer circuit board, and the transfer circuit board is fixed on the main circuit board or the main heat dissipation board through spring screws or other elastic supports.
  • the signal interconnection between the adapter circuit board and the main circuit board is realized through flexible conductive parts.
  • the elastic support can absorb the assembly tolerance and realize the tight fit between the chip and the heat sink shell, which can greatly reduce the gap between the chip and the heat sink shell.
  • the thickness of the heat conduction layer reduces the thermal resistance of the heat conduction layer, which can effectively reduce the temperature of the chip and reduce the risk of overheating of the chip.
  • the transfer circuit board and the elastic support are detachably connected, and the transfer circuit board and the chip form a replaceable assembly.
  • This setting can not only meet the needs of different customers for different types of chips, but also has high applicability, and if the ability to upgrade the chip is required, only the chip and the circuit board need to be replaced.
  • the evolution capability is strong and the cost of replacement is lower.
  • the elastic supporting member includes a spring screw or an elastic reed.
  • Both the spring screw or the elastic reed have sufficient supporting strength, and can be elastically deformed at the same time to provide elastic force, so that the chip is arranged close to the main cooling plate of the radiator shell.
  • the head of the spring screw is located on the side of the transfer circuit board facing away from the main circuit board, the tail of the spring screw is connected to the main circuit board, and the spring of the spring screw is located between the transfer circuit board and the main circuit board. between circuit boards.
  • the position of the main circuit board relative to the upper case is fixed, and the spring arranged between the transfer circuit board and the main circuit board can provide pressure for the transfer circuit board, so that the chip is closely attached to the main heat sink.
  • the side of the main circuit board away from the transfer circuit board is also provided with a structural reinforcement plate, the structural reinforcement plate is fixedly connected to the main circuit board, and the projection of the elastic support on the main circuit board is located in the structure.
  • the reinforcement board is within the range of the projection on the main circuit board.
  • the arrangement of the structural reinforcing plate can increase the rigidity of the main circuit board, and can prevent the elastic force of the elastic support from deforming the main circuit board, causing damage and failure of the stress-sensitive components on the main circuit board.
  • the head of the spring screw is located on the side of the transfer circuit board facing away from the main heat sink, the tail of the spring screw is connected to the main heat sink, and the spring of the spring screw is located between the transfer circuit board and the spring. between the heads of the screws.
  • the position of the head of the spring screw relative to the upper case is fixed, and the spring arranged between the head of the spring screw and the transfer circuit board can provide pressure for the transfer circuit board, so that the chip is tightly attached to the main heat sink.
  • the thickness of the heat conducting layer is less than 0.2 mm.
  • the chip Under the action of the elastic support, the chip is placed close to the main heat dissipation plate of the radiator shell, and the thickness of the heat conduction layer can be greatly reduced, thereby reducing the thermal resistance of the heat conduction layer and effectively reducing the temperature of the chip.
  • the heat conduction layer includes heat conduction silicone grease or a phase change heat conduction film.
  • Thermal conductive silicone grease and phase-change thermal conductive film have low thermal conductivity, and the process can achieve extremely thin thickness, which is beneficial to reduce the thermal resistance of the thermal conductive layer and reduce the temperature of the chip.
  • the flexible conductive member includes a flexible circuit board, a flexible connector or a cable.
  • the flexible circuit board, flexible connector or cable can realize the signal interconnection between the transfer circuit board and the main circuit board, and its flexible characteristics can ensure the reliability of the electrical connection when the transfer circuit board floats up and down during the installation process .
  • the provision of multiple elastic supports can provide uniform and reliable support for the transfer circuit board, and at the same time can improve the overall service life of the elastic supports.
  • Setting up multiple transfer circuit boards is beneficial to the conduction and heat dissipation between multiple high-power consumption chips and the main heat sink plate of the radiator shell, and the multiple transfer circuit boards are independently set up, which is smaller than setting up only one area.
  • the multiple transfer circuit boards are independently set up, which is smaller than setting up only one area.
  • For a large adapter circuit board that can fix multiple high-power consumption chips it can largely avoid other high-height devices on the main circuit board, thereby facilitating the arrangement of electronic devices on the main circuit board.
  • the main heat sink is an air-cooled heat sink or a liquid-cooled heat sink.
  • the main heat sink is the area with the highest heat dissipation efficiency in the heat sink, which can dissipate heat in different forms such as air cooling or water cooling, that is, the heat sink provided in the embodiment of the present application is suitable for air-cooled radiators or liquid-cooled radiators.
  • Another aspect of the embodiment of the present application provides a vehicle-mounted module, including the heat dissipation device as described above.
  • the upper shell and the lower shell of the heat sink are sealed and connected by dispensing, which can meet the design requirements of dustproof and waterproof.
  • the upper shell and the lower shell are fixed by dispensing, the upper shell and the lower The shell does not fluctuate up and down, so the fixing reliability of the connector is high, and the connection failure of the connector can be avoided.
  • the embodiment of the present application provides a heat dissipation device and a vehicle-mounted module, by separately fixing the high power consumption chip on the transfer circuit board, and fixing the transfer circuit board on the main circuit board or the main heat dissipation board through the elastic support , the elastic support can absorb the tolerance of assembly, and realize the tight fit between the chip and the radiator shell, thereby effectively reducing the risk of overheating of the chip, and helping to improve the overall heat dissipation effect of the vehicle module.
  • Fig. 1 is a schematic structural diagram of an on-board module provided by related technologies
  • FIG. 2 is a schematic cross-sectional view of a heat dissipation device provided by the related art
  • FIG. 3 is a schematic cross-sectional view of another heat dissipation device provided by the related art.
  • FIG. 4 is a schematic cross-sectional view of a heat dissipation device provided in an embodiment of the present application.
  • FIG. 5 is a schematic structural diagram of the internal components of the heat dissipation device provided by the embodiment of the present application.
  • FIG. 6 is another schematic cross-sectional view of the heat dissipation device provided by the embodiment of the present application.
  • 100-radiating device 11-radiator shell; 111-upper shell; 1111-radiating fin; 1112-main cooling plate; 1113-side wall; 1114-fixed boss; 112-lower shell; 13-transfer circuit board; 14-chip; 15-flexible conductive parts; 16-elastic support; 17-heat conduction layer; 18-structural reinforcement board; 191-thermal interface material; Grease; 194-threaded fasteners; 200-connectors.
  • FIG. 1 is a schematic structural diagram of an on-vehicle module provided by the related art.
  • the vehicle-mounted module may include a heat sink 100 and a connector 200, the vehicle-mounted module may be connected to an external cable or other device through the connector 200 to realize the function of the module, and the heat sink 100 may be used to realize the heat dissipation of the vehicle-mounted module Dissipate heat in time to avoid high temperature from damaging the function of the on-board module.
  • the vehicle-mounted module is equipped with a main circuit board and various electronic devices. Dust accumulation or liquid ingress will have a great impact on the performance and life of the main circuit board and electronic devices. Therefore, the vehicle-mounted module has higher requirements for dustproof and waterproof levels.
  • the vehicle-mounted module can be set as a rigid and sealed shell, which can be a die-cast metal shell, so as to meet the heat dissipation requirements and achieve a certain level of dustproof and waterproof.
  • FIG. 2 is a schematic cross-sectional view of a heat dissipation device provided in the related art.
  • the heat dissipation device 100 may include a radiator housing 11 and a main circuit board 12 disposed inside the radiator housing 11 , and a chip 14 and other electronic devices are disposed on the main circuit board 12 .
  • the heat generated by the main circuit board 12, the chip 14 and other electronic devices can be transmitted to the radiator shell 11 through radiation and convection.
  • the radiator shell 11 is provided with a plurality of heat dissipation fins 1111, which are conducted to the heat dissipation fins 1111. The heat can be dissipated to the outside air through radiation and convection.
  • a soft thermal interface material 191 is filled between the chip 14 and the radiator shell 11, such as a thermal gel or a thermal pad, etc., and the thermal interface material 191 can thermally connect the chip 14 to the radiator shell 11, so that the chip The heat of 14 can be transferred to the radiator shell 11 through the thermal interface material 191, and then dissipated into the environment, which can improve the heat dissipation efficiency.
  • the radiator housing 11 may include an upper case 111 and a lower case 112, the upper case 111 may include a main cooling plate 1112 and a side wall 113 connected around the main cooling plate 1112, and the cooling fins 1111 may be arranged on the main cooling plate of the upper case 111 1112 , the upper shell 111 and the lower shell 112 can be sealed and connected by dispensing glue, so that the radiator shell 11 meets a certain dustproof and waterproof level.
  • the side wall 1113 of the upper case 111 protrudes from a fixed boss 1114, the main circuit board 12 is fixed on the fixed boss 1114 and is opposite to the main heat sink 1112, and the chip 14 is fixed on the side of the main circuit board 12 facing the main board.
  • One side of the cooling plate 1112 One side of the cooling plate 1112 .
  • the chip 14 itself has a height tolerance
  • the radiator shell 11 itself also has a tolerance, that is, the tolerance of the fixed boss 1114.
  • the existence of these two types of unavoidable tolerances makes the distance between the chip 14 and the main heat sink 1112 not a fixed value.
  • the sealed connection of the upper shell 111 and the lower shell 112 cannot realize the adjustment of floating up and down, that is, the above two tolerances cannot be absorbed by changing the position of the upper shell 111 or the lower shell 112 . Therefore, in the related art, the soft thermal interface material 191 has the characteristics of flexible deformation and also has the function of absorbing tolerances.
  • the thickness of the heat-conducting gel or the heat-conducting pad is large, and the thermal resistance is high, which cannot meet the heat dissipation requirements of high-power consumption chips.
  • the thermal resistance of the thermal interface material 191 can be calculated by the above formula 1
  • the temperature difference between the upper and lower surfaces of the thermal interface material 191 can be obtained through the above formula two.
  • thermally conductive gel with good tolerance absorption capacity considering the height tolerance of the chip 14, the thickness tolerance of the main circuit board 12, and the processing tolerance of the radiator shell 11, the filling thickness of the thermally conductive gel is about 0.001m
  • the thermal conductivity of thermally conductive gel with better thermal conductivity is about 8W/mk
  • the coating area of the chip is about 0.024m*0.024m.
  • the thermal resistance of the thermally conductive gel can be obtained as 0.217°C/W.
  • the power consumption of the chip is 66W.
  • the temperature difference between the upper and lower surfaces of the thermal gel can be obtained as 14°C .
  • the temperature difference is related to the temperature of the chip 14 , and by reducing the temperature difference between the upper and lower surfaces of the thermally conductive gel, the temperature of the chip 14 can be reduced, reducing the risk of overheating of the chip 14 .
  • the thermal resistance of the thermal interface material 191 is related to the filling thickness of the thermal interface material 191 , thermal conductivity and the coating area of the thermal interface material 191 on the chip 14 .
  • the thermal interface material 191 is usually composed of inorganic materials filled with thermally conductive metal particles, it is difficult to increase its thermal conductivity, and increasing the thermal conductivity from 8W/mk to 10W/mk will increase its cost by 2 times. That is, reducing the thermal resistance of the thermal interface material 191 by increasing the thermal conductivity of the thermal interface material 191 is difficult and costly.
  • the main way is to reduce the filling thickness of the thermal interface material 191 and increase the coating area of the thermal interface material 191 .
  • the coating area of the thermally conductive gel is limited by the size of the chip 14 and cannot be further increased.
  • the coating area of the thermal interface material 191 can be increased by adding thermal expansion plates.
  • FIG. 3 is a schematic cross-sectional view of another heat dissipation device provided in the related art.
  • a thermal interface material 191, a thermal expansion plate 192 and a thermal grease 193 are arranged between the chip 14 and the heat sink housing 11.
  • the thermal expansion plate 192 can be a metal plate with high thermal conductivity
  • the function of the thermal expansion board 192 is to expand the heat on the chip 14 to a larger area with a flat plate with better thermal conductivity.
  • the coating area can be greatly increased, which plays a role in reducing thermal resistance.
  • the temperature difference can be reduced by about 7°C.
  • the thermal expansion board 192 needs to avoid other devices with higher heights on the main circuit board 12, and the area is limited, and when the area of the thermal expansion board 192 becomes larger, the thermal expansion effect of the heat expansion board 192 will also become smaller. Poor, so the improvement effect is limited; on the other hand, thermal conductive silicone grease 193 needs to be filled between the thermal expansion board 192 and the chip 14 to reduce the contact thermal resistance between the chip 14 and the thermal thermal expansion board 192, but one more The thermal interface material requires an additional coating process, which increases the cost of materials and processing.
  • the embodiments of the present application provide a heat sink and a vehicle-mounted module, by fixing the high power consumption chip on the transfer circuit board, and setting the elastic support to connect the transfer circuit board to the main circuit board or the upper case On the main cooling plate, the elastic support can absorb the assembly tolerance, and realize the tight fit between the chip and the radiator shell, thereby improving the heat dissipation capability of the cooling module.
  • FIG. 4 is a schematic cross-sectional view of a heat sink provided by an embodiment of the present application
  • FIG. 5 is a schematic structural view of internal components of the heat sink provided by an embodiment of the present application.
  • the embodiment of the present application provides a heat dissipation device 100 , which may include: a heat sink case 11 , a main circuit board 12 , an interposer circuit board 13 and a chip 14 disposed inside the heat sink case 11 .
  • the radiator shell 11 may include an upper shell 111 and a lower shell 112 , the upper shell 111 and the lower shell 112 are hermetically connected, and the upper shell 111 may include a main cooling plate 1112 and side walls 1113 connected around the main cooling plate 1112 .
  • the main heat dissipation plate 1112 can be an air-cooled heat dissipation plate.
  • heat dissipation fins 1111 are arranged on the outer surface of the main heat dissipation plate 1112, and the heat dissipation fins 1111 are vertically arranged with a plurality of spaced rows of heat dissipation fins 1111 relative to the main heat dissipation plate 1112.
  • the cloth can provide a large-area heat dissipation surface, so that after the heat on the upper shell 111 is conducted to the heat dissipation fins 1111, it can be dissipated into the outside air through radiation and convection.
  • the main heat sink 1112 can also be a liquid-cooled heat sink. At this time, the inside of the main heat sink 1112 can be a hollow cavity, and a coolant such as water can be provided inside the hollow cavity to absorb heat from the upper shell 111 .
  • the main circuit board 12 is fixed in the upper case 111 and located inside the side wall 1113 , and the main circuit board 12 and the main heat sink 1112 are parallel and oppositely arranged.
  • a fixing boss 1114 protrudes from the side wall 1113 of the upper case 111 , and the main circuit board 12 is fixedly connected to the upper case 111 through the fixing boss 1114 .
  • the main circuit board 12 is fixed on the fixing boss 1114 through the threaded fastener 194, the main circuit board 12 and the main cooling plate 1112 are arranged oppositely, and the main circuit board 12 is located at the side of the fixing boss 1114 away from the main cooling plate 1112 side.
  • the transfer circuit board 13 can be connected to the side of the main circuit board 12 facing the main heat sink 1112 , and the chip 14 can be fixed on the transfer circuit board 13 .
  • both the transfer circuit board 13 and the main circuit board 12 can be printed circuit boards, the area of the transfer circuit board 13 is smaller than the area of the main circuit board 12, and the area of the transfer circuit board 13 is larger than the area of the chip 14, so as to use To fix the chip 14.
  • the chip 14 and its peripheral devices can be welded on the interposer circuit board 13 to form an independent overall assembly. After the adapter circuit board 13 is added, the main circuit board 12 can save the space originally used to install the chip 14, which is equivalent to expanding the layout area of the electronic devices on the main circuit board 12, which is beneficial to improving the space utilization inside the heat sink 100 Rate.
  • the number of switch circuit boards 13 can be determined according to the number of chips 14 , and can be one or more.
  • One switch circuit board 13 can be provided with at least one chip 14 .
  • Setting a plurality of switching circuit boards 13 is beneficial to the conduction and heat dissipation of a plurality of high power consumption chips 14 and the main heat dissipation plate 1112 of the radiator shell 11, and the multiple switching circuit boards 13 are independently arranged, compared to As far as only one large-area adapter circuit board 13 that can fix a plurality of high-power consumption chips 14 is set, other devices with higher heights on the main circuit board 12 can be avoided to a large extent, thereby benefiting the main circuit board 12. Arrangement of electronic devices.
  • the transfer circuit board 13 can be electrically connected with the main circuit board 12 through a flexible conductive member 15, wherein the flexible conductive member 15 can be in the form of a flexible circuit board, a flexible connector or a cable.
  • the flexible conductive member 15 can realize the signal interconnection between the transfer circuit board 13 and the main circuit board 12, that is, realize the signal interconnection between the chip 14 and its peripheral devices and the main circuit board 12, and, because of its flexible characteristics, can ensure the transfer The reliability of the electrical connection when the circuit board 13 floats up and down during the installation process.
  • the transfer circuit board 13 can be connected to the main circuit board 12 through the elastic support 16, and the elastic support 16 is used for pressing
  • the adapter circuit board 13 makes the chip 14 closely adhere to the main heat dissipation plate 1112 of the upper case 111 .
  • the elastic supporting member 16 may be in the form of a spring screw or an elastic reed, which has sufficient supporting strength and can be elastically deformed to provide elastic force.
  • the elastic support 16 is set as a spring screw as shown in the figure, the head of the spring screw is located on the side of the transfer circuit board 13 facing away from the main circuit board 12, and the tail of the spring screw is connected to the main circuit board 12, and the spring screw
  • the spring is located between the adapter circuit board 13 and the main circuit board 12 .
  • the spring is in a compressed state, which provides upward pressure for the interposer circuit board 13 , so that the chip 14 can be closely attached to the main heat sink 1112 .
  • the side of the main circuit board 12 away from the adapter circuit board 13 is also provided with a structural reinforcing plate 18, the structural reinforcing plate 18 is fixedly connected to the main circuit board 12, and the elastic support 16 is on the main circuit board 12
  • the projection of is located within the range of the projection of the structural reinforcing plate on the main circuit board 12 .
  • the structural reinforcing plate 18 can be, for example, a metal plate such as stainless steel or aluminum alloy, which has high structural strength.
  • the structural reinforcement board 18 can be bonded to the main circuit board 12 , or fixed on the main circuit board 12 by fasteners. Exemplarily, the tails of the spring screws can fix the main circuit board 12 and the structural reinforcement board 18 . Setting the structural reinforcing plate 18 can increase the rigidity of the main circuit board, and can prevent the elastic force of the elastic support member 16 from deforming the main circuit board 12 , causing damage and failure of the stress-sensitive components on the main circuit board 12 .
  • FIG. 6 is another schematic cross-sectional view of the heat dissipation device provided by the embodiment of the present application.
  • the transfer circuit board 13 can be connected to the main heat sink 1112 through an elastic support 16, and the elastic support 16 is used to press the transfer circuit board 13 to make the chip 14 is closely attached to the main cooling plate 1112 of the upper case 111.
  • the elastic support 16 When the elastic support 16 is set as a spring screw as shown in the figure, the head of the spring screw is located on the side of the transfer circuit board 13 facing away from the main heat sink 1112, and the tail of the spring screw is connected to the main heat sink 1112, and the spring screw
  • the spring is located between the adapter circuit board 13 and the head of the spring screw. The spring is in a compressed state, which provides upward pressure for the interposer circuit board 13 , so that the chip 14 can be closely attached to the main heat sink 1112 .
  • the compression amount of the spring of the spring screw should be within a reasonable range, the compression amount of the spring should not be too large, and the pressure on the chip 14 should be within the allowable range of the chip 14 to prevent the chip 14 from being damaged due to excessive extrusion. Simultaneously, the amount of compression of the spring cannot be too small, and it should be ensured that when the heat sink is vibrated, the chip 14 is always pressed against the main heat sink 1112 without breaking away.
  • the number of elastic supports 16 can be one, and it is arranged in the center of the transfer circuit board 13, or the number of elastic supports 16 can be multiple, and the plurality of elastic supports 16 are evenly distributed on the transfer circuit board 13, so as to
  • the transfer circuit board 13 provides uniform and reliable supporting force, and at the same time can improve the overall service life of the elastic supporting member.
  • the elastic support member 16 can absorb the tolerance, and then can realize the tight fit between the chip 14 and the heat sink shell 11 , and realize the high-efficiency conduction and heat dissipation of the high power consumption chip 14 .
  • the chip 14 itself has a thickness tolerance
  • the radiator shell 11 itself also has a tolerance, that is, the height tolerance of the fixing boss 1114
  • the transfer circuit board 13 itself also has a thickness tolerance, so that the chip
  • the distance between 14 and the main cooling plate 1112 is not a fixed value, and the upper and lower shells 111 and 112 that are sealed and connected cannot be adjusted up and down, that is, the above three tolerances cannot be absorbed by changing the position of the upper shell 111 or the lower shell 112 .
  • the elastic support member 16 can deform and shrink after being stressed.
  • the degree of deformation of the elastic support member 16 is small, and the distance between the chip 14 and the main heat dissipation plate 1112
  • the degree of deformation of the elastic support 16 is relatively large, and the elastic support 16 can realize the floating up and down of the chip 14, so that the chip 14 can be pressed on the main heat dissipation plate 1112 of the radiator shell 11 all the time, ensuring that the chip 14 Good heat conduction contact can be maintained with the radiator shell 11.
  • the gap between the main circuit board 12 and the main heat sink 1112, the gap between the transfer circuit board 13 and the main heat sink 1112, and setting the compression amount of the elastic support 16 reasonably it is possible to ensure that the chip 14 The withstand pressure is within the safe range allowed by the chip 14.
  • the cooling device 100 when the cooling device 100 is applied to the vehicle-mounted module, it can be ensured that the chip 14 is always pressed against the main cooling plate 1112 of the radiator shell 11 under the action of the elastic support member 16 during the running vibration of the vehicle-mounted module. Disengagement will occur. Therefore, it can be ensured that the function of the vehicle-mounted module remains stable, and the heat dissipation remains effective.
  • the chip 14 Under the action of the elastic supporting member 16 , the chip 14 is arranged in close contact with the main heat sink 1112 , and the gap can be close to zero. However, when the chip 14 and the main heat dissipation plate 1112 are directly bonded, the thermal resistance between the two is relatively large.
  • a heat conduction layer 17 is filled between the chip 14 and the main heat sink 1112 of the upper case 111 , and the heat conduction layer 17 is used to reduce the contact thermal resistance between the chip 14 and the upper case 111 .
  • the heat conduction layer 17 may include heat conduction interface materials such as heat conduction silicone grease or phase change heat conduction film.
  • the thermal conduction coefficient of heat conduction silicone grease and phase change heat conduction film is low, and the thickness can be extremely thin, for example, less than or equal to 0.1 mm.
  • the thickness of the heat conduction layer 17 may be less than 0.2 mm.
  • the heat conduction layer 17 may be heat conduction silicone grease, and the thickness of the heat conduction silicone grease is 0.1 mm, that is, 0.0001 m.
  • the thermal conductivity of the thermally conductive silicone grease is about 6W/mk.
  • the coating area of the chip is still 0.024m*0.024m, and the filling thickness, thermal conductivity Substituting the coefficient and chip coating area into the above formula 1, the thermal resistance of the thermal grease can be obtained as 0.029°C/W.
  • the power consumption of the chip is 66W.
  • the temperature difference between the upper and lower surfaces of the thermal grease can be obtained as 1.9 °C.
  • the temperature difference is reduced by about 12°C, and the effect is very remarkable.
  • the heat dissipation device provided in the embodiment of the present application can effectively reduce the temperature of the chip 14 and reduce the risk of overheating of the chip 14 .
  • the chip 14 is directly soldered on the main circuit board 12. If the capability of the chip 14 is improved, the main circuit board 12 needs to be redeveloped, the overall evolution is poor, and the replacement cost is high.
  • the transfer circuit board 13 and the elastic support member 16 are detachably connected, and the transfer circuit board 13 and the chip 14 can form a replaceable assembly. This setting can not only meet the needs of different customers for different types of chips, but also has high applicability, and if you need to upgrade the ability of the chip 14, you only need to replace the chip 14 and the transfer circuit board 13. The evolution capability is strong, and the replacement cost is lower. Low.
  • the assembly process of the heat sink 100 provided by the embodiment of the present application can be as follows: first, solder the chip 14 and its peripheral devices on the transfer circuit board 13; then, connect the flexible conductive member 15 to the main circuit board 12 and the transfer circuit on the plate 13; then, the adapter circuit board 13 is fixed on the main circuit board 12 or fixed on the main heat dissipation plate 1112 by the elastic support member 16, and the heat conducting layer 17 is coated on the chip 14; then the main circuit board 12 It is installed on the fixed boss 1114 through the threaded fastener 194; finally, the upper shell 111 and the lower shell 112 are sealed and connected by dispensing glue.
  • the heat dissipation device fixes the high power consumption chip on the transfer circuit board separately, and fixes the transfer circuit board to the main heat sink of the main circuit board or the upper case through spring screws or other elastic supports.
  • the signal interconnection between the transfer circuit board and the main circuit board is realized through flexible conductive parts.
  • the elastic support can absorb the assembly tolerance and realize the tight fit between the chip and the heat sink shell, so that the chip and the heat sink shell can be greatly reduced. Reducing the thermal resistance of the thermal conduction layer can effectively reduce the temperature of the chip and reduce the risk of overheating of the chip.
  • the embodiment of the present application also provides a vehicle-mounted module, including a connector 200 and the heat dissipation device 100 provided in the above embodiment.
  • the heat dissipation device 100 includes a radiator shell 11 and a main circuit board 12 disposed inside the radiator shell 11, The adapter circuit board 13 , the chip 14 , and the connector 200 are connected to the main circuit board 12 inside the radiator shell 11 , and at the same time, the connector 200 is sealed and connected to the radiator shell 11 .
  • the vehicle-mounted module can be, for example, an intelligent driving computing module, a power supply module, etc., and the vehicle-mounted module can be installed in the engine compartment of the electric vehicle, the glove box of the co-pilot, or under the seat. These locations require the on-board module to support an ambient temperature of up to 80°C, and the heat dissipation environment is very harsh, so the heat dissipation capability of the on-board module is required to be high.
  • the vehicle-mounted module needs to be designed according to the dustproof and waterproof grade of the outdoor module, and the dustproof and waterproof grade can be IP67.
  • the upper shell and the lower shell of the heat sink are sealed and connected by dispensing, which can meet the design requirements of dustproof and waterproof.
  • the upper shell and the lower shell are fixed by dispensing, the upper shell and the lower The shell does not fluctuate up and down, so the fixing reliability of the connector is high, and the connection failure of the connector can be avoided.
  • the elastic support can absorb the tolerance of the assembly, and realize the close contact between the chip and the radiator shell It can effectively reduce the risk of overheating of the chip, which is conducive to improving the overall heat dissipation effect of the vehicle module.
  • the structure of the heat dissipation device provided in the above embodiments of the present application can be applied not only to vehicle-mounted modules, but also to other technical fields such as outdoor modules that require a higher level of dustproof and waterproof, and terminal electronic equipment.

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Abstract

本申请实施例提供一种散热装置及车载模块，散热装置包括：散热器外壳、主电路板、转接电路板和芯片；散热器外壳包括上壳和下壳，上壳和下壳密封连接，主电路板固定在上壳内，主电路板和上壳的主散热板相对设置，芯片固定在转接电路板上，转接电路板通过柔性导电件和主电路板电连接，转接电路板通过弹性支撑件连接在主电路板或者主散热板上，弹性支撑件用于压紧转接电路板使芯片紧密贴合上壳的主散热板，芯片和上壳之间填充有导热层，导热层用于减少芯片和上壳之间的接触热阻。本申请实施例提供一种散热装置及车载模块，可以提高高功耗器件的散热效率。

Description

散热装置及车载模块
本申请要求于2021年05月18日提交中国专利局、申请号为202110542232.X、申请名称为“散热装置及车载模块”和2021年11月11日提交中国专利局、申请号为202111335609.0、申请名称为“散热装置及车载模块”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及车载电子设备技术领域，尤其涉及一种散热装置及车载模块。
背景技术
车载模块包括金属外壳和设置在金属外壳内部的电路板，电路板上连接有多种高功耗器件，高功耗器件和外壳之间填充有柔软的导热界面材料，如导热凝胶或者导热垫等，高功耗器件的热量能通过导热界面材料传递到金属外壳上，再散失到环境中。随着车载模块功能越来越强大，芯片功耗也越来越大，导热凝胶或导热垫由于其厚度大，热阻高，无法满足散热要求。
发明内容
本申请实施例提供一种散热装置及车载模块，可以提高高功耗器件的散热效率。
本申请实施例一方面提供一种散热装置，包括：散热器外壳、主电路板、转接电路板和芯片；散热器外壳包括上壳和下壳，上壳和下壳密封连接，上壳包括主散热板，主电路板固定在上壳内，主电路板和主散热板相对设置，芯片固定在转接电路板上，转接电路板通过柔性导电件和主电路板电连接，转接电路板通过弹性支撑件连接在主电路板上或者主散热板上，弹性支撑件用于压紧转接电路板使芯片紧密贴合上壳的主散热板，芯片和主散热板之间填充有导热层，导热层用于减少芯片和主散热板之间的接触热阻。
本申请实施例提供的散热装置，通过将高功耗的芯片单独固定在转接电路板上，并将转接电路板通过弹簧螺钉或者其它弹性支撑件固定在主电路板或主散热板上，转接电路板和主电路板之间通过柔性导电件实现信号互连，弹性支撑件可以吸收组装的公差，实现芯片与散热器外壳紧密贴合，从而可以大大降低芯片和散热器外壳之间的导热层的厚度，降低导热层的热阻，可以有效降低芯片的温度，减少芯片的超温风险。
在一种可能的实施方式中，转接电路板和弹性支撑件可拆卸连接，转接电路板和芯片组成可更换组件。
这样设置，不仅可以满足不同客户对不同类型芯片的需求，适用性高，而且如果需要升级芯片的能力，只需要更换芯片和转接电路板即可，演进能力强，更新换代成本更低。
在一种可能的实施方式中，弹性支撑件包括弹簧螺钉或弹性簧片。
弹簧螺钉或弹性簧片均具有足够的支撑强度，同时可以发生弹性形变，以提供弹力，使芯片紧贴散热器外壳的主散热板设置。
在一种可能的实施方式中，弹簧螺钉的头部位于转接电路板的背向主电路板的一侧，弹簧螺钉的尾部和主电路板连接，弹簧螺钉的弹簧位于转接电路板和主电路板之间。
主电路板相对于上壳的位置固定，设置在转接电路板和主电路板之间的弹簧可以为转接电路板提供压力，使芯片紧贴在主散热板上。
在一种可能的实施方式中，主电路板的背离转接电路板的一侧还设置有结构加强板，结构加强板和主电路板固定连接，弹性支撑件在主电路板上的投影位于结构加强板在主电路板上的投影的范围内。
设置结构加强板可以增加主电路板的刚度，可以防止弹性支撑件的弹力使主电路板发生变形，导致主电路板上的应力敏感器件损坏失效。
在一种可能的实施方式中，弹簧螺钉的头部位于转接电路板的背向主散热板的一侧，弹簧螺钉的尾部和主散热板连接，弹簧螺钉的弹簧位于转接电路板和弹簧螺钉的头部之间。
弹簧螺钉的头部相对于上壳的位置固定，设置在弹簧螺钉的头部和转接电路板之间的弹簧，可以为转接电路板提供压力，使芯片紧贴在主散热板上。
在一种可能的实施方式中，导热层的厚度小于0.2mm。
在弹性支撑件的作用下，芯片紧贴散热器外壳的主散热板设置，导热层的厚度可以大大减小，从而可以降低导热层的热阻，有效降低芯片的温度。
在一种可能的实施方式中，导热层包括导热硅脂或相变导热薄膜。
导热硅脂和相变导热薄膜的导热系数较低，且工艺上可以实现极薄的厚度，从而有利于降低导热层的热阻，降低芯片的温度。
在一种可能的实施方式中，柔性导电件包括柔性电路板、柔性连接器或线缆。
柔性电路板、柔性连接器或线缆均可以实现转接电路板和主电路板之间的信号互连，且其柔性特性可以保证转接电路板在安装过程中上下浮动时电连接的可靠性。
在一种可能的实施方式中，弹性支撑件的数量为多个，多个弹性支撑件均匀分布在转接电路板上。
设置多个弹性支撑件，可以为转接电路板提供均匀可靠的支撑力，同时可以提高弹性支撑件整体的使用寿命。
在一种可能的实施方式中，转接电路板的数量为多个，一个转接电路板上设置有至少一个芯片。
设置多个转接电路板，有利于多个高功耗芯片分别实现与散热器外壳的主散热板的传导散热，并且，多个转接电路板各自独立设置，相比于仅设置一个面积较大的可固定多个高功耗芯片的转接电路板来说，可以较大程度地避让主电路板上其它高度较高的器件，从而有利于主电路板上电子器件的排布。
在一种可能的实施方式中，主散热板为风冷散热板或者液冷散热板。
主散热板为散热装置中散热效率最高的区域，可以通过风冷或者水冷等不同形式散热，即本申请实施例提供的散热装置适用于风冷散热器或液冷散热器。
本申请实施例另一方面还提供一种车载模块，包括如上所述的散热装置。
本申请实施例提供的车载模块，其散热装置的上壳和下壳通过点胶密封连接，可以满足防尘防水的设计要求，同时，上壳和下壳通过点胶固定后，上壳和下壳不会发生上下浮动，因此连接器的固定可靠性高，可以避免连接器的连接失效。
本申请实施例提供一种散热装置及车载模块，通过将高功耗的芯片单独固定在转接电路板上，并将转接电路板通过弹性支撑件固定在主电路板上或者主散热板上，弹性支撑件可以吸收组装的公差，实现芯片与散热器外壳紧密贴合，从而可以有效减少芯片的超温风险，有利于提高车载模块整体的散热效果。
附图说明
图1为相关技术提供的车载模块的结构示意图；
图2为相关技术提供的散热装置的剖面示意图；
图3为相关技术提供的另一种散热装置的剖面示意图；
图4为本申请实施例提供的散热装置的剖面示意图；
图5为本申请实施例提供的散热装置内部组件的结构示意图；
图6为本申请实施例提供的散热装置的另一种剖面示意图。
附图标记说明：
100-散热装置；11-散热器外壳；111-上壳；1111-散热翅片；1112-主散热板；1113-侧壁；1114-固定凸台；112-下壳；12-主电路板；13-转接电路板；14-芯片；15-柔性导电件；16-弹性支撑件；17-导热层；18-结构加强板；191-导热界面材料；192-热扩展板；193-导热硅脂；194-螺纹紧固件；200-连接器。
具体实施方式
图1为相关技术提供的车载模块的结构示意图。参考图1所示，车载模块可以包括散热装置100和连接器200，车载模块可以通过连接器200外接线缆或其它器件，以实现模块的功能，散热装置100则可以用来实现对车载模块的及时散热，以避免高温损害车载模块的功能。
车载模块内部设置有主电路板以及多种电子器件，灰尘积累或者液体进入都会对主电路板和电子器件的性能及寿命造成较大的影响，因此车载模块对防尘防水的等级要求较高。车载模块可以设置为一个刚性的、密封的外壳，该外壳可以是一个压铸的金属壳，以在满足散热需求的同时，达到一定的防尘防水等级。
图2为相关技术提供的散热装置的剖面示意图。参考图2所示，散热装置100可以包括散热器外壳11和设置在散热器外壳11内部的主电路板12，主电路板12上设置有芯片14和其它电子器件。主电路板12和芯片14及其它电子器件产生的热量，可以通过辐射和对流，传递到散热器外壳11上，散热器外壳11上设置有多个散热翅片1111，传导至散热翅片1111上的热量，可以通过辐射和对流散发到外界空气中。
相关技术中，在芯片14和散热器外壳11之间填充有柔软的导热界面材料191，例如导热凝胶或者导热垫等，导热界面材料191可以将芯片14与散热器外壳11热连接，使芯片14的热量能通过导热界面材料191传递到散热器外壳11上，再散失到环 境中，可以提高散热效率。
散热器外壳11可以包括上壳111和下壳112，上壳111可以包括主散热板1112和连接在主散热板1112周围的侧壁113，散热翅片1111可以设置在上壳111的主散热板1112上，上壳111和下壳112可以通过点胶密封连接，以使散热器外壳11满足一定的防尘防水等级。上壳111的侧壁1113上凸出设置有固定凸台1114，主电路板12固定在该固定凸台1114上且和主散热板1112相对设置，芯片14则固定在主电路板12的面向主散热板1112的一侧。
芯片14自身有高度公差，散热器外壳11自身也有公差，即固定凸台1114的公差，这两类难以避免的公差的存在，使得芯片14和主散热板1112之间的距离并非为一个固定值。而密封连接的上壳111和下壳112无法实现上下浮动调节，即无法通过改变上壳111或下壳112的位置来吸收上述两项公差。因此，相关技术中，柔软的导热界面材料191，具有柔性变形的特性，还具有吸收公差的作用。
然而，随着车载模块的功能越来越强大，芯片14的算力随之增加，芯片14的功耗也越来越大，散热要求越来越高。上述相关技术中，导热凝胶或导热垫的厚度大，热阻高，无法满足高功耗芯片的散热要求。
需要说明的是，
热阻＝填充厚度/(导热系数*芯片涂覆面积)       公式一
通过上述公式一可以计算得到导热界面材料191的热阻
温差＝芯片功耗*热阻         公式二
通过上述公式二可以得到导热界面材料191上下表面的温差。
以吸收公差能力良好的导热凝胶作为导热界面材料191的示例，考虑芯片14的高度公差、主电路板12的厚度公差、散热器外壳11的加工公差，导热凝胶的填充厚度约为0.001m，目前导热性能较佳的导热凝胶的导热系数约为8W/mk，芯片的涂覆面积约为0.024m*0.024m，将填充厚度、导热系数、芯片涂覆面积代入到上述公式一中，可以得到导热凝胶的热阻为0.217℃/W。
以车载自动驾驶模块中的人工智能AI芯片为例，芯片功耗为66W，将芯片功耗和导热凝胶的热阻代入到公式二中，可以得到导热凝胶上下表面产生的温差为14℃。该温差值关系着芯片14的温度，通过降低导热凝胶上下表面产生的温差，能降低芯片14的温度，减少芯片14的超温风险。
从公式一和公式二可以看出，导热界面材料191的热阻，与导热界面材料191的填充厚度、导热系数和芯片14上导热界面材料191的涂覆面积有关。由于导热界面材料191通常由无机材料填充导热金属颗粒组成，其导热系数的提升难度较高，而且将导热系数从8W/mk提升到10W/mk，其成本会增加2倍。即通过提升导热界面材料191的导热系数，来降低导热界面材料191的热阻，工艺难度高，成本高。
因此，若要降低导热界面材料191的热阻，主要的途径是减少导热界面材料191的填充厚度和增加导热界面材料191的涂覆面积。上述相关技术中，导热凝胶的涂覆面积受限于芯片14的尺寸，无法进一步增加。在另一种相关技术中，可以通过增加设置热扩展板以增加导热界面材料191的涂覆面积。
图3为相关技术提供的另一种散热装置的剖面示意图。参考图3所示，芯片14 和散热器外壳11之间设置有导热界面材料191、热扩展板192和导热硅脂193，热扩展板192可以是热传导效率较高的金属板，导热界面材料191设置在热扩展板192和散热器外壳11之间，热扩展板192的面积大于芯片14的面积。热扩展板192的作用是，用导热性较佳的平板将芯片14上的热量扩展到更大的面积上，热扩展板192上再填充导热凝胶等导热界面材料191，此时导热凝胶的涂覆面积可以大大增加，从而起到了降低热阻的作用。
该相关技术，相比于未设置热扩展板192的方案来说，温差大概可以减小7℃左右。但是，一方面，热扩展板192需要避让主电路板12上其它高度较高的器件，面积受到限制，且热扩展板192的面积变大后，热扩展板192发热的热扩展效果也会变差，所以改善效果有限；另一方面，热扩展板192和芯片14之间需要填充导热硅脂193，以减少芯片14和热热扩展板192之间的接触热阻，但是多增加了一种导热界面材料，多了一道涂覆工序，提高了材料成本和加工成本。
基于上述问题，本申请实施例提供一种散热装置和车载模块，通过将高功耗芯片固定在转接电路板上，并设置弹性支撑件将转接电路板连接在主电路板或者上壳的主散热板上，使弹性支撑件可以吸收组装公差，实现芯片与散热器外壳的紧密贴合，从而提高散热模块的散热能力。
以下参考附图和具体的实施例对本申请实施例提供的散热装置和车载模块进行具体的描述。
图4为本申请实施例提供的散热装置的剖面示意图，图5为本申请实施例提供的散热装置内部组件的结构示意图。参考图4和图5所示，本申请实施例提供一种散热装置100，可以包括：散热器外壳11和设置在散热器外壳11内部的主电路板12、转接电路板13以及芯片14。
散热器外壳11可以包括上壳111和下壳112，上壳111和下壳112密封连接，上壳111可以包括主散热板1112和连接在主散热板1112四周的侧壁1113。主散热板1112可以为风冷散热板，示例性地，主散热板1112的外表面上设置有散热翅片1111，散热翅片1111相对于主散热板1112垂直设置多个散热翅片1111间隔排布，可以提供较大面积的散热面，使上壳111上的热量传导到散热翅片1111上后，可以通过辐射和对流散发到外界空气中。主散热板1112也可以为液冷散热板，此时，主散热板1112内部可以为空心腔体，空心腔体内部可以设置有水等冷却液，以吸收上壳111上的热量。
主电路板12固定在上壳111内，位于侧壁1113的内部，主电路板12和主散热板1112平行且相对设置。上壳111的侧壁1113上凸出设置有固定凸台1114，主电路板12通过固定凸台1114实现与上壳111的固定连接。示例性地，主电路板12通过螺纹紧固件194固定在固定凸台1114上，主电路板12和主散热板1112相对设置，且主电路板12位于固定凸台1114的背离主散热板1112的一侧。
转接电路板13可以连接在主电路板12的面向主散热板1112的一侧，芯片14可以固定在转接电路板13上。其中，转接电路板13和主电路板12均可以为印制电路板，转接电路板13的面积小于主电路板12的面积，转接电路板13的面积大于芯片14的面积，以用来固定芯片14。芯片14及其周边器件可以焊接在转接电路板13上，构成一个独立的整体组件。增加了转接电路板13后，主电路板12可以节省出原本用来安 装芯片14的空间，从而相当于扩展了主电路板12的电子器件布置面积，有利于提高散热装置100内部的空间利用率。
转接电路板13的数量可以根据芯片14的数量确定，可以为一个或多个，一个转接电路板13上可以设置有至少一个芯片14。设置多个转接电路板13，有利于多个高功耗芯片14分别实现与散热器外壳11的主散热板1112的传导散热，并且，多个转接电路板13各自独立设置，相比于仅设置一个面积较大的可固定多个高功耗芯片14的转接电路板13来说，可以较大程度上避让主电路板12上其它高度较高的器件，从而有利于主电路板12上电子器件的排布。
为实现信号连接，转接电路板13可以通过柔性导电件15和主电路板12电连接，其中柔性导电件15可以采用柔性电路板、柔性连接器或线缆等形式。柔性导电件15可以实现转接电路板13和主电路板12的信号互连，即实现芯片14及其周边器件和主电路板12的信号互连，并且，由于其柔性特性，可以保证转接电路板13在安装过程中上下浮动时电连接的可靠性。
继续参考图4所示，为实现结构上的连接，在一种可能的实施方式中，转接电路板13可以通过弹性支撑件16连接在主电路板12上，弹性支撑件16用于压紧转接电路板13使芯片14紧密贴合上壳111的主散热板1112。
弹性支撑件16可以包括弹簧螺钉或弹性簧片等形式，其具有足够的支撑强度，同时可以发生弹性形变，以提供弹力。弹性支撑件16设置为图中所示的弹簧螺钉时，弹簧螺钉的头部位于转接电路板13的背向主电路板12的一侧，弹簧螺钉的尾部和主电路板12连接，弹簧螺钉的弹簧位于转接电路板13和主电路板12之间。弹簧处于压缩状态，会为转接电路板13提供向上的压力，从而使芯片14可以紧密贴合主散热板1112。
本申请实施例中，主电路板12的背离转接电路板13的一侧还设置有结构加强板18，结构加强板18和主电路板12固定连接，弹性支撑件16在主电路板12上的投影位于结构加强板在主电路板12上的投影的范围内。结构加强板18例如可以为不锈钢、铝合金等金属板，具有较高的结构强度。结构加强板18可以粘接在主电路板12上，或者通过紧固件固定在主电路板12上，示例性地，弹簧螺钉的尾部可以固定主电路板12和结构加强板18。设置结构加强板18可以增加主电路板的刚度，可以防止弹性支撑件16的弹力使主电路板12发生变形，导致主电路板12上的应力敏感器件损坏失效。
图6为本申请实施例提供的散热装置的另一种剖面示意图。参考图6所示，在另一种可能的实施方式中，转接电路板13可以通过弹性支撑件16连接在主散热板1112上，弹性支撑件16用于压紧转接电路板13使芯片14紧密贴合上壳111的主散热板1112。
弹性支撑件16设置为图中所示的弹簧螺钉时，弹簧螺钉的头部位于转接电路板13的背向主散热板1112的一侧，弹簧螺钉的尾部和主散热板1112连接，弹簧螺钉的弹簧位于转接电路板13和弹簧螺钉的头部之间。弹簧处于压缩状态，会为转接电路板13提供向上的压力，从而使芯片14可以紧密贴合主散热板1112。
应理解，弹簧螺钉的弹簧的压缩量应处于合理范围内，弹簧的压缩量不能过大，应使芯片14承受的压力在芯片14允许的范围内，防止芯片14受到过度挤压而损坏。同时，弹簧的压缩量不能过小，应确保散热装置在受到振动时，芯片14始终保持被压 紧在主散热板1112上而不会发生脱离。
弹性支撑件16的数量可以为一个，设置在转接电路板13的中央，或者，弹性支撑件16的数量可以为多个，多个弹性支撑件16均匀分布在转接电路板13上，以为转接电路板13提供均匀可靠的支撑力，同时可以提高弹性支撑件整体的使用寿命。
弹性支撑件16可以起到吸收公差的作用，进而可以实现芯片14与散热器外壳11之间的紧密贴合，实现高功耗芯片14的高效传导散热。需要理解的是，本申请实施例中，芯片14自身有厚度公差，散热器外壳11自身也有公差，即固定凸台1114的高度公差，以及，转接电路板13自身也具有厚度公差，使得芯片14和主散热板1112之间的距离并非一个固定值，密封连接的上壳111和下壳112无法实现上下浮动调节，即无法通过改变上壳111或下壳112的位置来吸收上述三项公差。
本申请实施例中，弹性支撑件16受力后可以变形收缩，芯片14和主散热板1112之间的距离较小时，弹性支撑件16的变形程度较小，芯片14和主散热板1112之间的距离较大时，弹性支撑件16的变形程度较大，弹性支撑件16可以实现芯片14的上下浮动，使芯片14可以始终压紧在散热器外壳11的主散热板1112上，确保芯片14和散热器外壳11可以保持良好的导热接触。
需要说明的是，通过控制主电路板12距离主散热板1112之间的间隙、转接电路板13和主散热板1112之间的间隙，合理设置弹性支撑件16的压缩量，可以确保芯片14承受的压力在芯片14允许的安全范围内。同时，散热装置100应用到车载模块中时，可以确保车载模块在车辆的行驶振动中，芯片14始终在弹性支撑件16的作用下被压紧在散热器外壳11的主散热板1112上，不会发生脱离。从而，可以保证车载模块的功能保持稳定，散热保持有效。
在弹性支撑件16的作用下，芯片14紧密贴合主散热板1112设置，其间隙可以接近于0。但是，芯片14和主散热板1112直接贴合时，两者之间热阻较大。本申请实施例中，芯片14和上壳111的主散热板1112之间填充有导热层17，导热层17用于减少芯片14和上壳111之间的接触热阻。
导热层17可以包括导热硅脂或相变导热薄膜等导热界面材料，导热硅脂和相变导热薄膜的导热系数较低，且工艺上可以实现极薄的厚度，例如小于等于0.1mm。导热层17的厚度可以小于0.2mm，在一种可能的实施方式中，导热层17可以为导热硅脂，导热硅脂的厚度为0.1mm，即0.0001m。
以0.0001m厚度的导热硅脂作为导热层17的示例，导热硅脂的导热系数约为6W/mk，对照上述相关技术，芯片的涂覆面积仍然为0.024m*0.024m，将填充厚度、导热系数、芯片涂覆面积代入到上述公式一中，可以得到导热硅脂的热阻为0.029℃/W。
仍然以车载自动驾驶模块中的人工智能AI芯片为例，芯片功耗为66W，将芯片功耗和导热硅脂的热阻代入到公式二中，可以得到导热硅脂上下表面产生的温差为1.9℃。与上述相关技术中14℃的温差相比，温差降低了约12℃，效果非常显著。显然，本申请实施例提供的散热装置，可以有效降低芯片14的温度，减少芯片14的超温风险。
此外，相关技术中，芯片14直接焊接在主电路板12上，如果芯片14的能力提升，则需要重新开发主电路板12，整体可演进性差，更新换代成本高。而本申请实施例中， 转接电路板13和弹性支撑件16可拆卸连接，转接电路板13和芯片14可以组成可更换组件。这样设置，不仅可以满足不同客户对不同类型芯片的需求，适用性高，而且如果需要升级芯片14的能力，只需要更换芯片14和转接电路板13即可，演进能力强，更新换代成本更低。
本申请实施例提供的散热装置100的装配过程可以为：首先，将芯片14及其周边器件焊接在转接电路板13上；然后，将柔性导电件15连接在主电路板12和转接电路板13上；接着，通过弹性支撑件16将转接电路板13固定在主电路板12上或者固定在主散热板1112上，并在芯片14上涂覆导热层17；然后将主电路板12通过螺纹紧固件194安装在固定凸台1114上；最后，采用点胶的方式密封连接上壳111和下壳112。
本申请实施例提供的散热装置，通过将高功耗的芯片单独固定在转接电路板上，并将转接电路板通过弹簧螺钉或者其它弹性支撑件固定在主电路板或者上壳的主散热面上，转接电路板和主电路板之间通过柔性导电件实现信号互连，弹性支撑件可以吸收组装的公差，实现芯片与散热器外壳紧密贴合，从而可以大大降低芯片和散热器外壳之间的导热层的厚度，降低导热层的热阻，可以有效降低芯片的温度，减少芯片的超温风险。
本申请实施例另一方面还提供一种车载模块，包括连接器200和如上实施例提供的散热装置100，散热装置100包括散热器外壳11和设置在散热器外壳11内部的主电路板12、转接电路板13、芯片14，连接器200和散热器外壳11内部的主电路板12连接，同时，连接器200和散热器外壳11密封连接。
其中，车载模块例如可以为智能驾驶计算模块、电源模块等类型，车载模块可以安装在电动汽车的发动机舱、副驾驶手套箱、座位底下等位置。这些位置要求车载模块需要最高支持80℃环境温度，散热环境非常恶劣，因此对车载模块的散热能力要求较高。并且，车载模块需要按照室外模块的防尘防水等级设计，防尘防水等级可以为IP67。
本申请实施例提供的车载模块，其散热装置的上壳和下壳通过点胶密封连接，可以满足防尘防水的设计要求，同时，上壳和下壳通过点胶固定后，上壳和下壳不会发生上下浮动，因此连接器的固定可靠性高，可以避免连接器的连接失效。通过将高功耗的芯片单独固定在转接电路板上，并将转接电路板通过弹性支撑件固定在主电路板上，弹性支撑件可以吸收组装的公差，实现芯片与散热器外壳紧密贴合，从而可以有效减少芯片的超温风险，有利于提高车载模块整体的散热效果。
另外，需要说明的是，本申请上述实施例提供的散热装置的结构，除了应用于车载模块外，还可以应用于其它防尘防水等级要求较高的室外模块，以及终端电子设备等技术领域。
最后应说明的是：以上各实施例仅用以说明本申请实施例的技术方案，而非对其限制；尽管参照前述各实施例对本申请实施例进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请实施例技术方案的范围。

Claims (13)

  1. 一种散热装置，其特征在于，包括：散热器外壳、主电路板、转接电路板和芯片；
    所述散热器外壳包括上壳和下壳，所述上壳和所述下壳密封连接，所述上壳包括主散热板，所述主电路板固定在所述上壳内，所述主电路板和所述主散热板相对设置，
    所述芯片固定在所述转接电路板上，所述转接电路板通过柔性导电件和所述主电路板电连接，所述转接电路板通过弹性支撑件连接在所述主电路板上或者所述主散热板上，所述弹性支撑件用于压紧所述转接电路板使芯片紧密贴合所述主散热板，
    所述芯片和所述主散热板之间填充有导热层，所述导热层用于减少所述芯片和所述主散热板之间的接触热阻。
  2. 根据权利要求1所述的散热装置，其特征在于，所述转接电路板和所述弹性支撑件可拆卸连接，所述转接电路板和所述芯片组成可更换组件。
  3. 根据权利要求1或2所述的散热装置，其特征在于，所述弹性支撑件包括弹簧螺钉或弹性簧片。
  4. 根据权利要求3所述的散热装置，其特征在于，所述弹簧螺钉的头部位于所述转接电路板的背向所述主电路板的一侧，所述弹簧螺钉的尾部和所述主电路板连接，所述弹簧螺钉的弹簧位于所述转接电路板和所述主电路板之间。
  5. 根据权利要求4所述的散热装置，其特征在于，所述主电路板的背离所述转接电路板的一侧还设置有结构加强板，所述结构加强板和所述主电路板固定连接，所述弹性支撑件在所述主电路板上的投影位于所述结构加强板在所述主电路板上的投影的范围内。
  6. 根据权利要求3所述的散热装置，其特征在于，所述弹簧螺钉的头部位于所述转接电路板的背向所述主散热板的一侧，所述弹簧螺钉的尾部和所述主散热板连接，所述弹簧螺钉的弹簧位于所述转接电路板和所述弹簧螺钉的头部之间。
  7. 根据权利要求1-6任一项所述的散热装置，其特征在于，所述导热层的厚度小于0.2mm。
  8. 根据权利要求7所述的散热装置，其特征在于，所述导热层包括导热硅脂或相变导热薄膜。
  9. 根据权利要求1-8任一项所述的散热装置，其特征在于，所述柔性导电件包括柔性电路板、柔性连接器或线缆。
  10. 根据权利要求1-9任一项所述的散热装置，其特征在于，所述弹性支撑件的数量为多个，多个所述弹性支撑件均匀分布在所述转接电路板上。
  11. 根据权利要求1-10任一项所述的散热装置，其特征在于，所述转接电路板的数量为多个，一个所述转接电路板上设置有至少一个芯片。
  12. 根据权利要求1-11任一项所述的散热装置，其特征在于，所述主散热板为风冷散热板或者液冷散热板。
  13. 一种车载模块，其特征在于，包括权利要求1-12任一项所述的散热装置。
PCT/CN2022/092032 2021-05-18 2022-05-10 散热装置及车载模块 WO2022242510A1 (zh)

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