CN117836923A - 运送系统以及判定方法 - Google Patents

运送系统以及判定方法 Download PDF

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Publication number
CN117836923A
CN117836923A CN202280040528.4A CN202280040528A CN117836923A CN 117836923 A CN117836923 A CN 117836923A CN 202280040528 A CN202280040528 A CN 202280040528A CN 117836923 A CN117836923 A CN 117836923A
Authority
CN
China
Prior art keywords
chip
sensor
hand
alignment
robot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280040528.4A
Other languages
English (en)
Chinese (zh)
Inventor
丹治彦
艾藢许·阿修可·巴瓦尼
赛门·贾帕连
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kawasaki Motors Ltd
Kawasaki Robotics USA Inc
Original Assignee
Kawasaki Jukogyo KK
Kawasaki Robotics USA Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kawasaki Jukogyo KK, Kawasaki Robotics USA Inc filed Critical Kawasaki Jukogyo KK
Publication of CN117836923A publication Critical patent/CN117836923A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H10P72/0608—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3404—Storage means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Control Of Conveyors (AREA)
CN202280040528.4A 2021-06-10 2022-06-02 运送系统以及判定方法 Pending CN117836923A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/343,765 US12002695B2 (en) 2021-06-10 2021-06-10 Transport system and determination method
US17/343,765 2021-06-10
PCT/JP2022/022446 WO2022259948A1 (ja) 2021-06-10 2022-06-02 搬送システム及び判定方法

Publications (1)

Publication Number Publication Date
CN117836923A true CN117836923A (zh) 2024-04-05

Family

ID=84390496

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280040528.4A Pending CN117836923A (zh) 2021-06-10 2022-06-02 运送系统以及判定方法

Country Status (6)

Country Link
US (1) US12002695B2 (https=)
JP (2) JP7734744B2 (https=)
KR (1) KR102913489B1 (https=)
CN (1) CN117836923A (https=)
TW (1) TWI822103B (https=)
WO (1) WO2022259948A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI840988B (zh) * 2022-10-06 2024-05-01 盛詮科技股份有限公司 晶圓吸附裝置
JP2025070327A (ja) * 2023-10-19 2025-05-02 川崎重工業株式会社 基板搬送ロボットシステム
CN117878017B (zh) * 2024-01-12 2024-07-26 苏州海通机器人系统有限公司 一种晶圆定位纠偏方法、系统及装置

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3808395A (en) * 1973-05-15 1974-04-30 Gen Electric Method of metallurgically joining a beryllium-base part and a copper-base part
JPH0529441A (ja) * 1991-07-23 1993-02-05 Oki Electric Ind Co Ltd ウエハー位置およびオリエンテーシヨンフラツト方向検出方法
US6225012B1 (en) * 1994-02-22 2001-05-01 Nikon Corporation Method for positioning substrate
JPH07302828A (ja) * 1995-04-24 1995-11-14 Nikon Corp 基板搬送装置
JP3624065B2 (ja) * 1996-11-29 2005-02-23 キヤノン株式会社 基板搬送装置、半導体製造装置および露光装置
JPH11106044A (ja) * 1997-10-08 1999-04-20 Mitsubishi Electric Corp 基板搬送装置および基板搬送方法
US7315373B2 (en) * 2001-11-14 2008-01-01 Rorze Corporation Wafer positioning method and device, wafer process system, and wafer seat rotation axis positioning method for wafer positioning device
JP4376116B2 (ja) * 2003-06-03 2009-12-02 東京エレクトロン株式会社 基板受け渡し位置の調整方法
US8600150B2 (en) * 2006-02-13 2013-12-03 Samsung Electronics Co., Ltd. Wafer aligning apparatus and related method
KR100772843B1 (ko) * 2006-02-13 2007-11-02 삼성전자주식회사 웨이퍼 얼라인 장치 및 방법
JP4961895B2 (ja) * 2006-08-25 2012-06-27 東京エレクトロン株式会社 ウェハ搬送装置、ウェハ搬送方法及び記憶媒体
JP5058836B2 (ja) * 2007-05-08 2012-10-24 東京エレクトロン株式会社 処理装置、処理方法、被処理体の認識方法および記憶媒体
JP2009054933A (ja) * 2007-08-29 2009-03-12 Ryusyo Industrial Co Ltd ウエハ搬送システム
JP5324231B2 (ja) * 2009-01-08 2013-10-23 日東電工株式会社 半導体ウエハのアライメント装置
WO2011061912A1 (ja) * 2009-11-19 2011-05-26 株式会社アルバック 基板中心位置の特定方法
JP2011108958A (ja) * 2009-11-20 2011-06-02 Hitachi High-Tech Control Systems Corp 半導体ウェーハ搬送装置及びこれを用いた搬送方法
JP5557516B2 (ja) * 2009-12-09 2014-07-23 株式会社日立ハイテクノロジーズ 真空処理装置
JP5582152B2 (ja) * 2012-02-03 2014-09-03 東京エレクトロン株式会社 基板搬送装置、基板搬送方法及び記憶媒体
JP5664570B2 (ja) * 2012-02-09 2015-02-04 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP5600703B2 (ja) 2012-03-30 2014-10-01 東京エレクトロン株式会社 搬送装置及び搬送方法
JP6339909B2 (ja) * 2014-09-17 2018-06-06 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP2016134526A (ja) * 2015-01-20 2016-07-25 リンテック株式会社 移載装置および移載方法
KR101817209B1 (ko) * 2016-06-24 2018-02-22 세메스 주식회사 기판 처리 장치 및 방법
JP7008573B2 (ja) * 2018-05-16 2022-01-25 東京エレクトロン株式会社 搬送方法および搬送装置
US11427412B2 (en) * 2019-05-09 2022-08-30 Kawasaki Jukogyo Kabushiki Kaisha Substrate conveying robot and substrate conveying method
CN115552583B (zh) * 2020-06-05 2025-06-27 日商乐华股份有限公司 晶圆搬运装置以及晶圆搬运方法
KR102624577B1 (ko) * 2020-10-28 2024-01-15 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
US11862507B2 (en) * 2020-11-25 2024-01-02 Kawasaki Jukogyo Kabushiki Kaisha Robot system, and slip determination method

Also Published As

Publication number Publication date
KR20240041909A (ko) 2024-04-01
KR102913489B1 (ko) 2026-01-15
JPWO2022259948A1 (https=) 2022-12-15
US20220399218A1 (en) 2022-12-15
WO2022259948A1 (ja) 2022-12-15
TW202306014A (zh) 2023-02-01
TWI822103B (zh) 2023-11-11
US12002695B2 (en) 2024-06-04
JP7734744B2 (ja) 2025-09-05
JP2025176047A (ja) 2025-12-03

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